JP2000260674A - Method of analyzing operation of manufacturing apparatus and manufacturing apparatus for implementing the method - Google Patents

Abstract

(57) [Problem] To provide an operation analysis method of a manufacturing apparatus capable of immediately performing accurate analysis without reducing production efficiency and reducing analysis cost. Further, a manufacturing apparatus for performing the operation analysis method is provided. An operation history control unit and an operation history recipe storage unit are provided in a control unit of a manufacturing apparatus (CVD apparatus).
And an operation history result storage unit 43. The operation history control unit 40 detects a change in the operation state information at the start and end of operation of the processing unit to be analyzed, and the detected change in the operation state information is sequentially stored in the operation history result storage unit 43 as operation history information. It is memorized. The selection of the analysis target and the like are performed according to the operation history recipe stored in the operation history recipe storage unit 41. The analysis of the manufacturing apparatus can be performed based on the operation history information.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for analyzing the operation of a manufacturing apparatus and a manufacturing apparatus for performing the method. In particular, the present invention relates to an operation analysis method performed for using a manufacturing apparatus in an optimum state, and an optimum manufacturing apparatus for performing the operation analysis method.

[0002]

2. Description of the Related Art FIG. 13 is a schematic diagram showing an example of a semiconductor manufacturing apparatus used for manufacturing a semiconductor device, and FIG. 14 is a block diagram showing a control unit of the semiconductor manufacturing apparatus. FIG.
1 is a chemical vapor deposition apparatus (hereinafter, simply referred to as a CVD apparatus) 100.
Are film forming units (vacuum chambers) 101 and 102;
Loading / unloading units 104 and 105 and transport unit 10
3 and a control unit 200.

Each of the film forming units 101 and 102 is a processing unit for forming a thin film on the semiconductor wafer 110. Each of the carry-in / out units 104 and 105 carries the unprocessed semiconductor wafer 110 into or from the film-forming unit 101 or 102, or
A processing unit that unloads the processed semiconductor wafer 110 from 02. The transport unit 103 includes the film forming unit 10
1 and 102 and carry-in / out units 104 and 105
Is a processing unit which carries in or takes out the semiconductor wafer 110 from / to each of the above.

The control unit 200 controls the processing operation of each processing unit. As shown in FIG. 14, the control unit 200 includes a main control unit 201, a process recipe control unit 202,
Processing recipe storage unit 203, processing result storage unit 204, operation recipe control unit 205, operation recipe storage unit 206, alarm processing unit 207, alarm recipe storage unit 208, alarm result storage unit 209, operation terminal 210, external storage device 2.
11 are constructed.

[0005] In the CVD apparatus 100 shown in FIGS. 13 and 14, an unprocessed semiconductor wafer 110 stored in the carry-in / out unit 104 is carried by the carrying unit 103 to each of the film forming units 101 and 102. In each of the film forming units 101 and 102, a thin film is formed on the semiconductor wafer 110 by the CVD method. A processed semiconductor wafer 110 on which a thin film has been formed.
Is transported from each of the film forming units 101 and 102 to the loading / unloading unit 105 by the transport unit 103, and is stored in the loading / unloading unit 105.

[0006] The film forming process performed by the CVD apparatus 100 includes a process recipe stored in the control unit 200 in advance.
It is performed automatically in accordance with the operation recipe and the alarm recipe. The processing recipe is information for setting the processing conditions of the semiconductor wafer 110 in each of the film forming units 101 and 102 in lot units or wafer units. The operation recipe is information instructing control contents such as operation items, operation order, and the like of the film forming units 101 and 102, the carry-in / out units 104 and 105, and the transport unit 103. The alarm recipe is information for controlling an alarm generated in each processing unit such as the film forming units 101 and 102.

The processing recipe is input from the operation terminal 210 of the control unit 200 or the external storage device 211 and stored in the processing recipe storage unit 203. The processing recipe stored in the processing recipe storage device 203 is stored in the processing recipe control unit 20.
2. The film forming unit 1 through each of the main control units 201
01 and 102 can be controlled. The processing result is stored in the processing result storage unit 204.

[0008] Similarly, the operation recipe is input from the operation terminal 210 or the external storage device 211 and stored in the operation recipe storage unit 206. The operation recipe stored in the operation recipe storage unit 206 includes the operation recipe control unit 205 and the main control unit 2.
01, the operation of each processing unit can be controlled. The alarm recipe is input from the operation terminal 210 or the external storage device 211, and is stored in the alarm recipe storage unit 2
08 is stored. The alarm recipe stored in the alarm recipe storage unit 208 can control generation of an alarm in each processing unit through each of the alarm processing unit 207 and the main control unit 201. The alarm generation result is stored in the alarm result storage unit 209.

In this type of the CVD apparatus 100, with the demand for higher precision and higher quality of the semiconductor device, the manufacturing method tends to be complicated, and the device configuration tends to be more complicated and higher in function. . Incorporating a plurality of film forming units 101 and 102 into the CVD apparatus 100 for high accuracy, high quality, and improvement in production capacity is also an example of such a technical trend.

