JP2000269544A - Light emitting / receiving element and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] In a surface mount type sensor having a light emitting section and a light receiving section on the same substrate (hereinafter referred to as a light receiving and emitting element), a light emitting section and a light emitting section are required to improve the S / N ratio of the light receiving and emitting element. It is necessary to provide a light-shielding portion between the light-receiving portions for directly blocking light. In the conventional light receiving and emitting element, the thickness of the light shielding plate is required to some extent, and not only the substrate size becomes large, but also it becomes difficult to manufacture the light shielding portion,
There is a problem that the number of man-hours is increased and the cost is increased. According to the present invention, the light-shielding portion of the light-receiving / emitting element can be made thinner by forming the light-shielding resin insertion region 4 'by transfer molding without forming the light-shielding portion 4 in advance. It is possible to reduce the size of the element and to maintain the shielding effect. Further, by adopting a simple manufacturing method of injecting a semi-solid resin as a light-blocking resin into the light-blocking resin insertion region 4 'and thermally curing the same, the process can be simplified and the cost can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type light emitting / receiving element having a light emitting unit and a light receiving unit such as a surface mount type tilt sensor and a reflection type interrupter on the same substrate.

[0002]

2. Description of the Related Art In a surface-mount type sensor having a light-emitting portion and a light-receiving portion on the same substrate (hereinafter referred to as a light-emitting / receiving element), an S
In order to improve the / N ratio, it is necessary to provide a light-shielding portion between the light-emitting portion and the light-receiving portion, which blocks light that reaches directly from the light-emitting portion to the light-receiving portion or through resin. Step 3 of a, b, c of FIG.
2 shows a simple structure of the light emitting / receiving element 51, respectively. The conventional light receiving and emitting element has a problem that the light shielding plate serving as a light shielding part is thick, and there is no degree of freedom in design, so that the element size cannot be reduced. This is because the light shielding portion was formed in advance and resin molding was performed.

Next, a description will be given of a manufacturing process of the conventional light emitting / receiving element 51. The MID method (Mold
In the Connected Device)
The light-emitting element 54 and the light-receiving element 55 are located at respective positions with the light-shielding part 52 interposed between the MID substrates 53 on which the light-shielding part 52 is provided in Step 1.
Is die-bonded with a conductive paint such as silver paste, and wire-bonded with a conductive material such as a gold wire or an Al wire. In step 2, a resin 57 such as epoxy is injected by a dispenser 56. Next, in step 3, the resin 57
Is cured, whereby the light receiving element 51 is completed.

In the transfer mold method shown in FIG. 5B, in step 1, the light emitting element 54 and the light receiving element 55 are die-bonded with a conductive paint such as silver paste to form a conductive material such as a gold wire or an Al wire. A light-shielding plate 52 'is bonded to a substrate 53' on which a light emitting element 54 and a light receiving element 55 are die-bonded and wire-bonded by wire bonding with a material. Step 2
Then, the resin 57 is injection-molded in the mold 58. Next, after the resin 57 is cured in step 3, the mold 58 is removed and the light emitting / receiving element 5
1 is molded and completed.

In the dam substrate method shown in FIG. 5C, in step 1, the light emitting element 54 and the light receiving element 55 are die-bonded with a conductive paint such as silver paste and wire-bonded with a conductive material such as a gold wire or an Al wire. Then, a dam substrate 53a for the resin 57 to enter into the die-bonded and wire-bonded substrate 53 'is joined. In step 2, the resin 57 is injected by the dispenser 56. Next, in step 3, the resin 57 is cured to complete the light emitting and receiving element 51.

In such a surface mount type light receiving / emitting element 51 having a light emitting section 54 and a light receiving section 55 on the same substrate, as described above, in order to improve the S / N ratio of the light receiving / emitting element, the light emitting section A light-shielding part 52 that blocks direct light from the light-emitting part 55 is required between the light-receiving part 55 and the light-receiving part 55. The light-shielding portion 52 serves as a light-shielding plate 52 ′ and a light-emitting portion 54 and a light-receiving portion 55 of the light-receiving / emitting element 51.
The light shielding plate 52 'needs to have a certain thickness to stand, and the size of the substrate is increased in FIGS. 5A, 5B and 5C. In addition, there is a problem that it is difficult to manufacture the light-shielding portion and the number of steps is increased, resulting in an increase in cost.

