JP2000251610A - Micro-fuse inserted in substrate and manufacture thereof - Google Patents
Micro-fuse inserted in substrate and manufacture thereofInfo
- Publication number
- JP2000251610A JP2000251610A JP11144550A JP14455099A JP2000251610A JP 2000251610 A JP2000251610 A JP 2000251610A JP 11144550 A JP11144550 A JP 11144550A JP 14455099 A JP14455099 A JP 14455099A JP 2000251610 A JP2000251610 A JP 2000251610A
- Authority
- JP
- Japan
- Prior art keywords
- base
- lead
- leads
- cap
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000003780 insertion Methods 0.000 claims abstract description 5
- 230000037431 insertion Effects 0.000 claims abstract description 5
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 abstract description 12
- 239000007924 injection Substances 0.000 abstract description 12
- 238000010276 construction Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
- H01H85/147—Parallel-side contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/48—Protective devices wherein the fuse is carried or held directly by the base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は基板挿入用マイクロ
ヒューズに関し、電子製品の軽薄短小化による内部部品
の小型化の必要性に応じて製品の安全保護素子として必
須不可欠なヒューズまたはプロテクター類の小型化趨勢
に対応するために母製品の回路基板に直接装着するよう
に作った基板挿入用マイクロヒューズ及びその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microfuse for inserting a substrate, and more particularly to a fuse or a protector which is indispensable as a safety protection element for a product in accordance with the necessity of miniaturization of internal parts due to reduction in size and weight of electronic products. The present invention relates to a board-inserting microfuse made to be directly mounted on a circuit board of a mother product in order to cope with the trend of the trend, and a method of manufacturing the same.
【0002】[0002]
【従来の技術】マイクロヒューズは、主に印刷回路基板
に用いられる装置であるが、物理的に小型のものが要求
され、このようなマイクロヒューズはたまたま流れる極
めて短い過渡時間におけるサージ電流を遮断するように
設計しなければならない。現在用いられているヒューズ
は、可溶体両端に連結される2つのリードをリード中央
部でプラスチックベースに固定し、この固定されたリー
ドの相対側2つの末部分が印刷回路基板の孔に挿入され
るようにするために、通称インサート射出という工法を
用いてリードとベース一体型部品を作った後、ヒューズ
の組立工程に投入している。2. Description of the Related Art A microfuse is a device mainly used for a printed circuit board, but is required to be physically small. Such a microfuse happens to cut off a surge current in an extremely short transient time. Must be designed. Currently used fuses have two leads connected to both ends of a fusible body fixed to a plastic base at the center of the lead, and the two opposite ends of the fixed lead are inserted into holes of a printed circuit board. In order to achieve this, a lead and base integrated part is manufactured using a method commonly known as insert injection, and then the fuse is assembled.
【0003】[0003]
【発明が解決しようとする課題】しかし、前記インサー
ト射出工法は、一定長さに切断されたリードを特別に製
作した精密超小型射出金型にいちいち取り付けた後、更
に射出器にこの金型を装着してプラスチック射出をしな
ければならないため、この特殊金型の製作費用が高く、
寿命も短く、時間当り生産性が一般射出に比べて著しく
劣るので非効率的である。However, according to the insert injection method, a lead cut to a predetermined length is attached to a specially manufactured precision ultra-small injection mold, and then this mold is further attached to an injector. Since it must be mounted and plastic injected, the production cost of this special mold is high,
This is inefficient because the life is short and the productivity per hour is significantly inferior to that of general injection.
【0004】更に、電子製品の製造面から重要なキーで
ある信頼性問題においても、インサート射出はリードの
半田付け性を著しく低下させることにより、製品全体の
信頼性を大いに損ねる結果を招く問題点がある。しか
し、このような問題点にも拘らず、リードがベースに強
固に固定されなければリードの遊動によって製品として
の役割や全体的な信頼を低下させる結果を招くため、リ
ードの固定を強固にしてくれるインサート射出工法の使
用が不可避であるというのが問題になっている。[0004] Furthermore, regarding the reliability problem, which is an important key from the viewpoint of the production of electronic products, insert injection significantly reduces the solderability of the leads, resulting in a great loss of the reliability of the entire product. There is. However, in spite of these problems, if the leads are not firmly fixed to the base, the movement of the leads will lead to a reduction in the role of the product and the overall reliability, so the leads must be fixed firmly. The problem is that the use of an insert injection method is inevitable.
