JP2000267125A - Liquid crystal panel, method of manufacturing the same, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a protection structure for a surface of an overhang area instead of a conventional resin mold so that a resin molding process is not required and the surface of the overhang area can be used as a support surface or a positioning surface. It can be so. SOLUTION: An insulating film 112 formed so as to cover an electrode layer 111 is drawn from a liquid crystal sealing region surrounded by a sealing agent 13 under the sealing agent 13 onto a surface of an overhang region 11a. Structure. This insulating film 1
Insulating film 11 formed on the surface of overhang region 11a
The second extension forming portion 112a covers the wiring 131.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal panel and a method for manufacturing the same.

[0002]

2. Description of the Related Art In general, as a liquid crystal panel, a pair of transparent substrates are bonded together via a sealant to form a liquid crystal sealing region between the substrates, and liquid crystal is injected into the liquid crystal sealing region and sealed. It has a unique structure.

FIG. 7 shows an example of such a liquid crystal panel.
Fig. 1 schematically shows the structure. This liquid crystal panel 10
Has substrates 11 and 12 made of glass or the like bonded together via a sealant 13, and a liquid crystal 14 is sealed between the substrates 11 and 12. On the opposing surface of the substrate 11, an electrode layer 111 made of a transparent conductor such as ITO, an insulating film 112, and an alignment film 1
13 are sequentially laminated, and the electrode layer 1
21, an insulating film 122 and an alignment film 123 are sequentially stacked. The electrode layers 111 and 121 are for applying an electric field to the liquid crystal 14. The insulating films 112 and 122 are called an overcoat film or a top coat film, and when conductive dust enters the liquid crystal sealing region between the substrates 11 and 12, the dust causes the electrode layer 111 to enter.
And 121 are insulating means for preventing a short circuit. The alignment films 113 and 123 are for controlling the alignment of the liquid crystal 14 in a predetermined state.

[0004] The substrate 11 has an area slightly larger than the substrate 12, and an end of the substrate 11 is an overhang region 11 a that extends outward from the end of the substrate 12. As shown in FIG. 8, which is a plan view showing the surface structure of the overhang region 11a, a plurality of wirings (for example, the electrode layer 111) electrically connected to the electrode layers 111 and 121 are provided on the surface of the overhang region 11a. , 121) are formed. Of the wirings 131, those electrically conductively connected to the electrode layer 111 are drawn out of the liquid crystal sealed region as they are under the sealant 13 onto the surface of the overhang region 11 a. What is conductively connected to 121 is transferred from the surface of the substrate 12 to the surface of the substrate 11 via the vertical conduction portion (not shown), and is drawn out from there onto the surface of the overhang region 11a.

[0005] On the surface of the overhang region 11a, an integrated circuit chip 133 is provided on the wiring 131 via an anisotropic conductive film 132 such as an ACF (Anisotropic Conductive Film).
Are electrically connected by thermocompression bonding or the like. In addition, a plurality of wirings 134 are formed on the surface of the overhang region 11a in addition to the wirings 131.
34 is also conductively connected to the terminal of the integrated circuit chip 133 via the anisotropic conductive film 132. The other ends of these wirings 134 are connected to the same anisotropic conductive film 135 as described above.
It is electrically conductively connected to the connection terminal of the flexible wiring board 136 via a heat seal or the like. There are various types of liquid crystal panels other than those having a COG (Chip On Glass) structure as described above.
In the case where a wiring member such as a flexible wiring substrate is directly conductively connected to the wiring 131 without mounting the integrated circuit chip on the surface of a, or various connectors made of anisotropic conductive rubber or the like are directly connected to the wiring 134. It may be configured to make contact. The structure on the surface of the overhang region 11a configured as described above is formed of a silicone resin in order to prevent electrical erosion of a large number of wirings 131 formed in parallel with a fine formation pitch and a fine line width. And the like. FIG. 8 shows a state before the surface of the overhang region 11a is covered with the insulating resin 137.

[0006]

When the above-described liquid crystal panel 10 is installed in various electronic devices, the liquid crystal panel 10 is directly mounted on a component such as a frame or a circuit board of the electronic device. It is necessary to mount or fix the liquid crystal panel 10 to a supporting (fixed) frame, a light guide, or another support, and to attach this support to the above-mentioned constituent members. In this case, usually, the ends of the substrates 11 and 12 of the liquid crystal panel 10 are supported or positioned so as to abut against the support.

