JP2000100291A - Mounting structure and mounting method for temperature fuse element - Google Patents
Mounting structure and mounting method for temperature fuse elementInfo
- Publication number
- JP2000100291A JP2000100291A JP10288841A JP28884198A JP2000100291A JP 2000100291 A JP2000100291 A JP 2000100291A JP 10288841 A JP10288841 A JP 10288841A JP 28884198 A JP28884198 A JP 28884198A JP 2000100291 A JP2000100291 A JP 2000100291A
- Authority
- JP
- Japan
- Prior art keywords
- fusible alloy
- melting point
- alloy piece
- low melting
- point fusible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 21
- 229910000743 fusible alloy Inorganic materials 0.000 claims abstract description 64
- 230000008018 melting Effects 0.000 claims abstract description 52
- 238000002844 melting Methods 0.000 claims abstract description 52
- 230000004907 flux Effects 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 33
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は温度ヒュ−ズエレメ
ントの取付け構造及び取付け方法に関し、例えば基板型
温度ヒュ−ズのヒュ−ズエレメントの取付けに有用なも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a method for mounting a temperature fuse element, and is useful, for example, for mounting a fuse element of a board type temperature fuse.
【０００２】[0002]
【従来の技術】ヒュ−ズエレメントに低融点可溶合金片
を用いた合金型温度ヒュ−ズとして、絶縁基板上に対向
して膜電極を設け、これらの膜電極間に低融点可溶合金
片を接続し、この低融点可溶合金片上にフラックスを塗
布し、このフラックス塗布合金片を覆ってエポキシ樹脂
塗装による絶縁被覆を設けた基板型温度ヒュ−ズが公知
である。2. Description of the Related Art As an alloy type temperature fuse using a low melting point fusible alloy piece as a fuse element, a membrane electrode is provided opposite to an insulating substrate, and a low melting point fusible alloy is provided between these membrane electrodes. 2. Description of the Related Art A substrate type temperature fuse in which pieces are connected, a flux is applied on the low melting point fusible alloy piece, and an insulating coating made of epoxy resin is provided over the flux coated alloy piece is known.
【０００３】この基板型温度ヒュ−ズの作動メカニズム
は、機器の過電流に基づく異常発熱で低融点可溶合金片
が溶融され、この溶融合金が溶融フラックスの活性力を
受けつつ膜電極との濡れの進行により膜電極に向け引き
込まれて分断され、この分断による通電遮断で機器の温
度が降下されて分断溶融合金が凝固されることにある。[0003] The operating mechanism of the substrate type temperature fuse is such that the low melting point fusible alloy piece is melted by abnormal heat generation due to the overcurrent of the equipment, and this molten alloy receives the activation force of the molten flux and contacts the membrane electrode. It is drawn toward the membrane electrode and divided by the progress of wetting, and the temperature of the device is lowered due to the cut-off of electricity by this division, and the divided molten alloy is solidified.
【０００４】この基板型温度ヒュ−ズにおける低融点可
溶合金片と膜電極との接合方法には、レザ−溶接法、抵
抗溶接法、鏝法等が知られている。また、各膜電極上に
はんだペ−ストを塗布し、これらの膜電極を跨って低融
点可溶合金片を載置し、オ−ブンで全体を加熱し低融点
可溶合金片端部と膜電極との間をはんだペ−ストを介し
て溶着する方法も提案されている（特開平２−２７６１
２５号公報）。[0004] Laser welding, resistance welding, iron welding, and the like are known as methods for joining the low melting point fusible alloy piece and the membrane electrode in the substrate type temperature fuse. In addition, a solder paste is applied on each of the membrane electrodes, a low-melting-point fusible alloy piece is placed over these membrane electrodes, and the whole is heated in an oven to form an end portion of the low-melting-point fusible alloy piece. A method of welding between the electrodes via a solder paste has also been proposed (JP-A-2-2761).
No. 25).