【0005】本発明は前記の如き問題点を解決するため
に案出したもので、基板挿入用マイクロヒューズの製造
工法において端子用リードを絶縁ベースに固定して高費
用のインサート射出工法を代替するようにし、アークエ
ネルギーを減殺してヒューズ構造物が破壊されることを
防止する基板挿入用マイクロヒューズ及びその製造方法
を提供するにその目的がある。The present invention has been devised to solve the above-mentioned problems, and replaces a high-cost insert injection method by fixing a terminal lead to an insulating base in a method of manufacturing a microfuse for inserting a substrate. Accordingly, it is an object of the present invention to provide a microfuse for substrate insertion and a method for manufacturing the same, which reduce arc energy and prevent a fuse structure from being destroyed.
【0006】[0006]
【課題を解決するための手段】前記の目的を達成するた
めに本発明は、2つの開口部を有するベースと、該ベー
スの開口部に装着されるリードと、該リードに半田付け
される可溶体とを備える基板挿入用マイクロヒューズで
あって、前記開口部は円錐形に形成され、前記リードの
終端部は所定の厚さに圧搾された状態に楕円形に形成さ
れて前記円錐形の開口部に挿入装着され、前記ベースの
内部を外部と遮断するために前記ベースの嵌合鍔と嵌め
合わされる凹溝を有するキャップを備える特徴がある。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a base having two openings, a lead mounted in the opening of the base, and a solderable lead. Wherein the opening is formed in a conical shape, and the terminal end of the lead is formed in an elliptical shape in a state of being pressed to a predetermined thickness, and the conical opening is formed. And a cap having a concave groove that is inserted and mounted in the portion and that is fitted with a fitting flange of the base to block the inside of the base from the outside.
【0007】また、本発明によるマイクロヒューズを製
造するために、開口部2つが円錐形状で形成されたベー
スを射出成型し、キャップを射出成型する射出成型段階
と;前記射出成型段階で成型された前記ベースの開口部
に予め準備されたリードを挿入するリード挿入段階と;
前記リード挿入段階で挿入されたリードを前記ベースに
固定させるために終端部の一定部位を所定の厚さに圧搾
して楕円形状の圧搾部を形成する圧搾段階と;前記圧搾
段階で形成された圧搾部の終端に予め準備された可溶体
を半田付けして固定する固定段階と;前記固定段階で前
記リードに前記可溶体が固定された状態で両リードを前
記ベースに装着されるまで引っ張る装着段階と;前記リ
ードが前記ベースに装着されると、前記ベースの突起を
キャップの凹溝部に挿入して製品を完成する完成段階と
を有する特徴がある。In order to manufacture a microfuse according to the present invention, a base having two conical openings is injection-molded and a cap is injection-molded; Inserting a lead prepared beforehand into the opening of the base;
Squeezing a predetermined portion of the terminal end to a predetermined thickness to fix the lead inserted in the lead insertion step to the base to form an elliptical squeezed portion; and forming the squeezed portion. A fixing step of soldering and fixing a previously prepared fusible body to the end of the squeezing portion; and mounting in which the fusible body is fixed to the lead in the fixing step until both leads are mounted on the base. And a completion step of: when the lead is mounted on the base, inserting a protrusion of the base into a concave groove of a cap to complete a product.
