JP2000271848A - Workpiece processing method for wire saw - Google Patents

Abstract

(57) [Summary] [PROBLEMS] A state in which a work is not required to adhere or peel a work to a holding plate or the like, workability can be improved, and the work is securely gripped by a simple configuration. Provided is a method of processing a workpiece in a wire saw that can perform a cutting process with a wire saw. A wire (1) is provided between a plurality of processing rollers (11).
2, the wire 12 is run by the rotation of the processing roller 11, and the work 16 is cut by pressing the work 16 against the running wire 12. During the cutting of the work 16 by the wire 12, at least two positions facing each other around the work axis on the outer peripheral surface of the work 16 are maintained in a state of being held by the holding member 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a workpiece on a wire saw.

[0002]

2. Description of the Related Art Conventionally, when a wire saw is used to cut a workpiece made of a hard and brittle material such as a semiconductor material, a magnetic material, and a ceramic using a wire, for example, a processing method as shown in FIG. 15 is employed. Was.

In this conventional method, an adhesive is used to
A carbon plate 32, a glass plate 33, and a metal mounting plate 34 are sequentially adhered and fixed to the outer periphery of the work 31, and the metal mounting plate 34 is clamped by a clamp 35, whereby the work 31 is mounted on a work support mechanism 36. ing. In this state, the work 31 and the wire 38 are moved relatively close to each other while the wire 38 stretched between the plurality of processing rollers 37 is running, and the work 31 is pressed against the wire 38 to thereby cause the work 31 to move. 31 is cut into a wafer.

However, in this conventional work processing method, a carbon plate 32, a glass plate 33, and an adhesive are required to bond and hold the work 31 to the metal mounting plate 34, so that the cutting work is required. There was a problem that the required cost was high. In addition, work 3
1 includes a carbon plate 32, a glass plate 33, and a metal mounting plate 3.
It requires a troublesome work process of bonding and fixing 4 in order, and it takes a long time for the adhesive to harden. In addition, after cutting the work, the work is peeled off the carbon plate or the residual adhesive is removed. However, there is a problem that the workability is very poor, and the processing cost is increased as described above.

[0005] In order to cope with such a problem, for example, a work processing method disclosed in Japanese Patent Application Laid-Open No. 9-123163 has been proposed. In this conventional method, a holding plate and a mounting plate are joined and fixed to the outer periphery of a work using ice, and the work is mounted on a work support mechanism via the mounting plate. In this state, the work is cut into a wafer by pressing the work against the wire while running the wire, as in the conventional method described above.

[0006]

According to this conventional processing method, the work and the holding plate and the mounting plate are joined and fixed with ice, so that the work and the holding plate are held in comparison with the case where an adhesive is used. The joining work and the peeling work with the plate and the mounting plate are facilitated. However, in this conventional processing method, a refrigerator is provided corresponding to a joint fixing portion between the work made of ice and the holding plate and the mounting plate, and the refrigerator fixes the joint fixing portion of ice in a predetermined frozen state. There is a need to. For this reason, there was another problem that the structure of the wire saw was complicated and expensive, and the refrigerator was not properly operated due to slurry applied to the refrigerator during cutting of the work.

The present invention has been made by paying attention to such problems existing in the prior art. The purpose is to reduce the number of steps and improve workability without the need to attach and detach the work to the holding plate, etc. It is an object of the present invention to provide a method of processing a workpiece in a wire saw that can perform a cutting process while holding the workpiece.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, during cutting of a workpiece by a wire, at least two opposed surfaces of the outer peripheral surface of the workpiece centered on the workpiece axis. The portion is maintained in a state of being gripped by the gripping member.

Therefore, as compared with the conventional method in which the work is bonded and fixed to the mounting plate via a holding plate or the like with an adhesive,
The work of attaching and detaching the holding plate and the like to the work can be omitted, the number of steps can be reduced, and the workability can be improved. Also, unlike the conventional method in which the work is bonded and fixed to a holding plate or the like with ice, there is no need to attach a complicated device such as a refrigerator, and the work is securely held by the simple holding member. A cutting process can be performed.

According to a second aspect of the present invention, in the method of processing a workpiece according to the first aspect, the gripping member grips both side surfaces of the workpiece at least at two locations facing each other in the wire running direction. It is.