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、抵抗溶
接法、鏝法等では加圧溶接であるために溶接部が膜電極
上によく濡れ拡がって極端に薄肉化され、この薄肉化が
溶接部近傍の低融点可溶合金片部分に波及して低融点可
溶合金片の電気抵抗値がかなり増大され易い。また、レ
−ザ−溶接の場合でもレ−ザ−による低融点可溶合金の
飛散があり、電気抵抗値の相当の増大が懸念される。However, in the resistance welding method, the trowel method, etc., since the welding is performed by pressure, the welded portion spreads well on the membrane electrode and is extremely thinned. And the electric resistance of the low melting point fusible alloy piece tends to be considerably increased. In addition, even in the case of laser welding, the low melting point fusible alloy is scattered by the laser, and there is a concern that the electric resistance value may be considerably increased.
【０００６】上記特開平２−２７６１２５号公報に開示
された方法は無加圧法であるが、膜電極上に塗布された
はんだペ−ストが溶融した低融点可溶合金の膜電極上で
の濡れ拡がりを促進するために溶着部のかなりの薄肉化
が避けられず、上記低融点可溶合金片の電気抵抗値の相
当の増大は免れ得ない。而るに、低融点可溶合金片の抵
抗値の増大が顕著になると、低融点可溶合金片が保護し
ようとする機器からの熱以外にジュ−ル発熱によっても
加熱される結果、温度ヒュ−ズの作動誤差が招来され
る。The method disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2-276125 is a non-pressurizing method. However, the solder paste applied on the membrane electrode is wetted on the membrane electrode by a low-melting-point fusible alloy melted. In order to promote the spread, considerable reduction in the thickness of the welded portion is unavoidable, and a considerable increase in the electric resistance value of the low melting point fusible alloy piece cannot be avoided. However, when the resistance value of the low-melting-point fusible alloy piece increases remarkably, the low-melting-point fusible alloy piece is heated not only by heat from the equipment to be protected but also by Joule heat, resulting in a temperature hue. Operation error is caused.
【０００７】本発明の目的は、基板型温度ヒュ−ズの低
融点可溶合金片の溶着部の薄肉化をよく抑えて低融点可
溶合金片の細りを充分に防止できる温度ヒュ−ズエレメ
ントの取付け方法を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a temperature fuse element capable of sufficiently suppressing the thickness of a welded portion of a low melting point fusible alloy piece of a substrate type temperature fuse and sufficiently preventing the low melting point fusible alloy piece from being thinned. It is an object of the present invention to provide a mounting method of the helmet.
【０００８】[0008]
【課題を解決するための手段】本発明に係る温度ヒュ−
ズエレメントの取付け方法は、絶縁基板上に対向して設
けた電極の上面にフラックスを塗布し、表面に酸化膜を
有する低融点可溶合金片を前記電極間にまたがって載置
し、無加圧の加熱により低融点可溶合金片と電極との間
を溶着することを特徴とする構成であり、無加圧の加熱
は、加熱炉による加熱や接触圧が実質上零の熱板接触に
よる加熱とすることができる。SUMMARY OF THE INVENTION A temperature hue according to the present invention is provided.
The flux element is attached by applying a flux to the upper surface of the electrode provided on the insulating substrate, placing a low melting point fusible alloy piece having an oxide film on the surface over the electrode, The structure is characterized by welding between the low melting point fusible alloy piece and the electrode by heating the pressure, and the non-pressurized heating is performed by heating with a heating furnace or hot plate contact with a contact pressure of substantially zero. Heating can be used.
【００１０】[0010]
【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図１の（イ）乃至図１の
（ニ）は本発明に係る温度ヒュ−ズエレメントの取付け
方法を示す図面である。図１の（イ）は温度ヒュ−ズヒ
ュ−ズエレメントである低融点可溶合金片が取付けられ
る対象部材を示し、セラミックス板等の絶縁基板１上に
膜電極２を対向して設けてある。この膜電極は電極形成
用ペ−ストをスクリ−ン印刷、ディップ、スピンコ−ト
等で塗布し、これを焼成することにより形成でき、電極
形成用ペ−ストには導電性金属粉末とガラス粉末と金属
酸化物粉末との混合物を溶媒、たとえばエチルセルロ−
スでペ−スト化したものを使用できる。Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A to 1D are views showing a method for mounting a temperature fuse element according to the present invention. FIG. 1 (a) shows a target member to which a low melting point fusible alloy piece as a temperature fuse element is mounted, and a membrane electrode 2 is provided on an insulating substrate 1 such as a ceramic plate so as to face the same. This film electrode can be formed by applying an electrode forming paste by screen printing, dipping, spin coating, or the like, and baking it. The electrode forming paste includes a conductive metal powder and a glass powder. And a mixture of the metal oxide powder with a solvent such as ethylcellulo-
Can be used.
【００１１】本発明により上記膜電極間に低融点可溶合
金片を取付けるには、まず図１の（ロ）に示すように膜
電極２の溶接箇所にフラックス３を薄く塗布し、更に図
１の（ハ）に示すように表面に酸化膜を有する低融点可
溶合金片４を膜電極２，２間に跨って載置し、ついで加
熱炉中に搬入して加熱し、図２の（ニ）に示すように低
融点可溶合金片４と膜電極２との間を融合させ、而るの
ち、加熱炉より取り出して冷却し、これにて本発明によ
る低融点可溶合金片の取付けを終了する。In order to attach a low melting point fusible alloy piece between the above-mentioned membrane electrodes according to the present invention, first, as shown in FIG. As shown in FIG. 2C, a low melting point fusible alloy piece 4 having an oxide film on its surface is placed across the membrane electrodes 2 and 2 and then loaded into a heating furnace and heated. D) As shown in (d), the low melting point fusible alloy piece 4 and the membrane electrode 2 are fused, and then taken out of the heating furnace and cooled, thereby attaching the low melting point fusible alloy piece according to the present invention. To end.
【００１２】上記低融点可溶合金片４は表面の酸化膜の
ために酸素を帯有しており、その酸化の程度は（低融点
可溶合金片の全酸素量ppm)／(低融点可溶合金片の全表
面積cm2)を２．５〜１．５ppm／cm2とするものである。
かかる表面酸化膜を有する低融点可溶合金片では、内部
の低融点可溶合金が溶融されても表面酸化膜が袋膜とし
て機能し、実質上流動変形されない。しかしながら、膜
電極に接触する部分では、フラックスが存在するために
酸化膜が溶解されて膜電極と低融点可溶合金片との間が
金属学的に接合される。この場合、フラックスは膜電極
上に薄く塗布してあるだけであり、フラックスの界面作
用による溶融金属の濡れ拡がりを僅かにとどめ得る。従
って、本発明によれば、低融点可溶合金片を実質上変形
させることなく当所の形状をよく保持させたままで膜電
極に溶着できる。The low melting point fusible alloy piece 4 has oxygen due to the surface oxide film, and the degree of oxidation is (total oxygen content of low melting point fusible alloy piece ppm) / (low melting point fusible alloy piece). The total surface area (cm 2 ) of the molten alloy piece is set to 2.5 to 1.5 ppm / cm 2 .
In the low melting point fusible alloy piece having such a surface oxide film, even if the internal low melting point fusible alloy is melted, the surface oxide film functions as a bag film and does not substantially undergo flow deformation. However, at the portion in contact with the membrane electrode, the oxide film is dissolved due to the presence of the flux, and the membrane electrode and the low melting point fusible alloy piece are metallurgically joined. In this case, the flux is only applied thinly on the membrane electrode, and the spread of the molten metal due to the interfacial action of the flux can be slightly suppressed. Therefore, according to the present invention, the low-melting-point fusible alloy piece can be welded to the membrane electrode while keeping the shape of the place well without being substantially deformed.
【００１３】上記において、フラックスの塗布量が多過
ぎたり、あるいはフラックスの活性が強過ぎると、低融
点可溶合金片のフラックスに接触した端部の膜電極上で
の濡れ拡がり易くなるので、フラックスにはアクチャベ
−タの添加の無い松やにを使用することが好ましく、ま
たフラックスの塗布には、フラックス溶液で濡らした紙
や不織布で膜電極表面を拭う方法を用いることが好まし
い。本発明においては、低融点可溶合金片４の溶着部の
巾を電極間の低融点可溶合金片部分の巾の１．２倍未満
にするように、フラックスの塗布量を制限している。In the above, when the amount of the applied flux is too large or the activity of the flux is too strong, the end of the low melting point fusible alloy piece in contact with the flux easily spreads on the membrane electrode. It is preferable to use pine or the like to which no activator is added, and to apply the flux, it is preferable to use a method of wiping the membrane electrode surface with paper or nonwoven fabric wetted with a flux solution. In the present invention, the amount of the applied flux is limited so that the width of the welded portion of the low melting point fusible alloy piece 4 is less than 1.2 times the width of the low melting point fusible alloy piece between the electrodes. .