【0008】さらに、本発明によるマイクロヒューズを
製造するために、開口部2つが円錐形状で形成されたベ
ースを射出成型し、キャップを射出成型する射出成型段
階と;前記射出成型段階で成型された前記ベースの開口
部に予め準備されたリードを挿入するリード挿入段階
と;前記リード挿入段階で挿入されたリードを前記ベー
スに固定させるために終端部の一定部位を所定の厚さに
圧搾して楕円形状の圧搾部を形成する圧搾段階と;前記
圧搾段階で形成された圧搾部を有する両リードを前記ベ
ースに装着されるまで引っ張る装着段階と;前記リード
が前記ベースに装着されると、前記両リードの終端に予
め準備された可溶体を半田付けして固定する固定段階
と;前記固定段階で前記リードに前記可溶体が固定され
た状態でベースの突起をキャップの凹溝部に挿入して製
品を完成する完成段階とを有する特徴がある。Further, in order to manufacture a microfuse according to the present invention, an injection molding step of injection molding a base having two conical openings and an injection molding of a cap; Inserting a lead prepared in advance into the opening of the base; and pressing a predetermined portion of the terminal end to a predetermined thickness in order to fix the lead inserted in the lead inserting step to the base. A pressing step of forming an oval-shaped pressing portion; a mounting step of pulling both leads having the pressing portion formed in the pressing step until the lead is mounted on the base; A fixing step of soldering and fixing a previously prepared fusible body to the ends of both leads; and a projection on the base in a state where the fusible body is fixed to the lead in the fixing step. It is characterized with a complete step to complete the product is inserted into the groove portion of the cap.
【0009】[0009]
【発明の実施の形態】以下、本発明の実施の形態による
基板挿入用マイクロヒューズの構造及び製造方法につい
て添付図面を参照しながら詳細に説明する。先ず、図1
〜図3を参照して本発明によるマイクロヒューズの構造
を考察してみれば次の通りである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a structure and a manufacturing method of a microfuse for inserting a substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, FIG.
The structure of the micro fuse according to the present invention will be described with reference to FIGS.
【0010】プラスチック射出物から成るキャップ100
と、前記キャップ100内周面に形成された凹溝100aと、
プラスチック射出物から成り絶縁機能をするベース110
と、前記ベース110に形成された一対の開口部110a, 110
bと、前記開口部110a, 110bにそれぞれ挿入される一対
のリード120, 130と、前記リード120, 130の終端部に半
田付けで固定されて過電流が流れる場合に溶断される可
溶体140から成る。[0010] Cap 100 made of plastic injection material
And a concave groove 100a formed on the inner peripheral surface of the cap 100,
Base 110 made of plastic injection material and has insulating function
And a pair of openings 110a, 110 formed in the base 110.
b, a pair of leads 120, 130 inserted into the openings 110a, 110b, respectively, and a fusible body 140, which is fixed by soldering to the end of the leads 120, 130 and melted when an overcurrent flows, Become.
【0011】前記リード120, 130は、終端部に所定の厚
さを有するように楕円形に圧搾された圧搾部120a, 130a
から成る。前記ベース110の開口部110a, 110bは、円錐
形に形成してリード120, 130の圧搾部120a, 130aを挿入
装着させる時に所定の空間を有するように形成する。前
記ベース110は、下端にリード120, 130の間隔を維持す
るために離隔調整突起114を含み構成される。[0011] The leads 120 and 130 are formed by pressing the pressing portions 120a and 130a which are squeezed in an elliptical shape so as to have a predetermined thickness at the end portions.
Consists of The openings 110a and 110b of the base 110 are formed in a conical shape so as to have a predetermined space when the pressing parts 120a and 130a of the leads 120 and 130 are inserted and mounted. The base 110 includes a separation adjusting protrusion 114 at a lower end thereof to maintain a space between the leads 120 and 130.
【0012】更に、前記ベース110及びキャップ100は、
4角形と円形を選択して製造することができる。前記の
如き構造のマイクロヒューズを製造する製造方法を図4
を参照して説明すると次の通りである。先ず、プラスチ
ック材質のベース110とキャップ100を射出成型する(S
1)。Further, the base 110 and the cap 100 are
It can be manufactured by selecting a square and a circle. FIG. 4 shows a method of manufacturing a microfuse having the above structure.
The following is a description with reference to FIG. First, the plastic base 110 and the cap 100 are injection-molded (S
1).
【0013】この際、射出成型されるベース110は、2
つの開口部110a, 110bが形成され、開口部110a, 110bは
円錐形状に成型され、キャップ100内部には凹溝100aが
成型される。S1でベース110とキャップ100が成型される
と、石綿糸の外周面に定格電流に合わせた可溶体を巻回
した巻線型ヒューズ可溶体140とリード120, 130を準備
する。At this time, the base 110 to be injection molded is 2
One opening 110a, 110b is formed, the openings 110a, 110b are formed in a conical shape, and a concave groove 100a is formed inside the cap 100. When the base 110 and the cap 100 are molded in S1, a wound type fuse fusible body 140 and leads 120, 130 in which a fusible body corresponding to the rated current is wound around the outer peripheral surface of the asbestos thread are prepared.
