JP2000244090A - Structure of electronic component and its support structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component which can prevent deterioration of reliability to an electric unit containing a printed board, by interelectrode shortcircuit and prevent increase of cost due to decrease of productivity, etc., due to conductive adhesive agent which is to be caused by decrease of interelectrode distance when the electronic component or the like is mounted on the electrodes on the printed board via the conductive adhesive agent. SOLUTION: In a mounting structure of a surface mount device 5 which is to be mounted on a printed board by sticking terminals 6 on electrodes 3 on the printed board 1 by using conductive adhesive agent 7, the respective electrodes are arranged on bottom surfaces in the respective recessed parts 2 formed on the printed board, and terminals of the surface mount device are connected via conductive adhesive agent which is spread on the electrodes arranged on the bottom surfaces in the respective recessed parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a support structure for mounting components on a printed circuit board or mounting a piezoelectric vibrator or the like in a package.

[0002]

2. Description of the Related Art (1) First Conventional Example When various components are mounted on a printed circuit board, a conductive adhesive may be used as a means for connecting an electrode on the printed circuit board to a terminal on the mounted component side. is there. FIG. 12 is a conventional example showing a mounting structure in which an electronic component is mounted on a printed circuit board. An electronic component 104 is provided on a flat upper surface of a printed circuit board 101 on an electrode 102 via a conductive adhesive 103. The mounting is performed by connecting the terminals 104a. The conductive adhesive 103 obtains conductivity by mixing a silver filler into an insulating adhesive material, for example. However, in recent years, with the miniaturization of the main body of the device using the above electronic components, the size of the entire electrical component including the printed circuit board has been required to be reduced in size and thickness, and the mounting electronic components have also been required to be reduced in size and thickness. Is getting stronger. As the electronic component 104 is miniaturized and the distance between terminals becomes shorter, the distance between electrodes on the substrate becomes correspondingly shorter. Then, the electronic component is mounted on the electrode 102 in order to mount the electronic component.
When the conductive adhesive 103 is pressed upward, the conductive adhesive 103 is pressed and flows out and develops, which may cause a short circuit between the electrodes. In addition, even if the electrodes are not short-circuited, when the distance between the electrodes is reduced, the phenomenon of migration in which the silver filler exudes from the conductive adhesive and flows out and develops on the substrate surface from the electrodes easily occurs, There is a possibility that the insulation resistance between the electrodes is reduced and the stray capacitance between the electrodes is increased.
Therefore, such a problem has hindered miniaturization of the printed circuit board and the mounted electronic components, and reduced reliability and productivity of the electric unit including the printed circuit board.
As a countermeasure to eliminate problems such as short-circuiting between electrodes due to conductive adhesive, it is conceivable to reduce the amount of conductive adhesive to be applied. And the connection portion may be peeled off by impact or the like. Such a problem is also caused when the piezoelectric vibrating element is directly mounted on the electrode on the printed circuit board or when the piezoelectric vibrating element is mounted on the electrode in the package.

(2) Second Conventional Example Next, FIG. 13A is an overall view showing a configuration example of a surface mounting component having a conventional flip chip mounting structure, FIG. 13B is an enlarged view of a main part thereof, (c) is an overall view showing a state of mounting on a printed circuit board. A chip component 106 shown in FIG.
As shown in FIG. 13 (b), a metal bump 108 of about mm
A small amount of the conductive adhesive 109 is applied to the tip of 08. When mounting the chip component 106 on the printed circuit board 110, it is necessary to place a bump 108 coated with a conductive adhesive 109 on the electrode 111 on the printed circuit board 110 as shown in FIG. Adhesion and fixation are performed while performing heating or the like according to. However, a small metal bump 1 having a diameter of about 1 mm
The amount of the conductive adhesive 109 that can be attached to the tip of the electrode 08 is small, and when the conductive adhesive 109 comes into contact with the electrode 111 having a significantly large area as compared with the size of the bump, the conductive adhesive 109 is formed on the electrode and the substrate. Because of this, the adhesive strength is not maintained, impact resistance is reduced, and peeling and poor connection are likely to occur. Therefore, the underfill 112 made of a non-conductive adhesive is used.
Is filled and applied between the chip body 107 and the substrate 110 to increase the connection strength. However, the addition of the reinforcing step using the underfill 112 causes a problem of a decrease in productivity and an increase in cost due to an increase in the number of steps. In order to prevent the conductive adhesive 109 from flowing out of the electrodes and onto the substrate as described above, the distance between the terminals and the distance between the electrodes are set to be large. There is a disadvantage that it becomes.
Further, if the amount of the adhesive is further reduced in order to prevent the conductive adhesive from flowing out, there is a problem that the adhesive strength is further reduced. Furthermore, when a piezoelectric vibrator such as a quartz vibrating element is directly mounted on a printed circuit board, and a space on the printed circuit board including the piezoelectric vibrating element is hermetically sealed by a metal case, a piezoelectric vibrator is manufactured. A structure in which a bump is fixed to a lead terminal on the bottom surface of a vibrating element and connected and fixed to an electrode on a printed circuit board using a conductive adhesive attached to the bump may be employed. In this case, an underfill is required to secure the connection strength. However, since the underfill generates gas over time, a substance constituting the gas adheres to the electrode on the piezoelectric vibrating element and the underfill fills the electrode. An increase in mass causes a problem that the frequency shifts (deterioration of aging).

(3) Third Conventional Example Next, FIG. 14 is a sectional view showing a package structure of a conventional piezoelectric oscillator. This piezoelectric oscillator 115 includes a package body 116 made of ceramic or the like and a package body 11.
An oscillator IC 118 as a chip component flip-chip mounted on an electrode on the inner bottom surface of the recess 117 of the sixth, and a piezoelectric vibrating element one end of which is adhesively supported by a conductive adhesive or the like on a pad 116b on a step 116a. 119, and a metal lid 120 fixed to the upper surface of the package body to hermetically seal the recess of the package body. Oscillator IC11
Reference numeral 8 denotes an oscillation circuit, a temperature compensation circuit, and the like. When assembling a piezoelectric oscillator of this type, the procedure of mounting the oscillator IC 118 on the inner bottom surface of the package body 116, mounting the piezoelectric vibrating element 119 on the pad 116b on the step, and finally fixing the metal lid 120 is as follows. Stepped on. For this reason, the piezoelectric vibration element 11 mounted on the pad 116b
The measurement of the electrical characteristics of No. 9 is performed before the metal lid 120 is fixed. Therefore, if it is determined that the piezoelectric vibrating element is defective as a result of the measurement, only the piezoelectric vibrator 119 cannot be discarded, and it is necessary to discard the entire package including the expensive oscillator IC. This has been a major obstacle to reducing the cost of components and piezoelectric oscillators.

