JP2000276784A - Replica product manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] In a method of manufacturing a duplicate product, which comprises a resin layer on which a physical pattern is recorded and a substrate to which the resin layer is pasted, in the prior art, after applying the resin to the substrate, the master is The resin was expanded to the required range by bonding. At this time, resin spreading failure occurs, losing value as a product, and sometimes damaging the master.
Also, the time required for the resin to spread has been a factor that hinders productivity. A resin is spread over the entire surface of a base by bonding a resin applied to the base to a clean flat plate, and a duplicate product is manufactured using the base.
As a result, the resin spreading defect is eliminated, the quality of the replicated product is improved by making the resin film thickness uniform, and the time required for the resin spreading is eliminated, thereby improving the productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a duplicate product using a curable resin.

The present invention relates to a method for manufacturing an optical disk substrate.

[0003]

2. Description of the Related Art FIG. 6 shows a method of manufacturing a duplicate product using a curable resin according to the prior art. FIG. 6 is a diagram showing a conventional substrate manufacturing process.

In the "base pretreatment" (a), a process for improving the adhesion between the base and the coating resin is performed. An adhesion reinforcing material (such as hexamethylsilazane) is applied by spin coating or vapor deposition. "Resin application" (b) is a step of applying a thermosetting or photocurable resin to a substrate. The resin is applied to an arbitrary position on the rotating base. The resin is continuously applied on the base in a circumferential direction, and the application is completed. Next, the resin-coated base and the master are "laminated" (c) in a vacuum.
Performing in a vacuum does not leave gas between the base and the master, and has the purpose of eliminating anything that hinders the spread of the resin. After bonding in vacuum, wait for the resin to spread to the required area of the substrate. After bonding in a vacuum, it is also necessary to wait for the resin to spread under the atmospheric pressure. Under atmospheric pressure, the base presses the resin, and the spread of the resin is promoted.

[0005] Thereafter, a "resin curing" (d) process is performed to "peel" (e) the substrate and the master. A duplicate product (f) in which the physical pattern of the master has been transferred to the peeled substrate is completed.

[0006]

In the conventional method, there are problems such as uneven thickness of the applied resin, poor spreading of the resin, and time required for the resin to spread to a required range. Some of these issues are described below.

[0007] The thickness unevenness of the resin for transferring the physical pattern of the master is affected by the fluidity of the resin, the surface properties of the base and the master in contact with the resin, and the parallelism between the base and the master when bonded. It is considered that these are mainly caused by the fluidity of the resin.

The time required for spreading the resin is roughly determined by the conventional method based on the viscosity of the resin, the amount of the resin applied, the pattern of the master to be transferred, and the like, and at present it is difficult to control it arbitrarily.

Regarding the spread of the resin, a poor spread of the resin, which does not spread in a required range, between the substrate and the master, a poor spread of the resin due to contamination of the base, entrapment of air bubbles, etc. have occurred.

In addition, the problem of the resin spreading time is about 10 seconds for a substrate having a diameter of 120 mm for an optical disk substrate, and therefore there is a demand for reduction in productivity and cost.

In order to solve the problem of spreading of the resin, a method of applying a resin to the entire surface of the base or the master before the base and the master are bonded together has been studied. For example, a spin coating method and a coating method using a flat nozzle by a position control device have been proposed.

However, in the spin coating method, as the viscosity of the resin increases, the flow of the resin becomes poor and the application becomes difficult, and the control of the application thickness of the resin also becomes difficult. In the spin coating method, it is necessary to shake off and remove unnecessary resin in order to make the resin thickness uniform. This is because the resin is consumed more than the amount of resin actually required, which is one of the major problems.

As other problems of the spin coating method, uneven coating, resin flow marks, foreign matter, and the like are generally known problems.

In the method of applying the coating resin from the flat nozzle to the base or the like by the position control mechanism, a device for uniformly applying the resin from the nozzle and a device for controlling the coating position are expensive and the device management is frequent. There are also important issues.

[0015]

According to a first aspect of the present invention, there is provided a method of manufacturing a duplicate product, comprising applying a resin to a substrate in a "resin application step" of applying a resin such as a photocurable or thermosetting resin to the substrate. Paste the resin surface of the base to a clean plate in a vacuum,
Spread the resin over the entire surface of the base, and peel the base with resin from the clean flat plate. A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps.

According to the above-described manufacturing method, unevenness in the thickness of the resin is improved, and poor spreading of the resin is almost eliminated. In addition, since defective resin spreading can be eliminated, the non-defective rate at the time of manufacturing a duplicate product is improved. This has the effect that almost no time is required for spreading the resin.

