JP2000151049A - Metal substrate for circuit, method of manufacturing the same, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form an electric circuit pattern of large thickness by constructing an insulating layer consisting of two insulating layers or more between a first metal plate and a second metal plate, and at least a part of the second metal plate is covered by the resin layer that contacts the side surfaces of the second metal plate. SOLUTION: A resin coating film 2 of 130 μm thickness is formed by coating an aluminum substrate 1 of 2 mm thickness with varnish by screen-printing (a). The aluminum substrate 1 having a resin-covering film of 111 μm thickness is formed by heat treatment (b). An 80 μm thick resin-coating film 3 is newly formed by screen-printing epoxy resin varnish on the resin-covering film (c). The solvent is mostly evaporated by a heat treatment, and a viscous resin- coating film 3 is obtained (d). A lead frame is mounted (e), and is subjected to a heating-and-pressurizing process for 30 minutes (f) to adhere the lead frame (g). On the side surfaces of the lead frame, fillet shapes 5 are formed by the resin flowed out in the heating-and-pressurizing process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit metal substrate used for mounting electronic and electric parts such as semiconductor elements, a method of manufacturing the same, and a semiconductor device using the circuit metal substrate.

[0002]

2. Description of the Related Art In electronic devices such as inverters, converters, and servos, high heat conductivity is usually provided on a metal plate in consideration of the high heat generation of power semiconductor elements such as diodes, transistors, IGBTs, and MOSFETs. Generally, a metal substrate provided with an insulating layer is used as a circuit substrate.
The material of the insulating layer is selected according to the heat value of the mounted component. Alumina ceramics, aluminum nitride ceramics, and the like are mainly used as insulating layers in large- and medium-capacity products having a large calorific value. However, those with a small capacity generally use a resin insulating layer.

A circuit metal substrate using a resin insulating layer to which the present invention is directed is usually manufactured by the following method. After applying a high thermal conductive resin highly filled with an inorganic filler to a metal plate, a conductive metal foil is disposed on the resin layer, and these are integrated by heating and pressing to form a metal plate / high thermal conductivity. To obtain a conductive resin layer / conductive metal foil laminated structure. Thereafter, the conductive metal foil is etched to form an electric circuit pattern, thereby obtaining a circuit metal substrate.

[0004] Diode, transistor, IGBT, MO
When mounting power semiconductor elements such as SFETs on this circuit metal substrate, in many cases, copper, molybdenum, etc. are used between the elements and the electric circuit pattern to effectively dissipate the heat generated by these elements. Via a heat diffusion plate.

[0005]

The circuit metal substrate obtained by the above-described method has a heat radiation property and an insulating property that can withstand use when the heat generated by the mounted components is relatively small, so that it is applied to various uses. ing. As described above, in many cases, the element is indirectly mounted on the circuit metal substrate via a heat diffusion plate. However, this is because the electric circuit pattern of the circuit metal substrate is formed by etching. One reason is that the thickness of the pattern cannot be made too large.
Normally, the thickness of this pattern is generally about 100 μm. However, if the thickness can be increased to 300 μm or more, the degree of freedom in designing the element to be directly mounted on the circuit pattern without the heat diffusion plate is increased. Eliminating the need for the heat diffusion plate not only simplifies the parts and assembly process, but also has a great merit in terms of securing and controlling product reliability by reducing the number of bonding interfaces. Therefore, there is a strong demand for a technique of forming a thick electric circuit pattern having a circuit pattern shape on a resin insulating layer while securing various characteristics. As a technique for forming an electric circuit pattern without depending on etching of a metal foil, for example, there is a technique disclosed in Japanese Patent Application Laid-Open No. 10-173097.

An object of the present invention is to provide a circuit metal substrate having a large thickness of an electric circuit pattern which is manufactured by a simple method without sacrificing various characteristics of a conventional circuit metal substrate. And a method of manufacturing the same and a semiconductor device using the circuit metal substrate.

[0007]

In order to achieve the above object, the present invention has the following features.

The feature of the circuit metal substrate of the present invention is that a conductive metal plate (hereinafter, referred to as a second metal plate) formed in an electric circuit pattern is laminated on the first metal plate via an insulating layer. In the circuit metal substrate configured as described above, the insulating layer between the first metal plate and the second metal plate is composed of two or more resin layers, and the resin in contact with the second metal plate The layer may cover at least a part of the side surface of the second metal plate. Further, an organic printed circuit board is mounted on the insulating layer on the first metal plate together with the second metal plate.

A feature of the method for manufacturing a metal substrate for a circuit according to the present invention is that one or more resin layers are applied to a first metal plate or formed by pasting a resin film, and then a resin is applied to an exposed surface of the resin layer. Applying, before the resin is cured, a conductive metal plate formed into an electric circuit pattern, and optionally an organic printed circuit board are further placed on the resin, and the electric circuit pattern is formed by heating and pressing. An object of the present invention is to integrate a conductive metal plate formed in a shape and the organic printed circuit board with the first metal plate via the resin layer.

The semiconductor device of the present invention is characterized in that a power semiconductor element such as a diode, a transistor, an IGBT, a MOSFET, etc. and various electronic / electric components are mounted on an electric circuit pattern of the circuit metal substrate of the present invention. It is composed.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings.

FIG. 6 schematically shows a process of assembling a circuit metal substrate according to the present invention. First metal plate 1
The material 4 can be the same as that used for the ordinary circuit metal substrate, including the material and thickness. 1.5 to 3mm thick
Generally, a metal plate made of aluminum or copper is used. If necessary, form an oxide film on the metal surface,
Various plating processes may be performed.

First, as shown in step (a), a resin layer 15 is formed on the surface of the first metal plate 14. As this method, there are a method of applying a liquid resin, a method of applying a film-like resin (including a resin prepreg) by heat and pressure molding, or attaching using a roller, but any method may be used. In the circuit metal substrate according to the present invention, since the resin layer formed here has a function of high thermal conductivity as well as insulating properties, the resin used here is made of an inorganic filler such as alumina, silica, aluminum nitride, and boron nitride. Material must be added. In order to ensure effective thermal conductivity, it is necessary to add 50% by weight or more of the inorganic filler. However, if the amount is too large, the viscosity of the compounded resin system is increased, and the coating property is deteriorated. There is a possibility that a good resin layer cannot be formed. In this case, it can be dealt with by adding and using various solvents. As a resin system to be used, a thermosetting resin system such as an epoxy resin and a phenol resin is advantageous in terms of adhesiveness, but a thermoplastic resin system including a polyamideimide and a polyamide ether system can also be used. . It is desirable that the resin layer formed here is allowed to undergo a curing reaction to such an extent that it does not soften in the subsequent heating step.

Next, as shown in step (b), a resin layer 16 for joining a conductive metal plate (hereinafter referred to as a second metal plate) formed in an electric circuit pattern is formed. still,
In FIG. 6, the resin layer is formed as a single layer, but if necessary, the step (a) may be repeated to form a plurality of layers (the resin type and thickness may be changed). It is also possible.

In the circuit metal substrate according to the present invention, the resin layer 16 formed here mainly has a function of bonding to the second metal plate 17. However, even if the adhesion to the second metal plate is good, if a defect such as a void occurs at this adhesion interface, the heat dissipation from the second metal plate on which the heat-generating component is mounted is greatly impaired. Therefore, it is necessary to bond the second metal plate while minimizing voids and the like. Therefore, in the present invention, as a resin used in this step, when a second metal plate is placed on the resin and molded by heating and pressing, the resin has a sufficient deformability, and a part of the resin is The one that can protrude and wet at least a part of the side surface of the second metal plate is used. By using a resin system having a large deformability as described above, voids taken into the bonding interface with the second metal plate 17 are eliminated during the heat and pressure molding, and
Since the thickness of the resin layer can be reduced, the effect of the resin layer on the thermal conductivity can be minimized, and further by wetting at least a part of the side surface of the second metal plate, The metal plate can be firmly bonded and fixed.

The resin used in this step may be the same as the resin used in step (a), but a liquid resin is preferred. If the deformability is not sufficient, the amount of the inorganic filler added may be reduced or the amount of the solvent added may be increased.

A liquid resin system is applied on the resin layer formed in the step (a) by screen printing, doctor blade method, coater method or the like. In this case, a liquid resin system may be applied to the entire surface of the resin layer, or may be applied in a pattern of the second metal plate 17. In some cases, it is also possible to apply the liquid resin not to the resin layer formed in the step (a) but to the resin-bonded surface of the second metal plate.

When using a resin system to which a solvent is added,
Thereafter, the solvent is scattered and removed at a temperature at which the curing reaction of the resin system does not completely proceed.

Next, as shown in step (c), a second metal plate is placed on the resin layer formed in step (b), and is subjected to heat and pressure molding. Since the resin layer is sufficiently soft at the initial stage, the resin layer protrudes at the time of the heat and pressure molding to form the fillet shape 5 and harden as shown in step (d). The fillet shape can be controlled by adjusting the thickness of the liquid resin application, the thickness of the second metal plate, the heating temperature, the pressure and the like. Particular attention must be paid to the thickness of the liquid resin application. If the thickness is too large, the protruding resin contaminates the exposed surface of the second metal plate 17 and hinders the mounting of components.

The contents of the present invention will be described in more detail with reference to Examples.

[Embodiment 1] The contents of this embodiment will be described with reference to FIG.

First, as shown in step (a), a thickness of 2 mm
Alumina filler is 82 wt.
% Of epoxy resin was added as a solvent to a varnish adjusted to a viscosity of 400 P by screen printing to form a resin coating film 2 having a thickness of 130 μm. Then, as shown in step (b) 8 on a hot plate
A heat treatment of 0 ° C./30 minutes + 160 ° C./1 hour was performed to manufacture an aluminum substrate with a resin coating having a thickness of 111 μm. Next, as shown in step (c), on the resin coating,
The epoxy resin varnish was applied by screen printing to form a new resin coating film 3 having a thickness of 80 μm. then,
The heat treatment at 80 ° C./30 minutes shown in step (d) was performed on a hot plate, and the solvent was roughly dried to obtain a sticky resin coating film. A nickel-plated copper lead frame 4 having a thickness of 0.7 mm is placed on the resin coating film as shown in step (e), and then at a temperature of 160 ° C. and a pressure of 3 kgf as shown in step (f). / Cm ² under heat and pressure
After that, the lead frame was bonded as shown in step (g). After the bonding of the lead frame was completed, a fillet shape 5 was formed on the side surface of the lead frame by the resin flowing out during heating and pressing. The thickness of the resin between the lead frame 4 and the aluminum substrate 1 was 119 μm.

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the lead frame bonding interface was examined by an ultrasonic flaw detector at predetermined times.
As a result, even after 1,000 times, no signs of deterioration such as voids and peeling were observed at the adhesive interface, and it was found that the adhesive interface had excellent adhesiveness.

[Embodiment 2] The contents of this embodiment will be described with reference to FIG.

First, an adhesive resin sheet 6 highly filled with alumina filler was produced by the following method. A varnish adjusted to a viscosity of 750 P by adding N-methyl-2-pyrrolidone as a solvent to an epoxy resin containing 86 wt% of alumina filler as a solvent is applied on the polyester film 7 by a doctor blade method, and then the varnish is treated at 80 ° C. for 1 hour. The solvent was dried by a heat treatment to form a resin coating film having a thickness of 80 μm on the polyester film. Next, the adhesive resin sheet 6 was placed on the aluminum substrate 1 having a thickness of 2 mm so that the coating film surface was in contact with the aluminum substrate 1 as shown in step (a). Then, the polyester film 7 and the step (b)
As shown in Fig. 7, a heating and pressurizing treatment was performed at a temperature of 170 ° C and a pressure of 40 kgf / cm ² for 30 minutes. Then, as shown in step (c), the polyester film 7 was peeled off to form a resin film on the aluminum substrate 1. Thereafter, the first embodiment
The lead frame was bonded in the same manner as in FIG. This step is shown in (d) to (h). After the bonding of the lead frame was completed, a fillet shape 5 was formed on the side surface of the lead frame 4 by the resin flowing out during heating and pressing. The thickness of the resin between the lead frame 4 and the aluminum substrate 1 was 87 μm.

With respect to the substrate manufactured in this example, the conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the lead frame bonding interface was examined by an ultrasonic flaw detector at predetermined times.
As a result, even after 1,000 times, no signs of deterioration such as voids and peeling were observed at the adhesive interface, and it was found that the adhesive interface had excellent adhesiveness.

Embodiment 3 The contents of this embodiment will be described with reference to FIG.

Steps (a) to (d) are performed in the same manner as in Example 1.
As shown in (1), a resin coating film was formed on the aluminum substrate 1. Thereafter, as shown in step (e), a 0.7 mm thick nickel-plated copper lead frame 4 and a 1 mm thick glass epoxy plate double-sided printed board 8 were placed on the resin coating. Thereafter, a silicone rubber sheet is mounted on the lead frame and the printed circuit board as a difference absorbing material, and then, similarly to the steps of FIGS. 1 (f) and 1 (g),
The lead frame and the printed circuit board were bonded. This step is shown in FIGS. 3 (f) and 3 (g). After the bonding was completed, a fillet shape 5 was formed on the side surfaces of the lead frame and the printed circuit board by the resin flowing out during heating and pressing.

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the bonding interface between the lead frame and the printed circuit board was examined by the ultrasonic flaw detector at predetermined times. As a result, even after 1000 times,
No signs of deterioration such as voids and peeling were observed at the bonding interface, indicating that the bonding interface had excellent adhesion.

[Embodiment 4] As in Embodiment 2, FIG.
In the steps up to (e), a resin coating film was formed on the aluminum substrate 1. Thereafter, the lead frame and the printed circuit board were bonded in the same manner as in the steps after Example 3 (e). After the bonding was completed, a fillet shape was formed on the side surfaces of the lead frame and the printed circuit board by the resin flowing out during heating and pressing.

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the bonding interface between the lead frame and the printed circuit board was examined by the ultrasonic flaw detector at predetermined times. As a result, even after 1000 times,
No signs of deterioration such as voids and peeling were observed at the bonding interface, indicating that the bonding interface had excellent adhesion.

Embodiment 5 The contents of this embodiment will be described with reference to FIG.

In the same manner as in Example 2, the resin sheet 6 was bonded onto the aluminum substrate 1 (step (a)). next,
As shown in step (b), the same epoxy resin varnish as used in Example 1 was applied to the general lead frame bonding portion on the resin sheet 6 by screen printing, and the resin coating 3 was formed.
Was formed. Then, the lead frame 4 was bonded in the same manner as in (e) to (h) of Example 2 (steps (c) to (c)).
(F)). Thereafter, as shown in step (g), the epoxy resin varnish is applied to the back surface, and the printed circuit board 8 obtained by drying the solvent by heating at 80 ° C. for 30 minutes is applied to the resin sheet 6
The printed circuit board was mounted thereon, and heated and pressed at a temperature of 160 ° C. and a pressure of 3 kgf / cm ² for 30 minutes.
After the bonding was completed, a fillet shape 5 was formed on the side surfaces of the lead frame and the printed circuit board by the resin flowing out during heating and pressing.

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the bonding interface between the lead frame and the printed circuit board was examined by the ultrasonic flaw detector at predetermined times. As a result, even after 1000 times,
No signs of deterioration such as voids and peeling were observed at the bonding interface, indicating that the bonding interface had excellent adhesion.

[Embodiment 6] The contents of this embodiment will be described with reference to FIG.

In the same process as in Example 4, a substrate was prepared in which the lead frame 4 and the printed circuit board 8 were bonded. However, in this embodiment, the resin coating film 3 for bonding the lead frame 4 and the printed board 8 was formed so that the resin sheet 6 was exposed at the peripheral portion on the substrate surface. This state is referred to as step (a).
Shown in Next, the lead frame was raised upward as shown in step (b). Then, as shown in step (c), the semiconductor elements 9 and
The electronic component 10 was mounted using solder, and was electrically connected with the bonding wire 11 made of Al. then,
As shown in step (d), the resin case 12 was bonded with a silicone adhesive. Thereafter, an epoxy resin was injected into the case and cured by heating at 135 ° C. for 2 hours to produce a semiconductor device shown in step (e).

With respect to the semiconductor device manufactured in this embodiment,
Conditions: -40 ° C / 30 minutes @ 25 ° C / 30 minutes @ 125 ° C /
A 30 minute temperature cycle test and a high temperature and high humidity test at 85 ° C./85% RH were performed. Even after 500 temperature cycles and 1000 hours of moisture absorption, there was no change in the characteristics of the semiconductor device and the insulation characteristics between the aluminum substrate and the lead frame, and the semiconductor device obtained in this example had excellent reliability. It was found to have

Comparative Example 1 A resin film having a thickness of 130 μm was formed on an aluminum substrate in the same manner as in Example 1. Then, the solvent was substantially dried by a heat treatment at 80 ° C./30 minutes. Next, on this resin coating film, a thickness of 0.7 mm
After the nickel-plated copper lead frame was mounted, a heat and pressure treatment was performed at a temperature of 160 ° C. and a pressure of 1 kgf / cm ² for 30 minutes to bond the lead frame. After the completion of the bonding, a fillet shape was formed on the side surface of the lead frame by the resin flowing out during heating and pressing.