(4) Fourth conventional example Next, FIGS. 15A and 15B are diagrams showing a method of connecting a piezoelectric vibrating element in a conventional piezoelectric device (piezoelectric vibrator, piezoelectric oscillator, etc.) Package 12 made of ceramic or the like
The lead electrodes 131a and 131a of the piezoelectric vibrating element 130 are formed on the two pads 127a and 127b adjacent to each other on the inner bottom surface of the recess 126 of the piezoelectric vibrating element 130 by using a conductive adhesive 128.
2a are electrically and mechanically connected and fixed. The piezoelectric vibrating element 130 has excitation electrodes 131 and 132 formed on both front and back surfaces of a piezoelectric element 133 such as a quartz element, and lead electrodes 131a and 132a from each of the excitation electrodes 131 and 132 toward one end of the element. Is provided. When the piezoelectric vibrating elements 130 are mass-produced by batch processing, the excitation electrodes and the lead electrodes are formed on a large-area base material by a method such as vapor deposition, and then the individual piezoelectric vibrating elements are cut and separated. Because production is performed,
Lead electrode 131a extending from excitation electrode 131 on the upper surface side
Terminates at one edge of the piezoelectric element plate 133 and does not extend to the end surface or the back surface of the element plate. Therefore, as shown in FIG. 15B, the lower lead electrode 132a can be connected to one pad 127a by applying the conductive adhesive 128 once, while the upper lead electrode 131a With respect to the connection between the pad 127b and the pad 127b, sufficient electrical and mechanical connection cannot be realized by a single adhesive application operation. Therefore, the upper lead electrode 13
1a and the pad 127b, the pad 12
7b and the lower surface of the base plate facing the pad 127b are connected by a conductive adhesive 128a to secure a mechanical fixing force, and then the conductive material is applied from the lead electrode 131a to the end surface of the base plate and further to the pad 127b. Electrical connection is realized by applying the conductive adhesive 128b. But,
As described above, the connection operation involving the application of the adhesive twice is extremely complicated, resulting in an increase in cost due to a reduction in workability.

(5) Fifth Conventional Example Next, FIGS. 16A and 16B are a plan view and a vertical sectional view showing a package structure of a conventional piezoelectric vibrator.
Recess 1 of ceramic package body 140 having
At two corners of the inside 41, steps 142 each having a substantially rectangular planar shape are provided. On each step 142, a rectangular pad 143 connected to the external electrode 144 is formed. When the piezoelectric vibrating element 145 is mounted in the concave portion 141, the lead electrodes 146a extending from the excitation electrodes 146 respectively formed on the upper and lower surfaces of the piezoelectric vibrating element toward one edge.
Is connected and fixed on the pad 143 using a conductive adhesive 147. The opening of the recess 141 is hermetically sealed by a metal cover (not shown). When the two corners of the piezoelectric vibrating element 145 are connected to each pad 143 having a large area via the conductive adhesive 147 as shown in the drawing, the conductive material extends along the periphery of the two corners of the piezoelectric vibrating element 145. Adhesive 1
47 rises in a fillet shape to increase the connection area and the amount of adhesive required for connection, thereby increasing the fixing strength. However, in such a conventional connection method, since a large amount of adhesive must be used, the amount of outgas generated from the adhesive 147 is not negligible, and the air pressure inside the package as an airtight space increases. In addition, there is a problem that aging of the vibrating element is deteriorated due to, for example, impurities adhering to the excitation electrode on the base plate, and frequency identification becomes unstable.

(6) Sixth conventional example Next, FIG. 17 is a cross-sectional view for explaining a package structure of a conventional piezoelectric device. A step 152 is formed in a recess 151 of a package body 150 made of ceramic or the like. And a configuration in which one end of a piezoelectric vibration element 155 is connected to a pad 153 on the step 152 via a conductive adhesive 154. Further, a metal cover 158 is provided on the outer frame upper surface 156 of the package body 150 via a resin binder 157.
Is fixed in close contact over the entire circumference.
The value of the seal width L on the outer frame upper surface 156 regulates the application width of the resin binder 157 on the outer frame upper surface, and when the application width is short, moisture in the outside air penetrates into the resin and the space in the package main body. The time to reach is shorter. When moisture enters the package, the frequency characteristics of the piezoelectric vibrating element fluctuate due to fluctuations in internal pressure, adhesion of water droplets, and the like, making it difficult to obtain frequency stability (aging). In response to recent miniaturization of various devices, the area of the piezoelectric device has also been required to be reduced in size, and when the package is reduced in size, the seal width (application width) L on the upper surface of the outer frame of the package body is inevitably reduced. . For this reason, moisture easily penetrates into the package by penetrating the resin binder 157, and the frequency stability tends to decrease.

[0008]

The first problem to be solved by the first invention is that when an electronic component or the like is mounted on an electrode on a printed circuit board via a conductive adhesive, the distance between the electrodes is reduced. It is possible to prevent a situation in which the conductive adhesive causes a short circuit between the electrodes due to the narrowing, which results in a decrease in reliability of the electric unit including the printed circuit board and a cost increase due to a decrease in productivity. An object of the present invention is to provide a mounting structure of an electronic component that can be used. Next, a problem to be solved by the second invention is that, even when an electronic component or the like having a bump on an electrode on a printed circuit board is bonded and fixed with a small amount of conductive adhesive, the cost increases due to a decrease in productivity. It is an object of the present invention to provide a mounting structure for an electronic component or the like that can secure a necessary and sufficient connection strength without using an underfill or the like that causes deterioration of aging and aging. Next, a problem to be solved by the third invention is to provide a piezoelectric vibrating element which is performed during a process of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating element and an oscillator IC having an oscillation circuit and the like are hermetically housed in a package. In the characteristic measurement described above, when it is determined that the quality is poor, only the piezoelectric vibrating element is discarded, and the package and the like can be reused, thereby reducing the cost of the components and the piezoelectric oscillator. In particular, the expensive oscillator I
By measuring the characteristics before mounting C, the oscillator I
There is no need to discard C, and the cost can be greatly reduced. Next, a problem to be solved by the fourth invention is that, in a piezoelectric device in which a piezoelectric vibration element or the like is hermetically housed in a package, the piezoelectric vibration element is separated using a conductive adhesive on a pad provided in the package. When holding and supporting, it is possible to complete the work of connecting the lead electrode provided on the upper surface of the piezoelectric vibration element with the corresponding pad using a conductive adhesive by one adhesive application work is there. Next, the problem to be solved by the fifth invention is:
In a piezoelectric device in which a piezoelectric vibrating element or the like is hermetically housed in a package, two corners of the piezoelectric vibrating element are connected to a large area pad provided on a step in the package using a conductive adhesive. In this case, a large amount of adhesive is needed to form a fillet that increases the connection strength between the corners of the piezoelectric vibrating element and the pad, and as a result, outgassing from the adhesive deteriorates the aging of the piezoelectric device. The problem is to solve the problem. Next, the sixth
The problem to be solved by the invention is to hermetically house the piezoelectric vibration element and the like in the package body having the concave portion,
When fixing the metal lid to the upper surface of the outer frame of the package body with a resin binder, moisture in the outside air via the resin binder generated due to the inability to secure a sufficient seal width on the upper surface of the outer frame can be secured. An object of the present invention is to effectively prevent intrusion into a package.

