JP2000249873A - Optical transmission module integrated with electronic circuit and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a method of manufacturing an optical transmission module integrated with an electronic circuit, which can reduce the manufacturing cost and increase the degree of freedom in optical wiring design and can be easily manufactured. SOLUTION: In the method for manufacturing an electronic circuit integrated optical transmission module according to the present invention, a step of fixing an optical I / O component 3 and an optical fiber 4 having one end connected thereto on a base 1; The O component 3 and the optical fiber 4 are
And a step of stacking the printed wiring board 9 connected to the optical I / O component 3 on the resin 6.
A step of pressing the printed wiring board 9, the base 1 and the resin 6 to integrate the printed wiring board 9,
Mounting the electronic component 12 thereon. As a result, the manufacturing cost can be kept low and the degree of freedom of the optical wiring design can be increased, so that the manufacturing can be simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit integrated type optical transmission module having both a circuit for transmitting an optical signal and a circuit for transmitting an electric signal, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A method of transmitting a signal between semiconductor components or between modules using an optical signal is capable of realizing a high-speed signal transmission and eliminating interference due to electromagnetic waves, as compared with the case of using an electric signal. This is the ideal method.

Here, when an electric signal and an optical signal are mixed in a certain module, the electric signal is generally transmitted using copper or aluminum wiring, and the optical signal is transmitted using an optical waveguide. It is a target.

[0004]

However, the method using an optical waveguide for transmitting an optical signal as described above has the following problems. (1) When an optical waveguide is formed in a module, the cost increases and the yield decreases.

(2) When an optical waveguide is used, the degree of freedom in designing the wiring in the XY directions and the wiring in the Z direction is reduced. (3) Deposition of copper or aluminum when producing electrical wiring on a module having an optical waveguide is a process with a high manufacturing cost.

On the other hand, from a macro viewpoint such as a dramatic increase in the amount of information flowing on a network, high-speed L
Even in the field close to component mounting, such as signal processing around SI, the conventional transmission method using electric signals is not sufficient, and a new transmission method is required instead.
Among them, internal wiring of semiconductor devices, wiring between boards,
When optical transmission is used in the wiring between devices, not only high-speed characteristics but also great advantages such as reduction of signal loss and reduction of electromagnetic radiation can be obtained.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic circuit integrated type optical transmission module having both a circuit for transmitting an optical signal and a circuit for transmitting an electric signal. It is in. It is another object of the present invention to provide a method of manufacturing an electronic circuit integrated optical transmission module that can be manufactured easily, while keeping the manufacturing cost low and increasing the degree of freedom in optical wiring design.

[0008]

To solve the above problems, an optical transmission module integrated with an electronic circuit according to the present invention comprises:
An optical I / O component connected to one end of the optical fiber; a resin sealing the optical I / O component and the optical fiber; a printed wiring board connected to the optical I / O component; And an electronic component mounted thereon.

An optical transmission module integrated with an electronic circuit according to the present invention is an optical transmission module integrated with an electronic circuit in which an optical conversion / transmission layer and an electric transmission layer are stacked, wherein the optical conversion / transmission layer includes an optical fiber; An optical I / O component connected to one end of the optical fiber; and a resin encapsulating the optical I / O component and the optical fiber, wherein the electric transmission layer is provided on the optical I / O component. A connected printed wiring board,
And an electronic component mounted on the printed wiring board.

In the above-mentioned optical transmission module integrated with an electronic circuit, the optical transmission module is formed on the surface of the resin by printing.
It is preferable to further include a wiring pattern connected to the optical I / O component and connected to the printed wiring board.
Preferably, the other end of the optical fiber extends outside the resin.

According to a method of manufacturing an optical transmission module integrated with an electronic circuit according to the present invention, a step of fixing an optical I / O component and an optical fiber having one end connected to the base is provided. A step of sealing the optical fiber with a resin, a step of stacking a printed wiring board connected to the optical I / O component on the resin, and integrating the printed wiring board, the base and the resin by pressing And a step of mounting an electronic component on the printed wiring board. Preferably, the method further includes, before the step of stacking the printed wiring boards, a step of exposing a part of the optical I / O component by polishing a surface of the resin. Further, before the step of stacking the printed wiring boards, the method further includes a step of forming a wiring pattern connected to the optical I / O component on the surface of the resin, and the wiring pattern is formed by the integration step in the integrating step. It is preferable to be electrically connected to the wiring of the printed wiring board.