Not only the CVD apparatus 100 but also many semiconductor manufacturing apparatuses have been complicated and multifunctional in order to maximize the production capacity. While maintaining high quality, semiconductor devices are used while optimizing and improving variable factors of device performance according to product specifications and manufacturing methods of semiconductor devices. The level of demand for higher precision, higher quality, and higher efficiency is constantly being increased, and there are quite a number of cases in which significant functions are added or modified in semiconductor manufacturing equipment.

In the CVD apparatus 100, a main variable factor in optimizing the apparatus is a processing recipe, and this processing recipe can generally be arbitrarily changed or set by a user. In order to improve production capacity, the film forming units 101 and 1
02 is the best means to reduce the film formation processing time. Also, besides shortening the film formation processing time, oversee the system configuration of the entire system and the entire use environment, and improve the parts that are inappropriate for improving the production efficiency in all operating states such as during production operation and maintenance and inspection. Is also the best way to increase production capacity.

For example, when analyzing the production efficiency for the purpose of shortening the processing time during the production operation, in addition to the processing time for performing the film forming process on the semiconductor wafer 110 by the film forming unit 101 or 102, the processing time of the semiconductor wafer 110 is It is necessary to investigate in detail each operation time at the time of lot processing, such as carry-in / out time and incidental operation time, and to diagnose the operation status. Factors that degrade production efficiency include time loss between processing operations. In the CVD apparatus 100 shown in FIG. 13, the transport unit 13
, The unprocessed semiconductor wafer 110 is sequentially carried in, and after the film formation, the semiconductor wafer 110 is immediately carried out from each of the film forming units 101 and 102.
For example, even though the film forming process is completed in one of the film forming units 101, the processed semiconductor wafer 1
If the transfer unit 10 is not carried out by the transport unit 103, the stop time of the carry-out operation results in a time loss.

In order to investigate and diagnose the time loss and analyze the production efficiency comprehensively, the start time and end time of the film forming process in each of the transport units 101 and 102 and the carry-in time and the carry-out time in the transport unit 103 are determined. Analytical workers carefully measure or use CVD equipment 100
It is necessary to have the manufacturing equipment manufacturer remodel so that the signal of the time information can be taken out by itself.

However, the loading operation and the unloading operation of the semiconductor wafer 110 by the transfer unit 103 are performed at a high speed due to an improvement in production efficiency.
Since the film forming processes 1 and 102 are performed in a predetermined gas atmosphere in a state where visibility is poor, visual measurement by the former analysis operator is substantially impossible. On the other hand, in the latter remodeling of a manufacturing apparatus maker, an analysis target for extracting a signal, that is, the film forming units 101 and 102 or the transport unit 103
Is specified, the specifications of the signal extraction method are determined, and the modification is requested. When the specification of the analysis target and the signal extraction method are changed, the modification is requested each time. For this reason, if the specification of the analysis target and the specification of the signal extraction method include the remodeling by the manufacturing apparatus maker and the operation confirmation work after the remodeling, the time and cost required for the analysis are greatly increased. Further, in order to investigate and diagnose the analysis target, and to modify the manufacturing equipment manufacturer to confirm the operation and perform a comprehensive analysis of the analysis target, it is necessary to stop the CVD apparatus 100 during production operation for a long time. Yes, it is very uneconomical and lowers production efficiency.

Further, the transport unit 1 of the CVD apparatus 100
In FIG. 03, a cylinder mechanism (not shown) is generally employed for the reciprocating motion of the transport fork for loading and unloading the semiconductor wafer 110. The cylinder mechanism includes a reciprocating cylinder, and position detection sensors disposed at one of the bottom dead centers and the other top dead center, which are the operation end points of the reciprocating cylinder, respectively. It can be confirmed by the detection sensor.

This cylinder mechanism control method uses an extremely general control method in which the direction of flow of the fluid for driving the reciprocating cylinder is switched by an electromagnetic valve in accordance with the operating direction of the reciprocating cylinder. For example, when the reciprocating cylinder located at the top dead center is moved to the bottom dead center, whether or not the reciprocating cylinder exists at the top dead center is confirmed by a position detection sensor arranged at the top dead center, and the position is determined. When the detection sensor confirms the presence of the reciprocating cylinder, control is performed to switch the solenoid valve to move the reciprocating cylinder to the bottom dead center side. When the reciprocating cylinder reaches the bottom dead center, the presence of the reciprocating cylinder is detected by a position detection sensor arranged at the bottom dead center. The movement operation to the dead point ends.

If the position detection sensor detects a position error of the reciprocating cylinder, or if there is an abnormality in the detection signal, a process for an operation abnormality prepared in advance is executed. Furthermore, as an operation safety measure, a time limit from the start of operation at the top dead center to the end of operation at the bottom dead center is set, and it is monitored whether or not the operation ends within this time limit. Control for interrupting subsequent processing is performed.

However, in the cylinder mechanism of the transport unit 103, the operation within the time limit of the reciprocating cylinder is monitored as an operation safety measure. However, the actual operating time of the reciprocating cylinder itself can be obtained without investigating (visual measurement). Can not do. Monitoring is to monitor whether the operation is actually performed within the time limit, and diagnosis is to evaluate whether the actual value of the actual operation is the optimum value for the set value. And from these diagnostic results, the CVD device 100
The analysis is to comprehensively evaluate the production efficiency.

[0019]

As apparent from the above description, no consideration has been given to the following points in the operation analysis method of the semiconductor manufacturing apparatus.

(1) To perform a comprehensive analysis on the production efficiency of the CVD apparatus 100, the film forming units 101, 10
2. The actual operation time of each processing unit such as the transfer unit 103, the actual operation time of the cylinder mechanism (not shown) of the transfer unit 103, or the film formation processing time and the transfer time of the semiconductor wafer 110 are investigated by visual measurement. The simplest method is to diagnose the measured value of the result with respect to the set value and calculate the useless time loss. However, there is a limit to visual measurement as described above. Especially in a high-speed operation part, visual measurement cannot be performed accurately, and visual measurement itself may not be performed due to poor visibility, so that production efficiency may be reduced. Could not be accurately analyzed.

(2) If the manufacturing apparatus maker is requested to remodel the CVD apparatus 100 so that a specific signal for analyzing the production efficiency can be extracted, it is necessary to perform the remodeling every time the investigation, diagnosis, or analysis target is changed. This greatly increases the cost of analysis. Further, not only in the CVD apparatus 100, but also in a semiconductor manufacturing apparatus, the configuration of the apparatus is becoming more complicated and multifunctional, and the information for analysis is diversified. In order to obtain the optimal information necessary for the analysis of high quality, high quality and high efficiency, the amount of information becomes enormous, and it is necessary to remodel the equipment so that signals can be extracted according to this amount of information. Costs will also increase significantly.

(3) When the manufacturing equipment manufacturer is requested to remodel, the production operation needs to be stopped for a long time as described above, and the production efficiency is rather lowered.

(4) Further, even if the amount of information for analysis is specified to be a small number, the information to be obtained for the purpose of investigation, diagnosis or analysis varies widely, so that the information to be investigated, the object to be diagnosed or It is extremely difficult to specify the analysis target in advance and to limit and equip it. If the scope of investigation, diagnosis, or analysis was expanded to all, the number of remodeling points required for signal extraction would increase as described above, and the cost of equipment would increase significantly, resulting in a significant increase in analysis costs. Will increase. In addition, increasing the amount of information for analysis
This hinders an increase in the processing speed of the control unit 200 of the apparatus 100, and as a result, lowers the operating speed of the entire system of the CVD apparatus 100.

The present invention has been made to solve the above problems. Accordingly, a first object of the present invention is to provide an operation analysis method of a manufacturing apparatus which can immediately perform an accurate target analysis without impairing production efficiency.

Further, a second object of the present invention is to provide a method of analyzing the operation of a manufacturing apparatus which can reduce the analysis cost while achieving the first object.

Further, a third object of the present invention is to provide a method of analyzing the operation of a manufacturing apparatus which can achieve the first object or the second object and reduce the labor required for analysis. is there.

Further, a fourth object of the present invention is to provide a manufacturing apparatus which can achieve the first object, the second object or the third object.

[0028]

In order to solve the above-mentioned problems, a first feature of the present invention is to provide an operation analysis method for a manufacturing apparatus, wherein operation state information of operation start and operation end of a processing unit to be analyzed is provided. Detecting a change in the operation state information, sequentially storing the detected change in the operation state information as operation history information and accumulating the operation history information, and processing the processing unit to be analyzed based on the accumulated operation history information. And a step of analyzing the quality of the operation state.

Here, in the operation analysis method of the manufacturing apparatus according to the first aspect of the present invention, a change in the operation control signal of the processing unit to be analyzed is detected as a change in the operation state information, and the detected change is detected. It is preferable to store the information as operation history information. That is, by detecting a change in the operation control signal originally held for controlling the operation of the processing unit by the manufacturing apparatus as a change in the operation state information, it is not necessary to create a new signal.

In such a method of analyzing the operation of the manufacturing apparatus, the operation history information can be electrically and accurately and quickly extracted and stored from the change in the operation state information of the processing unit to be analyzed. Accurate analysis, for example, analysis for improving production efficiency, can be performed based on the operation history information. Further, in the operation analysis method of the manufacturing apparatus, since the operation history information can be extracted only for the processing unit to be analyzed, the modification of the manufacturing apparatus can be minimized, and as a result, the analysis cost can be reduced. Can be reduced. Further, in the method of analyzing the operation of the manufacturing apparatus, the processing unit to be analyzed can be freely changed according to the purpose of the analysis, so that it is not necessary to remodel the manufacturing apparatus every time the analysis target is changed. The analysis cost can be reduced in total. Further, in the operation analysis method of the manufacturing apparatus, since the operation history information can be extracted only for the processing unit to be analyzed, the load on the manufacturing apparatus, especially the load on the control unit can be reduced, and the operation history can be reduced. The analysis speed can be increased by realizing a high information extraction speed. Further, in the analysis method of the manufacturing apparatus, since a change in the operation control signal of the processing unit is detected as a change in the operation state information, the operation history information can be extracted even while the manufacturing apparatus is operating. That is, since the operation history information can be taken out in parallel during the operation of the manufacturing apparatus, the analysis speed can be increased. Furthermore, in the method of analyzing a manufacturing apparatus, the operation history information can be taken out even during the operation of the manufacturing apparatus, so that it is not necessary to stop the manufacturing apparatus for analysis, and the production efficiency can be improved. Further, in the analysis method of the manufacturing apparatus, since the operation history information can be automatically detected and stored, the labor of the analysis operator can be reduced.