[0009]

According to a first aspect of the present invention, a semiconductor device is mounted on a printed circuit board by bonding terminals to electrodes on the printed circuit board using a conductive adhesive. In the mounting structure of the surface mount component, the individual electrodes are arranged on the bottom surfaces of the individual recesses formed on the printed circuit board, and the electrodes arranged on the bottom surfaces of the recesses and the terminals of the surface mount component are each formed using a conductive adhesive. Connected. The invention according to claim 2 is that on the electrodes of the printed circuit board,
Alternatively, in a support structure of a piezoelectric vibrating element connected by using a conductive adhesive on an electrode provided in a package, electrodes are arranged on the printed circuit board or on a bottom surface in a recess formed in the package. An electrode disposed on the bottom surface in each recess and a terminal of the piezoelectric vibrating element are connected by using a conductive adhesive. The invention according to claim 3 is a mounting structure of a surface mounting component using a conductive adhesive when fixing a bump fixed to a terminal of a surface mounting component for flip chip mounting to an electrode on a printed circuit board. It is characterized in that the bump is fixed by disposing it on the bottom surface in the recess formed on the printed circuit board and abutting a bump having a conductive adhesive applied to the tip on the electrode in the recess. The invention according to claim 4 is a structure in which a piezoelectric vibration element and an oscillator IC for flip-chip mounting are housed in the recess of the package body having a recess on the upper surface, and the opening of the recess is hermetically sealed with a metal lid. In the piezoelectric oscillator described above, one end of the piezoelectric vibrating element can be adhesively fixed in a cantilever state on a pad on the inner bottom surface of the concave portion, and the upper surface of the piezoelectric vibrating element can be connected to a terminal provided on the bottom surface of the oscillator IC. Oscillator IC is formed by forming a conductor pattern arranged so that
The oscillator IC is mounted on the upper surface of the piezoelectric vibration element by connecting and fixing the bumps fixed to the terminals on the bottom surface to the respective conductor patterns on the upper surface of the piezoelectric vibration element using a conductive adhesive.

According to a fifth aspect of the present invention, there is provided a piezoelectric device having a structure in which at least a piezoelectric vibrating element is housed in a concave portion of a package body having a concave portion on an upper surface and an opening of the concave portion is hermetically sealed by a metal lid. A lead, which is mounted on two pedestals projecting from the bottom surface of the package body at a predetermined interval with a predetermined interval therebetween, and which is located on the upper surface of one end of the piezo-electric vibration element protruding from one of the pedestals in an eaves shape When the electrode is connected to a pad on the inner bottom surface located immediately below the one end with a conductive adhesive, the conductive adhesive applied on the lead electrode on the upper surface of the one end passes through a side surface of the one end. Then, the pad and the lead electrode are electrically connected by turning around the back surface of the piezoelectric vibrating element. According to a sixth aspect of the present invention, there is provided a package body having a concave portion on the upper surface, one end of the piezoelectric vibrating element is bonded and fixed with a conductive adhesive on a pad on a step protruding from the inner bottom surface of the concave portion. In a piezoelectric device having a structure in which an opening is hermetically sealed with a metal lid, a second step having a planar L-shape is projected along a corner of the step upper surface having the pad to reduce the area of the step upper surface. Then, one end of the piezoelectric vibrating element is placed on the pad by a small amount of conductive adhesive filling a small space between the end face of the piezoelectric vibrating element connected to the pad on the upper surface of the step and the inner wall of the second step. It is characterized by fixed connection. According to a seventh aspect of the present invention, a concave portion is provided by accommodating at least a piezoelectric vibrating element in the concave portion of the package body having the concave portion on the upper surface and fixing a metal lid on the upper surface of the outer frame of the package body using a resin binder. In a piezoelectric device having a hermetically sealed portion, the upper surface of the outer frame of the package body is formed of a horizontal and flat annular surface, and an upright wall that stands up around the entire outer periphery of the annular surface, The peripheral edge of the metal lid is supported on the upper surface of the outer frame via a resin binder applied on the surface and along the inner wall of the upright wall.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments shown in the drawings. (Embodiment Corresponding to First Invention) FIGS. 1A and 1B are longitudinal sectional views of a printed circuit board for explaining a mounting structure of a surface mounted component of the present invention, and electronic components are provided on the printed circuit board. FIG. 4 is a cross-sectional view showing a state in which is mounted. In the printed circuit board 1 of the present invention shown in FIG. 1 (a), a concave portion (cavity) 2 is provided in a predetermined arrangement on a surface 1a of a substrate main body made of glass epoxy or other insulating material. Electrode 3
And the electrode 3 is connected to a wiring pattern (not shown). The illustrated two recesses 2 are formed at intervals corresponding to two terminals 6 provided on an electronic component (surface mount component) 5 to be mounted. When the electronic component 5 is mounted as shown in FIG. 1 (b), the electronic component is mounted so that each terminal 6 comes in contact with an appropriate amount of the conductive adhesive 7 applied on the electrode 3 in the recess 2. Positioning and mounting and pressurizing. Thus, the mounting of the electronic component 5 is completed. As described above, in the first invention, the recess 2 is formed on the surface of the printed circuit board as an object on which the surface mounting component 5 such as an electronic component is mounted, and the electrode 3 is provided on the inner bottom surface of the recess 2. On the electrode 3 in this recess, a sufficient amount of conductive adhesive 7 that can be bonded to the terminal 6 of the electronic component 5 to be mounted with a sufficient bonding area and bonding force is applied. That is, between one electrode 3 and the other electrode 3,
Since the substrate surface 1 a higher than the electrode 3 in the recess 2 is interposed as a step, when the electronic component 5 is placed on the conductive adhesive 7 and pressurized, it is in one of the recesses 2. The conductive adhesive 7 on the electrode 3 does not flow over the step 1a into the recess 2 having the other electrode 3 and short-circuit between the narrowed electrodes or silver filler from the conductive adhesive. There is no danger that a phenomenon called migration, which oozes out and flows out from the electrode to the substrate surface, will occur. Therefore, it is possible to cope with the reduction of the terminal interval due to the miniaturization of the electronic component. Further, according to this embodiment, since the electrodes 3 which have conventionally protruded on the substrate are located in the recesses 2, it is possible to reduce the mounting height of the electronic components, and the electric The unit can be made thinner. Furthermore, even if pressure is applied at the time of component mounting, there is no possibility that the adhesive will flow out, so that the adhesiveness can be improved, and the thickness of the adhesive can be made uniform. The state can be stabilized.