In the method for manufacturing an optical transmission module integrated with an electronic circuit, the optical I / O component and the optical fiber are sealed with a resin, so that the manufacturing cost of the optical transmission module can be reduced and the degree of freedom in optical wiring design can be reduced. And can be easily manufactured.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an electronic circuit integrated type optical transmission module according to an embodiment of the present invention. This electronic circuit integrated type optical transmission module is a module having both a circuit for transmitting a signal by light and a circuit for transmitting a signal by electricity.

The electronic circuit integrated type optical transmission module has a base 1 on which a plurality of plastic optical fibers 4 and optical I / O (Input Output) components 3 are mounted. The plastic optical fiber 4 and the optical I / O component 3 are sealed on the base 1 with a resin 6. One end of the plastic optical fiber 4 is an optical I / O
Plastic optical fiber 4 connected to part 3
Is extended outside the base 1. The optical fiber 4 and the optical I / O component 3 are sealed with a resin 6 on the base 1. The optical I / O component 3, the plastic optical fiber 4, and the resin 6 correspond to the light conversion / transmission layer 15.

The surface of the resin 6 is polished, and the printed electric wiring 7 is formed on the surface of the resin 6. The printed electrical wiring 7 is obtained by printing a conductive paste and then thermally curing the printed conductive paste. The printed electrical wiring 7 is an optical I / O
Connected to part 3.

The prepreg 10 is provided on the optical conversion / transmission layer 15.
The printed wiring board 9 as an electric transmission layer 21 is formed with the printed wiring board 9 and the light conversion / transmission layer 15 interposed therebetween.
Are integrated. That is, the light conversion / transmission layer 15 and the electric transmission layer 21 are formed integrally. The printed wiring board 9 has a multilayer wiring 17, and the electric wiring 7 and the printed wiring board 9 are electrically connected via the copper paste bumps 8.

A component electrode is formed on the surface of the printed wiring board 9, and an electronic component 12 is mounted on the component electrode via a solder paste.

In the above-mentioned optical transmission module integrated with an electronic circuit, an optical signal is inputted from one plastic optical fiber 4, and this optical signal is converted into an electric signal by the optical I / O component 3. The signal is sent to the electronic component 12 via the multilayer wiring 17. The electrical signal output from the electronic component 12 is sent to the optical I / O component 3 via the printed wiring board 9, and the electrical signal is converted into an optical signal by the optical I / O component 3. The light is output to the outside of the module through the other plastic optical fiber 4.

Next, a method of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG. 1 will be described. FIG.
3 (g) and FIGS. 3 (a) to 3 (d) are cross-sectional views for explaining a method of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG. FIG. 4 is a diagram showing a flow of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG.

First, as shown in FIG.
Prepare Next, as shown in FIG. 2B, an adhesive 2 for temporarily fixing the optical I / O component and the plastic optical fiber is dispensed on a predetermined position on the base 1.

Thereafter, as shown in FIG. 2C, an optical I / O component 3 and a plastic optical fiber (POF) 4 are mounted on the adhesive 2 of the base 1. The optical I / O component 3 and the plastic optical fiber 4 are temporarily fixed by the adhesive 2 (Step A in FIG. 4). One end of the plastic optical fiber 4 is connected to the optical I / O component 3, and the other end of the fiber 4 extends outside the base 1.

Next, as shown in FIG. 2D, the base 1 is placed in a mold 5 and a resin, for example, a thermosetting epoxy resin 6 is poured into the mold 5 and heat is applied to the resin. 6 is cured. Thereby, the optical I / O component 3 on the base 1
The plastic optical fiber 4 is sealed with a resin (step B in FIG. 4).

Thereafter, as shown in FIG.
Then, the base 1 is taken out, and the surface of the resin 6 is polished (for example, buffed). Thereby, the surface of the resin 6 is flattened (Step C in FIG. 4). Thus, the light conversion / transmission layer 15 including the optical I / O component 3 and the plastic optical fiber 4 is formed.

Next, as shown in FIG. 2 (f), after the conductive paste 7 is printed on the surface of the light conversion / transmission layer 15 (the surface of the resin 6), the paste 7 is thermally cured ( D process of FIG. 4). Thus, a conductive pattern (electric wiring) 7 is formed on the surface of the light conversion / transmission layer 15, and the wiring 7 is connected to the optical I / O component 3.

Thereafter, as shown in FIG. 2 (g), a conductive paste (copper paste) is further printed on the electric wiring 7,
The bumps 8 are formed on the electric wires 7 by thermosetting (step E in FIG. 4). Thus, the optical conversion / transmission module is completed.

Next, as shown in FIG. 3A, a printed wiring board 9 having a multilayer wiring 17 is prepared (Step F in FIG. 4). Thereafter, the prepreg 10 is sandwiched between the optical conversion / transmission module and the printed wiring board 9 and pressed in this laminated state (step G in FIG. 4). As a result, FIG.
As shown in (b), the light conversion / transmission module and the printed wiring board 9 are integrated, and the printed wiring board 9 and the light conversion / transmission layer 15 are electrically connected via the bumps 8.
Further, component electrodes 19 are formed on the surface of the printed wiring board 9.

Thereafter, as shown in FIG. 3C, the solder paste 11 is printed on the component electrodes 19 on the surface of the printed wiring board 9, and the electronic component 12 is mounted on the solder paste 11. Next, the mounted electronic component 12 is subjected to heat treatment such as reflow, so that
As shown in (d), the electronic component 12 and the printed wiring board 9
Are electrically connected. Thus, the mounting of the electronic component 12 is completed (Step H in FIG. 4).

According to the above embodiment, an electronic circuit integrated optical transmission module having both a circuit for transmitting a signal by light and a circuit for transmitting a signal by electricity can be easily manufactured. That is, for the optical conversion / transmission layer 15, by using the optical fiber 4 and the resin filling technique, it is possible to suppress the manufacturing cost and increase the degree of freedom in optical wiring design. That is, as an advantage when the optical fiber 4 is sealed with the resin 6, the degree of freedom of wiring of the plastic optical fiber 4 formed on the base 1 shown in FIG. Can be made higher than that of the optical waveguide 23 formed in the first step.

As a circuit for transmitting a signal by electricity, an electronic circuit 12 equivalent to a high-density mounting board can be designed by mounting the electronic component 12 on the printed wiring board 9. In addition, plastic optical fiber 4
Is extended outside the resin 6, so that an optical connector for outputting an optical signal from the module to the outside is not required. Therefore, cost can be reduced.

By sealing the optical I / O component 3 and the plastic optical fiber 4 with the resin 6, the optical transmission module (optical conversion / transmission layer 15) can be easily manufactured. Further, the integration of the optical transmission module and the electric transmission module (the electric transmission layer 21) can be easily realized by laminating the two.

Further, by using the printed wiring board 9 for the electric transmission module, it is possible to realize an optical transmission module capable of mounting electronic components at high density. Further, by using the optical fiber 4, the optical conversion / transmission
The manufacturing cost of the optical transmission module can be reduced, and the impact resistance of the optical transmission module can be further improved.

The present invention is not limited to the above embodiment, but can be implemented with various modifications. For example,
In this embodiment, the bumps 8 are formed on the electric wires 7 of the light conversion / transmission layer 15 and the light conversion / transmission layer 15 and the electric transmission layer 21 are integrated. Is formed, and the optical conversion / transmission layer 15 and the electric transmission layer 2 are formed.
1 can be laminated and integrated.

In this embodiment, the light conversion / transmission layer 15 and the electric transmission layer 21 are formed only on one side of the base 1, but the light conversion / transmission layer 15 and the electric transmission layer 15 are formed on both sides of the base. It is also possible to form the electric transmission layer 21,
Further, a plurality of layers can be stacked.

In the present embodiment, the electronic component 12 is mounted using the solder paste 11, but it is also possible to mount the electronic component at a relatively low temperature using an anisotropic conductive film. In this case, thermal damage to the resin-filled light conversion / transmission layer 15 can be suppressed.

[0035]

As described above, according to the present invention, an electronic circuit integrated type optical transmission module having both a circuit for transmitting an optical signal and a circuit for transmitting an electric signal can be provided. Further, it is possible to provide a method of manufacturing an electronic circuit integrated type optical transmission module which can reduce the manufacturing cost and increase the degree of freedom of optical wiring design and can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an optical transmission module integrated with an electronic circuit according to an embodiment of the present invention.

2 (a) to 2 (g) are cross-sectional views illustrating a method of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG. 1, and illustrating a method of manufacturing an optical conversion / transmission layer. .

3 (a) to 3 (d) illustrate a method of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG. 1, and are cross-sectional views showing the next step of FIG. 2 (g). is there.

FIG. 4 is a view showing a flow of manufacturing the optical transmission module integrated with an electronic circuit shown in FIG. 1;

FIG. 5A is a plan view showing an optical waveguide formed on a base, and FIG. 5B is a closed view showing a plastic optical fiber formed on the base.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... adhesive, 3 ... Optical I / O parts, 4 ... Plastic optical fiber, 5 ... Mold, 6 ... Resin, 7 ... Printed electrical wiring (conductive paste), 8 ... Copper paste bump,
9 printed wiring board, 10 prepreg, 11 solder paste, 12 electronic components, 15 light conversion / transmission layer,
17: multilayer wiring, 21: electric transmission layer, 23: optical waveguide.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H037 AA01 BA02 BA11 DA03 DA04 DA06 DA16 DA36 5E338 AA03 BB63 BB75 BB80 CC01 CC10 CD33 CD40 EE32 EE60 5E346 AA12 AA15 AA60 BB16 CC09 CC31 CC41 CC60 DD03 DD13 EE41 EE06 EE09 FF45 GG01 GG19 GG28 HH33 HH40 5F041 AA37 DA20 DA43 DC24 DC84 EE07 EE08 FF14 5F088 BA16 BB01 JA06 JA14

Claims (7)

[Claims] 1. An optical I / O connected to one end of an optical fiber.
An O component, a resin sealing the optical I / O component and the optical fiber, a printed wiring board connected to the optical I / O component, and an electronic component mounted on the printed wiring board. An optical transmission module integrated with an electronic circuit. 2. An electronic circuit-integrated optical transmission module in which an optical conversion / transmission layer and an electric transmission layer are stacked, wherein the optical conversion / transmission layer includes an optical fiber and an optical I / O connected to one end of the optical fiber. An O component, a resin sealing the optical I / O component and the optical fiber, wherein the electric transmission layer comprises: a printed wiring board connected to the optical I / O component; An electronic circuit integrated optical transmission module, comprising: an electronic component mounted on a board. 3. The method according to claim 1, wherein the resin is formed on a surface of the resin by printing,
The optical transmission module integrated with an electronic circuit according to claim 1, further comprising a wiring pattern connected to the optical I / O component and connected to the printed wiring board. 4. The optical transmission module integrated with an electronic circuit according to claim 1, wherein the other end of the optical fiber extends outside the resin. 5. A step of fixing an optical I / O component and an optical fiber having one end connected thereto on a base; a step of sealing the optical I / O component and the optical fiber with a resin; Stacking a printed wiring board connected to the optical I / O component, integrating the printed wiring board, the base and the resin by pressing, and mounting an electronic component on the printed wiring board A method for manufacturing an optical transmission module integrated with an electronic circuit, comprising the steps of: 6. The method according to claim 1, wherein the surface of the resin is polished before stacking the printed wiring boards.
The method according to claim 5, further comprising a step of exposing a part of the O component. 7. The method according to claim 1, further comprising a step of forming a wiring pattern connected to the optical I / O component on the surface of the resin before the step of stacking the printed wiring boards, wherein the wiring pattern is integrated. 6. The method according to claim 5, wherein the optical transmission module is electrically connected to the wiring of the printed wiring board in the step.