Therefore, even when a force is applied to the work in the traveling direction by the traveling of the wire, the work can be cut accurately while the work is firmly gripped.

According to a third aspect of the present invention, in the method of processing a work according to the second aspect, the holding member is cut by a wire together with the work.

Therefore, even if the gripping member contacts the wire, the wire is not cut, and the gripping member does not hinder the cutting of the work. For this reason, the work holding area of the work by the holding member is increased,
The work can be securely gripped, which contributes to accurate cutting.

According to a fourth aspect of the present invention, in the method of processing a work according to the first or second aspect, both side surfaces of the work are formed at least at two places facing each other in a direction orthogonal to the wire running direction by the gripping member. It is characterized by being gripped.

Therefore, even after the workpiece is cut into a wafer, the gripping state of the workpiece can be maintained, and dropping of the workpiece can be prevented. According to a fifth aspect of the present invention, in the method for processing a work according to the second aspect, at least two of the uncut portions of the work are held by the gripping member.
After the outer peripheral surface of the location is gripped, the gripping operation is switched such that another gripping member grips both side surfaces of the already cut portion of the work.

Therefore, when the workpiece is cut by the wire, the gripping member is not cut by the wire, and the gripping member can be used repeatedly. According to a sixth aspect of the present invention, in the method of processing a workpiece according to the fifth aspect, at the time of switching of the gripping operation, at least two gripping members in a direction intersecting with the wire traveling direction by another gripping member.
It is characterized in that both sides of the work are gripped at the location.

Therefore, the work does not fall into the non-gripping state when the gripping operation of the gripping member is switched, and the workpiece is reliably gripped at two points in the direction orthogonal to the traveling direction of the wire by another gripping member. Therefore, the workpiece can be always held in the gripping state, and the workpiece can be cut accurately.

According to a seventh aspect of the present invention, in the method for processing a workpiece according to any one of the first to sixth aspects,
The cutting work is performed by pressing the work against the wire from below.

Therefore, by pressing the work against the wire from below, the work can be cut smoothly, and the possibility that the cut work falls on the wire can be prevented.

According to the invention as set forth in claim 8, in the method of processing a work according to any one of claims 1 to 6,
It is characterized in that the work is pressed against the wire from above and cut.

Therefore, by pressing the work against the wire from above, the work can be cut smoothly. In the ninth aspect of the present invention, in the relative cutting operation of the workpiece and the wire, the workpiece is gripped so as to prevent contact between the gripping means for gripping the workpiece and the wire.

Accordingly, since the holding means is not cut by the wire, it is not necessary to replace the holding means every time the work is cut, and the holding means can be used any number of times. According to a tenth aspect of the present invention, in the first aspect, at least one of loading and unloading of the workpiece to and from the wire saw is performed in a state where the workpiece is gripped by the gripping member.

Therefore, not only is it easy to carry in and out the work, but also in the case of carrying out after the end of cutting, a large number of wafer-shaped works can be sent to the subsequent process while maintaining the aligned state. The wafer can be prevented from being damaged or dropped.

According to an eleventh aspect of the present invention, in the ninth aspect, at least one of loading and unloading of the workpiece to and from the wire saw is performed while the workpiece is gripped by the gripping means.

Therefore, the same function as the above-mentioned claim 10 can be obtained.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described in detail below with reference to FIG.

As shown in FIG. 1, in the wire saw of this embodiment, a wire 12 is wound between a plurality of processing rollers 11, and the wire 12 is
It is designed to run with the rotation of. A work support 13 is arranged below the wire 12 so as to face the same, and a pair of gripping members 14 are arranged on the upper surface of the work support 13 so as to be movable close to and away from each other along the running direction of the wire 12.

Each of the gripping members 14 is made of a material such as carbon which can be cut by the wire 12, and an arc-shaped gripping surface 15 for gripping a work 16 is formed at the upper end of the opposing surfaces thereof. A pair of cylinders 17 are arranged on the work support 13. At the rod end of each cylinder 17, a pressing plate 18 is mounted.
8 holds the gripping member 14 movably. Then, by the projecting operation of these cylinders 17, the gripping member 14 is moved closer through the pressing plate 18, and the outer peripheral surface of the work 16 is opposed to the work shaft center, and is gripped at two places in the wire running direction. It is designed to be gripped between the surfaces 15.