In the above description, an example is shown in which an electronic component having terminals on the bottom surface of a package or the like is mounted on a printed circuit board. The present invention can also be applied to a case where a piezoelectric vibrating element (e.g. That is,
FIG. 2A shows an electrode 3 in two recesses 2 on a printed circuit board 1.
The upper part shows a state in which the piezoelectric vibrating element 8 is cantilevered via the conductive adhesive 7, and leads extending from excitation electrodes (not shown) formed on both front and back surfaces of the piezoelectric element constituting the piezoelectric vibrating element. By connecting the terminals on the electrodes 3 arranged in the two recesses 2, a cantilever support structure is realized. In this embodiment, the two recesses 2 are arranged adjacent to each other in a direction perpendicular to the paper surface, and the electrode 3 is arranged in each recess. Therefore, the conductive adhesive on one electrode is prevented from flowing out and developing to the other. Next, FIG.
This is a modification of (a), in which the piezoelectric vibrating element is supported not on the printed circuit board but on the inner bottom surface of the packaged piezoelectric vibrator, and the above-mentioned electrode structure is used at this time. ing. That is, in this embodiment, the support step 11 provided on the inner bottom surface of the package body 10 is used.
Two recesses 12 are provided on the upper surface, a conductive adhesive 14 is applied on an electrode 13 provided in each recess 12, and a lead electrode of the piezoelectric vibration element 8 is bonded on the conductive adhesive 14. Thereafter, the opening of the package body 10 is hermetically sealed by the lid 15. Also in this embodiment, since the two recesses 2 arranged adjacently are shielded by a step, the conductive adhesive applied to the electrode in one of the recesses flows over the step and flows out to the other electrode. As a result, the occurrence of short-circuit between the electrodes and the outflow of the silver filler constituting the conductive adhesive (reduction of insulation resistance between electrodes, increase of stray capacitance) are eliminated. Further, the height of the package body 10 can be reduced by the electrode 13 being retracted into the recess 12, and pressure can be applied when the piezoelectric vibrating element is bonded, so that the adhesiveness is improved and the thickness of the adhesive is made uniform. There is also an advantage that the posture of the piezoelectric vibration element can be stabilized.

(Embodiment Corresponding to Second Invention) Next, a second invention will be described. FIG. 3A is a diagram showing a flip-chip mounting structure according to an embodiment of the second invention, FIG. 3B is an enlarged view of a main part thereof, and FIG. 3C is an enlarged view of a main part of a modification. . The electronic component 20 has a configuration in which a metal bump 22 is fixed to a terminal 21 a provided on a bottom surface of a component main body 21, and a required amount of a conductive adhesive 23 is applied to a tip of the bump 22 during mounting. The characteristic configuration of the embodiment shown in FIG. 3B is that the annular projection (dam) 26 surrounding the entire outer periphery of the electrode 25 provided on the printed circuit board 24 is provided on the substrate, and the annular projection 26 The point is that the electrode 25 is arranged in the formed recess 26a. When the electronic component 20 is flip-chip mounted on the electrode 25 of the printed circuit board having such a configuration, the conductive adhesive 23 attached to the tip of the bump 22 is removed from the recess 26a.
What is necessary is just to mount on the electrode inside. At this time, the periphery of the electrode 25 whose area is set to be sufficiently small is surrounded by the annular projection 26, so that a small amount of the conductive adhesive 23 does not flow out and develop on the electrode, which is effective. Adhesive strength can be ensured. Alternatively, without applying a conductive adhesive to the tip of the bump, the electrode 25 in the recess 26a defined by the annular projection 26 is applied and filled in advance,
A connection method in which a bump is placed on the conductive adhesive 23 is also possible. In this case, the amount of usable adhesive can be increased, and the bonding strength can be further increased. Furthermore, since the outflow of the conductive adhesive does not occur, the terminal interval on the electronic component 20 side and the corresponding electrode interval on the substrate can be shortened to achieve a fine pitch. Can be reduced in size. Further, as described in the conventional example, the piezoelectric vibrating element may be flip-chip mounted directly on a printed circuit board. In this case, too, by performing mounting using a substrate structure as shown in FIG. Adhesion can be achieved by using a small amount of adhesive. FIG. 3 (c)
Is characterized in that the electrode 25 is arranged on the inner bottom surface of the recess 27 provided on the surface 24a of the printed circuit board 24. The flip-chip mounting method using the printed circuit board shown in this embodiment is performed in the same procedure as the mounting method described with reference to FIG. 3B, and has the same effect. The same figure shows that the electronic components on the printed circuit board can be reduced in height because they are mounted on top.
This is different from the example of (b). Also, the point that the substrate structure shown in FIG. 3C can be applied to flip-chip mounting of the piezoelectric vibrating element is the same as the example of FIG. 3B.

