JP2000260335A - Member for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce discharge due to effect of a defective barrier rib by constituting the barrier rib for constituting a discharge space with a plurality of slender barrier ribs. SOLUTION: Stripe-shaped barrier ribs are made as a plurality of slender barrier ribs. In the case of a lattice-shaped barrier rib, among barrier rib groups arranged two-directionally in parallel, a barrier rib in at least one-directional barrier rib group is constituted with a plurality of slender barrier ribs. Especially, a barrier rib in the barrier rib group for separating colorings from each other is formed from a plurality of slender barrier ribs to prevent false luminescence. Height of the slender barrier ribs is 50-200 μm, and line width is 10-100 μm. Thus, since each barrier rib for constituting a discharge space is constituted with the plurality of slender barrier ribs, residual slender barrier ribs function as a satisfactory barrier rib even when a part of the slender barrier rib is defective, and the barrier rib substantially having no defective is provided. Number of the plurality of slender barrier ribs is not especially restricted. But, when the number of them is increased, line width of the barrier ribs is more slender and formation of the slender barrier ribs becomes difficult, and therefore the number is set 2 or 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a member for a plasma display. Note that the plasma display in the present invention refers to a display that performs display by discharging in a discharge space partitioned by partitions, and in addition to the above-described AC plasma display, various types of discharge including a plasma-addressed liquid crystal display. It includes a type display.

[0002]

2. Description of the Related Art Plasma displays (PDPs) are used in fields such as OA equipment and public information display devices because they can display at a higher speed than liquid crystal panels and can be easily made larger. In addition, progress in the field of high-definition television is highly expected. With the expansion of such uses, a color plasma display having a large number of fine display cells has been receiving attention.

The structure and principle of the plasma display will be described by taking an AC type plasma display as an example. Plasma discharge is generated between opposing anode and cathode electrodes in a discharge space provided between a front glass substrate and a rear glass substrate. The display is performed by applying ultraviolet rays generated from the gas sealed in the discharge space to a phosphor provided in the discharge space. In this case, the discharge is suppressed to a certain area, display is performed in a specified cell, and at the same time, a partition wall (barrier,
Ribs). In the case of an AC type plasma display, the partition walls are often formed in a stripe shape or a lattice shape.

[0004] Stripe-shaped partitions have a width of about 20 to 2
The thickness is 50 μm and the height is 50 to 200 μm. Usually, an insulating paste containing glass powder is printed and dried on a front glass substrate and a rear glass substrate by a screen printing method.
The drying step is repeated ten or more times to form a predetermined height.

[0005] JP-A-1-296534 and JP-A-2
JP-A-165538, JP-A-5-34292, JP-A-6-295676, JP-A-8-508
Japanese Patent Application Laid-Open No. 11 proposes a method for forming a partition by a photolithography technique using a photosensitive paste.

In any of the above methods, after forming an insulating paste containing glass powder in the shape of a partition pattern, the partition is formed by firing. At that time, part of the partition wall,
Problems such as chipping or falling off may occur due to poor printing, poor exposure, firing shrinkage, foreign matter, and the like. When there is this partition chipping, when the panel is formed by combining the front plate and the back plate,
A gap may occur between the top of the rear wall partition and the front panel,
The missing partition blocks the discharge space. As a result, there is a problem that light emission defects and extra light emission points are generated at the time of discharge, and the image is disturbed.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display in which erroneous discharge is substantially reduced due to the effect of chipping of a partition wall.

[0008]

That is, the present invention relates to a member for a plasma display panel in which electrodes and stripe-shaped partitions are formed on a substrate, wherein the partitions constituting a discharge space are composed of a plurality of fine partitions. A member for a plasma display panel.

The present invention also relates to a member for a plasma display panel in which an electrode and a grid-like partition are formed on a substrate, wherein a plurality of partitions of at least one direction among a group of partitions arranged in two directions are provided. A member for a plasma display panel, comprising:

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The substrate used in the present invention is not particularly limited, but a glass substrate, a ceramic substrate or the like can be used.

The substrate is preferably cleaned and then the electrodes are formed. Examples of the method of forming the electrodes include, for example, a method in which a conductive paste is screen-printed and then baked, a method in which a photosensitive conductive paste is screen-printed and then an electrode pattern is exposed and baked, and the photosensitive conductive paste is applied using a nozzle or the like. Thereafter, a method of exposing and firing the electrode pattern is preferably used. As the conductive paste or the photosensitive conductive paste, for example, a paste containing silver, copper, or the like can be used.

A dielectric layer is usually formed on the substrate on which the electrodes have been formed. The thickness of the dielectric layer is preferably 4 to 20 μm, more preferably 5 to 18 μm, for forming a uniform dielectric layer. When the thickness is 20 μm or less, the binder removal property during firing is improved, cracks are suppressed, and the stress applied to the substrate can be reduced, so that the substrate can be prevented from warping. Also, 4μ
By setting m or more, uniformity of thickness can be easily maintained.