A second feature of the present invention is that, in a manufacturing apparatus having an analysis function, a detection command for detecting a change in operation state information at the start and end of operation of a processing unit to be analyzed and a change in operation state information are detected. An operation history recipe storage unit that stores a storage instruction to be stored as operation history information; an operation history result storage unit that sequentially stores and accumulates operation history information; and an analysis target based on a detection instruction stored in the operation history recipe storage unit. An operation history control unit that detects a change in the operation state information, stores the change in the operation state information detected based on the storage command as operation history information in the operation history result storage unit, and stores the change in the operation history result storage unit. Operation history result output unit for outputting the operation history information.

Further, in the manufacturing apparatus having the analysis function according to the second aspect of the present invention, an operation recipe storage unit for storing an operation instruction of a processing unit to be analyzed, and an operation instruction stored in the operation recipe storage unit A control unit that controls the operation of the processing unit based on the control unit, detects a change in the operation state information of the processing unit from an operation control signal of the processing unit handled by the control unit, and operates the detected change in the operation state information. This is to store it in the operation history result storage unit as history information.

In the manufacturing apparatus having such an analyzing function, the manufacturing apparatus analyzing method according to the first aspect of the present invention can be realized. Furthermore, in the manufacturing apparatus having the analysis function, the processing unit to be analyzed is narrowed down to extract the operation history information. Therefore, the number of the apparatus configuration for the analysis can be reduced, and the apparatus size can be reduced. Can be.

[0034]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a schematic configuration diagram of a semiconductor manufacturing apparatus used for manufacturing a semiconductor device according to the embodiment of the present invention, and FIG. 1 is a block configuration diagram of a control unit of the semiconductor manufacturing apparatus according to the embodiment of the present invention. .

The semiconductor manufacturing apparatus according to the present embodiment shown in FIG. 2 is a CVD apparatus 1. This CVD apparatus 1 includes a plurality of vacuum type film forming units (vacuum chambers) 11 and 12,
It is configured to include a plurality of loading / unloading units (loader or unloader) 14 and 15, a transport unit 13 having a cylinder mechanism in a driving part, and a control unit 2.

The basic configuration of the CVD apparatus 1 according to the present embodiment is the same as that of the CVD apparatus 100 shown in FIG. 13 described above, and each of the film forming units 11 and 12 forms a thin film on the semiconductor wafer 10. This is a processing unit for forming a film. Although the semiconductor wafer 10 and the thin film to be formed are not particularly limited in this description, in this embodiment, the semiconductor wafer 10 is a single crystal silicon wafer, and the thin film is a silicon oxide thin film, a silicon nitride thin film, or a polycrystalline thin film. Any of the silicon thin films can be used practically.
Each of the carry-in / out units 14 and 15 is a film forming unit 1
This is a processing unit that loads the unprocessed semiconductor wafer 10 into 1 or 12, or unloads the processed semiconductor wafer 10 from the film forming unit 11 or 12. The transport unit 13 is a processing unit that loads or unloads the semiconductor wafer 10 between each of the film forming units 11 and 12 and each of the loading and unloading units 14 and 15.

The control unit 2 according to the present embodiment detects operation history information of at least a processing unit to be analyzed and a specific mechanism of the processing unit in addition to a function of controlling the processing operation of each processing unit. In addition, a function is provided for storing the operation history information, and performing investigation, diagnosis, and comprehensive analysis (for example, analysis for improving production efficiency) of the analysis target.
As shown in FIG. 1, the control unit 2 includes a main control unit 21,
Processing recipe control unit 22, processing recipe storage unit 23, processing result storage unit 24, operation recipe control unit 25, operation recipe storage unit 26, alarm processing unit 27, alarm recipe storage unit 2
8, the alarm result storage unit 29, the operation terminal 30, and the external storage device 31 are provided with respective basic configurations. In addition, an operation history control unit (status log control unit) 40, an operation history recipe storage unit (log recipe storage unit) 41, an operation history result storage unit (log result storage unit) 42, and an operation history output unit (external output unit) 43.

Next, the film forming operation of the CVD apparatus 1 according to the present embodiment shown in FIGS. 1 and 2 will be described. First, the unprocessed semiconductor wafer 10 stored in the loading / unloading unit 14 is transported by the transport unit 13 to each of the film forming units 11 and 12. Film forming unit 1
In each of 1 and 12, on the semiconductor wafer 10
A thin film is formed by a CVD method. The processed semiconductor wafer 10 on which the thin film has been formed is loaded and unloaded by the transfer unit 13 from each of the film forming units 11 and 12.
The processed semiconductor wafer 10 is stored in the carry-in / out unit 15.

The film forming process by the CVD apparatus 1 is as follows.
The automatic operation is performed in accordance with the processing recipe stored in the processing recipe storage unit 23 of the control unit 2 in advance, the operation recipe stored in the operation recipe storage unit 23 in advance, and the alarm recipe stored in the alarm recipe storage unit 28 in advance. Here, the processing recipe is information (processing instruction program) for setting the processing conditions of the semiconductor wafer 10 in each of the film forming units 11 and 12 in lot units or wafer units.
It is. The operation recipe is information (operation instruction program) instructing the control items such as the operation items and the operation order of each of the film forming units 11 and 12, the carry-in / out units 14 and 15, and the transport unit 13. The alarm recipe is information (alarm generation instruction program) for controlling an alarm generated when an abnormal operation occurs in each processing unit such as the film forming units 11 and 12.

The processing recipe is input from the operation terminal 30 or the external storage device 30 connected to the control unit 2 and stored in the processing recipe storage unit 23. The processing recipe stored in the processing recipe storage device 203 is stored in the processing recipe control unit 2.
2, the film forming unit 1 through each of the main control units 21
Each of the processing conditions 1 and 12 can be controlled. The processing result is stored in the processing result storage unit 24.

Similarly, the operation recipe is input from the operation terminal 30 or the external storage device 30 and is stored in the operation recipe storage unit 26.
Is stored. The operation recipe stored in the operation recipe storage unit 26 can control the operation of each processing unit through each of the operation recipe control unit 25 and the main control unit 21. The alarm recipe is input from the operation terminal 30 or the external storage device 30 and stored in the alarm recipe storage unit 28.
The alarm recipe stored in the alarm recipe storage unit 28 can control generation of an alarm in each processing unit through each of the alarm processing unit 27 and the main control unit 21. The alarm generation result is stored in the alarm result storage unit 29.

The processing recipe, the operation recipe, and the alarm recipe are all used in the operation terminal 30 in this embodiment.
From the external storage device 30 or read-only memory (Read Only Memory)
y), input from a storage medium such as a magnetic disk or a magnetic tape.

A CV for performing such a basic film forming processing operation
In the D apparatus 1, the control unit 2 includes an operation history control unit 40, and includes at least an operation history recipe storage unit 41 and an operation history result storage unit 42 connected to the operation history control unit 40, respectively. For example, investigation and diagnosis of actual operation time can be easily performed, and analysis of, for example, production efficiency can be easily performed from the results of the investigation and diagnosis.

The operation history control unit 40 includes an operation state of each processing unit held by the main control unit 21 of the control unit 2 and each of the main control units of the processing recipe control unit 22 and the operation recipe control unit 25. A change in the operation state information is monitored, a change in the operation state information is detected based on the selection of the operation history recipe stored in the operation history recipe storage unit 41, and the detected change in the operation state information is used as the operation history information as the operation history. The result can be stored and accumulated in the result storage unit 42.

FIG. 3 is a conceptual diagram showing the relationship between the basic operation state of each processing unit and changes in the basic operation state according to the embodiment of the present invention. As shown in FIG. 3, the basic operation state of each processing unit includes an operation (RUN) 50, a suspension (HOLD) 5
1. There are three modes, i.e., waiting (READY) 52. Here, the operation state information is defined as information “H” when the processing unit is in the target operation state and information “L” when the processing unit is not in the operation state.
The operation state information “H” is made to correspond to the “high level” control signal that actually maintains the operation state of the processing unit in the main controller 21 and the operation recipe control unit 25 of the control unit 2 shown in FIG. Similarly, the operation state information “L” is defined corresponding to a “low-level” control signal. The detection (or measurement or monitoring) of the state change of the operation state information refers to the processing unit or the specific processing unit selected as the analysis target in the operation history control unit 40 by the detection command stored in the operation history recipe storage unit 41. Only the operating state information of the mechanism is constantly monitored, and a state change of the operating state information, that is, a change from the operating state information “L” to the operating state information “H” is extracted as a signal, and the operating state information “H” is used as the operating state information. The change to "L" is taken out as a signal. The change from the operation state information “L” to the operation state information “H” becomes information meaning “operation start”, and the change from the operation state information “H” to the operation state information “L” is “ The information means "operation end".
Both pieces of information are recorded and accumulated in the operation history result storage unit 42 as operation history information together with the time when the state change occurs. Normally, the main control unit 21 has a built-in timer 21T.
Is built in, and time information can be supplied from the built-in timer 21T. However, when an abnormality occurs in the operation state, the operation states of the start time and the end time are reversed.

FIG. 4 is a diagram showing an example of the detailed information content of the basic operation state information shown in FIG. A processing unit shown in FIG.
The operating state 50, the suspended state 51, and the waiting state 52 of the basic operation state information of the mechanism unit of the processing unit and the like are constructed by a plurality of subdivided operation state information shown in FIG. That is, the basic operation state information is composed of a plurality of pieces of information including inoperable information, operable information, normal operating information, initializing information, idle information, operating (operating) information, and pause information.
Note that detailed contents of these pieces of information are described in FIG. 4, and thus description thereof will be omitted. As shown in FIG. 4, the basic operation state information is constructed from a plurality of detailed operation state information that is subdivided and defined, so that each processing unit to be analyzed, and each mechanism and component of the processing unit are not directly observed visually. However, the operating state can be analyzed in detail only by detecting the control signal to be analyzed. Therefore, even if the device configuration becomes more complicated and sophisticated, the operation state of the analysis target can be analyzed in detail.

FIG. 5 is a diagram showing an example of operation state information of the film forming unit 11 specifically selected as an analysis target. As shown in FIG. 5, the operation state information of the film forming unit 11 is constructed from information on unloading information, loading information, evacuation information, film forming processing information, and open air information of the semiconductor wafer 10. That is, the film forming unit 11
The operation state information is an operation recipe indicating the operation items in the film forming unit 11 and the control contents of the operation order.
The operation state information (operation recipe) of the film forming unit 11 is stored in the operation recipe storage unit 26.

FIGS. 6A and 6B are diagrams each showing an example of operating state information of a specific fork transport mechanism (not shown) of the transport unit 13 specifically selected as an analysis target. FIG. 6A shows a list of loading operation state information of the fork transport mechanism for loading the semiconductor wafer 10. The loading operation state information of the fork transport mechanism is constructed from, for example, information on fork entry into the film formation unit 11, information on fork descent, and information on evacuation of the fork from the film formation unit 11. FIG. 6B shows a list of unloading operation state information of the fork transfer mechanism that unloads the semiconductor wafer 10. The unloading operation state information of the fork transport mechanism is constructed from, for example, information on fork entry into the film formation unit 11, information on fork elevation, and information on evacuation of the fork from the film formation unit 11.

As shown in FIG. 4, FIG. 5, FIG. 6 (A), and FIG. 6 (B), the operation state of each processing unit such as the film forming units 11, 12 and the transport unit 13 is changed to each processing unit. The CVD apparatus 1 according to the present embodiment can perform investigation, diagnosis, and comprehensive analysis over a wide range up to a single operation state of a specific mechanism or component. The operating status information is
Although the operation method, the structure of the mechanism, and the parts to be handled are various for each processing unit and are unique to each processing unit, the CVD apparatus 1
Are stored in advance in the processing recipe storage unit 23, the operation recipe storage unit 26, and the alarm recipe storage unit 28 of the control unit 2 in order to perform the basic operation of the control unit 2. The main control unit 21, the processing recipe control unit 22, Operation recipe control unit 2
5. Information handled by the alarm processing unit 27.

In the CVD apparatus 1 according to the present embodiment, the operation history control unit 40 detects a change in the state of the operation state information already held or handled, which is necessary for performing such a basic operation. The state change of the operation state information is stored and accumulated in the operation history result storage unit 42 as operation history information. The time when the state change occurs in the operation state information, that is, the operation start time and the operation end time is determined by the main control unit 21.
Are simultaneously read from the built-in timer 21T by the operation history control unit 40, and the operation history information includes the read time information. If the CVD apparatus 1 is in the activated state (power is turned on and in operation), the processing unit or a specific mechanism or component of the processing unit is in one of the operating states, so that a change in the state of the operating state information is easily detected. And can be easily stored and accumulated as operation history information. The analysis target information stored in the operation history recipe storage unit 41, that is, a processing unit that performs investigation, diagnosis, or analysis, or a specific mechanism of the processing unit,
According to the operation history recipe for selecting parts and the like, the operation history control unit 40 detects a state change of the operation state information of the analysis target selected in the operation history recipe. As described above, according to the operation history recipe, the analysis target is selected, and the operation history information is detected by focusing only on the state change of the specific operation state information of the analysis target, so that the operation load of the control unit 2 can be reduced. it can. Further, even if the number of times of detection of the state change of the analysis target or the operation state information changes, for example, the modified operation history recipe is input from the operation terminal 30 and stored in the operation history recipe storage unit 26, and the analysis target The number of detections can be easily changed.

FIG. 7 is a diagram showing an example of the contents of an operation history recipe (log recipe) stored in the operation history recipe storage section 41. FIG. 7 shows a list of operation history recipes. For example, in the operation history number “R1”, the analysis target is “HA”.
L, FKIN ”is a“ fork mechanism that carries in the loading operation of the transport unit 13 ”, and the analysis condition (monitoring condition) is“ continuous ”. "Store as history information" is displayed. Similarly, in the operation history number “R2”,
"Transport unit 1" with the analysis target displayed as "HAU, FKIN"
3 fork mechanism that carries out the unloading operation of 3), and the analysis conditions are displayed as “97.06.09.15:00.00-97.06.09.16:00.00” on June 9, 1997, 15:00:00 to 97:06. 9th, 16:00
Detect the state change of the operation state information within the range of minute 00 seconds and store it as operation history information ".

FIG. 8 is a diagram showing an example of the operation history information (logging result) stored and accumulated in the operation history result storage section 42. FIG. 8 shows the contents of the operation history information detected according to the analysis contents of the operation history number “R1” of the operation history recipe shown in FIG. 7. In this example, “lot number”,
Operation history information including each of “operation state interruption contents” and “operation history result” is displayed. The “operation history result” includes the time “operation start time (year, month, day and time)” and “operation end time (year, month, day, and time)” information of the state change of the operation state information in the present embodiment. It is.

FIG. 9 is a control flowchart from detection of operation history information to storage and accumulation. As shown in FIG. 9, when the detection of the operation history information is started (reference numeral 60),
According to the operation history recipe stored in advance in the operation history recipe storage unit 41 shown in FIG. 1, the operation history control unit 40 detects a change in the state of the operation state information to be analyzed. In the operation history recipe shown in FIG. 7, a plurality of analysis targets are selected, and operation history numbers “R1”, “R2”,..., “Rn” are assigned to the respective selected analysis targets. First, a state change of the operation state information of the analysis target to which the operation history number “R1” is assigned (the loading of the fork mechanism of the transport unit 13 as described above) is detected (61). This detection is performed until the analysis conditions shown in FIG.
0). The information obtained as a result of the detection is stored in the operation history result storage unit 42 as the operation history information shown in FIG. 8 together with the analysis target (analysis target operation name), the contents of the state change, the start time and the end time of the state change. And stored (61
2).

On the other hand, in the CVD apparatus 1 according to the present embodiment, not only a change in the normal operation state information but also abnormal operation state information in which the operation state is interrupted halfway after the start of operation is stored as operation history information. can do. That is, as shown in FIG. 9, at the stage where the analysis condition is not satisfied (613), it is diagnosed whether the state change of the operation state information is "operation start" or "operation end" (614). The determination of “operation start” or “operation end” is made based on the operation state information “L” of the basic operation state described above with reference to FIG.
Is performed based on the state change from “H” to “L” from the operation state information “H”. That is, the former state change from the operation state information “L” to “H” is “operation start”,
The latter state change from the operation state information “H” to “L” is “operation end”.

In the case of "operation start", it is subsequently determined whether this "operation start" is normal "operation start" or "operation restart" from an abnormal state (61).
5). The determination of “operation start” and “operation restart” can be easily performed by monitoring “interruption” and “standby” of the basic operation state described in FIG. If the result of the determination is "operation start", the operation history information is stored and accumulated in the operation history result storage section 42 as operation history information together with the corresponding lot number and operation start time (616A). vice versa,
In the case of "operation restart", the operation history information storage section 42 stores and accumulates the operation lot information together with the corresponding lot number, the interruption content, and the operation end time at the time of interruption (6).
16B).

In the case of "operation end", it is subsequently determined whether this "operation end" is a normal "operation end" or an "operation interruption" in an abnormal state (61).
7). The determination of “operation end” and “operation interruption” can be easily performed by monitoring “interruption” and “standby” of the basic operation state described with reference to FIG. If the result of the determination is "operation end", the operation history information is stored and accumulated in the operation history result storage section 42 together with the corresponding lot number and operation end time (617A). vice versa,
If the operation is "interruption", the operation history information is stored in the operation history result storage unit 42 along with the corresponding lot number, the content of the interruption, and the operation start time when the interruption was released (617B).

When the operation history information of the analysis target with the operation history number “R1” is stored and accumulated in the operation history result storage unit 42, the analysis target of the analysis target with the operation history number “R2” is similarly set. A change in state of the operation state information is detected (62).
The operation history information is stored and accumulated in the operation history result storage unit 42, and a state change of the operation state information of the analysis target to which the last operation history number “Rn” is assigned is detected (63). The processing is continued until it is stored in the storage unit 42 and accumulated. In FIG. 7, reference numerals 610, 620,
630 are almost the same.

The operation history information stored and accumulated in the operation history result storage section 42 of the control unit 2 is output by the operation history result output section 43 connected to the control unit 2 to improve the production efficiency. Used for research, diagnosis and comprehensive analysis for. The operation history result output unit 43 may be a device such as a printer that prints and outputs the operation history information on paper, or a device such as a display that displays and outputs the operation history information on a screen.

FIGS. 10 to 12 are analysis diagrams of one example created based on the operation history information output by the operation history result output unit 43.

FIG. 10 is a line graph in which the start time is simply subtracted from the end time of the operation history information in the loading operation (“HAL, FKIN”) of the fork mechanism of the transport unit 13 and the number of analysis times is arranged. Changes in operating time can be analyzed. Here, when the management limit of the analysis target is clear, for example, as shown in FIG. 10, when the upper limit UCL and the lower limit LCL of the operation time are clear, the replacement of the corresponding part from the analysis result, Maintenance can be performed. Therefore, high-accuracy and high-quality processing can be stably obtained. Further, it is possible to increase the operation speed of a portion requiring useless operation time and improve production efficiency. Further, comprehensive production management can be easily performed.

FIG. 11 is a histogram obtained by calculating and summing up the unloading operation time in the loading operation (“HAL, FKIN”) of the fork mechanism of the transport unit 13, and the average value of the unloading operation can be analyzed. . Here, in the operation history information shown in FIG.
If the operation history information of the abnormal operation as described above is excluded from the calculation and aggregation, the start time is subtracted from the end time of the operation history information, and a histogram is created simply as the number of operations (frequency), the operation requiring a predetermined operation time can be performed. Can be diagnosed and can be used as information for analyzing operation reliability.