(Embodiment Corresponding to Third Invention) Next, a third invention will be described. FIG. 4 is a longitudinal sectional view showing a package structure of the piezoelectric oscillator according to the third invention, and FIGS. 5 (a), 5 (b) and 5 (c) are a plan view, a perspective view, and an equivalent circuit diagram of a main part. This piezoelectric oscillator uses a conductive adhesive 32 on two pads 31 protruding from the inner bottom surface of a package body 30 having a recess 30a on the upper surface by using a piezoelectric vibrating element 3.
3 is connected to two lead electrodes 35a extending to one end. As is well known, the piezoelectric vibrating element 33 has a configuration in which excitation electrodes 35 are formed on both front and back surfaces of a piezoelectric element such as a quartz element, and a lead electrode 35a is drawn out from each excitation electrode 35 toward one edge of the piezoelectric element. The piezoelectric vibrating element 33 is electrically and mechanically connected to the pad 31 by connecting each lead electrode to each pad 31 by using a conductive adhesive 32. A characteristic configuration of the piezoelectric oscillator of this embodiment is that an oscillator IC 34 having a flip-chip structure is mounted on a conductor pattern formed on the piezoelectric vibrating element 33 using a conductive adhesive. That is, an electrode film as an excitation electrode 35 is formed on both front and back surfaces of the piezoelectric element plate 33a of the piezoelectric vibration element 33, and a lead terminal (conductor pattern) 35a extends from each electrode film. A conductor pattern 3 for mounting the oscillator IC 34 on the surface of the piezoelectric plate separately from the excitation electrode 35 and the lead terminal 35a.
6a, 36b, and 36c are formed, and each conductor pattern extends to the rear surface side via the end surface of the piezoelectric element plate 33a, and terminates at an appropriate position on the rear surface. The terminal portions on the back side of the conductor patterns 36a, 36b, 36c are respectively connected to corresponding electrodes (not shown) provided on the bottom surface in the recess of the package body 30. FIG.
As shown in FIG. 5C, the oscillator IC 34 indicated by a broken line in FIG. 5A has a Vcc terminal 34a, a GND terminal 34b,
In addition to the UT terminal 34c, two lead electrodes (conductor patterns) 35 extending from the respective excitation electrodes 35 of the crystal resonator element 33
Terminals 34d and 34e respectively connected to a are provided. Terminals 34a to 34 provided on the bottom surface of oscillator IC 34
“e” is one in which a metal bump is fixed to the lower surface of a flat terminal provided on the bottom surface of the IC. Each terminal 34a-3
The bumps constituting 4e correspond to the corresponding conductor patterns 36.
a, 36b, 36c and the lead electrodes 35a, 35a are positioned and mounted and fixed by a conductive adhesive.
Depending on the oscillator IC, the Vcc terminal 34a, GN
D terminal 34b, OUT terminal 34c, terminals 34d, 3
In addition to 4e, there is also a device provided with a terminal for fine frequency adjustment. When an oscillator IC having the terminal for fine frequency adjustment is used, the conductor pattern on the surface of the piezoelectric plate is increased accordingly. It will be. This oscillator IC 34
Since the piezoelectric vibrating element is fixed to the upper surface of the end on the side where the piezoelectric vibrating element is fixed to the inner bottom surface of the recess, and is located at a position sufficiently separated from the excitation electrode 35, it does not hinder free vibration of the piezoelectric vibrating element. In the case of manufacturing a piezoelectric oscillator having the above configuration, the electrical characteristics of the piezoelectric oscillator 33 can be measured in a state where the piezoelectric vibration element 33 is attached to the bottom surface of the package body. Only when the oscillator IC 34 is mounted on the piezoelectric vibrating element 33,
While the package is airtightly sealed with the metal lid 37 and completed as a result of the measurement, if it is determined that the product is defective, the package body can be reused by peeling off only the piezoelectric vibration element 33 from the bottom surface in the recess. Can be. Even if the separation of the vibrating element fails, there is no fear that uselessness such as discarding the oscillator IC is generated. For this reason, a reduction in price can be realized.

(Embodiment Corresponding to Fourth Invention) Next, a fourth invention will be described. 6 (a) and 6 (b) are a longitudinal sectional view and a main part perspective view of a package structure showing an embodiment of the fourth invention, and FIGS. 7 (a), 7 (b) and 7 (c) show application of a conductive adhesive. It is a principal part explanatory view showing a process. The piezoelectric device shown in FIGS. 6A and 6B is a piezoelectric vibrator. The piezoelectric vibrator 40 has a predetermined space between a package body 41 having a recess 42 and an inner bottom surface of the package body recess 42. Two pedestals 43a and 43b projecting apart and two pads 44a and 43a formed on the inner bottom surface outside (right side) of one pedestal 43a.
44b, a piezoelectric vibrating element 45 such as a quartz vibrating element mounted on the two pedestals 43a and 43b, and the package body 4
1 has a metal lid 50 for sealing the upper surface. The piezoelectric vibration element 45 includes a piezoelectric element plate 46, an excitation electrode 47 and a lead electrode 47 a formed on the upper surface of the piezoelectric element plate 46, and a piezoelectric element plate 4.
Excitation electrode 48 and lead electrode 48a formed on the lower surface of 6
And both pedestals 43a and 43b are connected to the excitation electrodes 4
The forming position is set so as not to interfere with the electrodes 7 and 48, and to be in contact with the inner side of the both ends of the piezoelectric element plate. Also, pads 44a and 44b are located below the edge of the raw plate where both lead electrodes 47a and 48a terminate.
The lower lead electrode 48a is connected to one pad 44a as before.
And directly connected by a conductive adhesive 49. The lead electrode 47a on the upper surface is adhered and fixed by the conductive adhesive 49 through a single coating process according to the procedure shown in FIGS. 7 (a), 7 (b) and 7 (c). The conductive adhesive 49 used in the present invention has a lower viscosity and a better fluidity than conventional ones. That is, first, as shown in FIG. 7 (a), the discharge port 50a of the coating jig 50 in the form of a dropper or injector faces the upper lead electrode 47a, and discharge of the conductive adhesive 49 from the discharge port 50a is started. Then, it is applied on the lead electrode 47a. Then, as shown in FIG.
4b, the discharge is continued so that the conductive adhesive flows down,
Finally, as shown in (c), the discharge is stopped when the conductive adhesive that has reached the pad is spread downwardly below the end of the base plate projecting like an eave and sufficiently contacts the lower surface of the base plate. In FIG. 7, the discharge is performed in a state where the application jig 50 is fixed at one place. However, this is an example, and the application may be performed while the discharge ports 50a are sequentially lowered.

