JP2000194278A - Electric circuit device - Google Patents

Abstract

(57) [Summary] To reduce the number of parts and simplify the manufacturing process. SOLUTION: Two PCBs 3 are arranged side by side at a position facing an edge of a liquid crystal panel P, and their electrical connection and application of signals to them are performed by one member 4. . Therefore, the number of components can be reduced and the manufacturing process can be simplified as compared with the case where the electrical connection of the PCB 3 and the application of the signal to the PCB 3 are performed by separate members.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit device formed by electrically connecting two substrates having a plurality of terminals.

[0002]

2. Description of the Related Art Conventionally, 2
An electric circuit device formed by electrically connecting two terminal rows is used in various electric appliances.

FIG. 4 shows an example of the electric circuit device.
FIG. 2 is a plan view showing a conventional structure of a liquid crystal device. The liquid crystal device 40 includes a liquid crystal panel (liquid crystal element) P for displaying various information using liquid crystal.
Is configured such that liquid crystal is sandwiched between a pair of glass substrates 2 and 6. In addition, these glass substrates (first substrates) 2,
6, a large number of pixel electrodes 2b are formed on the surface of the glass substrate 6 (the pixel electrode on the glass substrate 6 side is formed on the back side of the drawing sheet, so that illustration thereof is omitted, and the pixel electrode 2b on the glass substrate 2 side is omitted). Only the electrode 2b is shown), its connection terminal 2a
(This is the first input terminal, hereinafter referred to as "panel-side terminal.")
Are arranged in a line at the edges of the glass substrates 2 and 6 (the panel-side terminals on the side of the glass substrate 6 are formed on the back side of the drawing, so that they are omitted from the drawing, and (Only the panel-side terminal 2a is illustrated.) Further, one PCB (second substrate) 43 is disposed at a position facing the upper edge, the lower edge, and the left edge of the liquid crystal panel P, and the PCB 43 has an output terminal 43a (hereinafter, “P”).
A large number of CB-side output terminals 43a ") are arranged in the same direction as the panel-side terminals 2a. The panel-side terminals 2a and the PCB-side output terminals 43a are individually and electrically connected via the FPC 45. In addition,
A control wiring board (not shown) is connected to the PCB 43 via an FPC 44 so that power and signals from the control wiring board are input to the liquid crystal panel P via the FPC 44, the PCB 43, and the FPC 45. It is configured.

Reference numeral 8 denotes a driving IC (driving semiconductor element) mounted on the FPC 45.
C8 generates a drive signal having a predetermined waveform based on a power supply or a signal from the control circuit board, and applies the drive signal to the pixel electrode 2b of the liquid crystal panel P. Reference numeral 7 denotes a polarizing plate attached to the glass substrate 6 side, and a polarizing plate (not shown) is also attached to the surface of the other glass substrate 2.

Since the PCB 43 and the liquid crystal panel P have different thermal expansion coefficients, if the ambient temperature of the liquid crystal device 40 is extremely high or low, the
a and the relative position of the PCB-side output terminal 43a is shifted. Moreover, in the liquid crystal device 40 described above, the PCB
The arrangement length of the side output terminals 43a (the length indicated by the symbol _LX2 shown in FIG. 4) is so long as to be substantially equal to the edge size of the liquid crystal panel P, so that the relative position shift is large and the connection is disconnected. There was a risk of doing so. In recent years, such a problem is remarkable because the size of the liquid crystal panel P has been increased.

To solve such a problem, there is a liquid crystal device 50 shown in FIG. In the liquid crystal device 50, two PCBs (second substrates) 53 are arranged side by side at positions facing the upper edge, the lower edge, and the left edge of the liquid crystal panel P, and the adjacent PCBs 53 are substantially arranged. They are electrically connected by a U-shaped wiring board 54. This P
In the case of the CB 53, the arrangement length of the PCB-side output terminals 53a (the length indicated by the symbol L _X1 in FIG. 5) is about half of L _X2 , and the relative displacement between the panel-side terminals 2a and the PCB-side output terminals 53a. Can be reduced.

[0007]

However, in the above-described liquid crystal device 50, the connection between the adjacent PCBs 53 and the supply of power or the like to the PCBs 53 are performed by separate members (a member indicated by reference numeral 54 and a member indicated by reference numeral 44). However, there is a problem that the number of parts such as the FPC and the FPC connector increases, the number of steps for the connection increases, and the cost increases.

Accordingly, an object of the present invention is to provide an electric circuit device having a reduced number of components.

Another object of the present invention is to provide an electric circuit device that reduces the cost.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a plurality of first batteries arranged side by side.
A first substrate having an input terminal, a second substrate having a plurality of second output terminals arranged in substantially the same direction as the plurality of first input terminals, and a second substrate electrically connected to the second substrate. And a plurality of first input terminals and second output terminals individually and electrically connected to each other, wherein the second substrate includes the first input terminal and the first input terminal. A plurality of the second output terminals are arranged in substantially the same direction as the direction in which the second output terminals are arranged, and the third substrate is connected to both of the plurality of second substrates arranged in a line. And

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
An embodiment of the present invention will be described.

The electric circuit device according to the present invention includes a first substrate 2 as shown by reference numeral 1 in FIG. 1A, and the first substrate 2 has a plurality of first input terminals 2a. They are arranged side by side. The direction in which the first input terminals 2a are arranged side by side (hereinafter referred to as “terminal arrangement direction”) may be any direction, and may be a plurality of different directions. In the electric circuit device 1 shown in FIG. 1A, the first input terminal 2a is connected to the first input terminal 2a.
The terminals are arranged along the lower edge and the upper edge of the substrate 2, and the terminal arrangement direction is the X direction in the figure.

The electric circuit device 1 includes a plurality of second substrates 3 arranged in a direction substantially the same as the terminal arrangement direction. Each second substrate 3 has a plurality of second output terminals 3a.
Are arranged substantially in the same direction as the terminal arrangement direction. The plurality of first input terminals 2a and the second output terminals 3a are individually and electrically connected (FIG. 1).
In (a), these terminals 2a and 3a are connected via a member indicated by reference numeral 5, which will be described later in detail).

Further, the second side-by-side arrangement
One third substrate 4 is electrically connected to both of the substrates 3. Here, the third substrate 4 is made substantially J-shaped, and FIG.
As shown in detail in (b), a portion 4A at one end of the third substrate 4 (that is, a portion formed by bending so as to be folded) may be connected to both of the second substrates 3. Good. In this case, a portion 4A at one end of the third substrate 4
Are formed with a plurality of third output terminals 4a, and a plurality of second input terminals 3b are formed on the plurality of second substrates 3 so as to face the third output terminals 4a, respectively. It is preferable to connect the 4a and 3b individually and electrically. Further, it is preferable that the second input terminal 3b and the third output terminal 4a are arranged on substantially the same line. Further, as the third substrate 4, a substrate on which wiring is formed only on one side may be used. Furthermore, the third substrate 4 may be formed into a substantially J-shape by: * a method of forming the third substrate 4 into a substantially J-shape as shown in FIG. 1 (a); * a method indicated by reference numeral 24 in FIG. A method of bending a stripe-shaped member into a substantially J-shape can be mentioned. In particular, when the third substrate 4 is formed by bending a substrate formed in a stripe shape as described above, an FPC (Flexible Printed) is used.
(Circuit) or the like. Further, it is preferable to supply a power supply and a control signal from the other end 4B of the third substrate 4 (that is, a portion which is not formed so as to be folded back).

On the other hand, the electrical connection between the first input terminal 2a and the second output terminal 3a can be made via a fourth substrate 5 as shown in FIG. Is also good. In the case where the fourth substrate 5 is used for the electrical connection, the number of the fourth substrate 5 may be plural, and an FPC (Flexible) may be used.
e. A flexible wiring substrate such as a printed circuit may be used.

On the other hand, the first substrate 2 may be of any type as long as it has the above-mentioned first input terminal 2a. A display element such as a liquid crystal element may be configured.

Here, when the liquid crystal element P is constituted by the first substrate 2, the opposing substrate 6 is arranged at a predetermined distance from the first substrate 2, and the pair of substrates 2, 6, a pair of electrodes 2b (only one electrode 2b is shown) are arranged so as to sandwich the liquid crystal, and the electrodes 2b are electrically connected to the first input terminal 2a. Good. Note that the liquid crystal element P may be a so-called simple matrix type or an active matrix type. Further, the first substrate 2 and the opposing substrate 6
In this case, a transparent substrate made of glass or plastic may be used, and a polarizing plate 7 (only the one disposed on the counter substrate 6 side is shown) may be disposed. Further, a driving semiconductor element 8 may be disposed between the electrode 2b and the second substrate 3, and a driving signal for driving the liquid crystal may be generated by the driving semiconductor element 8. 8 is FIG.
As shown in FIG. 3A, the FPC 5 may be mounted on an FPC 5 (inner lead not shown) as a fourth substrate to form a tape carrier package (TCP). As shown in FIG. COG (Chip On Glass) may be mounted on the surface of the glass substrate 2 which is a substrate. The driving semiconductor element 8 may be mounted on the glass substrate 2 by using an anisotropic conductive adhesive film (ACF) and thermocompression bonding. Further, a PCB may be used for the second substrate 3. Further, the connection between the substrates 2, 3, 4, and 5 described above may be performed by an anisotropic conductive adhesive film (ACF) and thermocompression bonding, or may be performed by soldering.

Next, effects of the present embodiment will be described.

According to the present embodiment, the plurality of second substrates 3
Are arranged side by side, the arrangement length of the second output terminals 3a on one second substrate 3 (the length indicated by the symbol L _X1 in FIG. 1A) is shortened, and The amount of displacement between the first input terminal 2a and the second output terminal 3a is reduced, and disconnection of the connection can be reduced.

Since connection between adjacent second substrates 3 and exchange of signals with these second substrates 3 are performed by one member (third substrate indicated by reference numeral 4), FIG.
The number of components can be reduced, the manufacturing process can be simplified, and the cost can be reduced, as compared with the case of using the separate members 54 and 44 as in the liquid crystal device 50 shown in FIG.

Further, when a flexible wiring board is used as the third substrate 4, the relative displacement between the adjacent second substrates 3 can be absorbed.

Further, when the first substrate 2 and the second substrate 3 are connected by a flexible fourth substrate 5, the relative displacement between these substrates 2 and 3 can be absorbed.

When the second input terminal 3b and the third output terminal 4a are arranged on substantially the same line, these terminals 3b
When b and 4a are connected by soldering or thermocompression bonding, the connection can be performed collectively, the time for connection can be shortened, and the manufacturing cost can be reduced.

[0024]

The present invention will be described below in more detail with reference to examples.

Example 1 In this example, a liquid crystal device (electric circuit device) 1 shown in FIG. 1 was prepared.

That is, a pixel electrode 2b, an alignment film (not shown) and the like are formed on the surface of the glass substrate (first substrate) 2, and a connection terminal of the pixel electrode 2b (first input terminal; Terminals 2a) were formed on the upper and lower edges of the glass substrate 2 in a line in the X direction. A glass substrate (opposite substrate) 6 is disposed at a position facing the glass substrate 2, and a pixel electrode, an alignment film, and connection terminals are formed on the surface of the glass substrate 6 in the same manner (the glass substrate 6). The pixel electrode and the panel side terminal are not shown because they are formed on the back side of the drawing.) Further, a liquid crystal is arranged in the gap between the substrates 2 and 6, and a polarizing plate 7 is attached to the outer surfaces of the substrates 2 and 6, thereby forming a simple matrix type liquid crystal panel (liquid crystal element) P.

Further, two PCBs (second substrates) 3 are arranged at positions facing the upper edge and the lower edge of the liquid crystal panel P, respectively, so that the output terminals 3a of the PCB and the panel-side terminals 2a are electrically connected. Was performed via an FPC (fourth substrate) 5. Also, a PCB is provided at a position facing the left edge of the liquid crystal panel P.
(2nd substrate) 2 are arranged, PCB3 and liquid crystal panel P
And were connected in a similar manner.

Further, one substantially J-shaped FPC (third substrate) 4 is connected to two adjacent PCBs 3,
Electrical connection between the PCBs 3 and supply of signals to the PCBs 3 are performed. Further, the input terminal 3b on the PCB 3 side and the output terminal 4a on the FPC 4 side are arranged substantially on the same line.

Further, the FPC 5 includes a driving semiconductor element 8.
Was mounted to form a tape carrier package (TCP).

Next, the effect of this embodiment will be described.

According to this embodiment, the connection between the output terminal 3a of the PCB and the panel side terminal 2a did not occur even when the environmental temperature was changed.

In addition, since one FPC 4 is used to electrically connect the adjacent PCBs 3 and supply signals to the PCBs 3, the number of parts can be reduced, the manufacturing process can be simplified, and the cost can be reduced. I was able to.

Further, by using the FPC4 and the FPC5, the relative displacement and the like between the liquid crystal panel P and the PCB 3 could be absorbed.

Example 2 In this example, a liquid crystal device (electric circuit device) 20 shown in FIG. 2 was prepared. That is, the third substrate 24 was formed by bending a stripe-shaped FPC into a substantially J-shape, and the other configuration was the same as that of the first embodiment.

According to this embodiment, the same effects as those of the first embodiment are obtained. In addition, since a generally used stripe-shaped FPC 24 can be used, the cost can be reduced.

Example 3 In this example, a liquid crystal device (electric circuit device) 30 shown in FIG. 3 was prepared. In the liquid crystal device 30, the driving semiconductor element 8 is not mounted on the FPC (fourth substrate) 35, but is mounted on a glass substrate (first substrate).
2 was mounted on the surface of COG (Chip On Glass). Other configurations were the same as those of the first embodiment.

According to this embodiment, the same effects as those of the first embodiment were obtained.

[0038]

As described above, according to the present invention,
Since the plurality of second substrates are arranged side by side, the arrangement length of the second output terminals on one second substrate is shortened, and the displacement between the first input terminals and the second output terminals due to a change in environmental temperature. The amount is reduced, and disconnection of the connection can be reduced.

Further, since the connection between the adjacent second substrates and the exchange of signals with these second substrates are performed by one member, compared with the case where the connection is performed by separate members,
The number of parts can be reduced, the manufacturing process can be simplified, and the cost can be reduced.

Further, when a flexible wiring substrate is used as the third substrate, the relative displacement between adjacent second substrates can be absorbed.

Further, when the first substrate and the second substrate are connected by a flexible fourth substrate, the relative displacement between the first substrate and the second substrate can be absorbed.

When the second input terminal and the third output terminal are arranged substantially on the same line, when these terminals are connected by soldering or thermocompression bonding, the connection can be performed collectively. The time for connection is reduced, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a view showing an example of the structure of an electric circuit device according to the present invention, wherein (a) is a plan view showing the entire structure, and (b) is a detailed view thereof.

FIGS. 2A and 2B are diagrams showing another example of the structure of the electric circuit device according to the present invention, wherein FIG. 2A is a plan view showing the entire structure, and FIG.

FIG. 3 is a plan view showing another example of the structure of the electric circuit device according to the present invention.

FIG. 4 is a plan view showing an example of the structure of a conventional electric circuit device.

FIG. 5 is a plan view showing another example of the structure of the conventional electric circuit device.

[Explanation of symbols]

 Reference Signs List 1 liquid crystal device (electric circuit device) 2 glass substrate (first substrate) 2a panel side terminal (first input terminal) 2b pixel electrode (electrode) 3 PCB (second substrate) 3a second output terminal 3b second input terminal 4 FPC (third substrate) 4a Third output terminal 5 FPC (fourth substrate) 6 Glass substrate (counter substrate) 24 FPC (third substrate) 24a Third output terminal 20 Liquid crystal device (electric circuit device) 30 Liquid crystal device (electricity) Circuit device) 35 FPC (fourth substrate) P Liquid crystal panel (liquid crystal element)

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shunichi Ouchi 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2H092 GA48 GA50 MA32 MA34 NA27 PA11 5E344 AA10 AA28 BB03 BB04 CD04 DD06 DD10 EE21 5G435 AA07 AA12 AA14 AA17 BB12 EE05 EE32 EE34 EE47 KK02 KK10

Claims (13)

[Claims] 1. A first substrate having a plurality of first input terminals arranged side by side, and a second substrate having a plurality of second output terminals arranged side by side in substantially the same direction as the plurality of first input terminals.
A substrate, a third substrate electrically connected to the second substrate,
Wherein the plurality of first input terminals and the second output terminals are individually and electrically connected to each other, wherein the second substrate includes the first input terminal and the second output terminal. An electric circuit, wherein a plurality of terminals are arranged in substantially the same direction as the direction in which the terminals are arranged, and the third board is connected to both of the plurality of second boards arranged in a row. apparatus. 2. A method according to claim 1, wherein the third substrate has a substantially J-shape, and a portion of the third substrate, which is bent and folded, is connected to both of the plurality of second substrates arranged side by side. The electric circuit device according to claim 1, wherein: 3. The electric circuit device according to claim 2, wherein the third substrate is formed into a substantially J-shape. 4. The electric circuit device according to claim 2, wherein the third substrate is formed into a stripe shape and bent into a substantially J shape. 5. A plurality of third output terminals are formed on the third substrate, and a plurality of second input terminals are respectively formed on the plurality of second substrates so as to face the plurality of third output terminals. The third substrate and the second substrate are connected by individually and electrically connecting these terminals, and the terminals are connected to each other. The electric circuit device according to claim 1. 6. The electric circuit device according to claim 5, wherein the plurality of second input terminals and the plurality of third output terminals are arranged substantially on the same line. 7. The electric circuit device according to claim 1, wherein the third substrate is a flexible wiring substrate. 8. The method according to claim 7, wherein the third substrate is an FPC (Flexib).
le Printed Circuit). The electric circuit device according to claim 7, wherein 9. The electric circuit according to claim 1, wherein an electric connection between the first input terminal and the second output terminal is made via a fourth substrate. apparatus. 10. The electric circuit device according to claim 9, wherein the electric connection between the first input terminal and the second output terminal is made via a plurality of fourth substrates. 11. The electric circuit device according to claim 9, wherein the fourth substrate is a flexible wiring substrate. 12. The method according to claim 11, wherein the fourth substrate is an FPC (Flexi).
ble Printed Circuit). The electric circuit device according to claim 11, wherein 13. An opposing substrate is disposed at a predetermined distance from the first substrate, a liquid crystal is disposed between the pair of substrates, and a pair of electrodes are disposed so as to sandwich the liquid crystal. The electric circuit device according to any one of claims 1 to 12, wherein the liquid crystal element is configured to be formed, and the electrode is electrically connected to the first input terminal.