FIG. 12 shows the total time of the non-operating time of each processing unit in each of the plurality of film forming units (CH1) 11, the film forming unit (CH2) 12, and the transport unit (HA) 13 to be analyzed. It is a chart, and it is possible to comprehensively analyze the non-operating time until the processed semiconductor wafer 10 is unloaded after the processing in each processing unit is completed based on a plurality of analysis targets.

As described above, the present invention has been described in detail according to the embodiments. However, the present invention is not limited to the above embodiments. In the above embodiment, a CVD apparatus is described as an example of a semiconductor manufacturing apparatus, but the present invention is a sputtering apparatus, an epitaxial apparatus, an etching apparatus,
The present invention can be widely applied to semiconductor manufacturing apparatuses such as cleaning apparatuses, exposure apparatuses, developing apparatuses, and drying apparatuses. Further, the present invention is not limited to a semiconductor manufacturing apparatus, but can be applied to general manufacturing apparatuses requiring analysis.

[0064]

According to the present invention, without impairing the production efficiency,
It is possible to provide a method of analyzing the operation of a manufacturing apparatus, which can immediately perform an accurate target analysis.

Further, the present invention can provide a method for analyzing the operation of a manufacturing apparatus, which can reduce the analysis cost.

Further, the present invention can provide a method for analyzing the operation of a manufacturing apparatus, which can reduce the labor required for the analysis.

Further, the present invention can provide a manufacturing apparatus for realizing the above-described operation analysis method.

[Brief description of the drawings]

FIG. 1 is a block diagram of a control unit of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a relationship between a basic operation state of each processing unit of the semiconductor manufacturing apparatus according to the embodiment of the present invention and a change in the basic operation state.

FIG. 4 is a diagram showing an example of detailed information content of basic operation state information according to the embodiment of the present invention.

FIG. 5 is a diagram illustrating an example of operation state information of a film formation unit selected as an analysis target according to the embodiment of the present invention.

FIGS. 6A and 6B are diagrams illustrating an example of operation state information of a specific transport mechanism of a transport unit selected as an analysis target according to the embodiment of the present invention;

FIG. 7 is a diagram showing an example of the contents of an operation history recipe according to the embodiment of the present invention.

FIG. 8 is a diagram showing contents of an example of operation history information according to the embodiment of the present invention;

FIG. 9 is a control flowchart from detection of operation history information to storage and accumulation according to the embodiment of the present invention.

FIG. 10 is an analysis diagram created based on operation history information according to the embodiment of the present invention.

FIG. 11 is an analysis diagram created based on operation history information according to the embodiment of the present invention.

FIG. 12 is an analysis diagram created based on operation history information according to the embodiment of the present invention.

FIG. 13 is a schematic configuration diagram of a semiconductor manufacturing apparatus according to the prior art of the present invention.

FIG. 14 is a block diagram of a control unit of the semiconductor manufacturing apparatus according to the prior art of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 CVD apparatus 2 Control unit 10 Semiconductor wafer 11, 12 Film formation unit 13 Transport unit 14, 15 Loading / unloading unit 21 Main control part 21T Built-in timer 22 Processing recipe control part 23 Processing recipe storage part 24 Processing result storage part 25 Operation recipe control Unit 26 operation recipe storage unit 27 alarm processing unit 28 alarm recipe storage unit 29 alarm result storage unit 30 operation terminal 31 external storage device 40 operation history control unit 41 operation history recipe storage unit 42 operation history result storage unit 43 operation history result output unit

Claims (4)

[Claims] 1. A step of detecting a change in operation state information at the start and end of operation of a processing unit to be analyzed, and sequentially storing the detected change in operation state information as operation history information and storing the operation history information. A method for analyzing the operation of a manufacturing apparatus, comprising: a step of accumulating; and a step of, based on the accumulated operation history information, analyzing whether or not an operation state of a processing unit to be analyzed is good or bad. 2. The method according to claim 1, wherein a change in an operation control signal of the processing unit to be analyzed is detected as a change in operation state information, and the detected change is stored as operation history information. Of analyzing the operation of a manufacturing apparatus. 3. An operation history recipe for storing a detection instruction for detecting a change in operation state information of an operation start and an operation end of a processing unit to be analyzed and a storage instruction for storing the change in the operation state information as operation history information. A storage unit, an operation history result storage unit that sequentially stores and accumulates the operation history information, and detects a change in operation state information of the analysis target based on a detection instruction stored in the operation history recipe storage unit. An operation history control unit for storing and accumulating a change in the operation state information detected based on the operation history information as operation history information in an operation history result storage unit; and an operation history result for outputting the operation history information accumulated in the operation history result storage unit. A manufacturing apparatus having an analysis function, comprising: an output unit. 4. An operation recipe storage unit that stores an operation instruction of the processing unit to be analyzed, based on an operation instruction stored in the operation recipe storage unit.
A control unit for controlling the operation of the processing unit, comprising: detecting a change in operation state information of the processing unit from an operation control signal of the processing unit handled by the control unit, and operating the detected change in the operation state information. The manufacturing apparatus having an analysis function according to claim 3, wherein the history information is stored in an operation history result storage unit.