FIGS. 8 (a) and 8 (b) are a plan view and a cross-sectional view along line XX showing another example of a package having a piezoelectric vibrator mounted by the bonding method shown in FIG. A step 51 is provided in the package body of the piezoelectric vibrator on the side on which the pad is formed.
A pad 52 is formed by metallizing 1. In this example, the inside of the recess formed between the step 51 and the right pedestal 43a is used as an adhesive pool, and the inside of this recess is metallized and used as the pads 52 (44a, 44b). When the conductive adhesive 49 is discharged by such a method, the adhesive 49 can be easily spread on the upper surface, the side surface, the lower surface, and further on the pad 52 of the edge of the piezoelectric vibrating element 45 that protrudes like an eave. . Next, FIGS. 9A and 9B are plan views of a piezoelectric vibrator according to a modification of the fourth invention, and FIGS.
It is X 'sectional drawing. Package body 4 of this piezoelectric vibrator
Steps (pedestals) 55a, 55 at both left and right end portions on the inner bottom surface of 1
The steps (pedestals) 55a and 55b are used as substitutes for the pedestals in the above-described embodiment, and support both ends of the piezoelectric vibration element 45. However, when the upper surface of the right step 55a is flat, a space for connecting the lower surface of the right end portion of the piezoelectric vibrating element 45 and the pad located immediately therebelow with the conductive adhesive cannot be secured. That is, the piezoelectric vibration element 45
Of the right end of the step 55a is in close contact with the flat upper surface of the step 55a, so that there is no room for the conductive adhesive to intervene. Therefore, in this embodiment, the upper surface of the step 55a is not flattened, and the recess 55a 'is not formed.
While forming the pad 56 by metallization at least in the recess 55a ', the recess 55
The right end of the piezoelectric vibrating element 45 is configured to protrude like an eave above a ′. Therefore, by applying the conductive adhesive 49 according to the procedure as shown in FIG. 7, the lead electrode 47a and the pad 56 can be ideally connected as shown in FIG. 9B. As described above, in the present invention, two pedestals provided on the inner bottom surface of the package body, or the piezoelectric vibrating element is supported at two places by the steps, while the end of the base plate protruding from the one pedestal or the steps in an eaves shape When connecting the lead electrode 47a on the upper surface of the edge to the pad located immediately below, a conductive adhesive having good fluidity is allowed to flow down from the upper surface of the lead electrode 47a to the edge of the base plate and further to the pad. Since the discharge of the adhesive is stopped when the conductive adhesive is filled between the lower surface of the base plate and the pad, the connection between the upper lead terminal and the pad can be completed by one application work. Thus, the workability can be improved and the product cost can be reduced. The fourth invention has a package structure that accommodates not only a piezoelectric vibrator in which a piezoelectric vibrating element is hermetically sealed in a package but also other components such as an IC constituting an oscillation circuit in addition to the piezoelectric vibrating element. The present invention can also be applied to a piezoelectric oscillator.

(Embodiment Corresponding to Fifth Invention) Next, a fifth invention will be described. FIGS. 10A and 10B are a main part plan view and a YY sectional view showing a package structure of a piezoelectric device according to an embodiment corresponding to the fifth invention. This piezoelectric device is provided with a conductive adhesive 64 on a pad 63 on a step 62 disposed at two corners in a concave portion 61 of a package body 60 made of ceramic or the like via a conductive adhesive 64 so that a corner of a piezoelectric vibrating element 65 is formed. The configuration in which the parts are connected is the same as that of the above-described conventional example, but by providing the second step 66 in an L shape along the corner on the upper surface of the step 62 (the corner of the inner wall of the package body), A narrow space is formed between the corner end face of the piezoelectric vibration element 65 connected to the pad 63 and the inner wall surface of the second step 66, and the conductive adhesive 64 is filled in this narrow space. Is different. That is, the second step 66 is a step formed by integrally projecting an L-shape planar shape along the corner of the upper surface of the step 62, and the pad 63 is provided immediately inside the vertical inner wall skirt. The periphery of is located. Therefore, the area is smaller than that of the conventional pad shown in FIG. 16, and the piezoelectric vibrating element 6 having the same size as the piezoelectric vibrating element 6 shown in FIG.
When the corners of No. 5 are connected using the conductive adhesive 64, a slight gap is formed between the end face of the corner of the piezoelectric vibration element 65 and the inner wall surface of the second step 66. By continuously filling the gap and the space between the upper surface of the pad and the lower surface of the piezoelectric vibrating element with the conductive adhesive 64, it is possible to obtain a strong connection strength with a small amount of the conductive adhesive. Become. That is, by filling and connecting the conductive adhesive 64 not only between the bottom surface of the piezoelectric vibration element 65 and the pad, but also between the end face of the piezoelectric vibration element and the inner wall of the second step 66, a large amount of A strong connection strength can be obtained with a small amount of the conductive adhesive without forming a fillet shape by the conductive adhesive. That is, the bonding area between the adhesive and the piezoelectric vibrating element obtained by the present invention is equal to the connection area by the conventional connection method using the fillet shape, and as a result, the connection strength is the same as when the fillet shape is used. Can be obtained. As described above, according to the present invention, the piezoelectric vibrating element can be connected and fixed on the pad using a smaller amount of the conductive adhesive, so that the amount of outgas generated from the adhesive when the package is airtightly sealed. Can be greatly reduced, and the aging of the piezoelectric device can be improved. The present invention can be applied not only to a piezoelectric vibrator in which only a piezoelectric vibrator is hermetically sealed in a package, but also to a piezoelectric oscillator in which an oscillator IC and the like are simultaneously sealed.

(Embodiment Corresponding to the Sixth Invention) Next, the sixth invention will be described. FIG. 11A is a longitudinal sectional view showing a package structure of a piezoelectric device according to an embodiment of the sixth invention, and FIG. 11B is a plan view. The piezoelectric device exemplified here is a piezoelectric vibrator, and a step 72 provided in a recess 71 of a package body 70 made of ceramic or the like.
One end of a piezoelectric vibration element 75 is connected and fixed to the upper pad 73 by a conductive adhesive 74. The outer frame upper surface 76 of the package main body 70 is not a flat surface, but comprises a flat, horizontal and flat annular surface 76a, and an upright wall 76b which stands up around the entire outer periphery of the annular surface 76a. The peripheral edge of the metal lid 80 is supported on the outer frame upper surface 76 via a resin binder 77 applied along the upper surface and the inner wall surface of the upright wall 76b. As shown in the sectional view of FIG. 11A, the resin binder 77 is developed and solidified in an L shape from the upper surface of the annular surface 76a along the inner wall of the upright wall 76b.
6, the total seal width of the horizontal seal width L1 and the height direction seal width L2 is longer than the seal width L even if the seal width L itself is not changed or the seal width L is reduced. In addition, moisture that tends to permeate from the upper end of the resin binder 77 does not easily enter the space in the package, and as a result, the frequency stability can be increased. The present invention can be applied not only to a piezoelectric vibrator in which only a piezoelectric vibrator is hermetically sealed in a package, but also to a piezoelectric oscillator in which an oscillator IC and the like are simultaneously sealed.