【0014】S1で成型されたベース110の開口部110a, 1
10bに予め準備したリード120, 130を挿入・貫通させた
後(S2)、前記S2で挿入されたリード120, 130をベース11
0に固定させるためにリード終端部の一定部位を所定の
厚さに圧搾して楕円形状の圧搾部120a, 130aを形成する
(S3)。前記S3で圧搾されたリード圧搾部120a, 130aの終
端に可溶体140を半田付けして可溶体140とリード120, 1
30が固定されるようにする(S4)。The openings 110a, 1 of the base 110 molded in S1
After inserting and penetrating the leads 120, 130 prepared in advance into 10b (S2), the leads 120, 130 inserted in S2 are connected to the base 11
In order to fix to 0, a certain portion of the lead end portion is squeezed to a predetermined thickness to form elliptical squeezed portions 120a, 130a
(S3). The fusible body 140 is soldered to the ends of the lead squeezed portions 120a, 130a squeezed in S3, and the fusible body 140 and the leads 120, 1 are soldered.
30 is fixed (S4).
【0015】S4でリード120, 130と可溶体140が固定さ
れた状態で両リード120, 130を鋏(例:空圧鋏)を利用
してベース110に装着されるまで物理的な力を加えてリ
ード120, 130を引っ張って圧搾により楕円形に拡張され
た圧搾部120, 130が開口部110a, 110bに指定された長さ
まで食い込んで装着されるようにする(S5)。以後、ベー
ス110の嵌合鍔112をキャップ100の内面に形成された凹
溝100aと嵌め合わせて位置固定されるように挿入して製
品を完成する(S6)。With the leads 120, 130 and the fusible member 140 fixed in S4, physical force is applied to both the leads 120, 130 until they are attached to the base 110 using scissors (eg, pneumatic scissors). Then, the leads 120 and 130 are pulled to compress the elliptical compressed portions 120 and 130 into the openings 110a and 110b so that the compressed portions 120 and 130 are attached to the openings 110a and 110b (S5). Thereafter, the fitting flange 112 of the base 110 is fitted into the concave groove 100a formed on the inner surface of the cap 100 and inserted so as to be fixed in position, thereby completing the product (S6).
【0016】なお、(S4)と(S5)とは逆の順序にしてもよ
い。Note that (S4) and (S5) may be reversed.
【0017】[0017]
【発明の効果】前述した通り、本発明はリード固定用絶
縁ベース製造工程で最も原価比重が高いインサート射出
法を用いる必要がないため、製造原価を節減する効果が
あり、ベースホール内壁とリードとの間に空間を形成し
てアークエネルギーにより膨張する空気圧力を著しく減
らす役割をして短絡遮断性能を向上させる効果があるの
で、電気電子部品製造産業上非常に有能な発明である。As described above, according to the present invention, it is not necessary to use the insert injection method having the highest cost ratio in the manufacturing process of the insulating base for fixing the lead, so that the manufacturing cost can be reduced, and the inner wall of the base hole and the lead can be reduced. This is a very effective invention in the electric and electronic parts manufacturing industry, since it has a function of forming a space between them to significantly reduce the air pressure expanded by the arc energy and improving short-circuit breaking performance.
【図1】本発明の一実施の形態によるマイクロヒューズ
の概略的な斜視図。FIG. 1 is a schematic perspective view of a microfuse according to an embodiment of the present invention.
【図2】本発明の一実施の形態によるマイクロヒューズ
の概略的な分解斜視図。FIG. 2 is a schematic exploded perspective view of a micro fuse according to an embodiment of the present invention.
【図3】本発明の一実施の形態によるマイクロヒューズ
の断面図。FIG. 3 is a sectional view of a micro fuse according to one embodiment of the present invention.
【図4】本発明のマイクロヒューズ製造方法に関するフ
ロー図。FIG. 4 is a flow chart relating to the microfuse manufacturing method of the present invention.
100 キャップ 100a 凹溝 110 ベース 110a, 110b 開口部 112 嵌合鍔 114 離隔調整突起 120, 130 リード 120a, 130a 圧搾部 140 可溶体 100 Cap 100a Concave groove 110 Base 110a, 110b Opening 112 Mating collar 114 Separation adjusting protrusion 120, 130 Lead 120a, 130a Squeezed part 140 Soluble
Claims (3)
スの開口部に装着されるリードと、該リードに半田付け
される可溶体とを備える基板挿入用マイクロヒューズで
あって、 前記開口部は円錐形に形成され、 前記リードの終端部は所定の厚さに圧搾された状態に楕
円形に形成されて前記円錐形の開口部に挿入装着され、 前記ベースの内部を外部と遮断するために前記ベースの
嵌合鍔と嵌め合わされる凹溝を有するキャップを備える
ことを特徴とする基板挿入用マイクロヒューズ。1. A board-inserting microfuse comprising: a base having two openings; a lead mounted in the opening of the base; and a fusible member soldered to the lead. Is formed in a conical shape, and the end of the lead is formed into an elliptical shape in a state of being squeezed to a predetermined thickness, and is inserted and mounted in the conical opening, so as to block the inside of the base from the outside. And a cap having a concave groove fitted with the fitting flange of the base.
スを射出成型し、キャップを射出成型する射出成型段階
と;前記射出成型段階で成型された前記ベースの開口部
に予め準備されたリードを挿入するリード挿入段階と;
前記リード挿入段階で挿入されたリードを前記ベースに
固定させるために終端部の一定部位を所定の厚さに圧搾
して楕円形状の圧搾部を形成する圧搾段階と;前記圧搾
段階で形成された圧搾部の終端に予め準備された可溶体
を半田付けして固定する固定段階と;前記固定段階で前
記リードに前記可溶体が固定された状態で両リードを前
記ベースに装着されるまで引っ張る装着段階と;前記リ
ードが前記ベースに装着されると、前記ベースの突起を
キャップの凹溝部に挿入して製品を完成する完成段階と
を有することを特徴とする基板挿入用マイクロヒューズ
製造方法。2. An injection molding step in which a base having two openings formed in a conical shape is injection-molded, and a cap is injection-molded; and a lead prepared in advance in an opening of the base molded in the injection molding step. Inserting a lead;
Squeezing a predetermined portion of the terminal end to a predetermined thickness to fix the lead inserted in the lead insertion step to the base to form an elliptical squeezed portion; and forming the squeezed portion. A fixing step of soldering and fixing a previously prepared fusible body to the end of the squeezing portion; and mounting in which the fusible body is fixed to the lead in the fixing step until both leads are mounted on the base. And a step of inserting the protrusion of the base into the concave groove of the cap when the lead is mounted on the base to complete a product, the method comprising the steps of:
スを射出成型し、キャップを射出成型する射出成型段階
と;前記射出成型段階で成型された前記ベースの開口部
に予め準備されたリードを挿入するリード挿入段階と;
前記リード挿入段階で挿入されたリードを前記ベースに
固定させるために終端部の一定部位を所定の厚さに圧搾
して楕円形状の圧搾部を形成する圧搾段階と;前記圧搾
段階で形成された圧搾部を有する両リードを前記ベース
に装着されるまで引っ張る装着段階と;前記リードが前
記ベースに装着されると、前記両リードの終端に予め準
備された可溶体を半田付けして固定する固定段階と;前
記固定段階で前記リードに前記可溶体が固定された状態
でベースの突起をキャップの凹溝部に挿入して製品を完
成する完成段階とを有することを特徴とする基板挿入用
マイクロヒューズ製造方法。3. An injection molding step in which a base having two openings formed in a conical shape is injection-molded, and a cap is injection-molded; and a lead prepared in advance in the opening of the base molded in the injection molding step. Inserting a lead;
Squeezing a predetermined portion of the terminal end to a predetermined thickness to fix the lead inserted in the lead insertion step to the base to form an elliptical squeezed portion; and forming the squeezed portion. A mounting step of pulling both leads having a squeezed portion until the leads are mounted on the base; and fixing the prepared fusible material to the ends of the both leads by soldering when the leads are mounted on the base. A step of inserting a protrusion of a base into a groove of a cap with the fusible body fixed to the lead in the fixing step to complete a product, the microfuse being inserted into a substrate. Production method.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR99-3034 | 1999-02-26 | ||
| KR2019990003034U KR20000017515U (en) | 1999-02-26 | 1999-02-26 | Manufacturing method of radial type microfuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000251610A true JP2000251610A (en) | 2000-09-14 |
| JP3273504B2 JP3273504B2 (en) | 2002-04-08 |
Family
ID=19572804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14455099A Expired - Fee Related JP3273504B2 (en) | 1999-02-26 | 1999-05-25 | Micro fuse for substrate insertion and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3273504B2 (en) |
| KR (1) | KR20000017515U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003079390A1 (en) * | 2002-03-15 | 2003-09-25 | Alpi Co., Ltd. | Method of producing fuses |
| JP2009540522A (en) * | 2006-06-16 | 2009-11-19 | スマート エレクトロニクス インク | Surface mount type small fuse and manufacturing method thereof |
| DE102009019059A1 (en) * | 2009-04-27 | 2010-11-04 | Chun-Chang Yen | Base for fuse, has wire which is inserted for connection pin in vending machine, where connection pin is cut into sections and bulge is attached to connection pin |
| WO2010123278A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Small fuse and manufacturing method thereof |
| CN101441961B (en) * | 2007-11-23 | 2012-01-04 | 斯玛特电子公司 | Hollow minitype fuse and manufacture method and clamping device for the same |
| JP2014241196A (en) * | 2013-06-11 | 2014-12-25 | 三菱マテリアル株式会社 | fuse |
| CN108231506A (en) * | 2016-12-09 | 2018-06-29 | Orisel株式会社 | Midget fuse and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461637B (en) * | 2018-12-26 | 2020-06-09 | 新昌县鸿吉电子科技有限公司 | Circuit protection device for artificial intelligence home systems |
-
1999
- 1999-02-26 KR KR2019990003034U patent/KR20000017515U/en not_active Ceased
- 1999-05-25 JP JP14455099A patent/JP3273504B2/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003079390A1 (en) * | 2002-03-15 | 2003-09-25 | Alpi Co., Ltd. | Method of producing fuses |
| JP2009540522A (en) * | 2006-06-16 | 2009-11-19 | スマート エレクトロニクス インク | Surface mount type small fuse and manufacturing method thereof |
| DE112006003928B4 (en) * | 2006-06-16 | 2011-05-05 | Smart Electronics, Inc. | Small size surface mount fuse and method of making same |
| CN101441961B (en) * | 2007-11-23 | 2012-01-04 | 斯玛特电子公司 | Hollow minitype fuse and manufacture method and clamping device for the same |
| WO2010123278A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Small fuse and manufacturing method thereof |
| JP2012524969A (en) * | 2009-04-21 | 2012-10-18 | スマート エレクトロニクス インク | Small fuse and manufacturing method thereof |
| DE112010001697B4 (en) * | 2009-04-21 | 2013-08-08 | Smart Electronics, Inc. | Small security and their manufacturing process |
| US9184011B2 (en) | 2009-04-21 | 2015-11-10 | Smart Electronics Inc. | Method of manufacturing small fuse |
| DE102009019059A1 (en) * | 2009-04-27 | 2010-11-04 | Chun-Chang Yen | Base for fuse, has wire which is inserted for connection pin in vending machine, where connection pin is cut into sections and bulge is attached to connection pin |
| JP2014241196A (en) * | 2013-06-11 | 2014-12-25 | 三菱マテリアル株式会社 | fuse |
| CN108231506A (en) * | 2016-12-09 | 2018-06-29 | Orisel株式会社 | Midget fuse and its manufacturing method |
| CN108231506B (en) * | 2016-12-09 | 2020-06-09 | Orisel株式会社 | Small fuse and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000017515U (en) | 2000-09-25 |
| JP3273504B2 (en) | 2002-04-08 |
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