According to a second aspect of the present invention, there is provided a duplicate product manufacturing method, wherein a resin is applied to a clean flat plate in a “resin coating step” for coating a resin such as a photocurable or thermosetting resin on a base, and the clean flat plate is vacuumed. The resin surface is bonded to the base, the resin is spread over the entire base, and the base with resin is separated from the clean flat plate. A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps.

According to the above-described manufacturing method, unevenness in thickness of the resin is improved, and poor spreading of the resin is almost eliminated. In addition, since defective resin spreading can be eliminated, the non-defective rate at the time of manufacturing a duplicate product is improved. This has the effect that almost no time is required for spreading the resin.

According to a third aspect of the present invention, there is provided a method of manufacturing a replicated product, wherein the resin is applied to the substrate by applying a resin such as a photocurable or thermosetting resin to the substrate. Adhere the surface to the new base, spread the resin over the entire base, and peel off the two bases. A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps.

According to the above manufacturing method, unevenness in the thickness of the resin is improved, and poor spreading of the resin is almost eliminated. In addition, since defective resin spreading can be eliminated, the non-defective rate at the time of manufacturing a duplicate product is improved. Almost no time is required for spreading the resin. Further, there is an effect that two substrates can be processed in one resin application operation, and the applied resin is not wasted at all.

According to a fourth aspect of the present invention, there is provided an apparatus for producing a duplicate product, comprising the production method according to any one of the first to third aspects.

According to the above-mentioned manufacturing apparatus, it is possible to manufacture a base having a high quality with respect to application of a resin, and to shorten the manufacturing time.

According to a fifth aspect of the present invention, there is provided a duplicated product manufactured by using the manufacturing method according to any one of the first to third aspects or the manufacturing apparatus according to the fourth aspect. It has the effect of being.

According to a sixth aspect of the present invention, there is provided an optical disk substrate manufactured by using the manufacturing method according to any one of the first to third aspects or the manufacturing apparatus according to the fourth aspect. This has the effect that an optical disc having the following characteristics can be manufactured.

[0025]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1 and 2 are process flow charts showing a substrate manufacturing method according to the first aspect of the present invention.

In the "base pretreatment" (a), a process for improving the adhesion between the base and the coating resin is performed. In the present embodiment, an adhesion reinforcing material using "silane cufflink material" was applied by a spin coating method. In addition, there is also a method of applying “hexamethyldisilazane” by a vapor deposition method.

"Resin application" (b) is a step of applying a resin to the base. "Resin application" (c) is a process of bonding the substrate coated with the resin in the "resin application" to a clean flat plate in a vacuum to spread the resin to a required range of the substrate.
"Resin coating" is a step of peeling the base plate and the clean flat plate bonded together by "resin coating". In the “resin coating inspection”, the resin spread on the substrate and expanded to the required range is checked for any defective resin spread or foreign matter defects, the resin thickness of the applied resin, etc., and only the acceptable products are sent to the next process . Since the defective substrate is eliminated in the inspection process, the yield rate of the final duplicated product substrate is improved. In the “bonding” (d), the resin-coated substrate that has passed the “resin coating inspection” and the master are bonded in a vacuum. Here, the physical pattern of the duplicate is transferred from the master to the resin. "Resin curing" (FIG. 2e) is a step of curing the resin filled between the base and the master and onto which the pattern of the master has been transferred. "Peeling" (FIG. 2f) peels off the resin and the master which are cured and adhered to the substrate.

The physical pattern of the master is transferred to a resin, and the resin is attached to the base, thereby completing a duplicate base.

FIG. 3 shows a step of applying a resin to the substrate in the substrate manufacturing method described with reference to FIGS.
It is an outline figure explaining one Example of "resin application".

In the "resin application" (a), a resin is applied to the substrate. A predetermined amount of the resin (302) is applied to the predetermined position of the rotating base (303) from the resin application nozzle (301) on the base without interruption.

The application position was set at a position where the resin spreads to necessary positions on the inner and outer peripheries of the substrate and spreads evenly over the entire range of the substrate.

The amount of the resin to be applied is determined by the thickness of the applied resin and the range in which the resin is spread.

Since it is desired that the application of the resin is uniform in the circumferential direction of the substrate, a quantitative coating apparatus was used.