However, with the recent miniaturization and thinning of electronic equipment, the liquid crystal panel 10 itself has been required to be thinner, and the substrates 11, 1 made of glass or the like have been required.
There is a movement to meet the above-mentioned demand by reducing the thickness of No. 2. In such a situation, the substrate 11,
When the thickness of the substrate 12 decreases, the strength of the substrate 11 also decreases. Therefore, when a stress due to an impact or the like is applied to the ends of the substrates 11 and 12 abutted on the supporting member, the substrates 11 and 12 may be damaged. In particular, in the liquid crystal panel having the above-described COG structure, since the overhang length of the overhang region 11a is large, there is a high possibility that the overhang region 11a of the substrate 11 is cracked.

In order to solve such a problem, it is not publicly known. However, by contacting a large part of the surface of the overhang region 11a with the support member, the support area is increased.
There are proposals to make up for insufficient strength of the substrate. However, since the surface of the overhang region 11a of the liquid crystal panel 10 is resin-molded with the insulating resin 137 as described above, there is a problem that the surface of the overhang region 11a cannot be used as a support surface or a positioning surface. .

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a protection structure for a surface of an overhang area which is different from a conventional resin mold, thereby eliminating the need for a resin molding step and providing an overhang area. Is used as a support surface or a positioning surface.

[0010]

In order to solve the above-mentioned problems, a liquid crystal panel according to the present invention has a liquid crystal sealing region in which liquid crystal is sealed between a pair of substrates bonded to each other. An electrode for applying an electric field to the liquid crystal and an insulating film covering the electrode are formed thereon, and one of the substrates is provided with an overhanging region that extends beyond an end of the other substrate. A liquid crystal panel in which a plurality of wirings drawn from the liquid crystal sealing region and connected to the electrodes are formed on a surface of the region, wherein the insulating film is formed on the surface of the projecting region together with the liquid crystal sealing region. Wherein the insulating film covers at least a part of the wiring on the surface of the overhang region.

According to the present invention, by forming the insulating film formed in the liquid crystal sealing region so as to cover the wiring also on the surface of the overhanging region, the resin molding step can be made unnecessary and a new process can be performed. It is possible to reliably protect the wiring from electrical contact and the like without generating a complicated process. In addition, since the surface of the overhang region can be formed flat, the surface of the overhang region can be used as a support surface or a positioning surface of the liquid crystal panel.

Here, it is more preferable that the insulating film is formed continuously on the surface of the overhang region continuously from the liquid crystal sealing region in order to enhance the protection performance of the wiring. Further, it is desirable that the insulating film is an overcoat layer formed in the liquid crystal sealing region and for preventing a short circuit between electrodes formed on the substrate due to mixed dust and the like.

In the present invention, it is preferable that the insulating film is provided with an exposure opening for exposing a conductive connection portion of the wiring.

According to the present invention, since the exposure opening for exposing the conductive connection portion of the wiring formed on the surface of the overhang region is provided, the conductive connection portion is not subjected to an opening process in a later step. An integrated circuit chip, a wiring member, and the like can be mounted thereon.

In the present invention, it is preferable that the conductive connecting portion is conductively connected to an integrated circuit or a wiring member.

In this case, it is desirable that an anisotropic conductive film is interposed between the conductive connecting portion and the integrated circuit or the wiring member.

In this case, it is preferable that the anisotropic conductive film is arranged so as to cover at least all of the portions of the wiring exposed at the exposed opening, which need to be protected.

According to the present invention, at least a portion of the wiring portion exposed by the exposure opening, which needs to be protected, for example, a wiring portion having a small wiring pitch and a small wiring width is covered with the anisotropic conductive film. By doing so, the portion not protected by the insulating film can be protected by the anisotropic conductive film, so that the protection performance can be further improved. In addition, the above-mentioned part which needs to be protected means, for example, a wiring directly drawn out of the liquid crystal sealed area, and the part which does not need to be protected is, for example, drawn directly from the liquid crystal sealed area. When the wiring is once connected to an integrated circuit mounted on the overhang region, it refers to a wiring for forming an external terminal connected only to the integrated circuit. The latter wiring is usually formed with a larger wiring pitch and wiring width than the former wiring.