Now, in this wire saw, the work 1
When processing 6, as shown in FIG. 1A, a work 16 is arranged between the gripping surfaces 15 of both gripping members 14, and the gripping member 14 is moved closer by the protruding operation of the cylinder 17. As a result, the outer peripheral side surfaces of the work 16 are held on the grip surface 1.
5 is strongly pressed between the two side portions 15a, and the wire 12 is held in a state where the wire 12 is gripped at two locations facing each other around the work axis in the running direction.

Thereafter, the wire 12 and the work 16 are moved relatively close to each other in a direction perpendicular to the running direction of the wire 12 while the wire 12 is running by the rotation of the processing roller 11. Press from below. Thereby, as shown in FIG. 1B, the work 16 is cut into a wafer by the wire 12. In this case, both the gripping members 14 are
It is cut by the wire 12.

After the work 16 is cut, the gripping member 14 is moved away by the immersion operation of the cylinder 17,
The work 16 may be released from the gripping state. Thus, the work 16 cut into a wafer can be easily taken out from the work support table 13.

The effects that can be expected from the above embodiment will be described below. (A) In the method of processing a work in the wire saw of this embodiment, at the time of cutting the work 16 by the wire 12, the gripping member 14 grips at least two locations on the outer peripheral surface of the work 16 which are opposed to each other around the work axis. I keep it in the state that I did. Therefore, the work 16 can be held on the work support 13 without using an adhesive.

For this reason, as compared with the conventional method in which the work 16 is bonded and fixed to the mounting plate via a holding plate or the like with an adhesive, the work of bonding the holding plate or the like to the work 16 or the work of peeling off the residual adhesive or the like. Can be omitted, the number of steps can be reduced, and workability in cutting the work 16 can be improved. Also, as in the conventional method in which the work 16 is joined and fixed to a holding plate or the like with ice,
There is no need to attach a complicated device such as a refrigerator, and there is no trouble as in the case where a refrigerator is provided, and cutting is performed while the work 16 is securely held by the gripping member 14 having a simple configuration. And a wire saw having a simple configuration can be adopted.

(B) The gripping member 14 grips both sides of the work 16 at two points in the traveling direction of the wire 12. For this reason, even if a lateral force due to the traveling of the wire 12 acts on the work 15, the work 1 is firmly gripped at two opposing positions about the work axis.
The movement and vibration of the workpiece 6 can be suppressed, and the work 16 can be cut accurately. Since the gripping member 14 grips the work 16 with a large area, the work 16 is
Thus, the wire is held even in a direction orthogonal to the wire running direction. For this reason, even after the work 16 is cut into a wafer, the gripping state of the work 16 can be maintained, and the falling off of the wafer-like work 16 can be prevented.

(C) The gripping member 14 is cut by the wire 12 together with the work 16. For this reason, a sufficient holding area of the work 16 by the holding member 14 can be secured,
An accurate cutting process can be achieved by securely gripping the work 16. Further, even when the workpiece 16 and the gripping member 14 come into contact with each other, the wire 12 is not cut, so that it is possible to prevent the cutting process from being hindered.

(D) The work 16 is pressed against the wire 12 from below and cut.
For this reason, even if the gripping member 14 is cut together with the work 16, the gripping member 14 maintains a state of securely gripping the work 16. Accordingly, it is possible to prevent the wafer-like work 16 from being damaged or falling off from the gripping member 14.

(Second Embodiment) Next, a second embodiment of the present invention will be described.
This embodiment will be described focusing on the differences from the first embodiment.

In the second embodiment, as shown in FIGS. 2 and 3, a pair of gripping members 14 in the first embodiment (the first gripping member 14 in the second embodiment). In addition to the above, one second gripping member 19 is arranged above the outer peripheral surface of the work 16 so as to oppose it. This second
The gripping member 19 is vertically movably attached to a frame supporting the processing roller 11 via a biasing member 19a, and the lowermost position that does not interfere with the wire 12 is determined by a stopper or the like (not shown). An arc-shaped gripping surface 20 for gripping the workpiece 16 between the lower surface of the second gripping member 14 and the bottom 15b of the gripping surfaces 15 of the first gripping members 14 is formed.