Next, in the “resin coating step” (b), the resin (3
02) The coated substrate is a clean plate in a vacuum chamber (304)
(305). A base horizontally supported with the resin application surface facing down, and a clean flat plate located immediately below the base and opposed to the base are bonded in a vacuum chamber. In this embodiment, the substrate was laminated on a clean flat plate and bonded. The vertical relationship between the base and the clean plate is arbitrary.

The parallelism between the opposing base and the master was 0.01 mm or less immediately before bonding.

The clean plate surface to be bonded to the base is a mirror-finished clean metal surface. In this embodiment, the clean plate surface is mirror-finished. However, the clean plate surface has a pattern for promoting the spread of the resin. No problem.

The vacuum level at the time of bonding is set to such an extent that the gas contained in the resin used can be defoamed.

The resin between the substrate and the clean plate bonded in the vacuum chamber spreads around the inside and outside of the substrate. In this embodiment, the spread of the resin is promoted under the atmospheric pressure after bonding to promote the spread of the resin.

In the "resin coating step" (c), after the resin has spread to the required area of the substrate, the substrate is peeled from the clean flat plate. A fixed amount of resin is applied on the entire surface of the base.

Thus, the resin coating process is completed.

The clean plate is used to remove the remaining resin and reuse it for the next resin application.

In the present embodiment, the method of applying the resin on the substrate has been described as a method of applying the resin in a circumferential manner without any breaks. The discontinuities are arbitrary.

(Embodiment 2) FIG. 4 is a schematic view for explaining one embodiment of the step of applying a resin, "resin application", "resin application" and "resin application" according to the second aspect of the present invention.

In the "resin coating" (a), the resin is coated on the clean flat plate (405). A predetermined amount of the resin (402) is applied to the predetermined position of the rotating clean plate from the resin application nozzle (401) on the clean plate without interruption. Details are the same as those described in the first embodiment.

Next, in the “resin coating step” (b), the clean plate coated with the resin is bonded to the substrate in a vacuum chamber. A clean flat plate horizontally supported with the resin application surface facing upward and a substrate located directly above the clean flat plate and opposed to the clean flat plate are bonded in a vacuum. In this embodiment, the substrate was laminated on a clean flat plate and bonded. The vertical relationship between the base and the clean plate is arbitrary.

The parallelism between the clean plate and the substrate and the specifications of the clean plate are the same as in the first embodiment.

In the "resin coating step" (c), after the resin has spread to the required area of the substrate, the substrate is peeled off from the clean flat plate.
A fixed amount of resin is applied on the entire surface of the base.

Thus, the resin coating process is completed.

The clean plate is used to remove the remaining resin and reuse it for the next resin application.

In this embodiment, the method of applying the resin to the clean flat plate is described as a method of applying the resin in a circumferentially continuous manner. -The discontinuity is optional.

(Embodiment 3) FIG. 5 is an external view for explaining one embodiment of the step of applying a resin, "resin application", "resin application", and "resin application" according to the third aspect of the present invention.

In the “resin application” (a), the resin is applied to the base (503). A predetermined amount of resin is applied from a resin application nozzle (501) to a predetermined position of the rotating base without any break on the base.

The details are the same as those described in the first embodiment.

The application position was such that the resin spread over the required positions on the inner and outer peripheries of the substrate and spread evenly over the entire area of the substrate.

Next, in the “resin application step” (b), the substrate on which the resin has been applied is bonded to a new substrate (510) in a vacuum chamber. A base (503) horizontally supported with the resin application surface facing down and a new base (510) located immediately below the base opposite to the base are bonded in a vacuum chamber (504). In the present embodiment, the base is overlapped on a new base and bonded. The hierarchical relationship between the base and the new base is arbitrary. The parallelism between the two substrates is the same as in the first embodiment.

The resin between the substrates bonded in a vacuum spreads inside and outside the substrates. In this embodiment, the spread of the resin is promoted under the atmospheric pressure after bonding to promote the spread of the resin.

In the "resin coating step" (c), the two substrates are separated after the resin has spread to the required range of the substrates. A fixed amount of resin is applied on the entire surface of the base.

Thus, the step of applying the resin is completed.

In this embodiment, the resin can be applied to two substrates by a single operation from the “resin application step” to the “resin application step”. Thus, the resin application step is completed.

In this embodiment, the method of applying the resin on the substrate has been described as a method of applying the resin circumferentially without any break. However, if the resin spreads over a necessary range of the substrate, the shape of the resin to be applied and the continuous The discontinuities are arbitrary.

In the present embodiment, two substrates can be used, respectively, and the treatment of a clean plate is not required.