It is preferable that an edge of the anisotropic conductive film overlaps with an edge of the insulating film.

Since the edge of the anisotropic conductive film overlaps with the edge of the insulating film, no gap is formed between the edges of the insulating film and the anisotropic conductive film. In addition, even if there is a slight shift in the formation pattern position of the insulating film or the deposition position of the anisotropic conductive film during the manufacturing process due to the presence of the overlapping width of both ends,
The risk of creating a gap is reduced.

Next, as a method of manufacturing a liquid crystal panel of the present invention, there is provided a liquid crystal sealing region in which liquid crystal is sealed between a pair of substrates bonded to each other, and one of the substrates has the other substrate. In the method for manufacturing a liquid crystal panel provided with an overhanging region extending beyond the end of the liquid crystal panel, electrodes are formed on the surfaces of the pair of substrates, respectively, and on the surface of one of the substrates corresponding to the overhanging region. Forming an interconnect connected to the electrode, and then forming an insulating film covering the electrode on the surface of one of the substrates, and forming an insulating film on the surface of the substrate corresponding to the overhang region by the insulating film. And covering at least a part of the wirings formed on the substrate, and thereafter, the substrates are bonded to each other to form the liquid crystal sealing region.

In the present invention, it is preferable that an exposed opening for exposing a conductive connection portion of the wiring is provided in the insulating film on a surface of the one substrate corresponding to the overhang region.

It is preferable that the conductive connection portion exposed by the exposure opening is conductively connected to an integrated circuit or a wiring member.

Further, it is preferable that an anisotropic conductive film is applied on the conductive connection portion, and the conductive connection portion and the integrated circuit or the wiring member are conductively connected via the anisotropic conductive film. .

It is preferable that the anisotropic conductive film is applied so as to cover at least a portion of the wiring exposed by the exposure opening that needs to be protected.

Preferably, the edge of the anisotropic conductive film is attached so as to overlap the edge of the insulating film.

Here, it is preferable to provide a first positioning portion for positioning the edge of the insulating film and a second positioning portion for positioning the edge of the anisotropic conductive film.

In this case, the first positioning portion and the second positioning portion can be constituted by different portions of the peripheral portion of the common positioning mark.

The liquid crystal panel of each of the above inventions is installed in various electronic devices. In this case, the liquid crystal panel is installed on a component such as a circuit board in the electronic device. At this time, for supporting or positioning the liquid crystal panel, the surface of the above-mentioned overhanging region (the surface portion excluding the mounting portion when an integrated circuit or the like is mounted) can be used as a support surface or a positioning surface. The surface of the overhang region may directly contact the above-mentioned constituent member, or may be configured to contact the support of the liquid crystal panel.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a liquid crystal panel and a method of manufacturing the same according to the present invention will be described in detail. FIG. 1 is a schematic sectional view schematically showing the structure of the liquid crystal panel of the present embodiment. This structure is basically the same as the above-described conventional liquid crystal panel. Substrates 11 and 12, sealant 13, liquid crystal 14, electrode layers 111 and 121, insulating films 112 and 12 are provided.
2, alignment films 113 and 123, wirings 131 and 134, anisotropic conductive film 132, and integrated circuit chip 133 are shown in FIGS.
Are similar to those shown in FIG.

In the present embodiment, an insulating film 112 formed so as to cover the electrode layer 111 passes under the sealant 13 from the liquid crystal sealed area surrounded by the sealant 13 to protrude from the overhanging area 11a. It is a structure drawn out on the surface of. The extension forming portion 112 a of the insulating film 112 formed on the surface of the overhang region 11 a of the insulating film 112 covers the wiring 131.

FIG. 2 is a plan view showing the surface structure of the overhang region 11a of the present embodiment. In this figure, the insulating film 1
The twelve extension forming portions 112a are hatched portions extending in the upper right direction in the figure, and cover many portions of the wiring 131. This extension forming part 112a is integrated circuit chip 1
33 is formed so as to avoid the vicinity of the portion where the mounting is performed. That is, the periphery of the connection portion is not covered with the insulating film 112 so that each of the wirings 131 is electrically connected to the bump electrode 133a of the integrated circuit chip 133.
The conductive connection between each of the wirings 131 and the bump electrodes 133a of the integrated circuit chip 133 is made by dispersing fine conductive particles (such as a gold-plated resin ball) in a thermoplastic resin. ), And is attached to a hatched portion extending below and to the upper left of the integrated circuit chip 133 in the figure. Here, the end of the anisotropic conductive film 132 is attached so as to overlap with the end of the extension forming portion 112a.