In this wire saw, when the work 16 is processed, the work 16 is arranged between the holding surfaces 15 of the first holding member 14 as shown in FIG. Then, by the projecting operation of the cylinder 17, the outer peripheral side surfaces of the work 16 are held between the two side portions 15a of the gripping surface 15 at two positions in the traveling direction of the wire 12.

In this state, the wire 12 and the workpiece 1 are moved while the wire 12 is running by the rotation of the processing roller 11.
6 is relatively approached and the work 16 is pressed against the wire 12 from below. As a result, FIG.
As shown in (b), the cutting of the work 16 by the wire 12 is started. At this time, the second gripping member 19 is held at the lowermost position and is separated from the work 16.

As shown in FIG. 3A, when the work 16 is cut by a predetermined amount from the upper part of the outer periphery, the work 16 comes into contact with the holding surface 20 of the second holding member 19, and the second holding member 19 Due to the restoring force of the urging member 19a, the gripping surface 2
0 is pressed against the outer peripheral upper surface of the work 16. Thereby, the outer peripheral surface of the work 16 can be gripped between the bottom 15 b of the gripping surfaces 15 of the first gripping members 14 and the gripping surface 20 of the second gripping member 19. Therefore, the work 16 is positioned outside the wire 12 at two positions in the running direction of the wire 12.
Is gripped at two points in a direction orthogonal to the traveling direction of the vehicle. Note that the second gripping member 14 may be positively driven by an actuator or the like.

Accordingly, the work 16 is then cut while the work 16 is gripped from four directions.
In this case, both the first holding members 14 are cut by the wire 12 together with the work 16 as in the first embodiment. Then, as shown in FIG.
After the 6 is cut on the wafer, the operation of pulling out the wire 12 from the work 16 is performed, and the first gripping member 14 and the second gripping member 19 are moved away from the outer peripheral surface of the work 16,
The work 16 is released from the gripping state. Thereby, the work 16 cut into a wafer can be easily picked up from the work support table 13.

Therefore, in the second embodiment,
The following effects can be expected in addition to the effects (A) to (D) in the first embodiment. (E) In addition to the first gripping member 14, the second gripping member 19
In the direction orthogonal to the running direction of the wire 12
At both locations, both sides of the work 16 are gripped. The work 16 is firmly gripped from four directions,
6 can be accurately performed.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
An embodiment will be described. In the third embodiment, as shown in FIGS.
And one second gripping member 19. Similarly to the first holding member 14, the second holding member 19 is made of a material such as carbon that can be cut by the wire 12, and an arc-shaped holding surface 20 is formed on the lower surface thereof. The second gripping member 19 is attached to a frame supporting the processing roller 11 so as to be vertically movable via an actuator or the like (not shown).

In this wire saw, when processing the work 16, as shown in FIG.
Of the wire 12 is held between two sides 15a of the gripping surface 15 of the first gripping member 14 at two locations in the traveling direction of the wire 12. The wire 12 and the work 16 are separated from each other.

In this state, as shown in FIG. 4B, the second gripping member 19 is moved toward the work 16 while moving the wire 12. Therefore, as shown in FIG. 6, the second gripping member 19 is cut by the wire 12 and then pressed against the outer peripheral upper surface of the work 16. Accordingly, the outer peripheral surface of the work 16 is also positioned between the bottom 15b of the gripping surface 15 of the first gripping members 14 and the gripping surface 20 of the second gripping member 19 at two places in a direction orthogonal to the traveling direction of the wire 12. It will be grasped.

Thereafter, the wire 12 and the work 16 are moved relatively close to each other, and the work 16 is pressed against the wire 12 from below. Thereby, as shown in FIG.
The work 16 is cut into a wafer shape by the wire 12, and the first holding members 14 are also cut by the wire 12. The second gripping member 19 is moved together with the workpiece 16 while maintaining the gripping state of the workpiece 16. Then, after the work 16 is cut, the first holding member 14 and the second holding member 19 are moved away from the outer peripheral surface of the work 16, and the work 16 cut into a wafer is picked up from the work support table 13. be able to.

Therefore, also in the third embodiment,
In the third embodiment, not only the same effects as those in the second embodiment can be expected, but also in the third embodiment, the work 1 is performed from the start to the end of the work on the work 16.
6 can be grasped from four places, and further high-precision processing becomes possible.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described.
An embodiment will be described. In the fourth embodiment, as shown in FIG. 7 and FIG.
A substantially V-shaped gripping surface 2 for gripping the workpiece 16 is provided on the opposing surfaces thereof, integrally and individually movable in a direction orthogonal to the traveling direction of the wire 12.
3, 24 are formed. And the upper gripping member 2
1 is made of a material such as carbon which can be cut by the wire 12, and an insertion groove 24 a for inserting the wire 12 is formed in the gripping surface 24 of the gripping member 22 below.

When the work 16 is processed with this wire saw, as shown in FIG.
Is held between two gripping surfaces 23 and 24 of the gripping members 21 and 22 at two locations in a direction orthogonal to the traveling direction of the wire 12. In this case, the wire 12 is inserted into the insertion groove 24a of the holding surface 24 of the lower holding member 22.
Through.

In this state, while the wire 12 is running, the wire 12 and the work 16 are moved relatively close to each other, and the work 16 is pressed against the wire 12 from above. As a result, as shown in FIG.
6 is cut into a wafer shape by the wire 12, and as shown in FIG.
Cut by two. Then, after the work 16 is cut, if the two holding members 21 and 22 are moved away from the outer peripheral surface of the work 16, the work 16 cut into a wafer can be taken out from between the two holding members 21 and 22. .

Therefore, in the fourth embodiment,
The same effect as in the first embodiment can be expected. (Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIGS. This fifth
In the embodiment, in addition to the pair of gripping members 21 and 22 (referred to as first gripping members 21 and 22 in the fifth embodiment) in the fourth embodiment, a pair of upper and lower second gripping members 25, 26 are equipped. These second gripping members 25 and 26 have a support arm 27 supported by the first gripping members 21 and 22 so as to be capable of opening and closing. The support arms 27 are arranged in pairs one above the other, and each support arm 27 is composed of a pair of arm pieces provided corresponding to both ends of the work 16. And
A gripping roller 28 is provided between the ends of the arm pieces of each support arm 27. Then, the upper second gripping member 25 and the lower second gripping member 26 are alternately switched to the gripping position, so that the outer peripheral surface of the work 16 is gripped at two places in the traveling direction of the wire 12. Has become.

When the work 16 is processed with this wire saw, as shown in FIG.
Of the first gripping members 21 and 22
Between the four, the wire 12 is maintained in a state of being gripped at two places in a direction orthogonal to the running direction of the wire 12. In this case, the wire 12 is inserted into the insertion groove 24a of the holding surface 24 of the lower holding member 22. At the same time, the upper second gripping member 25 is arranged at the gripping position, and the two side surfaces of the uncut portion of the work 16 are connected between the gripping rollers 28 with the wire 1.
In two traveling directions, the user also grasps at two places. The work 16 is gripped by one of the first holding member 21 and the second holding member 25 outside the wire saw.
6 can be carried into the wire saw together with the gripping members 21 and 26.

In this state, while the wire 12 is running, the wire 12 and the work 16 are moved relatively close to each other, and the work 16 is pressed against the wire 12 from above. Thus, the cutting of the work 16 by the wire 12 is started. Then, as shown in FIG.
The gripping roller 28 of the second gripping member 25 above the wire 12
, The second gripping member 25 is rotated from the gripping position to the release position to release the gripping of the work 16 in the wire traveling direction.

Thereafter, as shown in FIG. 9B, the wire 12 is held between the pair of first holding members 21 and 22 while the outer peripheral surface of the work 16 is held in a direction orthogonal to the running direction of the wire 12. The cutting of the work 16 is continued. Then, as shown in FIG.
2, when the second gripping member 21 approaches the upper first gripping member 21, the lower second gripping member 26 is arranged at the gripping position, and between the gripping rollers 28, both sides of the cut portion of the work 16 are It is gripped at two points in the running direction.