The dielectric layer can be formed by applying or laminating a dielectric paste composed of an inorganic material powder and an organic binder on a glass substrate, followed by firing. The amount of the inorganic material powder used for the dielectric layer paste is preferably 50 to 95% by weight based on the sum of the inorganic material powder and the organic component. By setting the content to 50% by weight or more, the denseness of the dielectric layer and the flatness of the surface can be obtained. By setting the content to 95% by weight or less, the increase in the paste viscosity is suppressed and the thickness unevenness during application is reduced. be able to.

By using a glass containing at least one of bismuth oxide, lead oxide and zinc oxide, more preferably 10 to 60% by weight of bismuth oxide, the heat softening temperature and the coefficient of thermal expansion can be easily controlled. Can be done. Use of glass containing 10 to 60% by weight of bismuth oxide also has advantages such as stability of the paste. By setting the addition amount of bismuth oxide, lead oxide, and zinc oxide to 60% by weight or less, it is possible to prevent the heat resistance temperature of the glass from becoming too low, and to facilitate baking on a glass substrate.

Specific examples of glass compositions include those containing the following compositions in terms of oxides, but the present invention is not limited to these glass compositions. Bismuth oxide 10-60 wt% Silicon oxide 3-50 wt% Boron oxide 10-40 wt% Barium oxide 5-20 wt% Zinc oxide 10-20 wt%.

As the inorganic material in the dielectric layer, in addition to glass, white fillers such as titanium oxide, alumina, silica, barium titanate, and zirconia are preferably used. As for the content ratio in the inorganic material, glass is 50 to 9%.
It is preferable that the content is 5% by weight and the filler content is 5 to 50% by weight. By containing the filler in this range, the reflectance of the dielectric layer is improved, and a high-luminance plasma display can be obtained.

Next, a partition is formed. In the plasma display of the present invention, it is necessary that each partition constituting the discharge space is composed of a plurality of fine partitions. When a partition is composed of a plurality of fine partitions, even if a defect occurs in a part of the fine partition, the remaining fine partitions can sufficiently function as a partition to obtain a partition substantially free of defects.

The number of the fine partition walls is not particularly limited, but if the number increases, the line width of the partition walls becomes narrower and it becomes difficult to form the fine partition walls.

FIG. 1 shows an example of the relationship among the fine partition, the partition, and the partition group. In FIG. 1, 1 is a fine partition, 2 is a set of partitions, and 3 is a partition group.

The partition walls are formed on the substrate in a stripe shape or a lattice shape. In the present invention, the stripe-shaped partition is composed of a plurality of fine partitions. In the case of a lattice-shaped partition wall, it is necessary that at least one of the partition groups arranged in two directions has a plurality of fine partition walls. In particular, it is preferable that the partition walls of the partition group separating the dyes be composed of a plurality of fine partition walls, from the viewpoint of preventing erroneous light emission. Further, both of the grid-like two-way partition groups may be formed of fine partition walls.

For the purpose of improving the strength of the partition, a part of the fine partition can be connected.

The height of the fine partition walls is preferably 50 to 200 μm, and the line width is preferably 10 to 100 μm. The line width may be the same or different between the fine partition walls.

The partition comprising a plurality of fine partitions of the present invention is
The present invention can be applied to both the partition formed on the back plate for plasma display and the partition formed on the front plate for plasma display.

The formation of an inclined portion at the end of the partition or the use of a low-softening point glass in the lower layer than the upper layer by forming the partition in a multilayer structure also increases the adhesive strength between the partition and the base such as the substrate and the dielectric layer. This is preferable because By improving the adhesive strength to the base, it is possible to prevent a jump-up defect at the end of the partition wall.

The dielectric constant of the partition wall is preferably 4 to 10 at a frequency of 1 MHz and a temperature of 20 ° C. in view of excellent power consumption and discharge life of the panel.

The specific gravity of the partition wall of the present invention is preferably 2 to 3.3 from the viewpoint of weight reduction.

The method for forming the fine partition walls is not particularly limited. For example, a screen printing method, a sand blast method, a lift-off method, a photolithography method, a master pressing method, using a partition wall paste composed of an inorganic material and an organic component. A fine partition can be formed by forming a partition pattern on a substrate by baking and baking. Above all, a photosensitive paste is used to form a coating film using a photosensitive paste, exposing the coating film through a photomask and developing it to form a partition pattern, and then baking the partition pattern to obtain a partition. The method is preferable because it has few steps and a fine pattern can be formed.

Preferred embodiments of the paste for partition used in the method for forming the fine partition will be described below.

The paste for partition walls usually comprises an inorganic component and an organic component.

As the inorganic component, a glass material is generally used. Specifically, the glass transition point is 430 to 50.
It is preferable to use a glass material having a softening point of 0 ° C and a softening point of 470 to 580 ° C. By setting the glass transition point to 500 ° C. or lower and the softening point to 580 ° C. or lower, the firing temperature can be lowered and the distortion of the substrate during firing can be reduced. The glass transition point is 4
By setting the softening point to 30 ° C. or higher and the softening point to 470 ° C. or higher, a more dense partition layer can be obtained, and peeling, disconnection, and meandering of the partition can be prevented.

The general high strain point glass used for the substrate glass has a coefficient of thermal expansion of 80 to 90 × 10 ⁻⁷ / K. Has a coefficient of thermal expansion at ₅₀ to ₄₀₀ ° C. (α ₅₀ to ₄₀₀ ) of 50 to 90 × 10 ⁻⁷ / K, and more preferably 60 to 90 × 10
It is preferable to use a glass material of ^-7 / K for the partition walls and the dielectric layer. By using a glass material having the above characteristics, peeling or disconnection of the partition can be prevented.

As a composition of the partition wall material, it is preferable that silicon oxide is blended in the glass in a range of 3 to 60% by weight. 3% by weight or more of the glass layer,
Strength and stability are further improved, and the coefficient of thermal expansion can be easily brought close to the coefficient of thermal expansion of the glass substrate. Also 6
By setting the content to 0% by weight or less, there is an advantage that the thermal softening point is lowered and baking on a glass substrate becomes possible.

Boron oxide is 5 to 50% by weight in the glass.
The electrical, mechanical and thermal properties such as electrical insulation, strength, coefficient of thermal expansion, and denseness of the insulating layer can be improved by blending in the range. When the content is 50% by weight or less, the stability of the glass is improved.

By using a glass powder containing at least one of lithium oxide, sodium oxide and potassium oxide in an amount of 2 to 15% by weight, it is possible to obtain a photosensitive paste having temperature characteristics capable of patterning a glass substrate. . Alkali metal oxides such as lithium, sodium and potassium are added in an amount of 15% by weight or less,
Preferably, by setting the content to 10% by weight or less, the stability of the paste can be improved.

As the glass composition containing lithium oxide,
It is preferable that the composition contains lithium oxide 2 to 15% by weight, silicon oxide 15 to 50% by weight, boron oxide 15 to 40% by weight, barium oxide 2 to 15% by weight aluminum oxide 6 to 25% by weight in terms of oxide. In the above composition,
Sodium oxide or potassium oxide may be used instead of lithium oxide, but lithium oxide is preferred in terms of paste stability.

Further, the glass containing both metal oxides such as lead oxide, bismuth oxide and zinc oxide and alkali metal oxides such as lithium oxide, sodium oxide and potassium oxide can be softened at a lower alkali content. Point and linear thermal expansion coefficient can be easily controlled.

In particular, the glass powder of the photosensitive paste used in the photosensitive paste method preferably contains aluminum oxide, barium oxide, calcium oxide, magnesium oxide, zinc oxide, zirconium oxide, or the like. In particular, by adding aluminum oxide, barium oxide, and zinc oxide, the softening point, the coefficient of thermal expansion, and the refractive index can be controlled. The content of aluminum oxide, barium oxide, and zinc oxide in the glass component is preferably 40% by weight or less, more preferably 25% by weight or less.

The inorganic component of the partition wall paste has a softening point of 5
50 to 1200 ° C, more preferably 650 to 800 ° C
May be contained in an amount of 3 to 60% by weight. Thereby, the shrinkage ratio at the time of firing after pattern formation is reduced, pattern formation is facilitated, and shape retention at firing is improved.

As the filler, titania, alumina,
A high melting point glass powder containing 15% by weight or more of ceramics such as barium titanate and zirconia, silicon oxide and aluminum oxide is preferable. As an example, it is preferable to use a glass powder containing the following composition. Silicon oxide: 25 to 50% by weight Boron oxide: 5 to 20% by weight Aluminum oxide: 25 to 50% by weight Barium oxide: 2 to 10% by weight.

When a high melting point glass powder is used as a filler, if the refractive index difference from the base glass material (low melting point glass) is large, the pattern forming property in the photosensitive paste method tends to deteriorate. Therefore, by setting the average refractive index N1 of the low-melting glass powder and the average refractive index N2 of the high-melting glass powder within the following relationship, the pattern formability can be improved. −0.05 ≦ N1−N2 ≦ 0.05 The small variation in the refractive index of the inorganic powder is also preferable for reducing the light scattering. The dispersion of the refractive index is ± 0.05 (95% by volume or more of the inorganic powder has an average refractive index of Ni ± 0.0
5) is preferable for reducing light scattering.

The filler preferably has an average particle diameter of 1 to 6 μm. D10 (10
Volume% particle diameter) 0.4 to 2 μm, D50 (50 volume% particle diameter): 1 to 3 μm, D90 (90 volume% particle diameter): 3
It is preferable to use one having a particle size distribution of about 8 μm and a maximum particle size of 10 μm or less from the viewpoint of pattern formation. Still more preferably, D90 is 3 to 5 μm, and the maximum particle size is 5 μm or less. D90 is 3-5μ
It is preferable that the powder has a fine particle size of m since it is excellent in that the firing shrinkage can be reduced and a partition having a low porosity is produced. In addition, it is possible to make the unevenness in the longitudinal direction of the upper part of the partition wall less than ± 2 μm. By using a powder having a small particle size for the filler, not only can the porosity be reduced, but also the irregularities at the top of the partition walls are reduced,
Erroneous discharge can be prevented.

The amount of the inorganic material used in the photosensitive paste method is 65 to 85% by weight based on the sum of the inorganic material and the organic component.
It is preferred that When the content is 65% by weight or more, the shrinkage ratio during firing becomes small, and disconnection and peeling of the partition can be prevented. In addition, the paste can be easily dried, stickiness can be prevented, and printing characteristics can be improved. Further, thickening of the pattern and generation of a residual film at the time of development can be prevented. By setting the content to 85% by weight or less, photocuring becomes easy to the bottom of the partition wall pattern, and the pattern formability can be improved.

Various metal oxides may be added to the inorganic component for the purpose of coloring the partition after firing. For example, black partition walls can be formed by including 1 to 10% by weight of a black metal oxide in the photosensitive paste.
The partition walls colored in black are excellent in increasing the contrast. Furthermore, in addition to black, a pattern of each color can be formed by using a paste to which an inorganic pigment that develops a color such as red, blue, or green is added.

As the organic component for the partition wall forming paste,
Contains a polymer component. Further, if necessary, additive components such as a plasticizer, a thickener, an organic solvent, an antioxidant, a dispersant, and an organic or inorganic precipitation inhibitor may be added. As the polymer component, a cellulose compound represented by ethyl cellulose, an acrylic polymer represented by polyisobutyl methacrylate, and the like can be used. In addition, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate-methacrylate copolymer, α-methylstyrene polymer, butyl methacrylate resin, and the like can be given. The components below the plasticizer can be used in common with the photosensitive paste described in detail below.

The organic component of the photosensitive paste contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer, and, if necessary, a binder and a photopolymerization initiator. Adding additives such as UV absorbers, sensitizers, sensitization aids, polymerization inhibitors, plasticizers, thickeners, organic solvents, antioxidants, dispersants, organic or inorganic precipitation inhibitors Is also performed.

The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group in the molecule. (B) Those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds (C) So-called diazo resins such as condensates of diazo amines and formaldehyde Etc.

Examples of the photo-soluble type include (D) a complex of a diazo compound with an inorganic salt or an organic acid, and a compound containing a quinone diazo compound. (E) a quinone diazo compound combined with an appropriate polymer binder. For example, phenol, naphthoquinone-1,2-diazide-5-sulfonic acid ester of a novolak resin, and the like.

As the photosensitive component used in the present invention, all of the above can be used. As the photosensitive paste, (A) is preferred because it can be easily mixed with inorganic fine particles and used.

The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, sec-
Butyl acrylate, iso-butyl acrylate, te
rt-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate Heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafuro Pentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene Glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, Polypropylene Glycol diacrylate, triglycerol diacrylate,
Trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct,
Diacrylates of bisphenol A-propylene oxide adducts, acrylates such as thiophenol acrylate and benzyl mercaptan acrylate, and monomers in which 1 to 5 hydrogen atoms of these aromatic rings have been substituted with chlorine or bromine atoms, or Styrene, p-
Methylstyrene, o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α-methylstyrene, brominated α-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxymethyl Styrene, vinyl naphthalene, vinyl anthracene, vinyl carbazole, and those obtained by changing some or all of the acrylate in the molecule of the above compound to methacrylate, γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, etc. No. In the present invention, one or more of these can be used.

In addition to these, the developability after exposure can be improved by adding an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.

The content of these monomers is preferably 5 to 30% by weight based on the sum of the glass powder and the photosensitive component.
By setting the content within these ranges, the pattern formability and the hardness after curing can be improved.

As the binder, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate ester
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins.

The amount of the polymer component comprising the photosensitive polymer, the photosensitive oligomer and the binder in the photosensitive glass paste is excellent in terms of the pattern forming property and the shrinkage ratio after firing. It is preferably 5 to 30% by weight based on the sum of the components. By setting the content in this range, pattern forming properties and prevention of pattern thickening are more effective.

It is also effective to add an ultraviolet absorber. By adding a compound having a high ultraviolet absorption effect, a high aspect ratio, high definition, and high resolution can be obtained. UV absorbers composed of organic dyes, especially 35
Organic dyes having a high UV absorption coefficient in the wavelength range of 0 to 450 nm are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, anthraquinone dyes, benzophenone dyes, diphenylcyanoacrylate dyes, triazine dyes, p-aminobenzoic acid dyes and the like can be used. Even when the organic dye is added as a light absorbing agent, it is preferable because deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing. Among these, azo dyes and benzophenone dyes are preferred.

The addition amount of the organic dye is preferably 0.05 to 1% by weight based on the glass powder. More preferably 0.1
０．１0.18% by weight. When the content is 0.05% by weight or more, the effect of adding the ultraviolet light absorbing agent becomes more remarkable, and when the content is 1% by weight or less, the insulating film characteristics after firing can be improved.
Further, a sensitizer having absorption at the exposure wavelength is used. In this case, the refractive index becomes extremely high in the vicinity of the absorption wavelength. Can be improved. In this case, the sensitizer may be added in an amount of 3 to 10% by weight.

The polymerization inhibitor is added to improve the heat stability during storage. Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone,
N-nitrosodiphenylamine, phenothiazine, p-
t-butylcatechol, N-phenylnaphthylamine,
2,6-di-t-butyl-p-methylphenol, chloranil, pyrogallol and the like. Further, by adding the polymerization inhibitor, the threshold value of the photocuring reaction is increased, and the pattern line width is reduced and the upper portion of the pattern with respect to the gap is not thickened. The addition amount is usually 0.01 to 1% by weight in the photosensitive paste. When the content is 0.01% by weight or more, the effect of addition becomes more remarkable. When the content is 1% by weight or less, the sensitivity is improved and the exposure amount for forming a pattern can be reduced.

When it is desired to adjust the viscosity of the solution, an organic solvent may be added. As the organic solvent used at this time,
Methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic An acid, chlorobenzoic acid, or the like, or an organic solvent mixture containing at least one of them is used.

The photosensitive paste is usually prepared by mixing various components such as inorganic fine particles, an ultraviolet absorber, a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator, a glass frit and a solvent so as to have a predetermined composition. The mixture is uniformly mixed and dispersed with three rollers or a kneading machine.

The viscosity of the paste is appropriately adjusted by the addition ratio of inorganic fine particles, a thickener, an organic solvent, a plasticizer, a suspending agent, etc., but the range is from 2000 to 200,000 cp.
s (centipoise). For example, when the coating on the glass substrate is performed by the spin coating method, 200 to 5000 c
ps is preferred. In order to obtain a film thickness of 10 to 20 μm by applying once by a screen printing method, 10,000 to 100,000 cps is preferable.

Next, an example of the formation of the partition wall by the photosensitive paste method will be described, but the present invention is not limited to this.

A photosensitive paste is applied over the entire surface or partially over a glass substrate, a ceramic substrate, or a polymer film. As the application method,
Methods such as screen printing, a bar coater, a roll coater, a die coater, and a blade coater can be used. The coating thickness can be adjusted by selecting the paste discharge amount, the number of coating times, the mesh of the screen, and the viscosity of the paste.

Here, when applying the paste on the substrate,
Surface treatment of the substrate can be performed to enhance the adhesion between the substrate and the coating film. Examples of the surface treatment liquid include silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and tris-silane.
(2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ (2-aminoethyl) aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane and the like, or organic metals such as organic titanium, organic aluminum and organic zirconium. After uniformly applying this surface treatment liquid on the substrate with a spinner or the like,
Surface treatment can be performed by drying at 140 ° C. for 10 to 60 minutes. In addition, a method of applying a paste on a film, drying the film, and exposing it to a substrate after exposure, or performing an exposure process after attaching the paste-coated film to a glass or ceramic substrate. There are also methods.

After application, exposure is performed using an exposure device. The exposure is generally performed by a mask exposure using a photomask, as is performed by ordinary photolithography. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component. Alternatively, a method of directly drawing with a red or blue laser beam without using a photomask may be used.

As an exposure apparatus, a stepper exposure machine, a proximity exposure machine, or the like can be used. In the case of performing a large-area exposure, after applying a photosensitive paste on a substrate such as a glass substrate, and performing the exposure while transporting, it is possible to expose a large area with an exposure machine having a small exposure area. it can. The active light source used at this time is, for example, visible light, near ultraviolet light, ultraviolet light, electron beam,
X-rays, laser beams and the like can be mentioned, and among them, ultraviolet rays are preferable. As the light source, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a halogen lamp, a germicidal lamp and the like can be used. Among these, an ultra-high pressure mercury lamp is preferred. Exposure conditions vary depending on the coating thickness.
Using an ultra-high pressure mercury lamp with an output of ５０50 mW / cm ²
Exposure is performed for seconds to 30 minutes.

After the exposure, development is performed utilizing the difference in solubility between the photosensitive portion and the non-photosensitive portion in the developing solution.
The immersion method, the shower method, the spray method, the brush method and the like are used.
As a developer to be used, an organic solvent in which an organic component in the photosensitive paste can be dissolved can be used. Further, water may be added to the organic solvent within a range that does not lose its dissolving power. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be performed with an aqueous alkali solution. As the alkaline aqueous solution, a metallic alkaline aqueous solution such as sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution, etc. can be used, but it is preferable to use an organic alkaline aqueous solution since the alkaline component can be easily removed during firing. As the organic alkali, an amine compound can be used.
Specifically, tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide,
Monoethanolamine, diethanolamine and the like can be mentioned. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble part tends not to be removed,
If the alkali concentration is too high, the pattern portion tends to peel off and the non-soluble portion tends to corrode. The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.

Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of the paste and the substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used. When pattern processing is performed on a glass substrate, 540 to 61 at a heating rate of 200 to 400 ° C./hour.
The sintering is performed at a temperature of 0 ° C. for 10 to 60 minutes. The firing temperature is determined by the glass powder to be used, but it is preferable to fire at an appropriate temperature at which the shape after pattern formation does not collapse and the shape of the glass powder does not remain. The temperature of 540 ° C. or higher is preferable because the porosity and unevenness of the upper part of the partition wall can be reduced, the discharge life can be extended, and erroneous discharge can be prevented. By controlling the temperature to 610 ° C. or lower, it is possible to prevent the shape from being lost at the time of pattern formation, the upper portion of the partition to be rounded, and the height of the partition to be reduced.

A heating step at 50 to 300 ° C. may be introduced between the coating, exposure, development and baking steps for the purpose of drying and preliminary reaction.

When the substrate on which the electrodes and the partitions are formed as described above is used as a back plate for an AC type plasma display panel, a phosphor layer emitting light of each of RGB colors is formed between the partitions. The phosphor layer can be formed by applying a phosphor paste containing a phosphor powder, an organic binder and an organic solvent as main components between predetermined partition walls. As a method of applying the phosphor paste, a method of pattern printing by a screen printing method, a method of pattern exposure after the screen printing of the photosensitive paste, a method of applying the phosphor paste from a die having discharge holes of a predetermined pitch between predetermined partitions. A discharging method or the like can be used.

Further, a transparent electrode, a bus electrode, a dielectric, and a protective film (Mg) are formed on a substrate different from the back plate in a predetermined pattern.
O), a front plate is produced, and further, after sealing the back plate and the front plate, a space formed between both members by a partition is evacuated, and is made of helium, neon, xenon, or the like. After charging the discharge gas, a plasma display panel can be manufactured by mounting a drive circuit.

[0070]

The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. The concentration (%) in Examples and Comparative Examples is% by weight unless otherwise specified. (Measurement and evaluation methods) (1) Glass transition point and softening point Glass was determined by differential thermal analysis (DTA). About 100 samples
mg was heated in air at 20 ° C./min, and the DTA curve was drawn by plotting the temperature on the horizontal axis and the calorific value on the vertical axis. And DT
From the A curve, the glass transition point and the softening point were read.

(2) Partition Width / Narrow Partition Width The partition width / narrow partition width was determined by measuring the width of the top of the partition. When the top edge of the partition wall was rounded, the width immediately below the rounded portion was measured.

(3) Light-Emitting Defect Display after manufacturing a plasma display panel,
When there was no display defect and uniform display was obtained, 0 was described, and when defects such as light emission defect and extra light emission point were found, the number was described.

(Materials Used) Materials used in Examples and Comparative Examples of the present invention are shown below.

(Substrate) Glass substrate P manufactured by Asahi Glass Co., Ltd.
D200, 300 × 400 × 2.8 mm.

(Electrode material) Composition: 88 parts by weight of conductive silver powder (weight average particle size: 1.4 μm), 11 parts by weight of binder (ethyl cellulose), 3 parts by weight of glass frit,
6 parts by weight of terpineol.

(Dielectric, Partition Material) Glass (1); Composition: 7% Li ₂ O, 22% SiO ₂ , B ₂ O ₃ 3
2%, BaO 4%, Al ₂ O ₃ 22%, ZnO 2
%, MgO 6%, CaO 4% Thermophysical properties: glass transition point 491 ° C, softening point 528 ° C, coefficient of thermal expansion 74 × 10 ^-7 / K Specific surface area: 1.92 m ² / g Refractive index: 1.59 (g line 436 nm) Specific gravity: 2.54 Glass (2); Composition: 38% Bi ₂ O ₃ , 7% SiO ₂ , B ₂ O ₃ 1
9%, BaO 12%, Al ₂ O ₃ 4%, ZnO 20
% Thermal properties: glass transition point 475 ° C, softening point 515 ° C, coefficient of thermal expansion 75 × 10 ^-7 / K

(White filler powder) Filler: TiO ₂ , specific gravity 4.61 (polymer) Polymer (1): 40% methacrylic acid (MAA), 3
0% methyl methacrylate (MMA) and 30%
0.4 equivalent of glycidyl methacrylate (G) to the carboxyl group of the copolymer of styrene (St)
MA) by addition reaction, a 40% solution of a photosensitive polymer having a weight average molecular weight of 43,000 and an acid value of 95 in γ-butyrolactone polymer (2); ethyl cellulose / terpineol = 6
/ 94 solution (weight ratio) (Monomer) Monomer _{(1); X 2 -N-} CH (CH 3) -CH 2 - (O-CH 2- CH (CH 3))
_n -NX ₂ X: —CH ₂ —CH (OH) —CH ₂ O—CO—C (CH ₃ ) = CH ₂ n = 2 to 10 Monomer (2); Trimethylolpropane triacrylate modified PO ( Photopolymerization initiator) IC-369; Irgacure-369 (Ciba-Geigy product) 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1 IC-907; Irgacure-907 (Ciba-Geigy) Product) 2-methyl-1- (4- (methylthio) phenyl-2-
Morpholinopropanone (sensitizer) DETX-S; 2,4-diethylthioxanthone (sensitizer aid) EPA; p-dimethylaminobenzoic acid ethyl ester (plasticizer) DBP; dibutyl phthalate (DBP) (thickener) SiO ₂ ; 15% solution of 2- (2-butoxyethoxy) ethyl acetate of SiO ₂ (organic dye) Sudan; azo organic dye, chemical formula C ₂₄ H ₂₀ N ₄ O, molecular weight 380.45 (solvent) γ-butyrolactone terpineol ( Dispersant) Nopcospars 092 (manufactured by San Nopco) (stabilizer) 1,2,3-benzotriazole.

Example 1 After cleaning a glass substrate with a hot water brush, the electrode paste was subjected to pattern printing using a screen printer. The firing of the paste was performed at 570 ° C. The obtained electrode had a stripe shape with a pitch of 360 μm, a thickness of 4 μm, and a line width of 120 μm.

Next, a photosensitive paste for a partition was prepared.
The organic dye was weighed at a ratio of 0.08 parts by weight to 100 parts by weight of the glass powder (glass (1)). Sudan was dissolved in acetone, a dispersant was added, and the mixture was homogeneously stirred with a homogenizer. After adding glass powder to this solution and uniformly dispersing and mixing, 100 ° C. using a rotary evaporator.
At 70 ° C. and the acetone was evaporated. In this way, a powder was prepared in which the surface of the glass powder was uniformly coated with the organic dye film.

The polymer (1), the monomer (1), the photopolymerization initiator (IC-369), the sensitizer, the plasticizer, and the solvent were mixed at 37.5: 15:
The mixture was mixed at a weight ratio of 4.8: 4.8: 2: 7.5 and homogeneously dissolved. Thereafter, this solution was filtered using a 400-mesh filter to obtain an organic vehicle.

The glass powder and the organic vehicle were added in a weight ratio of glass powder: organic vehicle = 70: 71.6, and mixed and dispersed with three rollers to prepare a photosensitive paste for partition walls. did. The refractive index of the organic component is 1.5
9. The refractive index of the glass powder was 1.59.

Similarly, a paste for a dielectric layer having a weight ratio of glass (2): filler: polymer (2) = 55: 10: 35 was prepared. This dielectric paste has a pitch of 360
An electrode having a thickness of 4 μm, a line width of 120 μm, and a thickness of 4 μm was uniformly applied by screen printing using a 325 mesh screen on a glass substrate. Thereafter, the resultant was dried at 80 ° C. for 40 minutes and calcined at 550 ° C. to form a dielectric layer having a thickness of 10 μm.

On the dielectric layer, the paste for partition was
The solution was uniformly applied by screen printing using a 25-mesh screen to form a coating film. Coating and drying were repeated several times or more to prevent pinholes and the like from being generated in the coating film, and the film thickness was adjusted. The screen printing plate used was designed to be smaller than the length of the partition wall pattern in the longitudinal direction. Drying on the way is 10 at 80 ° C.
After forming the coating film for 1 minute, drying was performed at 80 ° C. for 1 hour.
The thickness of the coating film after drying was 150 μm.

Subsequently, through a stripe-type negative chrome mask having a pitch of 360 μm, 50 mJ / c from the upper surface.
Ultraviolet irradiation was performed using an ultra-high pressure mercury lamp having an m ² output. The exposure amount was 1.0 J / cm ² . At this time, the chrome mask used had a partition pattern length longer than the length of the coating film in the partition longitudinal direction. The chrome mask was designed so that the width of each partition was 80 microns, the width of the fine partitions was 30 microns, the number of the fine partitions was 2 per partition, and the width between the fine partitions was 20 microns.

Next, a 0.2% by weight aqueous solution of monoethanolamine kept at 35 ° C. was developed by applying a shower for 170 seconds, and then washed with water using a shower spray. As a result, the portions that were not photocured were removed, and a striped fine partition pattern was formed on the glass substrate.

The glass substrate on which the fine partition wall pattern is formed is baked at 570 ° C. for 15 minutes in air.
Fine partition walls were formed.

When the defect pattern of the partition wall after firing was visually inspected, there was no short circuit between the partition walls. Although several short-circuits between the fine partitions were observed, it is considered that the short-circuit between the fine partitions does not cause a defect during light emission. In addition, several disconnections were observed in the fine partition walls, but it was considered that this was not a defect extending to adjacent fine partition walls and there was no problem in the function as the partition walls. This verification was performed by light emission evaluation described later.

Between the partition walls thus formed, red, blue,
A phosphor paste that emits green light was applied by a screen printing method, and the paste was baked (500 ° C., 30 minutes) to form a phosphor layer on the side and bottom of the partition, thereby completing the back plate.

Next, a front plate was manufactured by the following steps. First, after forming ITO by sputtering on the same glass substrate as the back plate, applying a resist, exposing and developing into a desired pattern, etching, and firing to a thickness of 0.1 μm.
m, a transparent electrode having a line width of 200 μm was formed. Further, using a photosensitive silver paste composed of black silver powder, a thickness of 10 μm after firing and a pitch of 360
A bus electrode having a line width of 120 μm was formed. further,
Apply a transparent dielectric paste on the front plate substrate on which the electrodes are formed.
It was coated at 0 μm and baked while being kept at 430 ° C. for 20 minutes. Next, an MgO film having a thickness of 0.5 μm was formed using an electron beam evaporator so as to uniformly cover the formed transparent electrode, black electrode, and dielectric layer, thereby completing the front plate.

After the obtained front substrate is bonded and sealed to the rear substrate, the substrate is evacuated and evacuated, and Xe5% -Ne95
% Gas was enclosed at 67 kPa, and a driving circuit was joined to produce a plasma display. Display was performed by applying a voltage to this panel. Table 1 shows the evaluation results. As shown in Table 1, uniform display was obtained without display defects over the entire surface.

Example 2 When applying the paste for partition walls to the substrate, a thickness of 240 μm before drying was applied using a slit die coater, and air was jetted using a nozzle having an inner diameter of 0.3 mm before drying. A partition pattern was formed in the same manner as in Example 1 except that an inclined surface was formed at the end of the coating film. Thereafter, a plasma display was fabricated and evaluated in the same manner as in Example 1. Table 1 shows the results.

Example 3 After cleaning the glass substrate with a hot water brush, the electrode paste was subjected to pattern printing using a screen printer. The firing of the paste was performed at 570 ° C. The obtained electrode had a stripe shape with a pitch of 360 μm, a thickness of 4 μm, and a line width of 120 μm.

Next, in the same manner as in Example 1, a photosensitive paste for partition walls and a paste for dielectric layer were prepared. This dielectric paste was uniformly applied by screen printing using a 325 mesh screen on a glass substrate on which the electrodes had been formed in advance. Then, at 80 ° C, 4
It was dried for 0 minutes and calcined at 550 ° C. to form a dielectric layer having a thickness of 10 μm.

On the dielectric layer, a paste for partition walls was coated on the substrate with a thickness of 240 μm before drying using a slit die coater.
m. Before drying the applied partition wall paste, air was sprayed using a nozzle having an inner diameter of 0.3 mm to form an inclined surface at the end of the coating film.

Subsequently, grid-like partition walls were formed. The partition walls of the partition group separating the dyes were composed of fine partition walls, and the partition groups in the other direction formed ordinary partition walls. Through a lattice negative chrome mask with a pitch of 360 μm between each dye and a pitch of 1080 μm in the other direction, 50 mJ / cm from the top.
Ultraviolet irradiation was performed using a ^two- output ultra-high pressure mercury lamp. The exposure amount is 1.
It was 0 J / cm ² . At this time, the chrome mask used had a partition pattern length longer than the length of the coating film in the partition longitudinal direction. The width of the partition separating each dye is 8
The chromium mask was designed such that the width of the fine partitions was 0 μm, the width of the fine partitions was 30 μm, the number of the fine partitions was 2 per partition, the width between the fine partitions was 20 μm, and the width of the partitions in the other direction was 40 μm.
Next, 0.2% of monoethanolamine kept at 35 ° C.
The solution was developed by applying a weight% aqueous solution in a shower for 170 seconds, and then washed with water using a shower spray. As a result, portions that were not photocured were removed, and a grid-like partition pattern was formed on the glass substrate.

The glass substrate on which the partition pattern was formed was fired in air at 570 ° C. for 15 minutes to form the partition.

When the defect pattern of the fired partition wall pattern was visually inspected, there was no short circuit between the partition walls. Although several short-circuits between the fine partitions were observed, it is considered that the short-circuit between the fine partitions does not cause a defect during light emission. In addition, several disconnections were observed in the fine partition, but it was considered that this was not a defect extending to the adjacent fine partition, and there was no problem in the function as the partition. This verification was performed by light emission evaluation described later.

Thereafter, a phosphor was formed in the same manner as in Example 1, and a front panel to a plasma display were manufactured and evaluated. As shown in Table 1, uniform display was obtained without display defects over the entire surface.

Comparative Example 1 A partition pattern was formed in the same manner as in Example 1 except that a 80 μm partition was formed without forming a fine partition. As a result of visual inspection after firing in the same manner as in Example 1, no short-circuit defect of the partition wall was found, but several breaks in the partition wall were found. Thereafter, a plasma display was fabricated and evaluated in the same manner as in Example 1. Table 1 shows the results. Three light emission defects were observed in the display surface.

[0100]

[Table 1]

[0101]

By having the fine partition walls of the present invention,
A member for a plasma display panel substantially free from the influence of disconnection or chipping of the partition can be obtained. Thus, it is possible to provide a plasma display capable of performing uniform display over the entire surface without causing a light emission defect and an extra light emission point.
The member for a plasma display panel of the present invention can be used for a large television or a computer monitor.

[Brief description of the drawings]

FIG. 1 is a schematic view of a partition according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Fine partition 2 Partition 3 Partition group

Claims (4)

[Claims] 1. A plasma display panel member having electrodes and stripe-shaped partitions formed on a substrate, wherein the partitions forming a discharge space are composed of a plurality of fine partitions. Panel members. 2. A member for a plasma display panel in which an electrode and a grid-like partition are formed on a substrate, wherein the partition of at least one of the partition groups arranged in two directions has a plurality of fine partitions. A member for a plasma display panel, comprising: 3. The member for a plasma display panel according to claim 1, wherein the number of the fine partition walls is two or three per one set of partition walls. 4. A thin partition having a height of 50 to 200 μm and a line width of 10 to 100 μm.
The member for a plasma display panel according to any one of the above.