[0019]

As described above, the first to sixth inventions have the following effects, respectively. First, in the first invention, an electrode is provided on the inner bottom surface of a recess formed on the surface of a printed circuit board as an object on which a surface mount component is mounted, and further, an electronic component to be mounted is placed on the electrode in the recess. A sufficient amount of conductive adhesive was applied so as to be able to adhere to the terminal with a sufficient adhesive area and adhesive strength. Therefore, when the electronic component is placed on the conductive adhesive and pressurized, the conductive adhesive on the electrode in one recess does not flow over the step and into the recess having the other electrode. In addition, there is no risk of a short circuit between the electrodes being narrowed or a migration phenomenon in which the silver filler seeps out of the conductive adhesive and flows out from the electrodes to the substrate surface. Further, the mounting height of the electronic component can be reduced. Furthermore, even if pressure is applied at the time of component mounting, there is no possibility that the adhesive will flow out, so that the adhesiveness can be improved, and the thickness of the adhesive can be made uniform. The state can be stabilized. In addition, even if the distance between the electrodes is reduced due to the miniaturization of the device, the conductive adhesive does not cause a short circuit between the electrodes and the like, so the miniaturization can be promoted, and as a result, the electric unit including the printed circuit board can be used. , Reliability can be increased, productivity can be increased, and costs can be reduced. Next, according to a second aspect of the invention, an annular projection (dam) surrounding the entire outer periphery of the electrode provided on the printed circuit board is provided on the substrate, so that the electrode is arranged in a recess formed by the annular projection. Since the electrodes in the recesses and the bumps of the flip-chip mounting component are connected by a conductive adhesive, the adhesive strength can be increased while reducing the amount of the adhesive, and the problem of the adhesive flowing out can be prevented. Since the conductive adhesive does not flow out, the terminal pitch on the electronic component side and the corresponding electrode interval on the substrate can be shortened to achieve a fine pitch, so that the electronic component and the printed circuit board can be miniaturized. can do. In some cases, a piezoelectric vibrating element is directly mounted on a printed circuit board by flip-chip mounting. In this case as well, mounting using a similar substrate structure enables bonding by using a small amount of adhesive. The use of an underfill which causes deterioration of aging is not required.

Next, a third invention relates to an oscillator I having a flip-chip structure on a conductor pattern formed on a piezoelectric vibrating element.
Since C is mounted using a conductive adhesive, it is possible to measure the electrical characteristics of the piezoelectric vibrating element mounted on the bottom surface of the package body. There is no danger of waste such as discarding, and the cost can be reduced. Next, according to a fourth aspect of the present invention, while the piezoelectric vibrating element is supported at two locations by two pedestals or a step provided on the inner bottom surface of the package body, a base plate protruding from one of the pedestals and the step in an eaves shape is provided. When connecting the lead electrode a on the upper surface of the edge to the pad located directly below, a conductive adhesive having good fluidity is allowed to flow from the upper surface of the lead electrode to the edge of the base plate, and further to the pad, and finally, Since the discharge of the adhesive is stopped when the conductive adhesive is filled between the lower surface of the base plate and the pad, the connection between the upper lead terminal and the pad can be completed by one application work. Thus, the workability can be improved and the product cost can be reduced. Next, the piezoelectric device according to the fifth aspect of the present invention provides a method for connecting the corners of a piezoelectric vibrating element via conductive adhesive to pads on steps which are respectively disposed at two corners in a package body. By providing the second step in an L-shape along the corner of the upper surface of the step, the gap between the corner of the piezoelectric vibrating element connected on the pad and the inner wall surface of the second step is narrowed. Since the space is formed and the conductive adhesive is filled in this narrow space, the space and the space between the upper surface of the pad and the lower surface of the piezoelectric vibration element are continuously filled with the conductive adhesive. This makes it possible to obtain a strong connection strength with a small amount of the conductive adhesive.
Therefore, the amount of outgas generated from the adhesive when the package is hermetically sealed can be significantly reduced, and the aging of the piezoelectric device can be improved. Next, in a piezoelectric device according to a sixth aspect of the invention, the upper surface of the outer frame of the package body includes a flat horizontal and flat annular surface, and an upright wall that stands up around the entire outer periphery of the annular surface. Since the peripheral edge of the metal lid is supported on the upper surface of the outer frame via a resin binder applied along the upper surface of the annular surface and the inner wall surface of the upright wall, even if the seal width of the entire upper surface of the outer frame is shortened, it is horizontal. Since the total seal width of the directional seal width and the height direction seal width is longer than the seal width, the water that tends to penetrate from the upper end of the resin binder 77 is less likely to enter the space inside the package, and as a result, the frequency stability is reduced. Can be increased. Therefore, it is possible to cope with the miniaturization of the package.

[Brief description of the drawings]

FIGS. 1A and 1B are a cross-sectional view of a printed circuit board for explaining a mounting structure of a surface-mounted component according to the present invention, and a cross-sectional view showing a state where electronic components are mounted.

FIGS. 2A and 2B are explanatory views of an embodiment according to the first invention.

3A is a diagram showing a flip-chip mounting structure according to an embodiment of the second invention, FIG. 3B is an enlarged view of a main part thereof, and FIG. .

FIG. 4 is a longitudinal sectional view showing a package structure of a piezoelectric oscillator according to a third invention.

FIGS. 5A, 5B, and 5C are a plan view, a perspective view, and an equivalent circuit diagram of a main part.

FIGS. 6A and 6B are a longitudinal sectional view and a perspective view of a main part of a package structure according to a fourth embodiment of the present invention.

FIGS. 7 (a), (b) and (c) are main part explanatory views showing a step of applying a conductive adhesive.

8A and 8B are a plan view and a cross-sectional view along line XX showing another example of a package on which a piezoelectric vibrator is mounted by the bonding method of FIG.

FIGS. 9A and 9B are a plan view and a cross-sectional view taken along line X′-X ′ of a piezoelectric vibrator according to a modified example of the fourth invention.

10A and 10B are a plan view and a longitudinal sectional view of a main part showing a package structure of a piezoelectric device according to an embodiment corresponding to the fifth invention.

11A is a longitudinal sectional view showing a package structure of a piezoelectric device according to an embodiment of the sixth invention, and FIG. 11B is a plan view.

FIG. 12 is an explanatory view of a conventional example.

13A is an overall view showing a configuration example of a surface mount component having a conventional flip-chip mounting structure, FIG. 13B is an enlarged view of a main part thereof, and FIG. 13C is a state of mounting on a printed circuit board. FIG.