(Example 4) The basic steps of the optical disk substrate are "substrate pretreatment", "resin coating", "resin coating", "resin coating", "resin coating", and "laminating" (here, the optical disk substrate The physical pattern of the stamper is transferred from the stamper to the resin.) "Resin curing" and "peeling", the physical pattern of the stamper is transferred to the resin, and the resin is attached to the substrate to complete the optical disk substrate. The details are the same as in claim 1.

Since the details of "resin coating", "resin coating" and "resin coating" in this embodiment are the same as those in the first aspect, only items specific to this embodiment will be described below.

As a resin to be applied, an acrylic UV curable resin was used.

The amount of resin is 230 cc coated on a DVD substrate having a substrate outer diameter of 120 mm.

The parallelism between the opposing substrate and the stamper was set to 0.01 mm or less within a range of 120 mm in diameter immediately before bonding.

The vacuum level at the time of bonding is 1 × 10 -3 To
rr.

After bonding to promote the spread of the resin, the spread of the resin is promoted under atmospheric pressure.

[0070]

According to the present invention, there are effects such as improvement in the unevenness of the thickness of the resin layer of the duplicated product, reduction of the spread failure of the resin, and reduction of the time required for the spread, thereby improving the quality of the duplicated product.

[Brief description of the drawings]

FIG. 1 is a view showing a process flow of a substrate manufacturing method according to the first embodiment;

FIG. 2 is a view showing a process flow of the substrate manufacturing method according to the first embodiment;

FIG. 3 is a schematic diagram illustrating an embodiment of “resin application”, “resin application”, and “resin application” according to claim 1.

FIG. 4 is a schematic view illustrating an embodiment of “resin application”, “resin application”, and “resin application” according to claim 2;

FIG. 5 is a schematic view for explaining one embodiment of “resin application”, “resin application” and “resin application” according to claim 3;

FIG. 6 is a diagram showing a process flow of a method of manufacturing a duplicate product according to a conventional technique.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Duplicated product 101 p Adhesion reinforcing material application nozzle 101 r Curable resin application nozzle 102 Curable resin 103 Substrate 104 Vacuum chamber 105 Clean plate 111 Master plate 112 Ultraviolet lamp 301 Curable resin application nozzle 302 Curable resin 303 Base 304 Vacuum chamber 305 Clean plate 306 Mounting plate 307 Remover 401 Curable resin application nozzle 402 Curable resin 403 Base 404 Vacuum chamber 405 Clean plate 406 Mounting plate 407 Remover 501 Curable resin application nozzle 502 Curable resin 503 Base 504 Vacuum chamber 505 Clean plate 506 Mounting plate 507 Remover 510 Base 2 600 Duplicated product 601p Adhesion reinforcing material application nozzle 601r Curable resin application nozzle 602 Curable resin 603 Base 611 Master 612 UV lamp

Claims (6)

[Claims] 1. A method for producing a duplicate product, comprising a resin layer on which a physical pattern is recorded and a substrate to which the resin layer is attached, wherein a resin such as a photocurable or thermosetting resin is applied to the substrate. Applying step, and transferring the physical pattern to the resin by bonding the master and the resin-coated base on which the physical pattern that is the basis of the duplicated product is recorded, the `` bonding step '' and after the transfer of the master pattern In the "resin application step" of the duplicate product manufacturing method, which consists of a "resin curing step" to cure the resin and a "peeling step" to peel off the cured resin and the master that are in close contact with the base, apply the resin to the base and apply vacuum. Attach the resin surface of the base to the clean plate, spread the resin over the entire surface of the base, and peel off the resin base from the clean plate.
A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps. 2. The resin coating step of claim 1, wherein the resin is applied to a clean flat plate, the resin surface of the clean flat plate is bonded to the base in a vacuum, the resin is spread over the entire surface of the base, and the resin is applied from the clean flat plate. Peel the base. A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps. 3. The resin coating step according to claim 1, wherein the resin is applied to the substrate, the resin surface of the substrate is bonded to a new substrate in a vacuum, and the resin is spread over the entire surface of the substrate. Peel off. A method for producing a duplicate product, wherein a resin is applied to a substrate by the above-mentioned steps. 4. An apparatus for producing a replicated product, wherein the production method according to claim 1 is used. 5. A duplicate product manufactured using the manufacturing method according to claim 1 or the manufacturing apparatus according to claim 4. 6. An optical disk substrate manufactured by using the manufacturing method according to claim 1 or the manufacturing apparatus according to claim 4.