JP2000269383A - Mounting structure and mounting method of high frequency circuit element - Google Patents

Abstract

(57) Abstract: To minimize an impedance shift caused by a positional shift when an MMIC chip is bonded to a mounting substrate. SOLUTION: A bonding pattern 14 is formed on a portion of a mounting substrate 11 on which an MMIC chip 12 is mounted, while being disconnected from a signal line 13. When it is not necessary to adjust the impedance, it is provided as it is, as in the signal line 13a. MMIC chip 1 via Au bump 16 or the like
2 is fixed by heat compression, and the connection position of the wire conductor 17 is adjusted by the scale pattern 15 in accordance with the amount of impedance deviation at this time. Thereby, a connection structure with good impedance matching is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a high-frequency circuit element in a portion for electrically connecting a signal line formed on a mounting substrate and a mounted high-frequency circuit element, and a mounting method thereof.

[0002]

An element used in a high frequency region represented by a millimeter wave, for example, an MMIC (Micr
The technology of bonding an owave / milliwave monolithic IC) chip to a substrate is extremely important in the mounting technology of a millimeter wave device. 2. Description of the Related Art Conventionally, as a typical technique for bonding a plurality of millimeter-wave MMIC chips to a substrate to establish electrical connection therebetween, a wire bonding method typified by Au wire or a ribbon bonding method such as a ribbon-shaped conductor is used. It has been proposed to do so using one of two methods.

Among them, for example, as shown in FIG.
When the MIC chip 1 and the signal line 2 are connected by wire bonding, the positional accuracy of the joining of the MMIC chip 1 to the metal or ceramic mounting substrate 3 becomes a problem. Normally, the MMIC chip 1 is bonded to the substrate 3 using Au bumps 4, solder, or the like. At this time, displacement at the time of bonding is inevitable. This displacement always occurs to some degree,
In a high-frequency region such as a millimeter wave, a slight positional shift is conspicuously expressed as an impedance shift.

In order to reduce such a displacement, it is first conceivable to increase the positioning accuracy when the MMIC chip 1 is joined to the mounting substrate 3; however, the positioning accuracy when an ordinary device is used is further improved. In practice, it is very expensive in terms of cost, and in practice, it is difficult to employ this in practice.

In view of the above, the following problems have been considered in the related art. For example, Japanese Patent Application Laid-Open No. 8-316368 discloses a technique in which a signal line and a bump are set at the same height in order to reduce impedance disturbance at the time of bonding. In this example, notches are provided in the bumps to reduce not only the height but also the lateral displacement. However, this method cannot expect the effect of reducing the positional deviation enough to reduce the impedance deviation, and therefore cannot solve the lateral positional deviation when joining the MMIC chip to the substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for mounting a high-frequency circuit element such as an MMIC chip even if a positional displacement of a junction occurs. An object of the present invention is to provide a mounting structure and a mounting method of a high-frequency circuit element capable of reducing generated impedance deviation at a connection portion.

[0007]

According to the first aspect of the present invention, a high-frequency circuit element is fixed to a portion of a bonding pattern formed on a mounting board, and is electrically insulated from the bonding pattern. Since the connection with the formed signal line is performed by the connection means while adjusting based on the scale pattern, for example, when fixing the high-frequency circuit element by flip chip connection or the like, due to the assembling accuracy of the device, etc. In a case where a positional shift occurs and as a result, an impedance shift occurs at a joint portion, the impedance shift is eliminated when connecting means is connected between the joining pattern portion to which the high-frequency circuit element is connected and the signal line. And a connection structure that ensures impedance matching can be obtained.

According to the second aspect of the present invention, a plurality of impedance adjustment patterns are arranged on at least one of the joining pattern and the signal line pattern so that the connection means can be selectively connected. By providing in advance an impedance adjustment pattern that adjusts according to the degree of impedance shift due to positional shift when fixing the high-frequency circuit element, an appropriate impedance adjustment pattern is selected when connecting the connection means Connection makes it possible to easily perform impedance adjustment.