[0007]

Therefore, in the present invention,
A simple structure in which a light-shielding resin is injected and cured by providing a light-shielding resin insertion area for inserting a light-shielding part between the respective light-emitting parts and light-receiving parts and providing a light-shielding part between the respective mold parts. The size of the light receiving / emitting element can be reduced, and the element manufacturing process can be simplified. Also, since the light-shielding resin is a semi-solid resin, the space to be the light-shielding resin insertion area is reduced depending on the thickness of the semi-solid resin, and the light-shielding portion can be easily formed even if the shape of the light-shielding portion is curved, The purpose is to be able to handle a wide variety of products.

[0008]

In a light receiving and emitting element in which a light emitting element and a light receiving element are provided on the same substrate, the light emitting element and the light receiving element are molded by transfer molding, respectively, and a light emitting element resin portion and a light receiving element are formed. A resin part is formed, and a light-shielding resin insertion region is formed between the light-emitting element resin part and the light-receiving element resin part to provide a shielding effect and to form a miniaturized light-emitting / receiving element. It is possible. By injecting a light-shielding resin into the light-shielding resin insertion region and thermally curing the same, not only can the size of the light-receiving / emitting element be reduced, but also the element manufacturing process can be simplified. Further, since the light-shielding resin is a semi-solid resin, the space for the light-shielding resin insertion region can be narrowed depending on the thickness of the semi-solid resin, and the light-shielding portion can be formed even if the insertion portion is curved.

Further, as a manufacturing process of the light receiving / emitting element,
The light emitting element and the light receiving element are respectively transferred.
Mold to mold the light emitting element resin part and light receiving element resin part,
Forming a light-blocking resin insertion region between the light-emitting element resin portion and the light-receiving element resin portion; injecting the light-blocking resin into the light-blocking resin insertion region; It consists of a curing step, which simplifies the process and reduces costs.

[0010]

FIG. 1 shows a perspective view, a front view, a side view, and a back view of a light emitting and receiving element according to the present invention. FIG.
It is a figure which shows PWB used in process 1 of 2nd Embodiment of the manufacturing method of the light receiving / emitting element of this invention, and the process 1.
FIG. 3 is a diagram showing a PWB used in step 1 of the second embodiment of the method for manufacturing a light receiving / emitting element of the present invention and step 1 thereof. FIG. 4 is a diagram showing a main part of the first and second embodiments of the method for manufacturing a light emitting / receiving element of the present invention in the order of steps.

As shown in the front view of FIG. 1, an LED 2 as a light emitting element, a photodiode 3 (hereinafter PD3) as a light receiving element, positive and negative electrodes 5 of the LED 2, positive and negative electrodes 6 of the PD 3, a PWB 9 and a light shielding section 4 are shown. And an epoxy resin part 8 of the light emitting part (hereinafter, light emitting element resin part 8) and an epoxy resin part 7 of the light receiving part (hereinafter, light receiving element resin part 7).

The LEDs 2 and PD3 are die-bonded with a conductive paint such as silver paste on a PWB 9 on which a wiring pattern is formed, and wire-bonded with a conductive material such as a gold wire or an Al wire to form a light emitting element. The resin part 8 and the light receiving element resin part 7 are each formed by transfer molding. At this time, the light-shielding resin insertion region 4 is simultaneously formed between the light emitting element resin portion 8 and the light receiving element resin portion 7.