FIG. 14 is a cross-sectional view showing a package structure of a conventional piezoelectric oscillator.

FIGS. 15A and 15B are diagrams showing a connection method of a piezoelectric vibrating element in a conventional piezoelectric device (a piezoelectric vibrator, a piezoelectric oscillator, or the like).

16 (a) and (b) are a plan view and a longitudinal sectional view showing a package structure of a conventional piezoelectric vibrator.

FIG. 17 is a cross-sectional view illustrating a package structure of a conventional piezoelectric device.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 printed board, 1a substrate body surface, 2 recess (cavity), 3 electrode, 5 electronic component (surface mounted component), 6 terminal, 7 conductive adhesive, 10 package body, 11 support step, 12 recess, 13 Electrode, 14
Conductive adhesive, 15 lid, 20 electronic components, 21 component body, 21a terminal, 22 metal bump, 23 conductive adhesive, 24 printed circuit board, 25 electrode, 26 annular protrusion (dam), 26a recess, 20 package body ,
30a recess, 31 pad, 32 conductive adhesive, 33
Piezoelectric vibrating element, 34 Oscillator IC, 34a, Vcc terminal, 34b GND terminal, 34c OUT terminal, 34
d, 34e terminal, 35 excitation electrode, 35a lead electrode, 36a, 36b, 36c conductor pattern, 40 piezoelectric vibrator, 41 package body, 42 recess, 43
a, 43b pedestal, 44a, 44b pad, 45 piezoelectric vibrating element, 46 piezoelectric element, 47 excitation electrode, 47a
Lead electrode, 48 excitation electrode, 48a lead electrode,
49 conductive adhesive, 50 coating jig, 50a discharge port, 55a, 55b step (pillow), 55a 'recess, 5
6 pads, 60 package body, 61 recess,
62 steps, 63 pads, 64 conductive adhesive, 65
Piezoelectric vibration element, 66 second step, 70 package body, 71 recess, 72 step, 73 pad, 74
Conductive adhesive, 75 piezoelectric vibrating element, 76 outer frame upper surface, 76a annular surface, 76b upright wall, 77 resin binder, 80 metal lid.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yasuyuki Miyatake 2-1-1 Kotani, Samukawa-cho, Koza-gun, Kanagawa F-term in Toyo Tsushinki Co., Ltd. (Reference) 5E319 AA03 AB05 BB11 5E336 AA04 AA08 CC31 CC58 EE08 5J079 AA03 BA43 HA03 HA07 HA16 HA28 HA29

Claims (7)

[Claims] In a mounting structure of a surface mounting component mounted on a printed circuit board by bonding a terminal to the electrode on the printed circuit board using a conductive adhesive, the individual electrodes are formed on the printed circuit board. A surface mounting component mounting structure, wherein the electrodes are disposed on the bottom surfaces of the individual recesses, and the electrodes disposed on the bottom surfaces of the respective recesses are connected to the terminals of the surface mounting component using a conductive adhesive. 2. A support structure for a piezoelectric vibrating element, which is connected to an electrode of a printed circuit board or an electrode provided in a package by using a conductive adhesive, wherein the piezoelectric vibrating element is provided on the printed circuit board or in the package. A support structure for a piezoelectric vibrating element, wherein electrodes are respectively arranged on the bottom surfaces of the formed recesses, and the electrodes disposed on the bottom surfaces of the recesses are connected to terminals of the piezoelectric vibrating element using a conductive adhesive. 3. A mounting structure for a surface-mounted component using a conductive adhesive when fixing a bump fixed to a terminal of a surface-mounted component for flip-chip mounting to an electrode on a printed circuit board. A surface mounting component, which is arranged on the bottom surface in the recess formed above, and is configured to fix the bump by abutting a bump coated with a conductive adhesive on the tip on an electrode in the recess. Mounting structure. 4. A piezoelectric device having a structure in which a piezoelectric vibrating element and an oscillator IC for flip-chip mounting are housed in a concave portion of a package body having a concave portion on an upper surface, and an opening of the concave portion is hermetically sealed with a metal lid. In the oscillator, one end of the piezoelectric vibrating element is adhesively fixed in a cantilever state on a pad on the inner bottom surface of the recess, and the upper surface of the piezoelectric vibrating element can be connected to a terminal provided on the bottom surface of the oscillator IC. The oscillator IC is subjected to the piezoelectric vibration by connecting and fixing the bumps fixed to the respective terminals on the bottom surface of the oscillator IC using conductive adhesive on the respective conductor patterns on the upper surface of the piezoelectric vibration element. A structure of a piezoelectric oscillator, which is mounted on an upper surface of an element. 5. A piezoelectric device having a structure in which at least a piezoelectric vibrating element is housed in a concave portion of a package main body having a concave portion on an upper surface and an opening of the concave portion is hermetically sealed by a metal lid. 2 projecting at a predetermined interval
A piezoelectric vibrating element is placed over two pedestals, and a lead electrode located on the upper surface of one end of the piezoelectric vibrating element protruding in an eaves-like shape from one pedestal is a pad on an inner bottom surface located immediately below the one end. When connecting with the conductive adhesive, the conductive adhesive applied on the lead electrode on the upper surface of the one end portion is wrapped around the back surface of the piezoelectric vibrating element via the side surface of the one end portion. A structure of a piezoelectric device, wherein the structure is configured to be electrically connected to a lead electrode. 6. An edge of a piezoelectric vibrating element is adhesively fixed on a pad on a step protruding from an inner bottom surface of a concave portion of a package body having an upper surface with a conductive adhesive, and an opening of the concave portion is formed. In a piezoelectric device having a structure hermetically sealed with a metal lid, a second step having a planar L-shape is projected along a corner of the step upper surface having the pad to reduce the area of the step upper surface, One end of the piezoelectric vibrating element is connected and fixed on the pad with a small amount of conductive adhesive filling a small space between the end face of the piezoelectric vibrating element connected to the pad on the upper surface of the step and the inner wall of the second step. A piezoelectric device characterized by the following. 7. A package body having a concave portion on an upper surface, at least a piezoelectric vibrating element is housed in the concave portion, and a metal lid is fixed to an upper surface of an outer frame of the package body by using a resin binder to form the concave portion. In a piezoelectric device having a hermetically sealed structure, an upper surface of an outer frame of the package body is constituted by a horizontal and flat annular surface and an upright wall which stands up around the entire outer periphery of the annular surface. A peripheral edge of the metal lid is supported on the upper surface of the outer frame via a resin binder applied along the inner wall of the upright wall.