According to the fourth aspect of the present invention, since the connection means is configured to connect the connection conductor between the signal line and the joining pattern, the connection position, the shape, the length, and the like at the time of the connection. Can be adjusted to adjust the impedance.

According to the fifth aspect of the present invention, the connection means uses a connection conductive layer formed by introducing conductive metal particles into a region between the signal line of the mounting board and the bonding pattern. Therefore, the impedance can be adjusted by adjusting the size and position of the pattern of the connection conductive layer or the concentration of the metal particles introduced during the formation.

According to the sixth aspect of the present invention, the connection means adjusts the connection position between the signal line and the joining pattern in order to adjust the impedance between the signal line and the high-frequency circuit element. By previously obtaining the adjustment amount of the impedance using the connection position of the connection conductor or the connection conductive layer as a parameter, the impedance can be easily and inexpensively adjusted without using a special structure or member.

According to the seventh aspect of the present invention, since the mounting substrate is made of a conductive metal, it is possible to adopt an electrical configuration such as giving a potential to the mounting substrate or setting it to the ground potential. , Can be set to a desired potential on the circuit configuration. According to the invention of claim 8, since the mounting substrate is made of an insulating ceramic, it is suitable for a configuration that requires insulation from a printed circuit board or the like.

According to the ninth aspect of the present invention, since the high-frequency circuit element has gold bumps formed at the bonding portion with the mounting substrate, the connection with the bonding pattern at the time of fixing to the mounting substrate is made by flip-chip connection. You will be able to connect easily.

According to the tenth aspect of the present invention, since the high-frequency circuit element is joined to the mounting board by soldering, it can be easily fixed by a reflow process or the like, and utilizes a self-aligning effect at the time of the reflow process. Thus, the displacement of the connection position can be suppressed, and the range of the impedance adjustment by the connection unit is narrowed, and the range of the impedance adjustment is narrowed, so that the adjustment accuracy within the range can be improved.

According to the eleventh aspect of the present invention, since the wire conductor is used as the connection conductor, the impedance can be easily adjusted by using a wire bonding technique used in a normal semiconductor manufacturing process.

According to the twelfth aspect of the present invention, since the ribbon-shaped conductor is used as the connection conductor, the width of the ribbon-shaped conductor is set to a value close to the width of the signal line or the joining pattern so that the impedance adjustment range can be adjusted. You can narrow down,
Thereby, the adjustment accuracy of the connection position can be improved.

According to the thirteenth aspect of the present invention, in the mounting in which the high-frequency circuit element is fixed on the mounting substrate and is electrically connected to the signal line, the mounting substrate is electrically insulated from the signal line pattern. Provide a joining pattern,
Since the high-frequency circuit element is joined to the joining pattern portion, the joining pattern and the signal line pattern are connected by the connection conductor so as to adjust the impedance deviation caused by the displacement of the joining position. ,
By using a general device used in the semiconductor manufacturing process, it is possible to easily adjust the impedance shift caused by the position shift.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, as the mounting substrate 11,
For example, a metal substrate is used, and the material is, for example, KOV.
AL (54% of Fe, 29% of Ni, 17% of Co) or a copper-tungsten alloy (90% of Cu, 10% of W). The material of the mounting substrate 11 is a MMIC (Microwave / milliwave Monolith) as a high-frequency circuit element mounted on the mounting substrate 11.
ic IC) The material of the chip 12 is considered. That is, the MMIC chip 12 uses a compound semiconductor such as GaAs (gallium arsenide) or InP (indium phosphide), and the mounting substrate 11
The above-described one is preferable because the one having a thermal expansion coefficient close to that of the IC chip 12 is adopted. The value of the coefficient of thermal expansion is as follows.

[0019]

[Table 1]

Further, as the mounting substrate 11, a ceramic substrate can be used as necessary instead of the metal plate. In this case, when the mounting substrate 11 is used as a metal plate, it can be used for the purpose of setting the potential to a predetermined potential or a ground level, and when using a ceramic substrate, the potential can be set. It can be used for a circuit that emphasizes insulation with a configuration that does not.