The light-shielding portion 4 is provided in the light-shielding resin insertion region 4 '.
It is formed by injecting a resin made of a semi-solid resin and thermosetting at 100 to 130 ° C., preferably at about 120 ° C. As described above, the light shielding portion 4 is formed by curing a semi-solid resin.
The non-woven fabric of polyester is used as a base material, and epoxy resin is applied to both sides. The transmittance of the light shielding portion 4 is determined by the type of the base material and the epoxy resin. Generally, it is commercially available as a thermosetting adhesive tape. Therefore, the thickness of the light-shielding resin insertion region 4 ′ can be made smaller than that of the conventional product, and semi-solid resin can be injected and cured, so that a light-shielding element having a shielding effect and a small size can be formed.

Next, a first embodiment of a method for manufacturing a light receiving / emitting element of the present invention will be described in the order of steps. PW used in FIG.
B is shown. Both the positive and negative electrodes 5 of the LED 2 and the positive and negative electrodes 6 of the PD 3 are formed as through-holes H,
The LEDs 2 and PD3 are die-bonded to predetermined positions on the PWB 9 where a plurality of wiring patterns of the light receiving and emitting elements are formed by conductive paint such as silver paste, and wire-bonded by conductive materials such as gold wires. . Also,
In the PWB 9, a line connecting the centers of the through holes H is defined as a dicing line X, and a slit Y perpendicular to the dicing line X is formed.

FIG. 4 shows a simplified diagram of the first process to a fourth process from the completion of the light emitting and receiving element, which will be described. As shown in FIG. 4, in the second step, the light emitting element resin portion 8 and the light receiving element resin portion 7 are each molded in a transfer mold into a box shape using an epoxy resin or the like. (At this time, the light emitting element resin part 8 and the light receiving element resin part 7 are each formed on the PWB 9 of FIG. 1 by a transfer mold into a plurality of boxes with epoxy resin or the like.)

In the third step, a light-shielding resin is injected into the light-shielding resin insertion area 4 'formed in the second step, and a weight G such as brass is placed thereon, and the temperature is set at 100 to 130 ° C., preferably 1 to 30 ° C.
The light-shielding part 4 is inserted by thermosetting in a thermostat at 20 ° C.
The light-shielding resin at this time is a resin made of a semi-solid resin. This semi-solid resin is obtained by applying an epoxy resin to both sides of a non-woven fabric of polyester as a base material, and the transmittance of the light shielding portion 4 is determined by the type of the base material and the epoxy resin.
Generally, it is commercially available as a thermosetting adhesive tape.

In the fourth step, a dicing line X connecting the center of the through hole H of the PWB 9 shown in FIG. 2 is diced, and the light emitting / receiving element 1 in the fourth step shown in FIG. 4 is completed. Here, since the PWB 9 in which the slit Y is formed is used, it is only necessary to dice the dicing line X.

FIG. 3 shows a PWB used in a second embodiment of the method for manufacturing a light receiving / emitting element of the present invention. In the second embodiment, the PWB 9 'in FIG. 3 is only a through-hole and has no slit. In the first step, both the positive and negative electrodes 5 of the LED 2 and the positive and negative electrodes 6 of the PD 3
The LED 2 and the PD 3 are formed on a PWB 9 ′ on which a plurality of wiring patterns of light receiving and emitting elements are formed.
Is die-bonded with a conductive paint such as silver paste, and wire-bonded with a conductive material such as a gold wire or an Al wire. Also, here, sulfo-
A line X connecting the centers of the lines H is a dicing line, and a line Y perpendicular to the line X is a dicing line.

FIG. 4 shows the steps from the simplified view of the first step to the fourth step until the light emitting and receiving element is completed. As shown in FIG. 4, in the second step, the light emitting element resin portion 8 and the light receiving element resin portion 7 are each molded in a substantially ridged shape using epoxy resin or the like by transfer molding. (At this time, FIG.
Light emitting element resin part 8 and light receiving element resin part 7 on PWB 9
Are molded in a transfer mold in the form of a plurality of ridges using an epoxy resin or the like. )

In the third step, a light-shielding resin is injected into the light-shielding resin insertion area 4 ′ formed in the second step, and a weight G such as brass is placed thereon, and the temperature is set at 100 to 130 ° C., preferably 1 to 30 ° C.
The light-shielding part 4 is inserted by thermosetting in a thermostat at 20 ° C.
The light-shielding resin at this time is a resin made of a semi-solid resin. This semi-solid resin is obtained by applying an epoxy resin to both sides of a non-woven fabric of polyester as a base material, and the transmittance of the light shielding portion 4 is determined by the type of the base material and the epoxy resin.
Generally, it is commercially available as a thermosetting adhesive tape.

In the fourth step, a dicing line X connecting the center of the through-hole H of the PWB 9 shown in FIG. 2 and a Y shown in FIG. 4 perpendicular to X are diced to receive the fourth step shown in FIG. The light emitting element 1 is completed. Although one light emitting element and one light receiving element have been described, a plurality of light emitting elements and light receiving elements may be provided.

[0022]

As described above, in a surface mount type light emitting / receiving element having a light emitting section and a light receiving section on the same substrate as in the prior art, the S / N of the light emitting / receiving element is high.
In order to improve the ratio, it is necessary to provide a light-shielding portion between the light-emitting portion and the light-receiving portion to block direct light from the light-emitting portion. According to the present invention, the light-shielding portion of the light-receiving / emitting element can be made thinner by forming the light-shielding resin insertion region by transfer molding without forming the light-shielding portion in advance, so that the size of the device can be reduced. And the shielding effect can be maintained. Further, by adopting a simple manufacturing method of injecting a light-blocking resin, which is a semi-solid resin, into the light-blocking resin insertion region and thermally curing the same, the process can be simplified and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing the structure of a perspective view, a front view, a side view, and a back view of a light emitting and receiving element of the present invention.

FIG. 2 is a view showing a PWB used in step 1 of the first embodiment of the method for manufacturing a light receiving / emitting element of the present invention.

FIG. 3 is a view showing a PWB used in Step 1 of a second embodiment of the method for manufacturing a light receiving / emitting element of the present invention.

FIG. 4 is a view showing a main part of the first and second embodiments of the method for manufacturing a light receiving / emitting element of the present invention in the order of steps.

FIG. 5 is a view showing a structure of a conventional light emitting / receiving element and a method of manufacturing the same in a process order.

[Explanation of symbols]

 1, 51 ... light receiving and emitting element 2, 54 ... LED (light emitting element) 3, 55 ... PD (light receiving element) 4, 52, 52 '... light shielding part (light shielding plate) 4' ... -Light-shielding resin insertion area 5-Positive and negative electrodes of LED 6-Positive and negative electrodes of PD 7-Light-receiving element resin part 8-Light-emitting element resin part 9, 9 '-PWB 53- ..MID board 53 '... board 53a ... dam board 56 ... dispenser 57 ... resin 58 ... mold H ... through hole S ... slit X, Y ... Dicing line G: Interesting

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Tomohisa Tanaka 2-9-13 Nakameguro, Meguro-ku, Tokyo Stanley Electric Co., Ltd. F-term (reference) 5F089 BB02 BB05 BC10 BC11 CA04 CA21

Claims (4)

[Claims] 1. A light-receiving and light-emitting element in which a light-emitting element and a light-receiving element are provided on the same substrate, wherein the light-emitting element and the light-receiving element are formed by transfer molding to form a light-emitting element resin part and a light-receiving element resin part. A light-shielding resin insertion region is formed between the light-emitting element resin part and the light-receiving element resin part. 2. The light emitting / receiving element according to claim 1, wherein a light shielding resin is injected into the light shielding resin insertion region and cured. 3. The light emitting / receiving element according to claim 1, wherein the light shielding resin is a semi-solid resin. 4. A method for manufacturing a light-receiving and light-emitting element in which a light-emitting element and a light-receiving element are provided on the same substrate, wherein the light-emitting element and the light-receiving element are transfer-molded to form a light-emitting element resin part and a light-receiving element resin part. The light-emitting element resin portion and the light-receiving element resin portion each include a step of molding a light-blocking resin insertion region, a step of injecting the light-blocking resin into the insertion region, and a step of thermally curing the light-blocking resin. A method for manufacturing a light receiving / emitting element, comprising: