JP2000164270A - Electric connector and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an electric connector in a short time and effectively prevent the disordered layout of connecting elements. SOLUTION: An electric connector for electrically conducting and connecting a plurality of electrode terminals 2 of a semiconductor package 1 of a surface mount BGA(ball grid array) to a plurality of electrodes 4 of a printed board 3 includes an includes polyimide base sheet 5 having a thickness of 20 μm-300 μm and a plurality of connecting elements 13 embedded in the base sheet 5 and connected to the electrodes. The plurality of connecting elements 13 are molded with conductive resins 12 having a volume resistivity of 1×10-2 Ωcm or less and the plurality of connecting elements 13 are mutually insulated, and both ends of the each connecting element 13 are protruded 0.05 mm-0.5 mm from both surface and back of the base sheet 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package represented by a BGA or an LGA, a circuit board represented by a printed circuit board or a build-up wiring board, circuit boards, or various electric and electronic components and a circuit board. And a method of manufacturing the same.

[0002]

2. Description of the Related Art Semiconductor packages include QFP (Quad Flat).
Packeage), TCP (Tape Carrier Packeage), SOP, SOJ, or
There are PLCC and other types, but PGA (pin grid array) types, which are easy to handle around terminals during mounting, have often been used. This PGA type semiconductor package 1B
As shown in FIG. 12, a plurality of pin-shaped electrode terminals 2B are two-dimensionally arranged on the back surface of the package, and have high power and high speed characteristics.

However, the semiconductor package 1B of the PGA type has a relatively large external dimension and requires a high degree of positioning and a large load for pin insertion, so that the number of pins per package is limited to about 200 pins. . Further, when a multi-pole high-density arrangement is required, the diameter of the pin-shaped electrode terminal 2B becomes small, which causes difficulty in forming the electrode terminal 2B or makes the electrode terminal 2B relatively easily deformed and unusable. There were also disadvantages such as.

Therefore, in recent years, surface-mount type semiconductor packages 1 such as BGA (ball grid array) type and LGA (land grid array) type, especially various BGA type semiconductor packages 1, have been studied and developed intensively. These include microprocessors and multi-pin ASICs (Applica
tion Specific Integrated Circuit).

[0005] A BGA type semiconductor package 1 shown in FIG. 13 has a configuration in which a plurality of electrode terminals 2 having a solder ball shape are arranged in a lattice pattern on the back surface of the package. On the other hand, although not shown, the LGA type semiconductor package has a structure in which only a plurality of planar electrode terminals are left on the back surface of the package. These semiconductor packages 1, especially a BGA type semiconductor package 1
Is smaller than the conventional QFP and can be equipped with multiple pins of 400 pins or more (high mounting density), and has features such as easy batch reflow surface bonding of multiple pins. It has become mainstream.

By the way, the BGA type semiconductor package 1 is arranged at a predetermined position on a printed circuit board, which is a mounting board, and is solder reflowed so that each electrode terminal 2 is melted and soldered to the electrode terminal of the printed circuit board. Joined and mounted on a printed circuit board. However, in such solder bonding, although the semiconductor package 1 can be attached, it is impossible to attach and detach the semiconductor package 1, so that a serious problem occurs. The reason that the semiconductor element of the semiconductor package 1 is detachable is because it is indispensable for trial production, CPU test mounting at the performance evaluation stage, or replacement with a new semiconductor element. Therefore, there is a need for an electrical connector that enables the mounting of the surface-mounted semiconductor package 1 and that can also be mounted and removed.

In view of the above problems, Japanese Patent Application Laid-Open No. Hei 9-115577
This publication proposes a bonding structure using an electrical connector, and enables mounting and dismounting of the semiconductor packages 1 and 1A in addition to mounting. Although not shown, the electrical connector is located along an inner surface of an insulating sheet having a plurality of conductive lands on both upper and lower surfaces and a through hole (through hole) formed at the position of the conductive land. It is composed of a conductive layer for conductive connection, an elastomer filled in a through hole, and metal bumps located on both upper and lower surfaces of the elastomer. The metal pump is formed in a hemispherical or spherical shape, and has a diameter smaller than the diameter of the through hole.

However, as described above, the conventional electrical connector has a problem that the number of components is very large, the manufacturing method is complicated, and the cost of the product is high. Then, in order to solve this, Japanese Patent Application Laid-Open No. 9-3578
No. 9 proposes an anisotropic conductive sheet formed by penetrating a plurality of conductive wires in a thickness direction of a sheet made of an insulating elastic material. This manufacturing method uses a wire bonding technique to bond conductive wires one by one to a base material, fill the base material with an insulating rubber, and expose both ends of each wire from the rubber, Thereafter, the rubber is cured and peeled from the substrate.

Prior art documents relating to this type of electrical connector and its manufacturing method include Japanese Patent Publication No. 7-105174 and Japanese Patent No. 2796872 in addition to the above-mentioned publications.

[0010]

As described above, the conventional electrical connector has a problem that the manufacturing operation is delayed because the conductive wires are bonded to the base material one by one. Furthermore, since each bonded wire is supported only at the tip, bending is likely to occur in the rubber filling process, and as a result, the wire arrangement is disturbed,
There was a problem that rubber had to be filled for a long time.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an electrical connector which can be manufactured in a short time and which can effectively prevent the arrangement of connectors from being disturbed, and a method of manufacturing the same. It is intended to be.

[0012]

According to the first aspect of the present invention, in order to achieve the above object, an electrode of an electrical joint is electrically connected to an electrode of an electrical joint. , An insulating base sheet having a thickness of 20 μm to 300 μm, and a plurality of connectors for connecting the electrodes provided in the base sheet.
^While molding using a conductive resin having a volume resistivity of ^-2 Ωcm or less, the plurality of connectors are insulated from each other, and at least one end of each connector is one of the front and back surfaces of the base sheet. Characterized by projecting from the surface of 0.05 mm to 0.5 mm.

[0013] In order to achieve the above object, the invention according to claim 2 includes an insulating base sheet and a plurality of conductive connectors provided in the base sheet.
The plurality of connectors are insulated from each other, and at least one end of each connector is projected from one of the front and back surfaces of the base sheet so as to be in contact with an electrode of an electric joint or an electric joint. A method of manufacturing an electrical connector in which the other end of each connector is brought into contact with an electrical joint or an electrode of the electrical joint, wherein a connector is formed on at least one of the front and back surfaces of the base sheet. A sheet is provided to form a laminate, a plurality of through holes are provided in the thickness direction of the laminate so as to be spaced apart from each other, and each through hole is filled with a conductive resin to constitute the laminate. It is characterized in that only the forming sheet is removed.

The connector forming sheet is preferably a polyvinyl alcohol sheet having a saponification degree of 50% or more. In addition, it is desirable that the connector forming sheet be swollen with water and peeled off. Further, each of the through holes can be provided in a similar shape corresponding to the shape of the electrode.

Here, at least the BGA, LGA, FBGA, PBGA, TBGA, FPBG
A or D ² BGA type semiconductor package, various surface-mounted electronic components substantially similar to these, electric components such as a microphone, a circuit board, and the like are included. Further, the electrical workpiece includes at least a circuit board for inspection, a printed board, a build-up wiring board which is a high-density wiring board, or an electrical workpiece substantially similar to these. Each electrode of the electrical joint and the electrical joint may be a single electrode, but preferably a plurality of electrodes.

As the insulating base sheet, any one having a function of holding a plurality of connectors in a mutually insulated state and having resistance in an environment where the electrical connector according to the present invention is used. good. Specifically, polyimide, polyamide imide, polyethylene terephthalate, polyethylene naphthalate, polyether ether ketone, polyether sulfone, polyphenylene sulfide, polystyrene, fluororesin, epoxy resin reinforced with glass fibers, etc., also polyphenylene ether, or Similarly, bismaleimide-triazine resin and the like can be mentioned. Among these, plastics are preferable to rubbers and elastomers because they are excellent in workability when providing a plurality of through holes and heat resistance during use, and have a small difference in coefficient of thermal expansion with the object to be joined. Among them, it is particularly desirable to select polyimide, polyamideimide, or polyethylene naphthalate.

As the connector forming sheet, saponification (sapon
degree) 50% -100%, preferably 90% -1
A 00% polyvinyl alcohol sheet is preferred, but there is no particular limitation as long as it can be removed by dissolution or swelling. In the case of using polyvinyl alcohol, it should be noted that when the degree of saponification is less than 50%, it is likely to dissolve in water and cause the following problems. That is, the connector forming sheet functions as a spacer for projecting a plurality of conductive resin connectors from at least one of the front and back surfaces of the base sheet,
Finally, it is dissolved or swelled and peeled off. Here, the reason for swelling and peeling-off is that when the polyvinyl alcohol sheet is dissolved and removed, the dissolved polyvinyl alcohol sheet may re-attach to the connector and cause a connection failure. Further, in order to prevent this connection failure, a cleaning step by careful water washing becomes indispensable, and the manufacturing process becomes complicated.

On the other hand, if the degree of saponification of the polyvinyl alcohol sheet is set to 50% or more, the polyvinyl alcohol sheet does not dissolve in water, and the possibility of poor connection and the washing step can be prevented or omitted. Become. In addition, by swelling, the through-hole provided in the polyvinyl alcohol sheet expands, and there is no risk that the connector will be removed during peeling and removal.

The thickness of the connector forming sheet determines the amount of protrusion of the connector, and can be set to a predetermined amount. However, from the viewpoint of promoting miniaturization of electric and electronic equipment, the thickness is 0.05 mm to 0.5 mm.
It is desirable to select within the range of mm. This is because if the amount of protrusion is small, variations in the gap between the electrodes of the article cannot be absorbed, and the connection may be unstable. Conversely, if it is too large, the connector will fall down due to recoil or impact after mounting, resulting in poor connection. In addition, when providing the connector forming sheet on both the front and back surfaces of the base material sheet,
Each sheet may have the same thickness or different thicknesses.

In the case of using a polyvinyl alcohol sheet, a plasticizer such as glycerin and other additives are added to such an extent that the swelling property with water is not impaired in order to improve the processability when processing on the base sheet. It is possible. Examples of the method for providing the connector forming sheet on the base sheet include a method of bonding and sticking via various commercially available adhesives, a method of laminating, a method of coating, a method of screening (screen printing), and the like. However, a method of laminating sheets or films is preferable. In addition, the size and arrangement of the plurality of through-holes can appropriately correspond to the electrodes and the like of the workpiece. Examples of a method of providing a plurality of through holes in the laminate include a method of punching by punching using a mold, a method of laser, a method of drilling, and the like. However, among these, the method of punching using a metal mold is the most suitable because the productivity is excellent.

As the conductive resin, a resin having a volume resistivity of 1 × 10 ⁻² Ω · cm or less, in which a conductive filler is dispersed in a synthetic resin, is preferable. As the synthetic resin (including rubber or elastomer), epoxy resin, unsaturated polyester resin, acrylic resin, silicone resin,
Or, a urethane resin or the like can be mentioned, and among them, a rubber or an elastomer is preferable. Among these are curing agents,
A curing aid, an inhibitor, or the like is appropriately added.

Examples of the conductive filler dispersed and mixed in the synthetic resin include gold, silver, copper, platinum, palladium, lead, and the like.
Needles, spheres, plates, irregular shapes, etc. made of metals such as tin, iron, zinc, aluminum, chromium, and titanium, iron-nickel alloys, alloys such as stainless steel, solder, beryllium copper, bronze, phosphor bronze, and brass , Carbon powders such as acetylene black, Ketjen black and furnace black, ceramic powders, various kinds of particles whose surfaces are metal-plated, mixtures thereof, and laminates. Among these, from the viewpoint of obtaining high conductivity with a small amount of addition, it is preferable to use a conductivity-imparting filler formed by coating or plating gold, silver, or copper powder on a main resin or ceramic powder. By appropriately mixing and dispersing these in the above synthetic resin, a conductive resin can be obtained. However, a commercially available conductive resin can also be used.

As a method of filling the plurality of through holes of the laminate with the conductive resin, when the viscosity of the conductive resin is low enough to flow under its own weight, an appropriate member is adhered to the lower side of the laminate. And a method in which a conductive resin is poured into the through-hole, excess conductive resin is scraped off with a doctor blade or the like, and the resin is cured by heating. In addition, when the viscosity of the conductive resin is such that it does not flow only by its own weight, the conductive resin is supplied onto the laminate and pressed by a squeegee, the conductive resin is supplied to one or both surfaces of the laminate, and a pair of rolls is provided. There are a method in which the conductive resin is supplied while pressurizing in between, and a method in which the conductive resin is supplied to one or both surfaces of the laminate and filled by pressing. Further, the number of the connectors may be two or more. Each connector can be formed in a columnar shape such as a cylinder, a prism, or a semicircle, a semiellipse, or a polygon.

According to the first aspect of the present invention, the connectors are collectively formed in the plurality of through holes of the base sheet, instead of being wire-bonded to the base sheet, so that the speed of the manufacturing operation is expected. it can. In addition, since the connector is held in each through hole, it is possible to prevent the connector from being bent. Further, the thickness of the base sheet is 20 μm to 300 μm.
Since the thickness is set in the range of μm, it is possible to effectively prevent the workability at the time of mounting the electrical joint from being lowered by being thinner than necessary. Also, if the thickness is too large, the absolute value of the stress due to the difference in thermal expansion with the object to be joined becomes large, which may cause a connection failure or an obstacle to miniaturization of the electric / electronic device using the electric connector. Absent.

The protrusion of the connector is 0.05 mm to 0.1 mm.
Because it is within the range of 5 mm, the protrusion amount is too small,
Variations in the gap between the electrodes of the workpiece cannot be absorbed, and the unstable connection can be effectively suppressed and prevented. Also, because the protrusion amount is too large,
The connector does not fall down due to recoil or impact after the mounting of the electrical joint, and the connection does not fail.

According to the fourth aspect of the present invention, since the connector forming sheet absorbs water and increases the size of the connector forming sheet and peels off the same, unlike the case of dissolving and removing the connector forming sheet, the connection forming sheet is removed. The connector forming sheet does not adhere to the child or the like, and there is no possibility of a connection failure. Further, there is no particular need for a cleaning step or the like that leads to complicated manufacturing operations in order to prevent poor connection. Furthermore, according to the invention described in claim 5, the shape of the electrode of the object to be electrically connected is a through hole,
In other words, since the connectors have a similar relationship of being enlarged or reduced, the electrodes and the connectors can be overlapped, and the connection can be stabilized.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to the following embodiments. As shown in FIGS. 6 to 8 and the like, the electrical connector according to the present embodiment electrically connects a plurality of electrode terminals 2 of a surface-mounted BGA type semiconductor package 1 to a plurality of electrodes 4 of a printed circuit board 3. The base sheet 5 includes an insulating base sheet 5 and a plurality of electrode connection connectors 13 embedded in the base sheet 5.

As shown in FIGS. 1, 6, and 7, etc., the base sheet 5 is made of a polyimide having excellent hot water resistance, thermal shock resistance, radiation resistance and the like, and has a thickness of 20 μm to 300 μm. It is shaped like a square. The plurality of connectors 13 are made of 1 × 10 ⁻² Ω in which a conductivity-imparting filler is dispersed in silicone rubber having excellent rubber elasticity, heat resistance, cold resistance, compression set characteristics, chemical resistance, and weather resistance. A cylindrical shape is formed by using the conductive resin 12 having a volume resistivity of not more than cm, and the resin is insulated in an array state separated from each other. Each end of the connector 13 has the base sheet 5
Are formed so as to protrude by about 0.2 mm from both front and back surfaces, and one end surface is in electrical contact with the plurality of electrode terminals 2 of the semiconductor package 1 and the other end surface is in electrical contact with the plurality of electrodes 4 of the printed circuit board 3. .

Next, a method for manufacturing the electrical connector will be described. When manufacturing electrical connectors,
A base sheet 5 and a mixing roll 9 are prepared in advance. As shown in FIG. 4, the mixing roll 9 includes a pair of cylindrical rolls 10, 10, which sandwich the laminated body 7.
A, and one cylindrical roll 10 has another cylindrical roll 10A.
(See the arrow in the figure). A conductive resin layer 11 is applied on the peripheral surface of one cylindrical roll 10 in advance.

Next, a connector forming sheet 6 made of a polyvinyl alcohol sheet and having a thickness of 0.2 mm is laminated on each of the flat front and back surfaces of the base sheet 5 and pressure-bonded to each other to form a laminate 7 integrally (see FIG. 2). ). After the laminated body 7 is formed, the laminated body 7 is set in a mold (not shown), and a plurality of through holes 8 are formed at predetermined intervals in a thickness direction thereof (see FIG. 3). A plurality of through-holes 8 are supplied between the pair of cylindrical rolls 10 and 10A of the mixing roll 9.
Is gradually filled with the conductive resin 12 of the conductive resin layer 11. After the plurality of through holes 8 are filled with the conductive resin 12, unnecessary conductive resins 12 attached to both the front and back surfaces of the laminate 7 are removed, and the conductive resin 12 is cured to form the plurality of connectors 13. (See FIG. 5).

Then, a predetermined temperature not shown (for example, 80
When the laminate 7 is swelled by immersing the laminate 7 in hot water for a certain period of time (for example, 5 minutes), each connector forming sheet 6 absorbs the hot water, and its dimensions increase without changing its structural structure. Thereafter, by peeling and removing each connector forming sheet 6 from the end, an electrical connector can be manufactured (see FIGS. 6 and 7).

After the electrical connector is manufactured, the electrical connector is mounted on the printed circuit board 3 and the plurality of connectors 13 are brought into contact with the plurality of electrodes 4 of the printed circuit board 3 to set the semiconductor package 1 on the electrical connector. Then, the plurality of electrode terminals 2 are brought into contact with the plurality of connectors 13 of the electrical connector, and then the semiconductor package 1 is pressed down, whereby the printed board 3 and the semiconductor package 1 can be electrically connected. .

According to the above configuration, the conductive resin 12 is filled into the plurality of through-holes 8 of the laminate 7 at a time and hardened, instead of bonding the conductive wires one by one on the base sheet 5. Since the plurality of connectors 13 are formed, a simple and quick manufacturing operation can be expected. In addition, since the connector 13 is held in each through hole of the base sheet 5, the connector 13
Never bends. Therefore, a plurality of connectors 1
There is no necessity to disturb the arrangement of 3 or to fill the conductive resin 12 for a long time. Further, since the laminated body 7 is immersed and swollen, and the through holes of the connector forming sheet 6 are expanded to have a larger diameter than the through holes of the base sheet 5, even if the through holes of the connector forming sheet 6 are rough, There is no possibility that the through-holes of the connector forming sheet 6 adhere to the connector 13 and cause damage at the time of peeling and removal. Also, a complicated cleaning operation can be omitted.

Further, since the connector forming sheet 6 is peeled and removed by using the swelling, the removing operation can be performed very quickly as compared with the dissolving and removing operation. In addition, conductive resin 1
2 has a volume resistivity of 1 × 10 ⁻² Ω · cm or less in which a conductivity-imparting filler is dispersed in silicone rubber. Therefore, when the volume resistivity exceeds 1 × 10 ⁻² Ω · cm, a signal or There is no deterioration in current propagation efficiency, increase in power consumption, heat generation, and the like. In addition, since the plurality of through-holes 8 of the laminate 7 need to have fluidity, it is necessary to use a solventless reaction-curable synthetic resin material to form voids.
The occurrence of d) can be prevented, and the protrusion amount of the connector 13 can be easily controlled.

Further, by employing swelling, the connector forming sheet 6 can be mechanically continuously peeled off, so that the production efficiency can be greatly improved. Furthermore, since the plurality of through-holes 8 are collectively filled with the conductive resin 12 by using the mixing roll 9, simplification, efficiency, and speedup of work can be greatly expected.

FIG. 9 shows a second embodiment of the present invention. In this case, an electric connector is mounted on a printed circuit board 3 and a plurality of connectors 13 and the printed circuit board 3 are connected.
After making the LGA type semiconductor package 1A set on the electrical connector and bringing the plurality of electrode terminals 2A into contact with the plurality of connectors 13 of the electrical connector, the semiconductor package 1A is removed. The printed circuit board 3 and the semiconductor package 1A are electrically connected to each other by applying a pressing pressure. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. It is clear that the present embodiment can expect the same operation and effect as the above embodiment.

Next, FIGS. 10 and 11 show a third embodiment of the present invention.
A plurality of through-holes 8 are formed in the thickness direction of the laminate 7 in a similar manner so as to correspond to the shape of the electrodes 4 of the printed circuit board 3.
The connector 13 is formed into a slightly reduced similar shape with respect to the electrode 4. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. Also in this embodiment, the same operation and effect as the above embodiment can be expected, and furthermore, since the electrode 4 and the connector 13 can be completely overlapped, a remarkable improvement in positioning and connection stability can be expected. Is obvious.

The electric connector can be fixed directly on the printed circuit board 3 or by using a positioning tool or a fixing tool. Moreover, it is also possible to mount on the printed circuit board 3 detachably. Alternatively, the connector forming sheet 6 may be laminated and pressure-bonded to only the front surface or the back surface of the base sheet 5 so that only one end or the other end of each connector 13 is projected. Further, the base sheet 5 and the connector forming sheet 6 may be of the same color, or may be of different colors in order to call attention and smooth the operation. Further, there are various types of mixing rolls 9, and any type can be adopted as long as similar effects can be expected. Furthermore, the base sheet 5 and the plurality of connectors 1
3 may be the same color, or may be a different color in order to impart discriminating power to facilitate the work or the like.

[0039]

Embodiments of the present invention will be described below. First, a urethane-based adhesive for dry lamination (manufactured by Takeda Pharmaceutical Co., Ltd.) having a thickness of 5 μm is applied to one surface of the pair of connector forming sheets 6 which is an adhesive surface.
And a connector forming sheet 6 was bonded to each of the front and back surfaces of the base sheet 5 with a pinch roller to form a laminated body 7 integrally. As the base sheet 5, 12
A polyimide sheet “Kapton” (manufactured by DuPont) having a thickness of 5 μm was used. The connector forming sheet 6 has a degree of saponification of 98% and glycerin as a plasticizer of 6%.
Polyvinyl alcohol having a thickness of 160 μm was used.

Next, the laminated body 7 was punched using a mold to form a laminated body 7 having a plurality of through holes 8 in the same arrangement as the mold. As a mold, a punching pin of φ0.6mm, pitch 1mm, 30 rows x 30 rows, inner 20 rows x
A mold was used which had a rectangular array with 20 rows missing (total number of pins: 500).

Next, a laminate 7 having a plurality of through holes 8
A conductive silicone rubber, which is a conductive resin 12, is disposed on one side of the laminate, and the laminate 7 is passed between a pair of constant velocity rolls at a linear pressure of 5 kgf / cm to fill each through hole 8 with the conductive silicone rubber. The laminate 7 was heated and pressed at 170 ° C. and 20 kgf / cm ² for 10 minutes to vulcanize the conductive silicone rubber. The conductive silicone rubber contains 82% by weight of silver as a conductivity-imparting filler, and has a volume resistivity of 8 × after curing.
A product made by Shin-Etsu Chemical Co., Ltd. having a viscosity of 10 ^{-4 to} 9 × 10 ^-4 Ωm and a viscosity before curing of 40,000 poise was used.

Then, the laminate 7 is immersed in water at a temperature of 90 ° C. for 3 minutes to swell the pair of connector forming sheets 6, and thereafter, each connector forming sheet 6 is peeled off from the end, and according to the present invention. An electrical connector was manufactured.

[0043]

As described above, according to the first or second aspect of the present invention, it is possible to manufacture in a relatively short time and to effectively prevent the arrangement of the plurality of connectors from being disturbed. effective.

[Brief description of the drawings]

FIG. 1 is a side view showing a base sheet in an embodiment of a method for manufacturing an electrical connector according to the present invention.

FIG. 2 is a side view showing a state in which a connector forming sheet is pressure-bonded to both front and back surfaces of the base sheet of FIG. 1 to integrally form a laminate.

FIG. 3 is a cross-sectional side view showing a state where a plurality of through holes are formed in the laminate of FIG.

FIG. 4 is a partial cross-sectional side view showing a state where the laminate of FIG. 3 is supplied to a mixing roll.

FIG. 5 is a cross-sectional side view showing a state where a plurality of connectors are formed by curing the conductive resin of the laminate of FIG. 4;

6 is a cross-sectional side view showing a state in which a connector forming sheet has been peeled off from the laminate of FIG. 5, respectively.

FIG. 7 is a plan view showing an embodiment of the electrical connector according to the present invention.

FIG. 8 is an explanatory view of a use state showing an embodiment of the electric connector according to the present invention.

FIG. 9 is an explanatory diagram illustrating a use state of an electric connector according to a second embodiment of the present invention.

FIG. 10 is a plan view showing a printed circuit board in a third embodiment of the electrical connector according to the present invention.

FIG. 11 is a plan view showing an electric connector in a third embodiment of the electric connector according to the present invention.

FIG. 12 is an explanatory perspective view showing a PGA type semiconductor package from the back side.

FIG. 13 is a partially cutaway perspective view showing a BGA type semiconductor package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 BGA type semiconductor package (electrical joint) 1A LGA type semiconductor package (electrical joint) 2 Electrode terminal (electrode) 2A electrode terminal (electrode) 3 Printed circuit board (electrical joint) 4 electrodes 5 Material sheet 6 Connector forming sheet 7 Laminated body 8 Through hole 9 Mixing roll 10 Cylindrical roll 10A Cylindrical roll 11 Conductive resin layer 12 Conductive resin 13 Connector

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takumi Suda 4-3-5 Nihonbashi Honcho, Chuo-ku, Tokyo Inside Shin-Etsu Polymer Co., Ltd. (72) Inventor Koichi Nei 4-3-5 Nihonbashi Honcho, Chuo-ku, Tokyo No. Shin-Etsu Polymer Co., Ltd. F-term (reference) 5E023 AA04 BB01 BB21 CC21 EE03 HH28

Claims (5)

[Claims] 1. An electrical connector for electrically connecting an electrode of an electrical joint and an electrode of an electrical joint, comprising: an insulating base sheet having a thickness of 20 μm to 300 μm; And a plurality of connectors for connecting the electrodes provided in the material sheet, wherein the plurality of connectors are 1 × 10 ⁻² Ω · c.
m and molded using a conductive resin having a volume resistivity of not more than m, the plurality of connectors are insulated from each other, and at least one end of each connector is 0% from one of the front and back surfaces of the base sheet. An electrical connector characterized by projecting from 0.05 mm to 0.5 mm. 2. An insulating base sheet, and a plurality of conductive connectors provided in the base sheet, the plurality of connectors insulated from each other, and at least one end of each connector is The base sheet is made to protrude from one of the front and back surfaces to be in contact with an electrode of an electrical joint or an electrical joint, and the other end of each connector is electrically joined or an electrical joint. A method for manufacturing an electrical connector to be brought into contact with the electrodes of claim 1, wherein a connector forming sheet is provided on at least one of the front and back surfaces of the base sheet to form a laminate, and a plurality of the laminates are formed in the thickness direction of the laminate. Wherein the through holes are provided apart from each other, and each of the through holes is filled with a conductive resin, and only the connector forming sheet constituting the laminate is removed. 3. The method according to claim 1, wherein the connector forming sheet has a saponification degree of 50.
The method for producing an electrical connector according to claim 2, wherein the polyvinyl alcohol sheet has a polyvinyl alcohol sheet content of at least 10%. 4. The method for manufacturing an electrical connector according to claim 3, wherein said connector forming sheet is swelled with water and peeled off. 5. The method for manufacturing an electrical connector according to claim 2, wherein each of the through holes is provided in a similar shape corresponding to the shape of the electrode.