A signal line 13 is formed on the surface of the mounting substrate 11, and a bonding pattern 14 is formed in a state electrically separated from the signal line 13 corresponding to the mounting position of the MMIC chip 12. I have. The bonding pattern 14 is formed at a position corresponding to the signal line 13 where the impedance adjustment operation described later needs to be performed. Further, the bonding pattern 14 is specifically formed to have substantially the same width as the signal line 13. A scale pattern 15 for impedance adjustment is provided on the surface of the mounting substrate 11 where the signal line 13 faces the bonding pattern 14.

The MMIC chip 12 of the mounting substrate 11
Au bumps 16 for connection to the respective signal lines 13a and the respective bonding patterns 14 are formed in the bonding region portion of FIG.
The Au bumps 16 are electrically connected to bonding pad portions of the MMIC chip 12 by heat compression.
Further, the MMIC chip 12 is joined to the mounting substrate 11.

Instead of using the Au bumps 16 described above, the MMIC chip 12 can be similarly joined to the mounting substrate 11 by using solder. In this case, there is an advantage that a self-alignment effect can be expected because the solder is melted and connected by reflow processing, and the amount of impedance shift due to the position shift can be reduced.

Between the joining pattern 14 and the signal line 13, a wire conductor 17 as a connection means and a connection conductor is provided.
Bonding. The bonding position of the wire conductor 17 is set at a position determined by using the scale pattern 15 as an index so as to adjust the impedance deviation caused by the deviation amount of the bonding position of the MMIC chip 12. As a result, the impedance deviation between the MMIC chip 12 and the signal line 13 is reduced as much as possible, and a highly consistent mounting is realized.

Next, a mounting process for forming the above configuration will be described with reference to FIGS. Mounting board 11
Is the MMIC chip 12 to be mounted, as shown in FIG.
The signal line 13 and the bonding pattern 14 are formed in a predetermined shape by etching the conductive thin film corresponding to the bonding. A predetermined gap is provided between the signal line 13 and the bonding pattern 14, and is formed in an electrically insulated state. A signal line 13a is also formed in a direction orthogonal to the signal line 13,
This is formed so as to have a width larger than the width of the MMIC chip 12, and the bonding pattern 14 is not provided, so that electrical connection with the MMIC chip 12 is made directly.

On the signal line 13 side where the signal line 13 and the bonding pattern 14 face each other, the mounting substrate 1
A scale pattern 15 for adjustment is printed at a predetermined position on the front surface of the device 1, and scale lines are drawn at predetermined intervals to indicate an index for setting a bonding position of the wire conductor 17.

Next, as shown in FIG. 3, the MMIC of the signal line 13a of the mounting substrate 11 and the bonding pattern 14
Au bumps 16 are provided (six in the figure) corresponding to the portion where the chip 12 is mounted. Subsequently, the mounting substrate 11
Then, the MMIC chip 12 is flip-chip connected. M
The MIC chip 12 has an Au pad 16
Heat-pressed in a state where it is positioned to face the
It is joined to the mounting board 11 and is electrically connected (see FIG. 4). When joining with solder, joining is performed by performing a reflow process after providing a solder piece.

After that, the signal line 13 and the bonding pattern 14 are electrically connected by the wire conductor 17.
At this time, the connection position of the wire conductor 17 is determined as follows. First, the MMIC chip 12 is mounted on the mounting substrate 1.
The impedance is measured in a state where the signal lines 13 are joined to each other, and the amount of deviation of the impedance of the signal line 13 due to the positional deviation at the time of joining is determined. Next, the connection position of the wire conductor 17 is determined so as to eliminate the impedance deviation. At this time, since the relationship between the connection position and the impedance adjustment amount is calculated in advance, the connection position is set corresponding to the position of the adjustment scale pattern 15.

In the above case, if the connection position of the wire conductor 17 to the signal line 13 is set to a position away from the bonding pattern 14, a portion from that position to the tip of the signal line 13 becomes extra. And thus electrically function as a stub. Therefore, taking into account the effect of the stub, the connection position required for impedance adjustment is calculated in advance and set to an appropriate position.