【００１４】上記の例では、加熱を加熱炉による加熱と
しているが、無加圧乃至は僅小接触圧のもとでの加熱で
あればよく、実質上接触圧零の熱板接触による加熱とす
ることもできる。In the above-described example, the heating is performed by the heating furnace. However, the heating may be performed under no pressure or under a slight contact pressure. You can also.
【００１５】本発明によれば、低融点可溶合金片４の溶
着部の巾を電極間の低融点可溶合金片部分の巾の１．２
倍未満（１倍を越え１．２倍未満）に抑えることがで
き、而して溶着部の薄肉化に伴う低融点可溶合金片の細
りを僅少にとどめる。According to the present invention, the width of the welded portion of the low melting point fusible alloy piece 4 is 1.2 times the width of the low melting point fusible alloy piece between the electrodes.
It can be suppressed to less than 1 times (more than 1 time and less than 1.2 times), so that the thinning of the low melting point fusible alloy piece accompanying the thinning of the welded portion can be minimized.
【００１６】図２の（イ）は本発明による温度ヒュ−ズ
エレメントの取付け方法により低融点可溶合金片を取付
けた基板型温度ヒュ−ズを示し、図２の（ロ）は図２の
（イ）におけるロ−ロ断面図である。図２において、１
は絶縁基板であり、例えばセラミックス板や耐熱性プラ
スチックフィルムを用いることができる。２，２は絶縁
基板１上に設けた膜電極であり、例えば銀電極を用いる
ことができる。２１は各膜電極２に溶着したリ−ド線で
ある。４は表面に酸化膜を有する低融点可溶合金片であ
り、外径数１００μｍの丸線、厚み数１０μｍの帯状体
を使用し、膜電極２上の低融点可溶合金片溶着部分の巾
を膜電極間の低融点可溶合金片の巾の１．２倍未満とし
てある。FIG. 2A shows a substrate-type temperature fuse to which a low-melting-point fusible alloy piece is attached by the method for attaching a temperature fuse element according to the present invention, and FIG. FIG. In FIG. 2, 1
Is an insulating substrate, for example, a ceramic plate or a heat-resistant plastic film can be used. Reference numerals 2 and 2 denote film electrodes provided on the insulating substrate 1, for example, silver electrodes can be used. Reference numeral 21 denotes a lead wire welded to each membrane electrode 2. Reference numeral 4 denotes a low-melting-point fusible alloy piece having an oxide film on its surface. Is less than 1.2 times the width of the low melting point fusible alloy piece between the membrane electrodes.
【００１７】この限定理由は、１．２倍を越えると、溶
着部の薄肉化による低融点可溶合金片の細りに基づく抵
抗値増大が招来されることにある。The reason for this limitation is that when the ratio exceeds 1.2 times, the resistance value is increased due to the thinning of the low melting point fusible alloy piece due to the thinning of the welded portion.
【００１８】５は低融点可溶合金片４上に塗布したフラ
ックスであり、アクチェベ−タを添加することが好まし
く、低融点可溶合金片中間部直下の間隙もこのフラック
ス５で満たされている。６はフラックス塗布低融点可溶
合金片を覆って設けた絶縁被覆体であり、例えば常温硬
化樹脂（例えばエポキシ樹脂）の滴下塗装、熱可塑性プ
ラスチックカバ−の超音波溶接（熱可塑性プラスチック
カバ−の周囲を絶縁基板の周囲に超音波ウエルダ−に溶
接）により設けることができる。Numeral 5 is a flux applied on the low melting point fusible alloy piece 4 and it is preferable to add an activator. The gap immediately below the middle portion of the low melting point fusible alloy piece is also filled with the flux 5. . Numeral 6 denotes an insulating coating provided over the flux-coated low-melting-point fusible alloy piece. For example, a cold-setting resin (for example, epoxy resin) is dripped, and a thermoplastic cover is ultrasonically welded (for a thermoplastic cover). The periphery can be provided around the insulating substrate by welding to an ultrasonic welder.
