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JP2000198146A - Repair method of resin molded product surface - Google Patents

Repair method of resin molded product surface

Info

Publication number
JP2000198146A
JP2000198146A JP60099A JP60099A JP2000198146A JP 2000198146 A JP2000198146 A JP 2000198146A JP 60099 A JP60099 A JP 60099A JP 60099 A JP60099 A JP 60099A JP 2000198146 A JP2000198146 A JP 2000198146A
Authority
JP
Japan
Prior art keywords
molded product
resin molded
hot air
present
repairing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP60099A
Other languages
Japanese (ja)
Inventor
Eiji Tawara
暎二 田原
Hiroyuki Kawasaki
博行 河崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAIMAKKUSU KK
Mitsubishi Chemical Corp
Original Assignee
SAIMAKKUSU KK
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAIMAKKUSU KK, Mitsubishi Chemical Corp filed Critical SAIMAKKUSU KK
Priority to JP60099A priority Critical patent/JP2000198146A/en
Publication of JP2000198146A publication Critical patent/JP2000198146A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Containers Having Bodies Formed In One Piece (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

(57)【要約】 【課題】強度に優れるポリカーボネート樹脂(PCR)
成型品表面に形成された傷部の補修方法であって、補修
跡が目立たない様に改良された補修方法を提供する。 【解決手段】PCR成型品表面に形成された傷部を研磨
・研削処理した後に当該処理部を熱風加熱処理する樹脂
成型品表面の補修方法において、熱風加熱処理の前に研
磨・研削処理部の内部水分を200ppm以下にするた
めの乾燥処理を行う。
(57) [Abstract] [Problem] Polycarbonate resin (PCR) with excellent strength
Provided is a method for repairing a flaw formed on the surface of a molded article, wherein the repair mark is improved so that repair marks are not conspicuous. In a method for repairing the surface of a resin molded product, in which a scratch formed on the surface of a PCR molded product is polished and ground, and then the treated portion is heated with hot air, a polishing and grinding process is performed before the hot air heating process. A drying process is performed to reduce the internal moisture to 200 ppm or less.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂成型品表面の
補修方法に関するものであり、詳しくは、強度に優れる
ポリカーボネート樹脂(PCR)成型品表面に形成され
た傷部の補修方法であって、補修跡が目立たない様に改
良された補修方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for repairing a surface of a resin molded product, and more particularly, to a method for repairing a flaw formed on the surface of a polycarbonate resin (PCR) molded product having excellent strength. The present invention relates to a repair method improved so that repair marks are not conspicuous.

【0002】例えば、シリコンウエハーを搬送するため
の容器として、透明かつ強度に優れるポリカーボネート
樹脂の様なPCRの成型品が使用されている。斯かる成
型品は、その使用過程において、切り傷や擦り傷などの
傷部が表面に形成されることがある。
For example, as a container for transporting a silicon wafer, a molded PCR product such as a polycarbonate resin having excellent transparency and strength is used. In the process of using such a molded product, scratches such as cuts and scratches may be formed on the surface.

【0003】従来、長期間に亘って樹脂成型品を使用す
るため、表面に形成された傷部を研磨・研削した後に熱
風加熱処理する補修方法が行われている。この方法にお
いて、研磨・研削処理は、例えばサンドぺーパーや研削
ドリルにより行われ、傷部の切り傷や擦り傷を除去する
前処理であり、熱風加熱処理は、研磨・研削処理により
形成された白化部を透明化する後処理である。そして、
この熱風加熱処理においては、樹脂温度が高いほどに透
明化が良好に行われる。
[0003] Conventionally, in order to use a resin molded product for a long period of time, a repair method in which a flaw formed on a surface is polished and ground and then heated with hot air has been performed. In this method, the polishing / grinding process is performed by, for example, a sandpaper or a grinding drill, and is a pre-process for removing cuts and abrasions of the scratched portion. Is a post-processing for making the transparent. And
In this hot air heating treatment, the higher the resin temperature, the better the transparency.

【0004】[0004]

【発明が解決しようとする課題】ところで、上記の従来
の補修方法においては、本発明者らが検討したところ、
熱風加熱処理の際の樹脂温度が高過ぎた場合は樹脂内部
に気泡が発生し、また、樹脂温度が低過ぎた場合は、白
化部が充分に透明化されず、従って、何れの場合も補修
跡が残るという問題がある。
By the way, in the above-mentioned conventional repair method, the present inventors have studied,
If the resin temperature during the hot air heating treatment is too high, bubbles will be generated inside the resin, and if the resin temperature is too low, the whitened portion will not be sufficiently transparent, and therefore, in either case, it will be repaired There is a problem that traces remain.

【0005】本発明は、上記実情に鑑みなされたもので
あり、その目的は、強度に優れるPCR成型品表面に形
成された傷部の補修方法であって、補修跡が目立たない
様に改良された補修方法を提供することにある。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for repairing a flaw formed on the surface of a PCR molded article having excellent strength, which is improved so that repair marks are not conspicuous. To provide a repair method.

【0006】[0006]

【課題を解決するための手段】本発明者は、上記の目的
を達成すべく種々検討を重ねた結果、次の様な知見を得
た。すなわち、PCR成型品は通常1000〜2000
ppmの水分を吸収しており、高温熱風加熱処理の際に
樹脂内部に発生する気泡は上記の水分の蒸発によって生
じる。
Means for Solving the Problems The present inventor has made various studies in order to achieve the above object, and has obtained the following knowledge. That is, PCR molded products are usually 1000 to 2000
ppm of water is absorbed, and the bubbles generated inside the resin during the high-temperature hot-air heat treatment are generated by the evaporation of the water.

【0007】本発明は、上記の知見に基づき完成された
ものであり、その要旨は、ポリカーボネート樹脂成型品
表面に形成された傷部を研磨・研削処理した後に当該処
理部を熱風加熱処理する樹脂成型品表面の補修方法にお
いて、熱風加熱処理の前に研磨・研削処理部の内部水分
を200ppm以下にするための乾燥処理を行うことを
特徴とする樹脂成型品表面の補修方法に存する。
The present invention has been completed on the basis of the above findings, and the gist of the present invention is to provide a resin in which a scratch formed on the surface of a polycarbonate resin molded product is polished and ground, and then the processed portion is heated with hot air. In the method for repairing the surface of a molded article, a method for repairing the surface of a resin molded article is characterized in that a drying treatment is performed before the hot air heat treatment to reduce the internal water content of the polishing / grinding treatment section to 200 ppm or less.

【0008】[0008]

【発明の実施の形態】以下、本発明を添付図面を参照し
て詳細に説明する。図1は、本発明の補修方法を示す概
念図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a conceptual diagram showing the repair method of the present invention.

【0009】本発明において、補修対象となる樹脂成型
品は、強度に優れ、比較的に安価で且つ透明性にも優れ
るPCRが好適に使用される。具体的な樹脂成型品とし
ては、シリコンウエハー搬送容器が挙げられる。
In the present invention, the resin molded article to be repaired is preferably a PCR which is excellent in strength, relatively inexpensive and excellent in transparency. As a specific resin molded product, there is a silicon wafer transport container.

【0010】本発明において、補修すべき傷部には、図
1(a1)に示す切り傷や図1(a2)に示す擦り傷な
どが含まれる。なお、図1においては、実際よりも凹凸
を誇張して描いている。
In the present invention, the damaged portion to be repaired includes the cut shown in FIG. 1 (a1) and the abrasion shown in FIG. 1 (a2). It should be noted that in FIG. 1, the irregularities are exaggerated as compared to the actual case.

【0011】先ず、本発明においては、サンドペーパー
や研削ドリルにより、傷部を研磨・研削する。斯かる処
理は、従来の補修方法と同様に行うことが出来る。研磨
・研削処理により、図1(b)に示す様に切り傷や擦り
傷は除去される。同時に白化部が形成される。
First, in the present invention, a flaw is polished and ground with a sandpaper or a grinding drill. Such a process can be performed in the same manner as the conventional repair method. By the polishing / grinding process, cuts and scratches are removed as shown in FIG. At the same time, a whitened portion is formed.

【0012】次に、本発明においては、後述の熱風加熱
処理の前に上記の研磨・研削処理部の内部水分を200
ppm以下にするための乾燥処理を行う。この点に本発
明の特徴が存し、斯かる乾燥処理により、熱風加熱処理
の際に水分の蒸発による気泡の発生は無くなり、従っ
て、白化部を充分に透明化するのに必要な高温熱風加熱
処理を採用することが出来る。
Next, in the present invention, before the hot air heating process described later, the internal water content of the above-mentioned polishing / grinding processing section is reduced by 200%.
A drying process is performed to reduce the concentration to less than ppm. The feature of the present invention resides in this point. By the drying treatment, the generation of bubbles due to the evaporation of water during the hot air heating treatment is eliminated, and therefore, the high-temperature hot air heating necessary for sufficiently clearing the whitened portion is performed. Processing can be employed.

【0013】上記の乾燥処理は、オーブン(加熱)乾
燥、真空乾燥など公知の乾燥手段によって行われる。例
えば、1000〜2000ppmの水分を含有するPC
R成型品の場合は、約120℃のオーブン乾燥機中に約
3時間以上放置することにより、水分は200ppm以
下となる。研磨・研削処理部の内部水分は、100pp
m以下にするのが好ましい。
The above-mentioned drying treatment is performed by known drying means such as oven (heating) drying and vacuum drying. For example, PC containing 1000 to 2000 ppm of water
In the case of an R molded product, the water content is reduced to 200 ppm or less by leaving the product in an oven dryer at about 120 ° C. for about 3 hours or more. The internal water content of the polishing / grinding section is 100pp
m or less.

【0014】次に、本発明においては、図1(c)に示
す乾燥処理された樹脂成型品の研磨・研削処理部を熱風
加熱処理する。斯かる処理は、ホットドライヤー等を使
用し従来の補修方法と同様に行うことが出来る。しかし
ながら、本発明においては、従来の補修方法と異なり、
樹脂内部における気泡の発生を全く問題にせず、熱風温
度を充分に高くすることが出来る。具体的な熱風温度
は、特に制限されないが、ホットドライヤー出口の熱風
温度として、通常200〜350℃、好ましくは250
〜300℃とされる。研磨・研削処理部の熱風加熱処理
により、図1(d)に示す様に、研磨・研削処理部に形
成された微細な粗面は平滑化され、白化部は透明化され
る。
Next, in the present invention, the polishing / grinding processing section of the dried resin molded product shown in FIG. Such a treatment can be performed using a hot dryer or the like in the same manner as the conventional repair method. However, in the present invention, unlike the conventional repair method,
The generation of air bubbles inside the resin does not matter at all, and the hot air temperature can be sufficiently increased. Although the specific hot air temperature is not particularly limited, it is usually 200 to 350 ° C., preferably 250
~ 300 ° C. As shown in FIG. 1 (d), the fine rough surface formed in the polishing / grinding section is smoothed and the whitened section is made transparent by the hot air heating treatment in the polishing / grinding section.

【0015】なお、本発明においては、熱風加熱処理の
前に研磨・研削処理部の内部水分を200ppm以下に
することが出来る限り、この様な乾燥処理と研磨・研削
処理の順序は任意であり、例えば、PCR成型品を乾燥
処理した後に傷部の研磨・研削処理を行ってもよい。
In the present invention, the order of such drying treatment and polishing / grinding treatment is arbitrary as long as the internal water content of the polishing / grinding treatment part can be reduced to 200 ppm or less before hot air heating treatment. For example, after the PCR molded product is subjected to a drying process, the wound portion may be polished and ground.

【0016】[0016]

【実施例】以下、本発明を実施例により更に詳細に説明
するが、本発明は、その要旨を超えない限り、以下の実
施例に限定されるものではない。
EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist of the present invention.

【0017】実施例1 PCR製シリコンウエハー搬送容器の表面に形成された
切り傷を次の要領で補修した。先ず、#240と#40
0の各サンドペーパーを順次に使用して容器表面の傷部
を研磨処理した。次いで、温度が120℃に設定された
熱風乾燥機内に容器を3時間放置して乾燥した。乾燥前
の容器材料中の水分は約800ppmであり、乾燥後の
水分は約100ppmであった。次いで、乾燥機から取
り出し、直ちに、出口熱風温度260℃のホットドライ
ヤーにより研磨処理部を30秒間加熱処理した。熱風加
熱処理により、研磨処理部に形成された微細な粗面は平
滑化され、白化部が透明化された。勿論、樹脂内部の気
泡の発生は一切起こらなかった。従って、補修跡は目立
たなかった。
Example 1 A cut formed on the surface of a PCR silicon wafer carrier was repaired in the following manner. First, # 240 and # 40
The scratches on the surface of the container were polished using the respective sandpapers of No. 0 in order. Next, the container was left for 3 hours in a hot air dryer set at a temperature of 120 ° C. to be dried. The moisture in the container material before drying was about 800 ppm, and the moisture after drying was about 100 ppm. Then, the polishing section was taken out of the dryer and immediately heated by a hot drier at an outlet hot air temperature of 260 ° C. for 30 seconds. By the hot air heating treatment, the fine rough surface formed in the polishing treatment part was smoothed, and the whitened part was made transparent. Of course, no bubbles were generated inside the resin. Therefore, the repair marks were not noticeable.

【0018】[0018]

【発明の効果】以上説明した本発明によれば、強度に優
れるPCR成型品表面に形成された傷部の補修方法であ
って、補修跡が目立たない様に改良された補修方法が提
供され、本発明は、PCR成型品のリサイクル等による
長期間使用における実用的価値が大きい。
According to the present invention described above, there is provided a method for repairing a flaw formed on the surface of a PCR molded article having excellent strength, the repair method being improved so that repair marks are not conspicuous. INDUSTRIAL APPLICABILITY The present invention has great practical value in long-term use such as recycling of PCR molded products.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の補修方法を示す概念図FIG. 1 is a conceptual diagram showing a repair method according to the present invention.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 河崎 博行 福岡県北九州市八幡西区黒崎城石1番1号 三菱化学株式会社黒崎事業所内 Fターム(参考) 3E033 AA20 BA26 GA03 4F213 AA28 AG07 AH55 AH56 WA54 WA74 WA83 WA94 WB01 WM02 WM05 5F031 EA02  ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroyuki Kawasaki 1-1 Kurosaki Castle Stone, Yawatanishi-ku, Kitakyushu City, Fukuoka Prefecture F-term in the Kurosaki Plant of Mitsubishi Chemical Corporation (reference) 3E033 AA20 BA26 GA03 4F213 AA28 AG07 AH55 AH56 WA54 WA74 WA83 WA94 WB01 WM02 WM05 5F031 EA02

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ポリカーボネート樹脂成型品表面に形成
された傷部を研磨・研削処理した後に当該処理部を熱風
加熱処理する樹脂成型品表面の補修方法において、熱風
加熱処理の前に研磨・研削処理部の内部水分を200p
pm以下にするための乾燥処理を行うことを特徴とする
樹脂成型品表面の補修方法。
1. A method for repairing a surface of a resin molded product in which a scratch formed on the surface of a polycarbonate resin molded product is polished and ground, and then the treated portion is heated with a hot air. 200p internal moisture
A method for repairing the surface of a resin molded product, which comprises performing a drying treatment so as to reduce the pressure to pm or less.
【請求項2】 ポリカーボネート樹脂成型品がシリコン
ウエハー搬送容器である請求項1に記載の補修方法。
2. The repair method according to claim 1, wherein the polycarbonate resin molded product is a silicon wafer transfer container.
JP60099A 1999-01-05 1999-01-05 Repair method of resin molded product surface Withdrawn JP2000198146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60099A JP2000198146A (en) 1999-01-05 1999-01-05 Repair method of resin molded product surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60099A JP2000198146A (en) 1999-01-05 1999-01-05 Repair method of resin molded product surface

Publications (1)

Publication Number Publication Date
JP2000198146A true JP2000198146A (en) 2000-07-18

Family

ID=11478236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60099A Withdrawn JP2000198146A (en) 1999-01-05 1999-01-05 Repair method of resin molded product surface

Country Status (1)

Country Link
JP (1) JP2000198146A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011031202A1 (en) * 2009-09-10 2011-03-17 Leif Anders Jilken Method to recreate the surface of an aged and deteriorated fibre-reinforced plastic facing material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011031202A1 (en) * 2009-09-10 2011-03-17 Leif Anders Jilken Method to recreate the surface of an aged and deteriorated fibre-reinforced plastic facing material
US9120273B2 (en) 2009-09-10 2015-09-01 Leif Anders Jilken Method to recreate the surface of an aged and deteriorated fibre-reinforced plastic facing material

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