As described above, the wiring 134 has a relatively large line width as compared with the wiring 131 and has a smaller number of terminals than the wiring 131 and the like. Has become. Also,
In the present embodiment, the wiring 134 is configured to be pressed into contact with a connector made of anisotropic conductive rubber or the like (not shown). In this case, a wiring member such as a flexible wiring substrate may be conductively connected to the wiring 134 via the anisotropic conductive film as described above.

Next, the manufacturing process of the above structure will be described with reference to FIGS. First, a transparent conductor, for example, ITO (indium tin oxide) is formed on the surface of the substrate 11.
Is deposited by a PVD method such as evaporation or sputtering, and is patterned using a known photolithography method or the like, whereby the electrode layer 111 and the wirings 131 and 134 shown in FIG. 1 are formed. Alternatively, these may be selectively formed by a PVD method using a shielding mask. FIG. 3 shows the overhang region 1 on the surface of the substrate 11.
Only the surface of 1a (the area to be formed) is shown. In this step, the positioning marks 137, 138, and 139 are formed by the same material and the same method as those described above, together with the electrode layer 111 and the wirings 131 and 134. The positioning mark 137 defines the position of the edge of the extension forming portion 112a of the insulating film 112, the positioning mark 138 defines the position of the edge of the anisotropic conductive film 132, and the positioning mark 139 defines The position of the outer edge of the integrated circuit chip 133 is determined. Also,
The distal end of the wiring 131 which is not covered with the extension forming portion 112a (hatched portion) of the insulating film is a connection terminal portion 131a which is conductively connected to the bump electrode 133a of the integrated circuit chip 133 by the anisotropic conductive film 132. .

Next, an insulating film 112 is formed in the liquid crystal sealing region of the substrate 11. As described above, the insulating film 112 is simultaneously formed on the surface of the overhang region 11a as the extension forming portion 112a. The insulating film 112 is formed of SiO ₂ , TiO _2, or the like by a sputtering method, an oxidation method, or the like. The insulating film 112 is also formed in a predetermined pattern on the surface of the substrate 11 by performing patterning or selectively forming the insulating film 112 using a shielding mask. At this time, the positioning is performed so that the edge of the extension forming portion 112a is aligned with the positioning mark 137 during patterning or selective formation. In the example shown in FIG. 3, the positioning mark 137 is used to position the edge of the extension forming portion 112a facing the mounting region of the integrated circuit chip 133. This positioning is performed by capturing the surface image of the substrate 11 with a camera or the like, detecting the position of the positioning mark 137 in the surface image by a known image processing technique or the like, and aligning an exposure mask during patterning or a shielding mask during selective formation. Is carried out.

Next, an orientation film 113 shown in FIG. 1 is formed on the surface of the substrate 11 and subjected to a known orientation treatment. Then, the substrate 11 is similarly treated with an electrode layer 121, an insulating film 122 and an orientation film 123. A liquid crystal cell is completed by bonding the substrate 12 on which is formed via the sealant 13 shown in FIG. 1 and injecting and sealing a liquid crystal 14. Then, the positioning mark 138 is provided on the surface of the overhang region 11a shown in FIG.
Is used to deposit the anisotropic conductive film 132. At this time, due to the positional relationship between the positioning marks 137 and 138, the outer edge 132b of the anisotropic conductive film 132 is larger than the outer edge 112b of the extended portion 112a of the insulating film.
As a result, the edge of the anisotropic conductive film 132 overlaps with the edge of the extension forming portion 112a of the insulating film.

FIG. 5 shows the positioning marks 137 and 138.
And the relationship between the extension forming portion 112a and the edge of the anisotropic conductive film 132. Here, the positioning mark 137
Is set as a reference for setting the position of the outer edge 112b of the extension forming portion 112a, and the left edge 137a of the positioning mark 138 is set as the reference.
Reference numeral 38a is set as a reference for determining the position of the outer edge 132b of the anisotropic conductive film 132. Therefore, the edge of the extension forming portion 112a and the edge of the anisotropic conductive film 132 are designed to overlap by a width d between the peripheral portions 137a and 138a in design. The width d is set in consideration of the pattern accuracy at the time of forming the insulating film 112 and the deposition accuracy of the anisotropic conductive film 132. 112a and anisotropic conductive film 132
It is designed so that there is no gap between them.

