JP2000260072A - Optical disc bonding method and apparatus - Google Patents

Abstract

(57) [Problem] To bond an optical disk in which two substrates are bonded together with an adhesive so that the amount of warpage of the substrate during hardening bonding can be secured with high accuracy over the entire recording range. A method and apparatus are provided. SOLUTION: The first substrate and the second substrate are held and positioned at the time of irradiation with ultraviolet light to correct the warpage of the substrate and to suppress the warpage at the time of curing. Further, the illuminance of ultraviolet light is gradually applied to the adhesive to reduce the influence of substrate distortion due to curing shrinkage and the effect of radiant heat for bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminating method in which at least two resin-formed discs or glass substrates each having information recorded thereon are opposed to each other, and these are joined and fixed with an ultraviolet curing adhesive or the like. TECHNICAL FIELD The present invention relates to a method of bonding optical disks of a type and a bonding apparatus for performing the bonding method.

[0002]

2. Description of the Related Art As a method of bonding two optical disks formed of a resin material into a disk shape and recording information in the respective thickness directions, the methods shown in FIGS. 5A to 5D are well known. I have. That is, after applying an appropriate amount of an ultraviolet light reactive curing type adhesive 4 to the information recording side 51 surface of one of the first substrates 2 constituting the optical disk with the nozzle 5 while rotating the adhesive 4 in the arrow PI direction, The second substrate 3 with arrow PII
And is opposed to the first substrate 2 via the applied adhesive 4. Next, the first substrate 2 and the second substrate 3
Are rotated at a high speed in the direction of arrow PI to form uncured adhesive 4A between first substrate 2 and second substrate 3. Next, by irradiating ultraviolet light 54 from one or both of the first substrate 2 and the second substrate 3, the adhesive 4
A is cured, and the bonding of the first substrate 2 and the second substrate 3 is completed.

As shown in FIG. 6, a device for solidifying and bonding the adhesive 4A includes a holding member 61 in which a reference pin 60 for positioning a substrate is embedded, and an indexer for conveying the holding member 61 in the direction of arrow PIII. This is performed by a bonding apparatus including a transport device 62 constituted by a mechanism, an ultraviolet light generating device 63, the transport device 62, and a control device 64 for controlling on / off of the ultraviolet light generating device 63. In the production mode, as shown in FIG. 7, the first substrate 2 and the second substrate 3 on which the uncured adhesive 4A has been formed are supplied by a substrate supply device (not shown) in the direction of the arrow PIV. It is positioned and installed in a natural state on a holding member 61 made of. The first substrate 2 and the second substrate 3 installed on the holding member 61 are moved by an index mechanism 62 by an arrow PI.
It is sequentially fed out in the II direction, and passes through the inside of a plurality of ultraviolet light generating devices 63 in which the irradiation output of the ultraviolet light 54 is controlled in the direction of the arrow PV at a constant speed. The above ultraviolet light generator 6
When the light passes through the condensing position 65 indicated by the oblique line 3, the adhesive 4 </ b> A is cured by the irradiation of ultraviolet rays, and the first substrate 2 and the second substrate 3 are bonded to each other. The bonded substrate is further fed out in the direction of the arrow PVI, and is taken out of the holding member 61 in the direction of the arrow PVII through the inspection step (not shown) by the board take-out device (not shown).

[0004]

Among the optical disks, for example, an optical disk of a single-sided reproduction double-layer disk of a DVD (digital versatile disk) as shown in FIG. 8 is formed in two layers in the thickness direction of the optical disk 1. Record information 6
It is necessary to accurately read each of A and 6B with the laser beam 7 projected from one side of the optical disc 1, and the first substrate 2 and the second substrate 2 bonded together so as not to hinder the incidence and reflection of the laser beam. The amount of inclination θ of the substrate 3 must be maintained within a predetermined standard over the entire recording range.
Note that a reflective film 8 is formed in the information recording area on the first substrate 2, and a translucent film 9 is formed in the information recording area on the second substrate 3.

[0005] However, the first substrate 2 and the second substrate 3 on which the uncured adhesive 4A described above with reference to FIG. If only the light irradiation output and the passing speed are controlled under certain conditions, warpage occurs in the vertical and circumferential directions of the bonded substrates, and it is difficult to keep the amount within a predetermined standard over the entire recording range.

FIG. 9 shows the phenomenon that the warpage occurs.
This will be described with reference to (A) to (C).

In a state where the first substrate 2 and the second substrate 3 are stuck to each other via the adhesive layer 4 and the uncured adhesive 4A is brought closer to the position where the ultraviolet light 54 acts, the adhesive 4A is sequentially placed. Reaction hardens, but as shown in FIG.
The condensing position of the ultraviolet light 54 is linear 9 with respect to the adhesive 4A.
In order to act on 0, the volume to be cured changes on the surface 91 of the substrate, for example, in the order of progression. Further, as shown in FIG. 9B, the second substrate 3 is moved by the arrow PVII by the heat generating portion 93 when the uncured adhesive 4A is reactively cured by the ultraviolet light 54 and the radiant heat 92 of the ultraviolet light generator 63.
It expands once in the I direction, and cures while warping downward. Further, as shown in FIG. 9C, the shrinkage progresses in the direction of the arrow PIX together with the cooling, and finally a state in which uneven warpage is generated in the upward direction. That is, when the adhesive 4A is cured by the ultraviolet light 54, the disk 1 is significantly deformed to an irregular shape.

FIG. 10 shows the deformation amount of the disk 1 in the bonding experiment when the ultraviolet irradiation output of the ultraviolet light generator 63 is 70%. The horizontal axis is the radius (mm) from the center of the disk 1 and the vertical axis is Is shown by the displacement amount (μm) of the disk 1, and it is clear that the disk 1 is deformed to an extremely irregular shape.

Further, in the injection molding process for forming a substrate at a high temperature, the first substrate 2 and the second
Although the accuracy of the substrate 3 is determined, it is a well-known fact that since the thickness is as thin as 0.6 mm with respect to 120 mm in diameter, it is sensitive to various conditions at the time of molding and distortion is easily generated inside the molded product. It is. Furthermore, since the temperature gradient of the front and back surfaces also occurs during the natural cooling process in the atmosphere after being taken out from the mold, there is already a non-repeatable warpage in both the radial direction 94 and the circumferential direction 95 before bonding. It has a shaped shape.

[0010] As described above with reference to FIG. 8, the reflective film 8 is formed in the information recording area on the first substrate 2, and the translucent film 9 is formed in the information recording area on the second substrate 3. However, it is a well-known fact that warpage occurs due to distortion of the surface layer due to film formation.

That is, since two substrates having the above-mentioned internal distortion and uneven warpage are bonded together by ultraviolet light accompanied by thermal deformation and curing shrinkage, the amount of warpage of the substrates in the hardened joint is reduced. It was extremely difficult to secure the target over the entire recording range and maintain it for a long time.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problem, and in an optical disk formed by bonding two substrates with an adhesive, the amount of warpage of the substrates in the hardened joint can be specified over the entire recording range. It is an object of the present invention to provide a method of bonding optical disks which can be secured in the apparatus, and an apparatus therefor.

[0013]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the first and second disk-shaped substrates superposed in the thickness direction are irradiated with the ultraviolet light at the ultraviolet light condensing position via the ultraviolet light reactive curing adhesive. And bonding the adhesive to form an optical disk. The method according to claim 8, further comprising: holding the first substrate and the second substrate while irradiating the ultraviolet light with the first substrate and the second substrate. By gradually approaching the ultraviolet light condensing position while passing the substrate along an arc locus and passing through the ultraviolet light condensing position, the adhesive is solidified while the illuminance of the ultraviolet light on the adhesive acts slowly. To provide a method for bonding optical disks.

According to the second aspect of the present invention, the first substrate and the second substrate are arc-shaped while the distance between the lower surface of the first substrate and the upper surface of the second substrate is kept constant during the irradiation of the ultraviolet light. By gradually approaching the ultraviolet light condensing position while following the trajectory and passing through the ultraviolet light condensing position, the ultraviolet light is applied to the adhesive while correcting the warp of the first substrate and the second substrate. The method for bonding optical disks according to the first aspect, wherein the adhesive is solidified by irradiation.

According to the third aspect of the present invention, the lower surface of the first substrate is sucked by suction during the irradiation of the ultraviolet light, and the optical disk follows the arc trajectory while the lower surface of the first substrate is sucked. The adhesive is irradiated with the ultraviolet light while correcting the warp of the first substrate and the second substrate by gradually approaching the ultraviolet light focusing position and passing through the ultraviolet light focusing position. An optical disk bonding method according to the first or second aspect, wherein the adhesive is solidified.

According to the fourth aspect of the present invention, the lower surface of the first substrate is sucked by the suction surface having the suction shape in consideration of the amount of warpage of the first substrate after the adhesive is solidified, and By irradiating the adhesive with the ultraviolet light while correcting the warp of the first substrate and the second substrate by gradually approaching the light collecting position while following an arc locus and passing the ultraviolet light collecting position. The method for attaching an optical disk according to the third aspect, wherein the adhesive is solidified by using the method.

According to the fifth aspect of the present invention, the disk is raised toward the irradiation side of the ultraviolet light at the center of the ultraviolet light condensing position, and is moved until the disk reaches the center of the ultraviolet light condensing position. The optical disk bonding method according to any one of the first to fourth aspects, wherein the disk is lowered so as to move away from the irradiation side of the ultraviolet light in the region after the arrival and the region after the arrival.

According to the sixth aspect of the present invention, the first and second disk-shaped substrates superposed in the thickness direction are irradiated with the ultraviolet light at the ultraviolet light condensing position via the ultraviolet light reactive curing adhesive. An optical disk laminating device for solidifying the adhesive to form an optical disk, comprising: a holding device for holding the first substrate; and an opening / closing device for the first substrate held by the holding device. Thereby, the first substrate can be moved from the second substrate side.
A pressing and positioning device for pressing or positioning the second substrate toward the substrate; and a first positioning device that is held by the holding device.
By moving the holding device and the pressing and positioning device continuously or intermittently so that the disk moves along the circumferential direction of an arc locus having a radius from the center of the substrate to a predetermined position outside the holding device, A rotary elevating device that passes the ultraviolet light condensing position while following the arc locus while moving up and down at the ultraviolet light condensing position of the ultraviolet light, and the ultraviolet light at the ultraviolet light condensing position on the arc locus An ultraviolet light irradiating device for irradiating the disk with the ultraviolet light is provided.

According to the seventh aspect of the present invention, in order to minimize the amount of warpage of the adhesive after solidification connected to the rotary elevating device, the trajectory and speed of the ultraviolet light condensing position, By controlling the light condensing position avoidance trajectory and avoidance speed,
According to a sixth aspect, there is provided the optical disc bonding apparatus according to the sixth aspect, further comprising: a control device that causes the illuminance of the ultraviolet light to act slowly.

According to an eighth aspect of the present invention, the control device raises the disk toward the ultraviolet light irradiation side at the center of the ultraviolet light condensing position, while controlling the center of the ultraviolet light condensing position. In the ultraviolet light focusing position reaching trajectory, which is an area until reaching the portion, and in the ultraviolet light focusing position avoidance trajectory, which is an area after reaching, the disc is lowered so as to move away from the irradiation side of the ultraviolet light. An optical disk bonding apparatus according to the seventh aspect is provided.

According to a ninth aspect of the present invention, the suction force of the first substrate is connected to the holding device and the pressing and positioning device so as to minimize the warpage of the adhesive after solidification. The optical disc bonding apparatus according to the sixth aspect, further comprising a control device for controlling a size and a suction maintaining time and a magnitude of a pressing force of the second substrate and a suction maintaining time to apply a correcting force during the ultraviolet light irradiation. I will provide a.

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings.

An optical disk bonding method and an optical disk bonding apparatus for executing the bonding method according to an embodiment of the present invention will be described below with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals.

An optical disk bonding apparatus according to an embodiment of the present invention shown in FIG. 1 basically has a thickness direction through an ultraviolet light reactive curing adhesive 4 similarly to the above-mentioned conventional optical disk bonding apparatus. Disc-shaped first substrate 2 superposed on
And an apparatus for irradiating the adhesive 4 with ultraviolet light 54 on the second substrate 3 to solidify the adhesive 4 to form the disk 1.
The optical disk laminating apparatus according to the embodiment is roughly divided into a first substrate 2 that forms a part of the disk 1.
, A pressing and positioning device 11 for positioning and holding the second substrate 3 constituting the remaining part of the disk 1 at a predetermined pressing position with respect to the first substrate 2, and a rotating device for the disk 1 12, an elevating device 13 of the holding device 10, an ultraviolet light irradiating device 14 for irradiating the disk 1 with ultraviolet light, and a control device 15 for controlling the operation of each device. The disc 1 has, as an example, a reflective film formed on the information recording area of the first substrate 2 and a translucent layer formed on the information recording area of the second substrate 3 as described above. That is, the disk 1
Is for receiving the ultraviolet light 54 on the adhesive 4 from the second substrate 3 side.

In the present embodiment, the holding device 10 holds the first substrate 2 by sucking the lower surface (back surface) 2A of the first substrate 2 by a suction operation, and also holds the back surface 2A of the first substrate 2 by suction operation. This is an apparatus that corrects distortion caused by molding or film formation of the first substrate 2 by forcibly adsorbing and maintains the upper surface of the first substrate 2, that is, the bonding surface, with high precision and flatness. The holding device 10 includes a suction plate 20 described below for holding the first substrate 2 by suction, an arm 22 supporting the suction plate 20, and a suction device 100 connected to the arm 22 to perform the suction operation. And
In the present embodiment, a vacuum pump 23 and a control opening / closing valve 24 are used as the suction device 100, and the vacuum pressure is, for example, about -150 mmHg. In addition,
The holding device 10 revolves around a main shaft 47 of the rotating device 12 as described later.

The suction plate 20 is a circular plate having an outer diameter substantially equal to the diameter of the first substrate 2,
A circular engraved air chamber 25 is provided on the lower back surface,
A vent hole 26 composed of a plurality of small diameter holes is provided in the air chamber 25 at a substantially constant distance in the radial direction and the circumferential direction so that air can pass through the suction operation. In addition, a reference pin 21 is provided at the center thereof. For example, the center of the first substrate 2 and the second substrate 3 has a diameter of 15.08 m.
m through holes are formed, and the reference pin 2
Numerals 1 are fitted and penetrated in the through holes, respectively, to position the first substrate 2 and the second substrate 3 with respect to the suction plate 20. The first substrate 2 is placed on the suction plate 20, and the vacuum pump 23 of the suction device 100 is driven to open the control opening / closing valve 24 so that the suction plate 20 is opened.
Of the first substrate 2 with the suction plate 20
To be held by suction. The suction surface 27 of the suction plate 20 that holds the first substrate 2 by suction is highly accurate (for example, 1
/ 200 [mm] = accuracy of about 8 μm), and the suction surface 27 is made of an aluminum alloy having excellent heat dissipation as a material for heat storage as an example.

The sealing material 2 is provided on the back surface of the suction plate 20.
When the suction plate 20 is fixed to the arm 22 after the application of the coating 8, the circular engraving of the suction plate 20 functions as the air chamber 25. Also, the arm 22
Is provided with an air passage 30 having one end (upper end) opened to the air chamber 25 and the other end (lower end) connected to the first tube 29. The first tube 29 connected to the other end of the air passage 30 is connected to a rotation member 12A of the rotation device 12 to be described later, and the first tube 29 is connected to the air passage 5 of the rotation member 12A.
8, and further from the vacuum path connected to the second tube 31, the control on-off valve 2 with a vacuum pressure gauge attached.
4 and connected to the vacuum pump 23. Therefore, the inside of the air chamber 25 is set to a negative pressure by the suction device 100. In addition, the air chamber 25 has a volume that is, for example, 5 to 8 times the air volume in all the air holes 26 provided in the suction plate 20, so that the air volume in all the air holes 26 is not affected by the pulsation of the vacuum pump 23. The first substrate 2 can be sucked at a uniform suction pressure.
The base end of the arm 22 is inserted into and fixed to an upper end of a main shaft 47 of a rotation member 12A of the rotating device 12 described later, and is rotatable integrally with the main shaft 47.

In the present embodiment, the pressing and positioning device 11 corrects or deforms the distortion caused by molding or film formation of the second substrate 3 from the upper surface 32 side of the second substrate 3 by the pressing operation. This is an apparatus that positions while maintaining the gap between the bonding surface of the first substrate 2 and the bonding surface of the second substrate 3 at, for example, about 60 μm. The pressing positioning device 11 includes a pressing plate 33 and a holding member 3 that holds the pressing plate 33.
4, an opening and closing drive member 35 for opening and closing the holding member 34
Opening / closing power generating member 36 for generating the opening / closing driving force
And In the present embodiment, a rotary actuator with a control opening / closing valve operated by air pressure is used as the opening / closing power generation member 36. The air pressure is, for example, about 4 kg / mm ² .

The pressing plate 33 has an outer diameter which is, for example, about 20 mm larger than the diameter of the second substrate 3 and has a relief hole 37 for the reference pin 21 provided at the center of the suction plate 20 at the center thereof. Have. The pressing plate 33 is made of a quartz glass material that has been subjected to flat processing on its front and back surfaces and highly polished for the purpose of preventing deterioration and diffusion by the ultraviolet light 54 and transmitting the ultraviolet light 54 at a high rate. It is fixed to the holding member 34.

As a material of the holding member 34, an aluminum alloy having excellent heat dissipation is used as an example for weight reduction and heat storage measures, and the holding member 34 for holding the pressing plate 33 for transmitting ultraviolet light. For example, a through hole or a transmission portion 34 a (see FIG. 2) having an inner diameter smaller than the inner diameter of the fixing portion 38 by about 10 mm is provided. The surface of the fixing portion 38 of the holding member 34 that comes into contact with the pressing plate 33 is flattened with high precision. A through hole 39 through which a shaft 41 to be described later is inserted is provided at an end of the holding member 34, and an opening and closing drive described below is disposed at a position where the holding member 34 can be rotated and opened with the center of the suction plate 20 as a starting point. The end of the holding member 34 is connected to the member 35.

The opening / closing drive member 35 is connected to the holding device 1.
A shaft 40, a pulley 42 fastened to one end of the shaft 41, and a timing belt 43.

A pulley 44 is fixed to an end of the rotary actuator of the opening / closing power generating member 36, and the pulley 44 is connected to the pulley 42 by the timing belt 43. When the opening / closing power generation member 36 is actuated, the pulley 44 rotates forward and reverse, and the pulley 42 also rotates forward and reverse by the timing belt 43, and the holding member 34 to which the pressing plate 33 is fixed is moved.
As shown in FIG.
It opens and closes with respect to the holding device 10 while rotating forward and backward in the directions.

Since it is necessary to match the center of the ultraviolet light condensing position, the rotating device 12 has its rotating member 12A.
Is the maximum radius R from the center of rotation of the holding device 10 to the center of the holding device 10, that is, the center of the suction surface 27 of the suction plate 20 of the holding device 10 (actually, the center axis of the reference pin 21).
(See FIG. 1), the center of the disk 1 held while being corrected by the holding device 10 and the pressing and positioning device 11 is along a circular locus, at least along an arc locus, along the circumferential direction III of the circumference of the maximum radius R. The disk 1 held while being corrected is continuously or intermittently rotated so as to move and pass through the lower surface of an ultraviolet light generator 14 described later.
B.

The main shaft 47 of the rotating member 12A has a different diameter (a flat portion is formed by cutting out a part of the outer peripheral portion of the upper end portion).
2, the arm 22 has a base end inserted into and fixed to a top end of a main shaft 47 of a rotation member 12A of the rotation device 12, which will be described later.
The holding member 1 having a roller bearing 48 built therein.
The 2B holder 49 is rotatably supported by a pair of upper and lower thrust bearings 50 sandwiching the roller bearing 48 and a nut 52 disposed at the lower end of the lower thrust bearing 50. Therefore, the holder 49 acts so that the holding device 10 operates in parallel along the rotation direction of the disk 1. A pulley 53 is fitted to the lower part of the main shaft 47 so as to be slidable in the axial direction and relatively non-rotatable, and a timing belt 57 is provided between the pulley 56 connected to the motor 55 and the pulley 53 of the main shaft 47.
Is being wrapped around. Therefore, the spindle 47 is connected to the motor 55
Pulley 56 and timing belt 57
And the pulley 53 can be rotated. The rotation ratio between the pulley 53 and the pulley 56 is set to 1/4 to 1/6. One end of the main shaft 47 is connected to the first tube 2.
9 has the other end connected to the second tube 31.
8 is formed along the extending direction, and a rotary tube fit 59 is used so that the rotation of the main shaft 47 does not twist the second tube 31.

The elevating device 13 moves the disk 1 held while being corrected by the holding device 10 and the pressing and positioning device 11 by the rotating device 12 in the circumferential direction III.
A device that changes the vertical distance to the ultraviolet light generating device 14 in the process of rotating continuously or intermittently and passing the lower surface of the ultraviolet light generating device 14 described below, and includes a mounting member 13A and a lifting power generating member. 13B.

The mounting member 13A includes a slider 70 with a built-in bearing (not shown) and a base 7 on which devices are arranged.
1 and a guide rail 72 for connecting the slider 70 and the base 71, so that the slider 70 can be easily moved up and down. Also, the slider 70 has an arrow II
Is connected to the lifting power generation member 13B from the lower surface in the straight direction. In this embodiment, the lifting power generating member 13B
Air cylinder 45 operated by air pressure
And an on-off valve 46 for control. The air pressure is, for example, about 4 kg / mm ² .

The holder 49 of the rotating device 12 is fixed to the slider 70 of the lifting device 13. As a result, when the slider 70 is moved up and down by driving the air cylinder 45, the holder 49 of the rotating device 12 connected to the slider 70 is also moved up and down. Therefore, the holding device 10 and the pressing and positioning device 11 are moved by the rotating operation of the rotating device 12 and the vertical movement of the elevating device 13.
3, a rotational movement in the direction of arrow III and a vertical movement in the direction of arrow IV are possible.

A pulley guide 73 is fastened to the base 71 in order to prevent the position of the pulley 53 from being changed by the vertical movement of the holder 49. Therefore, even if the holder 49 moves up and down, the pulley guide 73
By this, the pulley 53 connected to the holder 49 is restricted from moving up and down together with the holder 49,
The rotational motion is transmitted from the pulley 53 to the holder 49.

The ultraviolet light generating device 14 stably and efficiently generates ultraviolet light having a certain wavelength, and
And a light-emitting lamp 75
, A reflection plate 76 and a housing 77. Case 7
A cooling air intake port 78 and an exhaust port 79 are provided in the cooling air 7 to suppress heat storage due to radiant heat. As described above, the disk 1 is moved from the center of the main shaft 47 of the rotating device 12 to the suction surface 2 of the suction plate 20 of the holding device 10.
7, the center of the light emitting lamp 75 is arranged so as to substantially coincide with the center of the holding device 10 in consideration of the variation in the illuminance in the longitudinal direction of the light emitting lamp 75 in consideration of the maximum radius R. . To illustrate this, reference numeral 75F in FIG. 3 indicates a region on the suction plate 20 of the holding device 10 where the light-emitting lamp 75 is projected.

The control device 15 controls the on / off and suction force of the suction of the holding device 10 and the pressure positioning device 1.
1 opening / closing on / off and opening / closing pressure, and rotating device 12
On and off and the rotation speed of the elevating device 13, the on and off and elevating speed of the elevating device 13 and the ultraviolet light generating device 1
4 is a device for controlling ON and OFF of the light emission of 4, the magnitude of the suction force of the first substrate 2 and the suction maintaining time, the magnitude of the pressing force of the second substrate 3 and the pressing maintaining time, and the position where the ultraviolet light 54 is condensed. The arrival / avoidance trajectory and the arrival / avoidance speed can be set relatively freely. The control of each operation will be described later.

FIG. 3 shows a production mode of the disk 1 using the bonding method and apparatus according to the present embodiment. The disk 1 composed of the first substrate 2 and the second substrate 3 having the uncured adhesive 4A formed therebetween is attracted to the holding device 10 by a substrate supply device (not shown) in the direction of arrow I. It is positioned and placed on the plate 20 by the reference pin 21.
At the same time as mounting, the vacuum pump 23
(In other words, the vacuum pump 23 is turned on and driven at the same time as receiving the vacuum-off signal of the substrate supply device) to suck the first substrate 2 in the direction of arrow II. Further, the opening / closing power generation member 36 is controlled to be turned on and driven, and the disk 1 is pressed by the pressing plate 33 from the upper surface of the second substrate 3 or the thickness direction of the first substrate 2 and the second substrate 3 of the disk 1 Is pressed and positioned so that the gap dimension becomes constant. That is, depending on the case, there are a case where only the pressing operation is performed (for example, a case where the film thickness is defined and the gap dimension is made constant) and a case where the pressing positioning operation is performed. Based on the ON / OFF control of the opening / closing power generating member 36, the control device 15
When the motor 55 of the rotating device 12 is turned on and driven at the same time as the mounting of the disk 1 proceeds, the rotating member 12A of the rotating device 12 rotates around the central axis of the main shaft 47 while being held by the holding member 12B. The pressing plate 33 of the pressing and positioning device 11 is also rotated together with the suction plate 20 of the holding device 10 so that the center of the disc 1 held between the suction plate 20 and the pressing plate 33 has a center of the maximum radius R. Along the axis III and relatively rotationally controlled at a relatively high speed (for example, 500 mm / sec). By this rotational movement, the center of the disk 1 approaches the irradiation area of the light emitting lamp 75 of the ultraviolet light generator 14.
Assuming that the focus position of the ultraviolet light 54 of the ultraviolet light generating device 14 is the maximum illuminance (eg, 600 mW), the above-described position immediately before the illuminance distribution position (the state of FIG. 3) of at least １ ／ to ５ of the maximum illuminance is obtained. The motor 55 is decelerated by the control device 15 (for example, 100 mm / sec), and the ultraviolet light 54 passes through the through-hole or the transmitting portion 34 a of the holding member 34 and passes through the second substrate 3 of the disc 1 to the adhesive 4 A. And the curing of the adhesive 4A by the ultraviolet light 54 is started.

Here, when the control device 15 controls the air cylinder 45 of the lifting device 13 to be turned on at substantially the same timing as the deceleration control, the holder 49 of the rotating device 12 moves up together with the slider 70, The main shaft 47 connected to the holder 49 and the arm 22 connected to the main shaft 47 are raised. Therefore, the disc 1 held between the suction plate 20 and the pressing plate 33 via the arm 22 is used for the ultraviolet light 5 of the ultraviolet light generator 14.
Arrow 4 of FIG. 3 toward the light-collecting position 4 (the state of FIG. 3).
It will be exposed to the ultraviolet light 54 while rising in the V direction.
By controlling the motor 55 by the control device 15, the moving speed of the disk 1 at the focusing position (the state shown in FIG. 3) is controlled (for example, 100 to 200 mm / s).
ec) While the disk 1 is condensed at the focusing position (the state of FIG. 3)
Through. When the control unit 15 detects that the disk 1 has passed the focusing position (the state of FIG. 3) from the rotation signal of the motor 55, the control unit 15 controls the air cylinder 45 of the elevating device 13 to be turned off. When the disk 1 is stopped after moving down, the disk 1 is assumed to have a maximum illuminance (e.g., 600 mW) at which the ultraviolet light 54 is condensed. The illuminance distribution position is at least １ ／ to １ ／ of the maximum illuminance (see FIG. 3), the disk 1 is exposed to the ultraviolet light 54 while descending in the direction of the arrow V, so that the ultraviolet light 54 gently acts on the second substrate 3 and the adhesive 4A to cure the adhesive 4A. Thus, the first substrate 2 and the second substrate 3 are bonded. The drive of the motor 55 is controlled by the control device 15, and the bonded disc 1 is relatively fast in the direction of arrow III (for example, 500 mm /
When the opening / closing power generating member 36 is controlled to be turned off by the control device 15, the pressing plate 33 is opened to release the upper surface of the second substrate 3. At the same time, the control device 15 controls the vacuum pump 23 to be turned off and stopped to release the suction of the first substrate 2. Further, the motor 55 is driven by the control device 15 to rotate and move the disk 1 to perform an inspection process (not shown), and then to remove the disk 1 from the suction plate 20 of the holding device 10 by a device (not shown). It is taken out in the direction of arrow VI. It should be noted that the ultraviolet light generator 14 requires several tens of seconds to stabilize the illuminance. Therefore, the controller 15 normally drives the ultraviolet light generator 14 so that it is controlled to be turned on at the same time as the automatic operation of the ultraviolet light generator 14 is started. Is not supplied from the direction of the arrow I for a certain period of time (for example, 20 seconds), the control device 15 performs an off-control to stop the drive and take an energy saving measure.

As described above, according to the method for bonding optical disks according to the above embodiment of the present invention, basically the same as the above-described conventional method for bonding optical disks,
In this method, the disc 1 is formed by irradiating the first and second disc-shaped substrates 2 and 3 stacked in the thickness direction with the ultraviolet light reaction curing adhesive 4 by irradiating the first substrate 2 and the second substrate 3 with ultraviolet light 54 to solidify the disk. In the embodiment, the disk 1 having the first substrate 2 and the second substrate 3 via the uncured adhesive 4A is held by the holding device 10 without exerting an attraction force. In addition, the suction force is not applied to prevent local deformation of the ventilation hole (suction hole for suction) due to excessive increase in vacuum suction force)
In addition, the rotating device 12 moves so that the holding device 10 together with the disc 1 gradually approaches the focusing position of the ultraviolet light 54 while passing along the circular locus, at least the arc locus, passing through the focusing position. By controlling the moving speed and the height position of the disk 1 by the
The illuminance of the ultraviolet light 54 can be gradually applied to the uncured adhesive 4A, and the substrates 2 and 3 can be bonded together by reducing the distortion of the substrates 2 and 3 due to the curing shrinkage of the adhesive 4A and the influence of radiant heat. Can be.

According to the above embodiment, the first substrate 2
1 having a first substrate 3 and a second substrate 3 via an adhesive 4A
Is held by the holding device 10 and the suction force is not applied (the suction force is once applied for holding, and the suction force is reduced to prevent local deformation of the ventilation hole (suction hole for suction) due to excessive rise of the vacuum suction force). Without acting), the pressing and positioning device 11 presses the second substrate 3 and positions the substrates 2 and 3 to each other.
By controlling the moving speed and the height position of the disk with the lifting device 13 and the elevating device 13, the disk is controlled so as to gradually approach the light collecting position of the ultraviolet light 54 and pass through the light collecting position while following a circular locus. While improving the shape of the substrate of the second substrate 3 (for example, improving correction of warpage in the circumferential and radial directions) and securing the thickness of the adhesive 4A between the substrates 2 and 3 to a predetermined value. The illuminance of the ultraviolet light 54 can be gradually applied to the adhesive 4, and the substrates 2, 3 due to curing shrinkage can be used.
The substrates 2 and 3 can be bonded to each other while reducing the influence of distortion and radiant heat.

In the above embodiment, the disk 1 having the second substrate 3 is held by the holding device 10 via the first substrate 2 and the adhesive 4A, and the back surface 2A of the first substrate 2 is sucked by suction. Then, while controlling the moving speed and height position of the disk by the rotating device 12 and the elevating device 13, the disk gradually approaches the light collecting position of the ultraviolet light 54 while passing through the circular locus and passes through the light collecting position. By controlling, the first
The shape of the substrate 2 is improved (for example, improvement in correcting the warpage in the circumferential direction or the radial direction), and the illuminance of the ultraviolet light 54 is gradually applied to the adhesive 4 so that the substrate 2 is cured by shrinkage. The substrates 2 and 3 can be bonded to each other while reducing the influence of distortion and radiation heat of the substrate 3.

In the above embodiment, the disk 1 having the second substrate 3 is held by the holding device 10 via the first substrate 2 and the adhesive 4A, and the back surface 2A of the first substrate 2 is sucked by suction. Further, while pressing the second substrate 3 with the pressing positioning device 11, the positioning between the substrates 2 and 3 is performed.
By controlling the moving speed and the height position of the disk by using the lifting device 13 and the lifting device 13, while gradually following the circular trajectory, approaching the light collecting position of the ultraviolet light 54 and passing through the light collecting position, To improve the shape of the first substrate 2 and the second substrate 3 (for example, to correct the molding warp in the circumferential direction and the radial direction) and to secure the thickness of the adhesive 4A between the substrates 2 and 3 to a predetermined value. In addition, by making the illuminance of the ultraviolet light 54 gradually act on the adhesive 4, the substrates 2 and 3 can be bonded to each other while reducing the distortion of the substrate due to curing shrinkage and the influence of radiant heat.

The present invention is not limited to the above embodiment, but can be implemented in other various modes. For example, a disk 1 having the first substrate 2 and the second substrate 3 via an adhesive 4A is held by a holding device 10, and the first
In the method according to the above embodiment, the back surface 2A of the substrate 2 is sucked by suction, and the pressing and positioning device 11 presses the second substrate 3 to position the substrates 2 and 3.
(Here, details of vent holes, air chambers, etc. are not shown for simplicity.) As shown in the drawing, the suction surface 27 of the suction plate 20 for sucking the substrate and the pressing plate 33 for pressing the substrate are respectively provided. The rotating device 12 and the elevating device 13 gradually approach the condensing position of the ultraviolet light 54 while following a circular locus while controlling the moving speed and the height position of the disk while taking into account the amount of warpage after curing. The first substrate 2 and the second substrate 3 are controlled so as to pass through the focusing position.
(For example, improvement in correcting the warpage in the circumferential or radial direction, or improvement in correcting the shape by intentionally changing the shape), and gently acting on the adhesive 4 with the illuminance of the ultraviolet light 54 By doing so, the substrates 2 and 3 can be bonded to each other while reducing the effects of radiant heat and distortion of the substrates 2 and 3 due to curing shrinkage. For example, as shown in FIG. 4, the suction surface 27 and the pressing plate 33 of the suction plate 20 may be shaped to allow for the amount of warpage after curing.
The suction surface 27 of 0 is a conical surface whose central portion is upwardly convex,
The lower surface of the pressing plate 33 corresponds to the conical surface, and the central portion is a concave surface that is concave downward.

It should be noted that two pairs of the holding devices 10 were prepared,
You may make it oppose centering | focusing on a rotary apparatus.

[0050]

As described above in detail, according to the method for bonding optical disks of the present invention, two substrates constituting an optical disk which are overlapped with each other via an adhesive are corrected and positioned from both sides. The position and the moving speed of the two substrates can be controlled so that the illuminance of the ultraviolet light gradually acts on the adhesive. With such a configuration and operation, it is possible to correct the distortion caused by the molding and film formation of the two substrates, to stably secure the thickness of the adhesive flowing between the substrates,
The illuminance of ultraviolet light is gradually applied to the adhesive to reduce the distortion of the substrate due to rapid curing shrinkage and reduce the influence of radiant heat, thereby enabling bonding. Therefore, the amount of warpage of the disk can be ensured with high accuracy over the entire recording range without being affected by the manufacturing accuracy of the substrate.

According to the optical disk laminating apparatus of the present invention, the holding apparatus, the pressing positioning apparatus, the rotating apparatus,
Equipped with an elevating device, an ultraviolet light generating device, and a control device for controlling them, and correcting and positioning the two substrates that constitute the optical disc by superimposing them via an adhesive from both sides to moderate the illuminance of ultraviolet light. The position and the moving speed of the two substrates can be controlled so that they act on the adhesive. With such a configuration and operation, the distortion caused by the molding and film formation of the two substrates can be corrected, the thickness of the adhesive flowing between the substrates can be stably secured, and the illuminance of the ultraviolet light is moderately reduced. It can be bonded to an adhesive by reducing the distortion of the substrate due to rapid curing shrinkage and the effect of radiant heat.
Therefore, the amount of warpage of the disk can be ensured with high accuracy over the entire recording range without being affected by the manufacturing accuracy of the substrate.

More specifically, according to the optical disk bonding method and apparatus according to the above-mentioned aspect of the present invention, the first disk-shaped substrate and the first disk-shaped substrate stacked in the thickness direction via an ultraviolet light reactive curing adhesive are provided. In the method and apparatus for forming a disk by irradiating the substrate 2 with ultraviolet light and solidifying the disk, the disk having the first substrate and the second substrate via an uncured adhesive is held and a suction force is applied. (After suction once for holding, no suction force is applied to prevent local deformation of ventilation holes (suction holes for suction) due to excessive increase in vacuum suction force)
In addition, the circular locus of the disk passing through the ultraviolet light condensing position, at least, the moving speed and the height position of the disk so as to gradually approach the ultraviolet light condensing position and pass through the light condensing position while following the circular arc locus. , The illuminance of the ultraviolet light can be gently applied to the uncured adhesive, and the substrates can be bonded together by reducing the effects of distortion of the substrate due to curing contraction of the adhesive and radiant heat.

According to another embodiment, a disk having a first substrate and a second substrate via an adhesive is held,
Do not apply the suction force (after once adsorbing for holding,
Secondly, the suction force is not applied to prevent local deformation of the ventilation hole (suction hole for suction) due to excessive increase of the vacuum suction force.
Positioning the substrates while pressing the substrates, controlling the moving speed and the height position of the disk, and controlling the disk so as to gradually approach the ultraviolet light converging position and pass through the light converging position while following an arc trajectory. This makes it possible to improve the substrate shape of the second substrate (for example, to improve the warpage in the circumferential and radial directions) and to secure the thickness of the adhesive between the substrates to a predetermined value while maintaining the thickness of the ultraviolet light. The illuminance of light can be gradually applied to the adhesive, and the substrates can be bonded together while reducing the effects of substrate distortion and radiant heat due to curing shrinkage.

According to still another mode, the disk having the second substrate is held via the first substrate and the adhesive, the back surface of the first substrate is sucked by suction, and the moving speed of the disk is adjusted. The shape of the first substrate is improved (for example, by changing the shape of the first substrate by controlling the height position so as to gradually approach the ultraviolet light condensing position while passing through the converging position while following an arc trajectory. To correct the warpage in the direction and the radial direction) and to apply the ultraviolet light to the adhesive gently to reduce the distortion of the substrate due to curing shrinkage and reduce the influence of radiant heat to bond the substrates. Can be.

Further, according to the another aspect, the disk having the second substrate is held via the first substrate and the adhesive, and the back surface of the first substrate is sucked by suction.
Positioning the substrates while pressing the substrates, controlling the moving speed and the height position of the disk, and controlling so as to gradually approach the ultraviolet light condensing position and pass through the light condensing position while following an arc trajectory. By doing so, it is possible to improve the shapes of the first and second substrates (for example, to correct the molding warp in the circumferential direction and the radial direction), and to secure the thickness of the adhesive between the substrates to a predetermined value. By making the illuminance of ultraviolet light gradually act on the adhesive, it is possible to reduce the effects of distortion and radiant heat of the substrate due to curing shrinkage and bond the substrates.

According to the another aspect, a disk having the first substrate and the second substrate is held via an adhesive, the back surface of the first substrate is sucked by suction, and the second substrate is sucked.
In the method and the apparatus for positioning between substrates while pressing the substrates, the suction surface for suctioning the substrates and the pressing surface for pressing the substrates each have a shape that allows for the amount of warpage after curing, and the moving speed and height position of the disk The shape of the first substrate and the second substrate is improved (e.g., by changing the shape of the first substrate and the second substrate) by controlling the laser beam so as to gradually approach the ultraviolet light condensing position and pass through the light condensing position while following the circular arc locus. And deformation of the substrate due to curing shrinkage by gently acting on the adhesive with the illuminance of ultraviolet light. And a substrate can be bonded with reduced influence of radiant heat.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view illustrating a configuration of an optical disc bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view for describing in detail the configuration and operation of a part of the optical disc bonding apparatus shown in FIG.

FIGS. 3A and 3B are a side view and a plan view, respectively, for explaining the concept of the optical disk bonding method according to the embodiment of the present invention.

FIG. 4 is a diagram for explaining another embodiment of the present invention with respect to a part of the optical disc bonding method shown in FIG. 3;

FIGS. 5A, 5B, 5C, and 5D are perspective views illustrating a conventional optical disc manufacturing process.

FIG. 6 is a diagram showing a configuration of a conventional optical disc bonding apparatus.

FIG. 7 is a view for explaining the concept of a conventional optical disc bonding method.

FIG. 8 is a diagram for explaining a point of quality of an optical disc;

FIGS. 9A, 9B, and 9C are diagrams for explaining problems in bonding optical disks using ultraviolet light.

FIG. 10 is a graph showing a warp amount of a disk in a conventional optical disk bonding method and apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Disc, 2 ... 1st board | substrate, 3 ... 2nd board | substrate, 4 ... Adhesive, 10 ... Holding device, 11 ... Pressing and positioning device, 12 ...
Rotating device, 12A: rotating member, 12B: holding member, 1
3 ... Elevating device, 13A ... Mounting member, 13B ... Elevating power generating member, 14 ... Ultraviolet light generating device, 15 ... Control device, 20
... Suction plate, 21 ... Reference pin, 22 ... Arm, 23
... Vacuum pump, 33 ... Pressing plate, 36 ... Open / close power generation member, 40 ... Base, 41 ... Shaft, 47 ... Spindle,
54 ... ultraviolet light, 55 ... motor, 57 ... timing belt, 70 ... slider, 71 ... base, 75 ... lighting lamp, 76 ... reflector, 92 ... radiant heat, 100 ... suction device.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Norihide Higaki 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5D121 AA07 FF03 FF11 GG02

Claims (9)

[Claims] 1. An ultraviolet light is radiated at an ultraviolet light condensing position to a disk-shaped first substrate and a second substrate which are stacked in the thickness direction via an ultraviolet light reactive curing adhesive to solidify the adhesive. An optical disk bonding method for forming an optical disk by irradiating the first substrate and the second substrate with an arc trajectory while holding the first substrate and the second substrate during the ultraviolet light irradiation. An optical disc characterized in that the adhesive is solidified while gradually approaching the ultraviolet light condensing position and passing through the ultraviolet light condensing position so that the illuminance of the ultraviolet light with respect to the adhesive gradually acts. Lamination method. 2. The method according to claim 1, further comprising: maintaining the distance between the lower surface of the first substrate and the upper surface of the second substrate during irradiation with the ultraviolet light, and tracing the first substrate and the second substrate along an arc trajectory. By irradiating the adhesive with the ultraviolet light while correcting the warp of the first substrate and the second substrate by gradually approaching the light position and passing through the ultraviolet light condensing position, the adhesive is solidified. The method for bonding optical disks according to claim 1. 3. The method according to claim 1, wherein the lower surface of the first substrate is attracted by suction during the irradiation of the ultraviolet light, and the optical disk gradually moves to the ultraviolet light condensing position while following the circular arc trajectory while the lower surface of the first substrate is attracted. 2. The adhesive is irradiated with the ultraviolet light while the warp of the first substrate and the second substrate is corrected by passing through the ultraviolet light condensing position in the vicinity of the first substrate, thereby solidifying the adhesive. Or the method of laminating optical disks according to 2. 4. A lower surface of the first substrate is attracted by an attracting surface having an attracting shape in consideration of an amount of warpage of the first substrate after solidification of the adhesive, and an arc locus is traced to the ultraviolet light condensing position. Irradiating the adhesive with the ultraviolet light while solidifying the adhesive while correcting the warp of the first substrate and the second substrate by gradually approaching and passing the ultraviolet light condensing position. Item 4. The method for bonding optical disks according to Item 3. 5. The disk is raised toward the ultraviolet light irradiation side at the center portion of the ultraviolet light condensing position, while the disk is moved up to the center portion of the ultraviolet light converging position and in a region after the arrival. 5. The method of laminating optical disks according to claim 1, wherein the disk is lowered so as to be away from the ultraviolet light irradiation side. 6. An ultraviolet light is radiated at an ultraviolet light condensing position onto the first and second disk-shaped substrates laminated in the thickness direction via an ultraviolet light reactive curing adhesive to solidify the adhesive. An optical disc laminating apparatus for forming an optical disc, comprising: a holding device for holding the first substrate; and a second substrate side by opening and closing the first substrate held by the holding device. A pressing and positioning device for pressing or positioning the second substrate toward the first substrate, and an arc having a radius from a center of the first substrate held by the holding device to a predetermined position outside the holding device. As the disk moves along the circumferential direction of the trajectory, the holding device and the pressing and positioning device are continuously or intermittently moved,
A rotary elevating and lowering device that passes through the ultraviolet light condensing position while following the arc locus while moving up and down at the ultraviolet light condensing position of the ultraviolet light, and the ultraviolet light at the ultraviolet light condensing position on the arc locus And an ultraviolet light irradiation device for irradiating the light onto the disk. 7. A trajectory and an arrival speed of an ultraviolet light condensing position, a trajectory of avoiding an ultraviolet light condensing position, and an evasion trajectory for avoiding an ultraviolet light condensing position, which are connected to the rotary elevating device to minimize the amount of warpage of the adhesive after solidification. 7. The optical disk bonding apparatus according to claim 6, further comprising a control device that controls a speed to gradually reduce the illuminance of the ultraviolet light. 8. The control device raises the disk toward the ultraviolet light irradiation side at the center of the ultraviolet light condensing position, and in a region until the disk reaches the center of the ultraviolet light condensing position. 8. The light according to claim 7, wherein the disc is lowered so as to move away from the irradiation side of the ultraviolet light on the certain ultraviolet light converging position reaching locus and the ultraviolet light converging position avoiding locus which is an area after the arrival. Disk bonding device. 9. The suction force of the first substrate, the suction holding time, and the suction holding time, which are connected to the holding device and the pressing and positioning device and minimize the warpage of the adhesive after solidification. 7. The optical disc bonding apparatus according to claim 6, further comprising a control device for controlling the magnitude of the pressing force of the two substrates and the suction maintaining time so as to apply a correcting force at the time of irradiating the ultraviolet light.