According to the above configuration, the bonding pattern 14 is provided in a state of being electrically insulated from the signal line 13 so that the MM
Since the connection structure for connecting the signal line 13 and the bonding pattern 14 to the position where the impedance is adjusted by the wire conductor 17 after the bonding of the IC chip 12 is adopted, the MMI
It is possible to further reduce the impedance shift due to the positional shift of the junction of the C chip 12 and obtain a connection structure with good matching.

In the above configuration, the signal line 1
Since the adjustment graduation pattern 15 serving as a guide for determining the connection position of the wire conductor 17 was provided at the end of No. 3 by printing,
Simple and inexpensive, and high-precision impedance adjustment can be easily performed.

In the above embodiment, the connection position is adjusted on the signal line 13 side. Instead, the connection position with the bonding pattern 14 is adjusted to adjust the impedance. You can also. In this case, the same effect as described above can be obtained by forming the length of the joining pattern 14 so as to be long enough to secure an amount necessary for adjustment, and forming the scale pattern 15 for adjustment in that portion. Will be able to do it. Also, the signal line 13
It is also possible to adopt a configuration in which the impedance adjustment is performed by adjusting the connection positions of both the bonding patterns 14.

(Second Embodiment) FIGS. 5 and 6 show a second embodiment of the present invention. The difference from the first embodiment is that a mounting board 11 for adjusting impedance is provided. A plurality of impedance adjustment patterns 18a
To 18c. That is, as shown in FIG. 5, a plurality of, for example, 3
Impedance adjustment patterns 18a, 18b, 1
8c are arranged in a comb shape. Wire conductor 17
Is connected to one end of the joining pattern 14, the other is connected to any of the impedance adjustment patterns 18a to 18c, and is connected to the signal line 13 via the adjustment patterns 18a to 18c.

The impedance adjusting patterns 18a-1
8 c are arranged in a comb-tooth shape with respect to the joining pattern 14, and the other side is electrically connected to the signal line 13. Each impedance adjustment pattern 18a-
The wire conductors 18c are set to have different widths and lengths so as to eliminate the amount of impedance shift caused by the positional shift when the MMIC chip 12 is bonded. Are connected to each other as shown in the figure.

In this case, while the impedance adjusting pattern 18b is provided as a reference pattern in which no impedance shift occurs, the impedance adjusting pattern 18a has a wider width and a shorter length. The width is set to be short, and the impedance adjusting pattern 18c is formed such that only the width is set wide.

FIG. 6 shows the mounting substrate 11 in a state in which the MMIC chip 12 is being bonded. The tip of the signal line 13 has impedance adjustment patterns 18a to 18c.
Are arranged and formed in a comb shape. Between the impedance adjustment patterns 18a to 18c located on the left and right in the figure,
The impedance adjustment patterns 18a and 18c, 18b and 1
8b, 18c and 18a face each other via the mounting area of the high-frequency circuit element 12.

This is because, when performing impedance adjustment, when one of the impedances increases when the mounting position of the high-frequency circuit element 12 is displaced in the signal propagation direction of the signal line 13, the other impedance decreases. It is assumed. In either case, when bonding the two wire conductors 17 on the left and right sides, either of the impedance adjustment patterns 18a and 18c located on the upper side is selected, or the impedance adjustment patterns 18b and 18 at the intermediate position are selected.
The adjustment can be made by selecting either “b” or the lower impedance adjustment patterns 18c and 18a.

When any one of the three impedance adjustment patterns 18a to 18c is selected and the wire conductor 17 is connected as described above, the remaining two unselected impedance adjustment patterns 18a to 18c have the impedance of the portion. Affect. Each pattern shape and dimensions are set in consideration of the impedance given to the connection by the impedance adjustment patterns 18a to 18c when they are not actually connected.

According to the second embodiment, three impedance adjustment patterns 18a to 18c are provided at the end of the signal line 13 in advance, and when connecting the wire conductor 17, any one of them is selected. By connecting, you can adjust the impedance deviation, so with a simple configuration without using special technology or equipment,
Impedance adjustment can be performed in accordance with the displacement of the high-frequency circuit element.

In the above embodiment, the case where three impedance adjustment patterns 18a to 18c are provided has been described. However, it is needless to say that four or more impedance adjustment patterns can be provided.
Further, the impedance adjustment patterns 18a to 18c
Is provided not only on the signal line 13 side but also on the joining pattern 14 side, or may be provided on both sides as needed.

The impedance adjustment pattern 18a
When any one of .about.18c is selected and connected, the position with respect to the signal propagation direction may be adjusted as needed, so that finer impedance adjustment can be performed. In this case, the scale pattern 15 for adjustment may be printed and provided on each of the impedance adjustment patterns 18a to 18c.

(Third Embodiment) FIG. 7 shows a third embodiment of the present invention.
This embodiment is different from the first embodiment in that a ribbon conductor 19 is used as a connection conductor instead of the wire conductor 17. That is, as shown in the figure, a flat ribbon-shaped conductor is used as a connection conductor, and the ribbon-shaped conductor 19 has a width corresponding to the width of the signal line 13. This is connected to the position determined by the scale pattern 15 in the same manner as described above.

With such a configuration, the same operation and effect as described above can be obtained. Further, when the ribbon-shaped conductor 19 is connected, for example, the width of the ribbon-shaped conductor 19, By selecting and connecting thicknesses and the like as appropriate, the range of impedance adjustment can be narrowed, and the adjustment work by positioning can be performed with higher accuracy within the adjustment range.

(Fourth Embodiment) FIG. 8 shows a fourth embodiment of the present invention.
This embodiment is different from the second embodiment in that a ribbon-shaped conductor 19 is used as a connection conductor instead of the wire conductor 17. That is, as shown in the figure, a flat ribbon-shaped conductor is used as a connection conductor, and the ribbon-shaped conductor 1 is used.
Reference numeral 9 denotes a dimension whose width corresponds to the width of the signal line 13.
And the selected impedance adjustment patterns 18a to 18
The impedance matching is achieved by connecting to any one of the components c.

With such a configuration, the same operation and effect as described above can be obtained. Further, similarly to the third embodiment, by selecting the width of the ribbon-shaped conductor 19 as the connection conductor, the impedance can be reduced. It is possible to narrow down the adjustment range and perform highly accurate adjustment within the adjustment range.

(Fifth Embodiment) FIG. 9 and FIG.
The fifth embodiment of the present invention is different from the first embodiment in that a conductive layer 20 is formed as a connecting means instead of a conductor. That is, as a connecting means for electrically connecting between the signal line 13 and the bonding pattern 14, a conductive metal is implanted into a region between them to form a conductive layer 20, and the connection is made by this.

After the high-frequency circuit element 12 is adhered and fixed to the mounting substrate 11, the amount of impedance generated depending on the degree of positional deviation at that time is determined, and the conductive layer 20 is formed so as to eliminate the amount of impedance deviation. The scale pattern 15 for impedance adjustment serves as an index for setting a conductive metal implant region for forming the conductive layer 20.

FIG. 10 is a plan view of the mounting substrate 11 before the high-frequency circuit element 12 is joined. The signal line 13 and the joining pattern 14 are formed in the same manner as in the first embodiment. The distance g between them is set to a predetermined size. On the other hand, when the high-frequency circuit element 12 is bonded on the mounting board 11, a displacement of the impedance occurs due to the displacement.

The conductive layer 20 is formed by setting a region where the conductive metal is implanted so as to eliminate the deviation of the impedance, for example, by setting the region to a distance of d in the signal propagation direction. In this case, in the step of implanting the conductive metal, for example,
Target conductive metal ions (eg, As ions)
Is implanted into a desired region using a focused ion beam apparatus to form a conductive layer 20.

According to the fifth embodiment, the same operation and effect as those of the above-described embodiment can be obtained. In addition, since the connection means is formed by forming the conductive layer 20, the connection is poor. Inconvenience is reduced, and a highly reliable connection structure can be obtained.

(Sixth Embodiment) FIGS. 11 and 12
Shows a sixth embodiment of the present invention. The difference from the second embodiment is that a conductive layer 20 is formed instead of a conductor as a connecting means. In other words, a fifth connecting means for electrically connecting any one of the impedance adjusting patterns 18a to 18c provided at the end of the signal line 13 and the joining pattern 14 is used.
In the same manner as in the first embodiment, a conductive layer is formed by implanting a conductive metal into a region between them, and connection is made by this.

After the high-frequency circuit element 12 is adhered and fixed to the mounting substrate 11, the amount of impedance generated depending on the degree of positional displacement at that time is determined, and the conductive layer 20 is formed so as to eliminate the amount of impedance deviation. The formation region of the conductive layer 20 is formed by selecting one of the selected impedance adjustment patterns 18 a to 18 c and the bonding pattern 1.
4, and a conductive metal implantation process is performed.

FIG. 12 is a plan view of the mounting board 11 before the high-frequency circuit element 12 is fixed. Similar to the second embodiment, impedance adjustment patterns 18a to 18c are formed at the tip of the signal line 13. At the same time, a bonding pattern 14 is formed. As shown in the figure, for example, when the impedance adjustment-like pattern 18b is selected, the conductive layer 20 is formed so as to linearly connect with the bonding pattern 14.

According to the sixth embodiment, the same operation and effect as those of the above-described embodiment can be obtained. In addition, since the connecting means is connected by forming the conductive layer 20, the connection failure such as the occurrence of connection failure can be obtained. Inconvenience is reduced, and a highly reliable connection structure can be obtained.

In the above embodiment, the length between the selected impedance adjusting patterns 18a to 18c can also be adjusted to adjust the impedance, thereby achieving higher accuracy. Adjustment work can be performed.

The present invention is not limited to the above embodiment, but can be modified as follows. That is, in each of the above embodiments, the case where the MMIC chip 12 as the high-frequency circuit element is flip-chip connected is described. However, the bonding method is not limited to this, and the bonding pad of the MMIC chip 12 is connected to the bonding pad by a method such as wire bonding. After that, the signal line 1 is connected so as to eliminate the deviation of the impedance caused by the wire bonding with the chip.
The impedance may be adjusted by connecting the connection pattern 3 and the bonding pattern 14 by connecting means.

In the first embodiment, the scale pattern 15 is provided as a guide for setting the position where the wire conductor 17 is bonded. However, the scale pattern 15 may be provided as needed. 1
Even if 5 is lost, it can be implemented sufficiently. Further, the signal line 13 may be formed into a pattern with a scale in a shape corresponding to the scale pattern 15, or may be formed so as to be used as a guide for positioning by giving a difference in the width dimension or the forming direction of the pattern. .

[Brief description of the drawings]

FIG. 1 is a plan view and a cross-sectional view illustrating a mounted state of an MMIC chip according to a first embodiment of the present invention.

FIG. 2 is a plan view and a cross-sectional view showing a state where signal lines and bonding patterns are provided on a mounting board.

FIG. 3 is a plan view and a cross-sectional view showing a state where an Au bump is provided on a mounting substrate.

FIG. 4 is a plan view and a cross-sectional view showing a state in which an MMIC chip is fixed to a mounting board.

FIG. 5 is a view corresponding to FIG. 1, showing a second embodiment of the present invention;

FIG. 6 is a diagram corresponding to FIG. 3;

FIG. 7 is a view corresponding to FIG. 1, showing a third embodiment of the present invention;

FIG. 8 is a view corresponding to FIG. 1, showing a fourth embodiment of the present invention;

FIG. 9 is a view corresponding to FIG. 1, showing a fifth embodiment of the present invention;

FIG. 10 is a diagram corresponding to FIG. 3;

FIG. 11 is a view corresponding to FIG. 1, showing a sixth embodiment of the present invention;

FIG. 12 is a diagram corresponding to FIG. 3;

FIG. 13 is a diagram corresponding to FIG. 1 showing a conventional example.

[Description of Signs] 11 is a mounting board, 12 is an MMIC chip (high-frequency circuit element), 13 and 13a are signal lines, 14 is a bonding pattern, 15 is a scale pattern, 16 is an Au bump, and 17 is a wire conductor (connection means). , Connection conductors), 18a to 18c are impedance adjustment patterns, 19 is a ribbon-shaped conductor (connection means, connection conductor), and 20 is a conductive layer (connection means).

Claims (13)

[Claims] 1. A mounting structure of a high-frequency circuit element for fixing a high-frequency circuit element on a mounting substrate on which a signal line is formed and electrically connecting the high-frequency circuit element and the signal line. In the mounting region of the high-frequency circuit element, the signal line is formed in an electrically insulated state and is electrically connected to the high-frequency circuit element, and a bonding pattern is formed between the signal line and the bonding pattern. A high-frequency circuit comprising: a connection means for electrically connecting; and a scale pattern for setting a connection position formed on a portion for adjusting the position of the portion for connecting the connection means. Device mounting structure. 2. A mounting structure of a high-frequency circuit element for fixing a high-frequency circuit element on a mounting substrate on which a signal line is formed, and electrically connecting the high-frequency circuit element and the signal line. In the mounting region of the high-frequency circuit element, the signal line is formed in an electrically insulated state and is electrically connected to the high-frequency circuit element, and a bonding pattern is formed between the signal line and the bonding pattern. A mounting structure for a high-frequency circuit element, comprising: connecting means for electrically connecting, and a plurality of impedance adjustment patterns arranged at a portion connecting the connecting means so that the connecting means can be selectively connected. . 3. The mounting structure for a high-frequency circuit element according to claim 2, wherein the plurality of impedance adjustment patterns are arranged in a comb shape. 4. The mounting structure for a high-frequency circuit device according to claim 1, wherein said connection means is a connection conductor connected between said signal line and said joining pattern. Characteristic high-frequency circuit element mounting structure. 5. A mounting structure of a high-frequency circuit element for fixing a high-frequency circuit element on a mounting substrate on which a signal line is formed and electrically connecting the high-frequency circuit element and the signal line. A bonding pattern formed in a mounting area of the high-frequency circuit element so as to be electrically insulated from the signal line and electrically connected to the high-frequency circuit element; and the signal line and the bonding pattern on the mounting board. And a connection means comprising a conductive layer region formed so as to introduce metal particles into a region between the two and electrically connect the two. 6. The mounting structure for a high-frequency circuit element according to claim 1, wherein the connection unit adjusts an impedance between the signal line and the high-frequency circuit element. A mounting structure for a high-frequency circuit element, wherein the mounting structure is provided so as to adjust at least one connection position between each of the joining patterns. 7. The mounting structure for a high-frequency circuit device according to claim 1, wherein the mounting substrate is made of a conductive metal. 8. The mounting structure for a high-frequency circuit device according to claim 1, wherein the mounting substrate is made of ceramic. 9. The mounting structure for a high-frequency circuit element according to claim 1, wherein the high-frequency circuit element has a gold bump formed at a joint portion with the mounting substrate. Mounting structure of high-frequency circuit elements. 10. The mounting structure of a high-frequency circuit element according to claim 1, wherein the high-frequency circuit element is joined to the mounting board by soldering. Construction. 11. The mounting structure for a high-frequency circuit element according to claim 4, wherein the connection conductor is a wire conductor. 12. The mounting structure for a high-frequency circuit element according to claim 4, wherein the connection conductor is a ribbon-shaped conductor. 13. A method for mounting a high-frequency circuit element on a mounting board and electrically connecting the high-frequency circuit element to a signal line, wherein the mounting board is electrically insulated from the signal line pattern. Providing a bonding pattern on the mounting portion of the high-frequency circuit element; bonding the high-frequency circuit element to the bonding pattern portion of the mounting board; connecting the bonding pattern and the signal line pattern A method for mounting a high-frequency circuit element, comprising the steps of connecting with a conductor.