In this state, the cutting of the work 16 is continued, and as shown in FIG. 10B, the work 16 is cut into a wafer by the wire 12 and the upper gripping member 21 is Cut by. After the work 16 is cut, the first holding member 2
By moving the first and second 22 away from the outer peripheral surface of the work 16 and rotating the lower second holding member 26 from the holding position to the release position, the work 16 cut into a wafer can be taken out. After the cutting process is completed, the state where the work 16 is held by the first holding member 22 and the second holding member 26 is maintained, and in this state, the work 16 is carried out of the wire saw together with the holding members 22 and 26. You can also.

In the fifth embodiment, the upper first gripping member 21, that is, the first gripping member 21 that is cut when the cutting of the work 16 is completed, has only the cut portion made of carbon or the like. It is made of a material that is easy to cut.

Therefore, in the fifth embodiment,
The following effects can be expected in addition to the effects of the above embodiments. (F) The gripping operation is performed so that the upper second gripping member 25 grips both side surfaces of the uncut portion of the work 16 and then the lower second gripping member 26 grips both side surfaces of the already cut portion of the work 16. Is switched. Therefore, the second gripping members 25 and 26 are not cut by the wire 12 when the work 16 is cut by the wire 12, and the second gripping members 25 and 26 can be used repeatedly.

(G) When the gripping operation of the second gripping members 25 and 26 is switched, the first gripping members 21 and 22 grip both sides of the work 16 at two points in a direction orthogonal to the traveling direction of the wire 12. Like that. Therefore, when switching the gripping operation of the second gripping members 25 and 26,
The work 16 does not fall into a non-gripping state, and is reliably gripped by the first gripping members 21 and 22 at two places in a direction orthogonal to the traveling direction of the wire 12. Therefore, the work 16 can be always held in the gripping state, and the work 1
6 can be accurately performed.

(F) The work 16 is held by the holding members 21 and 25
Alternatively, it is possible to carry in and out of the wire saw in a state where the wire saw is held at 22, 27. Therefore, not only can they be easily loaded and unloaded, but also, after cutting, a large number of wafer-shaped workpieces can be sent to the subsequent process while maintaining the aligned state. In addition, the wafer can be prevented from being damaged or dropped.

(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described.
An embodiment will be described. In the sixth embodiment, as shown in FIGS. 11 to 14, the first gripping members 21 and 22 and the second gripping member 2 are similar to those of the fifth embodiment.
5, 26 are equipped. The upper first holding member 21 does not have to be formed of a material that can be cut by the wire 12, and the lower first holding member 22 has no insertion groove 24 a formed in the holding surface 24.

In this wire saw, when the work 16 is processed, as shown in FIG. 11A, the work 16 is joined to the holding surface 23 of the upper first holding member 21, and the work 16 is connected to the upper surface. (2) The gripping member 25 is pivotally disposed at the gripping position. As a result, the outer surface of the uncut portion of the work 16 is moved between the gripping surface 23 of the upper first gripping member 21 and the gripping roller 28 of the second gripping member 25 above.
2 in one running direction and 2 in the direction orthogonal to the running direction
Maintain the gripped position. In this state, wire 1
2, the wire 12 and the work 16 are moved relatively close to each other, and the work 16 is pressed against the wire 12 from above. Thus, the cutting of the work 16 by the wire 12 is started.

When the wire 12 approaches the gripping roller 28 of the upper second gripping member 25, the lower first gripping member 22 is moved toward the work 16 as shown in FIG. . Accordingly, the outer peripheral surface of the work 16 is moved between two gripping surfaces 23 and 24 of the first gripping members 21 and 22 and between the gripping rollers 28 of the upper second gripping member 25 at two locations in the running direction of the wire 12 and running. It grasps simultaneously in two places of the direction orthogonal to the direction. Then, FIG.
As shown in (a), the second gripping member 25 is rotated from the gripping position to the release position to release the gripping of the work 16 in the wire traveling direction.

Thereafter, as shown in FIG. 12A, the wire 16 is held between the pair of first holding members 21 and 22 while the outer peripheral surface of the work 16 is held in a direction perpendicular to the running direction of the wire 12. The cutting of the work 16 by 12 is continued. Then, as shown in FIG. 12B, when the wire 12 approaches the upper first gripping member 21, the lower second gripping member 26 is arranged at the gripping position, and between the gripping rollers 28, Both sides of the cut portion of the work 16 are gripped at two places in the traveling direction of the wire 12.