FIG. 6 shows another example of forming a positioning mark. In this drawing, a positioning mark 137 'is formed, and a peripheral portion 137'a on the left side of the positioning mark 137' in the drawing is formed on an outer edge 112b of the extension forming portion 112a.
Is designed so that the peripheral portion 137 ′ b on the right side in the figure defines the position of the outer edge 132 b of the anisotropic conductive film 132.

After the anisotropic conductive film 132 is deposited as described above, the integrated circuit chip 133 shown in FIG. The bump electrode 133a is made of an anisotropic conductive film 13.
2 is set so as to correspond to the connection terminal portion 131a of the wiring 131 on the surface of the overhang region 11a via the second terminal 2a. And
The integrated circuit chip 133 is connected by a thermocompression bonding device (not shown).
And the overhang area 11a are mutually pressurized against each other,
Heated at the same time. The base resin of the anisotropic conductive film 132 softened by the heating is crushed by the pressing force, and the conductive particles dispersed in the base resin become the integrated circuit chip 1.
The terminal 31 is electrically connected to the connection terminal 131a of the wiring 131.

The conductive connection structure using such an anisotropic conductive film and the thermocompression bonding method employ the wiring 13 as shown in FIG.
This is not limited to the case where the flexible wiring board 136 as the wiring member is conductively connected to the wiring 4 or the case of the above-described COG structure.

In the above-described embodiment, the insulating film 112 formed in the liquid crystal sealing region is formed to extend on the overhang region 11a, that is, the portion of the insulating film 112 in the liquid crystal sealing region and the extension forming portion 112a are formed. Formed in an interconnected state,
This enhances the protection of the wiring from electrical erosion and other protection by the insulating film. However, in the present invention, the insulating film 112 is extended over the surface formed in the liquid crystal enclosing region and over the surface of the overhang region 11a. The formation part 112a may be formed in a state separated from each other.

In the above embodiment, the insulating film 112 as an overcoat layer for preventing a short circuit failure of the liquid crystal panel is formed on the surface of the overhang region 11a. It is similarly effective to form an insulating film on the surface of the overhang region 11a. Further, since the above-described alignment film 113 also has an insulating property, the alignment film 113 may be formed on the surface of the overhang region 11a instead of the extension forming portion 112a.

Further, in the above embodiment, the overhang area 11
Of the wirings 131 and 134 formed in the area of the surface a of FIG. 1A and not covered by the extension forming portion 112a, only the wiring 131 that needs to be protected is completely covered with the anisotropic conductive film 132. However, as shown by the dotted line in FIG. 2, the anisotropic conductive film 132 may be applied so as to completely cover the wiring 134 as well. That is, this shows a state in which the anisotropic conductive film 135 and the anisotropic conductive film 132 in FIG. 8 are integrally formed, whereby the anisotropic conductive film is completely covered by the anisotropic conductive film.

It should be noted that the liquid crystal panel of the present invention is not limited to the above-described illustrated examples, and it is needless to say that various changes can be made without departing from the spirit of the present invention.

[0045]

As described above, according to the present invention,
By forming the insulating film formed in the liquid crystal enclosing area so as to cover the wiring on the surface of the overhanging area, the resin molding step can be made unnecessary and the new step can be surely performed without generating a new step. Wiring can be protected from electric contact and the like. In addition, since the surface of the overhang region can be formed flat, the surface of the overhang region can be used as a support surface or a positioning surface of the liquid crystal panel.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view schematically showing a schematic structure of an embodiment of a liquid crystal panel according to the present invention.

FIG. 2 is a schematic enlarged plan view showing a surface structure of an overhang region of the embodiment.

FIG. 3 is a schematic enlarged plan view showing a state in which an insulating film is formed on a surface of an overhang region in the embodiment.

FIG. 4 is a schematic enlarged plan view showing a state in which an anisotropic conductive film is applied on the surface of the overhang region in the same embodiment.

FIG. 5 is an enlarged explanatory view showing an arrangement of positioning marks in the embodiment.

FIG. 6 is an enlarged explanatory view showing a modified example of the positioning mark of the embodiment.