【００１９】上記基板型温度ヒュ−ズにおいては、低融
点可溶合金片のジュ−ル熱の発生を防止し、保護しよう
とする機器が許容温度にまで加熱されると、迅速に溶断
作動させることができる。In the above substrate type temperature fuse, the generation of Joule heat of the low melting point fusible alloy piece is prevented, and when the equipment to be protected is heated to the allowable temperature, the fuse is quickly blown. be able to.
【００２０】本発明に係る温度ヒュ−ズエレメントの取
付け方法は、上記基板型温度ヒュ−ズにおける低融点可
溶合金片の取付けのほか、絶縁基板の片面にヒュ−ズエ
レメント取付け用膜電極及び抵抗体取付け用膜電極を設
け、各膜電極にリ−ド線を接続し、抵抗体取付け用膜電
極間に抵抗ペ−ストの印刷・焼き付けにより膜抵抗を設
け、ヒュ−ズエレメント取付け用膜電極間に低融点可溶
合金片を接続し、該低融点可溶合金片にフラックスを塗
布し、絶縁基板の片面上に絶縁被覆体を設ける抵抗体付
き温度ヒュ−ズにおける低融点可溶合金片の取付けにも
使用できる。The method for mounting the temperature fuse element according to the present invention includes, in addition to mounting the low melting point fusible alloy piece in the above-mentioned substrate type temperature fuse, a membrane electrode for mounting the fuse element on one surface of the insulating substrate, and A membrane electrode for mounting a resistor is provided, a lead wire is connected to each membrane electrode, a membrane resistor is provided between the membrane electrodes for mounting a resistor by printing and baking a resistor paste, and a membrane for fuse element mounting is provided. A low melting point fusible alloy in a temperature fuse with a resistor, in which a low melting point fusible alloy piece is connected between the electrodes, a flux is applied to the low melting point fusible alloy piece, and an insulating coating is provided on one surface of an insulating substrate. Can also be used to attach pieces.
【００２１】[0021]
【実施例】〔実施例〕セラミックス板に銀ペ−ストの印
刷・焼付けにより膜電極を形成した基板の各膜電極に、
松やにの溶剤溶液を極めて薄く塗布した。これらの膜電
極間に跨って、酸素量が単位表面積当たりで約２．０pp
m/cm2、寸法が巾０．４ｍｍ×厚み０．２ｍｍの鉛−錫
共晶合金片を載置し、オ−ブンに入れて各膜電極と低融
点可溶合金片各端部との間を溶着した。溶着部の巾は電
極間の低融点可溶合金片の巾にほぼ等しく、低融点可溶
合金片の細りを実質的に排除できた。[Embodiment] Each membrane electrode of a substrate having a membrane electrode formed by printing and baking silver paste on a ceramic plate,
The solvent solution on pine was applied very thinly. Across these membrane electrodes, the oxygen content is about 2.0 pp per unit surface area.
m / cm 2 , a lead-tin eutectic alloy piece having a width of 0.4 mm and a thickness of 0.2 mm is placed and placed in an oven, and each membrane electrode and each end of the low melting point fusible alloy piece are placed in an oven. The gap was welded. The width of the welded portion was substantially equal to the width of the low melting point fusible alloy piece between the electrodes, and the thinning of the low melting point fusible alloy piece could be substantially eliminated.
【００２２】〔比較例〕実施例に対し、フラックスに代
え鉛−錫共晶合金のクリ−ムはんだを使用した以外、実
施例と同じにした。比較例では膜電極上での低融点可溶
合金片の濡れ拡がりが相当に広く膜電極前端位置で低融
点可溶合金片が伸びて薄くなった。COMPARATIVE EXAMPLE The procedure was the same as in the example, except that a lead-tin eutectic alloy cream solder was used instead of the flux. In the comparative example, the low-melting-point fusible alloy piece spread considerably on the membrane electrode and spread considerably at the front end position of the membrane-electrode and became thin.
【００２３】[0023]
【発明の効果】本発明に係る温度ヒュ−ズエレメントの
取付け方法によれば、絶縁基板直上の対向膜電極間に低
融点可溶合金片を全長にわたりほぼ当所の形状を保持さ
せて接続できる。従って、本方法により基板型温度ヒュ
−ズの低融点可溶合金片を取付けると、低融点可溶合金
片の細りを排除でき抵抗値を実質上変化させること無く
所定値に保持でき、作動精度の高い基板型温度ヒュ−ズ
の製造が可能となる。According to the method of mounting the temperature fuse element according to the present invention, the low melting point fusible alloy piece can be connected between the opposed film electrodes directly above the insulating substrate while maintaining the shape of the fusible alloy over the entire length. Therefore, when the low melting point fusible alloy piece of the substrate type temperature fuse is attached by this method, the thinning of the low melting point fusible alloy piece can be eliminated, and the resistance value can be maintained at a predetermined value without substantially changing the resistance value. This makes it possible to manufacture a substrate type temperature fuse having a high temperature.
【図１】本発明に係る温度ヒュ−ズエレメントの取付け
方法を示す図面である。FIG. 1 is a view showing a method for mounting a temperature fuse element according to the present invention.
【図２】本発明に係る温度ヒュ−ズエレメントの取付け
方法によりヒュ−ズエレメントを取付けた基板型温度ヒ
ュ−ズを示す図面である。FIG. 2 is a view showing a substrate-type temperature fuse to which a fuse element is attached according to the method for attaching a temperature fuse element according to the present invention.
１ 絶縁基板 ２ 電極 ３ フラックス ４ 低融点可溶合金片 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Electrode 3 Flux 4 Low melting point fusible alloy piece
Claims (4)
フラックスを塗布し、表面に酸化膜を有する低融点可溶
合金片を前記電極間にまたがって載置し、無加圧の加熱
により低融点可溶合金片と電極との間を溶着することを
特徴とする温度ヒュ−ズエレメントの取付け方法。A flux is applied to an upper surface of an electrode provided on an insulating substrate, and a low-melting-point fusible alloy piece having an oxide film on the surface is placed over the electrode, and a non-pressurized A method for mounting a temperature fuse element, comprising welding a low melting point fusible alloy piece and an electrode by heating.
請求項１記載の温度ヒュ−ズエレメントの取付け方法。2. The method for mounting a temperature fuse element according to claim 1, wherein the non-pressurized heating is heating by a heating furnace.
接触による加熱である請求項１記載の温度ヒュ−ズエレ
メントの取付け方法。3. The method according to claim 1, wherein the non-pressurized heating is heating by hot plate contact with a contact pressure of substantially zero.
に低融点可溶合金片が溶着され、該溶着部の巾が電極間
の低融点可溶合金片部分の巾の１．２倍未満とされてい
る温度ヒュ−ズエレメントの取付け構造。4. A low melting point fusible alloy piece is welded between electrodes provided immediately above an insulating substrate, and the width of the welded portion is 1.2 times the width of the low melting point fusible alloy piece between the electrodes. Mounting structure of the temperature fuse element, which is less than double.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288841A JP2000100291A (en) | 1998-09-26 | 1998-09-26 | Mounting structure and mounting method for temperature fuse element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10288841A JP2000100291A (en) | 1998-09-26 | 1998-09-26 | Mounting structure and mounting method for temperature fuse element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000100291A true JP2000100291A (en) | 2000-04-07 |
Family
ID=17735448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10288841A Pending JP2000100291A (en) | 1998-09-26 | 1998-09-26 | Mounting structure and mounting method for temperature fuse element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000100291A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420148B1 (en) * | 2001-10-19 | 2004-03-02 | 삼성에스디아이 주식회사 | Protector and secondary battery mounting the such |
| DE10355282A1 (en) * | 2003-11-18 | 2005-06-16 | E.G.O. Elektro-Gerätebau GmbH | Method for producing an overtemperature fuse and overtemperature fuse |
| JP2010522420A (en) * | 2007-03-26 | 2010-07-01 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Fusible gold element, thermal fuse with fusible gold element, and method for manufacturing a thermal fuse |
-
1998
- 1998-09-26 JP JP10288841A patent/JP2000100291A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420148B1 (en) * | 2001-10-19 | 2004-03-02 | 삼성에스디아이 주식회사 | Protector and secondary battery mounting the such |
| DE10355282A1 (en) * | 2003-11-18 | 2005-06-16 | E.G.O. Elektro-Gerätebau GmbH | Method for producing an overtemperature fuse and overtemperature fuse |
| JP2010522420A (en) * | 2007-03-26 | 2010-07-01 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Fusible gold element, thermal fuse with fusible gold element, and method for manufacturing a thermal fuse |
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