In this state, the cutting of the work 16 is continued, and the work 16 is cut into a wafer by the wire 12 as shown in FIG. When the cutting of the work 16 is completed, the upper first gripping member 21 is moved upward away from the outer peripheral surface of the work 16 together with the wire 12. Therefore, if the lower second gripping member 26 is rotated from the gripping position to the release position after the cutting of the work 16, the work 16 cut into a wafer can be taken out.

In the sixth embodiment, similarly to the fifth embodiment, the work 16 is held by the
It is possible to carry in / out the wire saw while holding it at 22, 26, 26.

Therefore, in the sixth embodiment,
The same effect as the effect in the fifth embodiment can be expected. (Modification) This embodiment can be modified and embodied as follows.

In the third embodiment, an insertion groove is previously formed in the gripping surface 20 of the second gripping member 19,
As shown in FIG. 4B, when gripping the work 16 between the pair of first gripping members 14, the wire 12 is inserted through the insertion groove, and the gripping surface 20 of the second gripping member 19 is To be configured to be joined to the outer peripheral upper surface.

In each of the above embodiments, the vertical relationship between the work 16 and the wire 12 is reversed. Cutting the work 16 relatively into the wire 12 by cutting the work 16 obliquely from above.

Cutting the work 16 relatively into the wire 12 by cutting the work 16 obliquely from below.・ Support the work 16 at three points. For example, work 16
By supporting one point of the upper end or the lower end and supporting the two points of the lower end or the upper end, the work 16 is supported at the vertex of an isosceles triangle.

In the fifth and sixth embodiments, the gripping roller 28 for gripping the work 16 is provided at the tip of the support arm 27, but instead of this gripping roller 28,
Fixing a gripping member made of an elastic material such as rubber or metal.

[0072]

As described in detail in the above embodiments, the present invention has the following effects. According to the first aspect of the present invention, during cutting of the workpiece by the wire, at least two locations facing each other around the workpiece axis on the outer peripheral surface of the workpiece are maintained in a state of being gripped by the gripping member, thereby adhering to the workpiece. Work and the like can be omitted, the number of work steps can be reduced, and workability can be improved. Further, the cutting process can be performed in a state where the workpiece is securely held by the holding member having the simple configuration.

According to the second aspect of the present invention, since the gripping member grips both side surfaces of the work at two points in the wire running direction, a force in the running direction acts on the work by running the wire. In addition, the workpiece can be cut accurately while the workpiece is firmly gripped.

According to the third aspect of the present invention, the gripping member is
By being cut by a wire with the work,
By increasing the gripping area of the workpiece by the gripping member, it is possible to reliably grip the workpiece and contribute to accurate cutting.

According to the fourth aspect of the present invention, the workpiece is gripped on two sides in the direction perpendicular to the wire running direction by the gripping member, so that the workpiece is gripped even after the workpiece is cut into a wafer. The state can be maintained, and the work can be prevented from falling off.

According to the fifth aspect of the present invention, the gripping operation is performed such that the gripping member grips both sides of the uncut portion of the work, and then grips both sides of the already cut portion of the work with another gripping member. By switching, the gripping member can be repeatedly used without cutting the gripping member by the wire.

According to the sixth aspect of the present invention, when the gripping operation is switched, the gripping operation of the gripping member is performed by gripping both side surfaces of the work at two positions in a direction orthogonal to the wire traveling direction by another gripping member. The work does not fall into the non-grip state at the time of switching, and the work can always be held in the grip state, so that the work can be cut accurately.

According to the seventh aspect of the present invention, by cutting the work by pressing the work against the wire from below, the work can be cut smoothly, and the cut work can be placed on the wire. The possibility of falling can be prevented.

According to the eighth aspect of the present invention, the work can be smoothly cut by pressing the work against the wire from above and cutting the work. According to the ninth aspect of the present invention, a gripping means for gripping the work is provided, and the gripping means grips the work so as to prevent contact with the wire in a relative cutting operation of the work and the wire. Since the holding means is not cut, there is no need to change the holding means every time the work is cut, and the holding means can be used any number of times.