FIG. 7 is a schematic enlarged plan view showing a schematic structure of a conventional liquid crystal panel.

FIG. 8 is a schematic enlarged plan view showing a surface structure of an overhang region of a conventional liquid crystal panel.

[Explanation of symbols]

 Reference Signs List 10 liquid crystal panel 11, 12 substrate 111, 121 electrode layer 112, 122 insulating film 113, 123 alignment film 131, 134 wiring 132, 135 anisotropic conductive film 133 integrated circuit chip 136 flexible wiring substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA33 GA41 GA44 GA48 GA49 GA50 GA51 GA55 GA57 GA60 HA25 NA15 NA16 NA17 NA25 NA27 NA29 PA06 5G435 AA00 AA17 BB12 EE37 EE42 EE47 FF00 FF01 HH12 HH14 KK03 KK05 KK05

Claims (15)

[Claims] 1. A liquid crystal enclosing region in which liquid crystal is sealed between a pair of substrates bonded to each other, and an electrode for applying an electric field to the liquid crystal and an insulating material covering the electrode are provided on a surface of the substrate. A film is formed, and one of the substrates is provided with an overhang region extending beyond the edge of the other substrate, and the surface of the overhang region is pulled out of the liquid crystal sealing region and connected to the electrode. A liquid crystal panel on which a plurality of wirings are formed, wherein the insulating film is formed on the surface of the overhang region together with the inside of the liquid crystal sealing region, and the insulating film is formed on the surface of the overhang region. A liquid crystal panel which covers at least a part of a wiring. 2. The liquid crystal panel according to claim 1, wherein the insulating film is provided with an exposure opening for exposing a conductive connection portion of the wiring. 3. The liquid crystal panel according to claim 2, wherein the conductive connection portion is conductively connected to an integrated circuit or a wiring member. 4. The conductive connection according to claim 3, wherein:
A liquid crystal panel, wherein an anisotropic conductive film is interposed between the integrated circuit and the wiring member. 5. The semiconductor device according to claim 4, wherein the anisotropic conductive film is disposed so as to cover at least all of the portions of the wiring exposed at the exposed opening that need to be protected. LCD panel. 6. The liquid crystal panel according to claim 4, wherein an edge of the anisotropic conductive film overlaps an edge of the insulating film. 7. A liquid crystal sealing area in which liquid crystal is sealed between a pair of substrates bonded to each other, and one of the substrates is provided with an overhanging area that extends beyond an end of the other substrate. In the method for manufacturing a liquid crystal panel, an electrode is formed on each of the surfaces of the pair of substrates, and a wiring connected to the electrode is formed on a surface of the one substrate corresponding to the overhang region, Next, an insulating film covering the electrode is formed on the surface of one of the substrates, and at least a part of the wiring formed on the surface of the substrate corresponding to the overhang region by the insulating film. And thereafter, bonding the substrates to each other to form the liquid crystal enclosing region. 8. The insulating film according to claim 7, wherein an exposed opening for exposing a conductive connection portion of the wiring is provided on a surface of the one substrate corresponding to the overhang region. Liquid crystal panel manufacturing method. 9. The method for manufacturing a liquid crystal panel according to claim 8, wherein the conductive connection portion exposed by the exposure opening is conductively connected to an integrated circuit or a wiring member. 10. The conductive connection portion according to claim 9, wherein an anisotropic conductive film is applied on the conductive connection portion, and the conductive connection portion and the integrated circuit or the wiring member are electrically connected via the anisotropic conductive film. A method for manufacturing a liquid crystal panel, comprising connecting. 11. The liquid crystal according to claim 10, wherein the anisotropic conductive film is applied so as to cover at least all of the portions of the wiring exposed by the exposure opening that need to be protected. Panel manufacturing method. 12. The method for manufacturing a liquid crystal panel according to claim 10, wherein the edge of the anisotropic conductive film is attached so as to overlap the edge of the insulating film. 13. The method according to claim 12, wherein a first positioning portion for positioning an edge of the insulating film and a second positioning portion for positioning an edge of the anisotropic conductive film are provided. Characteristic liquid crystal panel manufacturing method. 14. The liquid crystal panel according to claim 13, wherein said first positioning portion and said second positioning portion are formed by different portions of a peripheral portion of a common positioning mark. 15. An electronic device comprising the liquid crystal panel according to claim 1. Description: