JP2000114701A - Component mounting method on circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize an equipment and make it thinner by mounting a chip part on a side surface of a circuit board. SOLUTION: A recessed part 5 having a thin conductive layer for connecting a chip part is provided to a side surface of a board 1, and the recessed part 5 is filled with cream solder to mount a chip part. The thin conductive layer is previously formed on an inner surface of the recessed part 5 in a technique of through-hole plating to make soldering possible. In the circuit board 1, the recessed part 5 is exposed from the side surface of the circuit board 1. And the circuit board 1 is set on a supply jig 13, and a first-surface mounting part 14 and a side-surface mounting part 15 are fitted to specified positions, respectively, and the supply jig 13 is put in a reflow furnace, thereby obtaining a double faced circuit board wherein a chip part is mounted on a side surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a circuit board and a method for mounting components.

[0002]

2. Description of the Related Art Conventionally, surface mount components are mounted on a circuit board only on the front and back surfaces of the circuit board. FIG.
The circuit board 30 shown in (a) is housed inside a personal computer housing 31, and its periphery is surrounded by a side surface of the housing, a keyboard 32, a hard disk drive 33 and the like. FIG.
In the case of the conventional example shown in (a), the height of the personal computer is limited by the tall surface-mounted components 34 mounted on the surface of the circuit board 30. The tall surface mount component 34 is shown in FIG.
By attaching to the side surface of the circuit board 30 as shown in (b), the height of the circuit board 30 can be reduced. At this time, the area of the circuit board 30 can be reduced because the mounting area of the surface mount component 34 can be eliminated. Therefore, the area may be smaller than the conventional area, and a reduction in size, weight, and thickness can be achieved.

In the case of a component with a lead wire, it is difficult to arrange a connection land around the circuit board, fix the lead wire with solder, and then bend the lead wire to lay down the surface mount component as shown in FIG. However, in the case of a chip component having a flat terminal, only the mounting shown in FIG. 8A could be performed.

[0004]

SUMMARY OF THE INVENTION According to the present invention, connection lands for chip components are provided on the side surface of a circuit board to reduce the size of equipment.
It is an object of the present invention to provide a circuit board corresponding to a reduction in thickness.

[0005]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention is configured to mount a chip component on a side surface of a circuit board.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that a concave portion having a thin conductive layer for connecting a chip component is provided on a side surface of a substrate, and the concave portion is filled with cream solder to form the chip. It is characterized by mounting components, so that a high-density mounting circuit board can be provided, and the size, weight, and thickness of the device can be reduced.

According to a second aspect of the present invention, there is provided the first aspect of the present invention, wherein a storage frame for storing the chip component is provided on a peripheral substrate facing the recess. In addition, the side mounting substrate can be manufactured without requiring a special jig.

Hereinafter, a mounting method of the present invention will be described with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view for explaining a method of forming a component land on a side surface of a circuit board. In the drawing, 1 is a circuit board, 2 is a peripheral board of the circuit board 1, 3 is a through hole, 4 is a wiring pattern, and 5 is a recess provided for forming a side land.

On the inner surface of the recess 5, a thin conductive layer is formed in advance by using a through-hole plating technique so that soldering can be performed.

Although the wiring pattern 4 is provided on the front substrate, it may be provided on the inner substrate. The peripheral board 2 is the circuit board 1
Is used for positioning, transporting, etc. in the manufacturing process and the inspection process. After the mounting components are mounted on the circuit board 1 and the final process inspection is completed, the peripheral substrate 2 is cut off along the through holes 3 and completed. It becomes a circuit board.

In the first embodiment, as shown in FIG. 2, it is necessary to protrude the cream solder 7 for connecting the chip components from the side surface 6 of the circuit board.

Hereinafter, the first embodiment will be described in the order of the manufacturing process.
A side mounting method will be described. FIG. 3 is an overall front view of the circuit board 1 according to the first embodiment. Reference numeral 8 denotes connection lands for surface-mounting mounted components, and reference numeral 9 denotes a cut-off line for cutting off the peripheral board 2. Although components are mounted on both sides of the circuit board 1, the first surface can be manufactured by a normal reflow process. Therefore, the reflow process on the second surface for performing side mounting will be described.

The circuit board 1 on which the first surface reflow process has been completed is first cut off the peripheral board 2 along the cutout line 9, and the recess 5 as shown in FIG. 2 is exposed on the side surface of the circuit board 1. FIG. 4A shows a jig plate 10 for forming a convex cream solder in the concave portion 5. Jig plate 10
Has a frame 11 for accommodating the circuit board 1 obtained by cutting off the peripheral board 2, and a cut 12 corresponding to the recess 5 is provided around the frame 11. FIG. 4B is a cross-sectional view in which the circuit board 1 in which the first surface has been mounted on the frame portion 11 and the peripheral substrate 2 has been cut off has been mounted. A cream solder 7 is applied to the surface of FIG. 4B by a printing method. After the cream solder 7 is air-dried, the circuit board 1 is taken out from the jig plate 10.
The solder application of the connection lands 8 and the protruding solder of the concave portions 5 (the state shown in FIG. 2) are simultaneously formed.

When the circuit board 1 is set on a supply jig 13, a surface mount component 14 and a side mount component 15 are mounted at predetermined positions, and the supply jig 13 is placed in a reflow furnace. A substrate is obtained (FIG. 5).

(Second Embodiment) FIG. 6 is a partial front view of a circuit board 16 used in a second embodiment. Circuit board 16
Has a storage frame 17 for storing a chip component 18 mounted on a peripheral substrate 19.

The circuit board 16 on which the mounting of the first surface described in the first embodiment is completed is turned upside down, and the chip component 18 is set in the storage frame 17. At this time, the chip component 18 is attached so that the electrode of the chip component 18 faces the concave portion 5 serving as a side surface land provided on the circuit board 16 and the side surfaces of the circuit board 16 and the chip component 18 are at the same height (FIG. 7 (a)).

A cream solder is applied to the connection lands 8 and the recesses 5 by the printing method described in the first embodiment. FIG. 7 shows a section A of the recess 5 to which the cream solder 7 has been applied. At this time, apply so that the surface of the cream solder 7 rises,
When the cream solder 7 is melted in the reflow furnace and contracted in volume, the cream solder 7 in the raised portion is drawn into the recess 5. After the reflow, the peripheral substrate 19 is cut off along the through holes 3 to obtain a double-sided / side-side mounted substrate.

The circuit board 16 and the side chip components 18
In the case where the thickness of the solder paste is significantly different, the cream solder can be filled in the recess 5 by a dispenser regardless of the printing method. FIG. 7B is a cross-sectional view in which the chip component 18 is mounted on the storage frame 17 so that the terminal electrode 21 of the chip component 18 faces the recess 5, and the connection portion is filled with the cream solder 7 by the dispenser 20. is there.

Although the embodiment has been described with an example in which chip components are mounted on the side surface of the circuit board, the substrate may be cut out in a square shape and the components may be mounted on the inner side surface of the square shape. is there.

[0020]

According to the present invention, the height of the mounted component can be reduced, and the thickness of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the periphery of a side recess in an embodiment.

FIG. 2 is a perspective view of a cream solder in a side recess according to the embodiment;

FIG. 3 is a front view of a circuit board according to the embodiment;

FIG. 4A is a perspective view of a jig plate according to the embodiment; FIG. 4B is a cross-sectional view in which a circuit board is mounted on the jig plate according to the embodiment;

FIG. 5 is a perspective view of a supply jig in a reflow step in the embodiment.

FIG. 6 is a front view illustrating another circuit board in the embodiment.

FIG. 7A is a cross-sectional view illustrating a state of applying cream solder to a side recess according to the embodiment; and FIG. 7B is a cross-sectional view illustrating filling of cream solder by a dispenser.

FIG. 8A is a cross-sectional view of a conventional surface mount circuit board. FIG. 8B is a cross-sectional view of a surface mount / side mount circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 16 Circuit board 2 Peripheral board 5 Depression 7 Cream solder 8 Surface connection land 15 Side mounting component 17 Chip component storage frame

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H05K 3/42 640 H05K 3/42 640Z F term (Reference) 4M105 AA11 5E317 AA04 AA22 AA25 CC15 CC22 CD32 GG14 5E319 AA01 AA08 AA10 AB01 AB05 BB05 CC33 CD27 CD29 GG01 5E336 AA08 AA13 AA14 BB02 BC25 BC36 CC51 DD26 EE03

Claims (2)

[Claims] A concave portion having a thin conductive layer for connecting a chip component is provided on a side surface of the substrate, the concave portion is filled with cream solder, and the chip component is mounted. Component mounting method. 2. The method for mounting components on a circuit board according to claim 1, wherein a storage frame for storing the chip components is provided on the peripheral substrate facing the recess.