According to the tenth aspect of the present invention, at least one of loading and unloading of the workpiece to and from the wire saw is performed in a state where the workpiece is gripped by the gripping member, which facilitates loading and unloading of the workpiece. In the case of unloading after completion of cutting, a large number of wafer-shaped workpieces can be sent to a subsequent process while maintaining an aligned state, so that breakage and falling off of wafers can be prevented.

According to the eleventh aspect of the present invention, in the ninth aspect, at least one of loading and unloading of the workpiece to and from the wire saw is performed in a state where the workpiece is gripped by the gripping means. Can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing steps of a method for processing a work according to a first embodiment.

FIG. 2 is a sectional view showing steps of a method for processing a work according to a second embodiment.

FIG. 3 is a cross-sectional view showing steps of a work processing method according to a second embodiment.

FIG. 4 is a sectional view showing steps of a method for processing a workpiece according to a third embodiment.

FIG. 5 is a sectional view showing steps of a work processing method according to the third embodiment.

FIG. 6 is a sectional view taken along line 4-4 in FIG. 4 (b).

FIG. 7 is a sectional view showing steps of a method for processing a work according to a fourth embodiment.

FIG. 8 is a sectional view taken along line 5-5 in FIG.

FIG. 9 is a sectional view showing steps of a work processing method according to a fifth embodiment.

FIG. 10 is a sectional view showing steps of a work processing method according to the fifth embodiment.

FIG. 11 is a sectional view showing steps of a work processing method according to a sixth embodiment.

FIG. 12 is a sectional view showing steps of a work processing method according to the sixth embodiment.

FIG. 13 is a sectional view showing steps of a work processing method according to the sixth embodiment.

FIG. 14 is a perspective view showing a state of gripping a workpiece in the fifth and sixth embodiments.

FIG. 15 is a side view showing a conventional work processing method.

[Explanation of symbols]

11: processing roller, 12: wire, 14: gripping member of the first embodiment and first gripping member of the second to third embodiments, 15: gripping surface, 16: workpiece, 19: second to second The second gripping member of the third embodiment, 20 ... gripping surfaces, 21, 22 ...
The gripping member of the fourth embodiment and the first gripping members of the fifth to sixth embodiments, 23, 24... Gripping surfaces, 25, 26.
-The second gripping member of the sixth embodiment, 27 ... a support arm,
28 ... Grip roller.

Claims (11)

[Claims] 1. A method in which a wire is wound between a plurality of rollers, and the wire runs by rotating the rollers.
In a wire saw configured to cut a workpiece by pressing the workpiece against a traveling wire, at least two positions facing each other around the workpiece axis on the outer peripheral surface of the workpiece while the workpiece is being cut by the wire,
A method for processing a workpiece in a wire saw that maintains a state of being held by a holding member. 2. The method according to claim 1, wherein the gripping member grips the outer peripheral surface of the workpiece at least at two locations facing each other in the wire running direction. 3. The method according to claim 2, wherein the holding member is cut by a wire together with the work. 4. The method of processing a workpiece according to claim 1, wherein the outer peripheral surface of the workpiece is gripped by at least two locations facing each other in a direction intersecting with the wire running direction by the gripping member. 5. The gripping device according to claim 2, wherein the gripping member grips at least two outer peripheral surfaces of the uncut portion of the workpiece, and then grips the outer peripheral surface of the already-cut portion of the workpiece by another gripping member. A method of processing a work whose operation is switched. 6. The method of processing a workpiece according to claim 5, wherein when switching the gripping operation, the outer peripheral surface of the workpiece is gripped by at least two points in a direction intersecting with the wire running direction by another gripping member. 7. The method according to claim 1, wherein the workpiece is pressed against a wire from below and cut. 8. The method according to claim 1, wherein the workpiece is pressed against the wire from above and cut. 9. A method of processing a workpiece, comprising: gripping means for gripping a workpiece, wherein the gripping means grips the workpiece so as to prevent contact with the wire in a relative cutting operation between the workpiece and the wire. 10. The method according to claim 1, wherein at least one of loading and unloading of the workpiece to and from the wire saw is performed while the workpiece is gripped by the gripping member. 11. The method according to claim 9, wherein at least one of loading and unloading of the workpiece to and from the wire saw is performed while the workpiece is gripped by gripping means.