With respect to the substrate manufactured in this comparative example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. As a result, even after 1000 times, no signs of deterioration such as peeling were observed in the appearance of the bonded portion of the lead frame. However, when the substrate manufactured in this comparative example was disassembled and inspected after the temperature cycle test, it was found that there was variation in the thickness of the resin between the lead frame and the aluminum substrate. Although there were a few portions with a thickness of 3 μm or less, crack-like defects occurred in these regions, and it was found that insulation properties could not be secured.

Comparative Example 2 The resin sheet formed on a polyester film used in Example 2 was placed on an aluminum substrate having a thickness of 2 mm, and the entire polyester film was subjected to a temperature of 100 ° C. and a pressure of 30 kgf / cm ² . Heat and pressure treatment was performed for 30 minutes under the conditions, and a resin sheet was temporarily bonded to the aluminum substrate. Then, a copper lead frame with a thickness of 0.7 mm with nickel plating was placed thereon, and the temperature was 170 ° C. and the pressure was 4 mm.
Heat and pressure treatment was performed for 30 minutes under the condition of 0 kgf / cm ² to bond the lead frame. In the case of this comparative example, no resin fillet was formed on the side surface of the lead frame.

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the lead frame bonding interface was examined by an ultrasonic flaw detector at predetermined times.
As a result, at about 300 times, signs of peeling were observed at the bonding interface, and the defects grew with the number of times.

Comparative Example 3 A lead frame was bonded in the same process as in Example 1. However, in the case of this comparative example, the pressing condition after mounting the lead frame was set to 0.3 kgf / so that no resin fillet was formed on the side surface of the lead frame.
cm ² .

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the lead frame bonding interface was examined by an ultrasonic flaw detector at predetermined times.
As a result, from around 200 times, signs of peeling were observed at the bonding interface, and this defect grew with the number of times.

Comparative Example 4 A lead frame was adhered in the same process as in Example 2. However, in the case of this comparative example, the pressing condition after mounting the lead frame was set to 0.3 kgf so that no resin fillet was formed on the side surface of the lead frame.
/ Cm ² .

With respect to the substrate manufactured in this example, conditions were as follows:
A temperature cycle test was performed at −40 ° C./30 minutes⇔25 ° C./30 minutes⇔125 ° C./30 minutes. The bonding state of the lead frame bonding interface was examined by an ultrasonic flaw detector at predetermined times.
As a result, from around 200 times, signs of peeling were observed at the bonding interface, and this defect grew with the number of times.

[0046]

As described above, in the circuit metal substrate according to the present invention, since the electric circuit pattern is formed without depending on the etching, the thickness of the electric circuit pattern is not restricted, and it has been conventionally difficult to manufacture. It is possible to easily form an electric circuit pattern having a thickness. Further, in the conventional configuration in which the single resin layer is made to adhere to the thermal conductivity and the electric circuit pattern, if the resin is made to have high thermal conductivity, it becomes easy for voids to be taken into the resin or the electric circuit pattern. It has not been easy to simultaneously satisfy various properties including thermal conductivity, insulation properties, and temperature cycling properties due to a decrease in adhesiveness of the resin. Since it is configured to share the thermal conductivity and the adhesion with the electric circuit pattern, it is advantageous in simultaneously satisfying the various characteristics described above.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of an assembling process of a circuit metal substrate according to the present invention.

FIG. 2 is a schematic view showing another example of an assembling process of the circuit metal substrate according to the present invention.

FIG. 3 is a schematic view showing another example of the assembling process of the circuit metal substrate according to the present invention.

FIG. 4 is a schematic view showing another example of the assembling process of the circuit metal substrate according to the present invention.

FIG. 5 is a schematic view showing an assembling process of the semiconductor device according to the present invention.

FIG. 6 is a schematic view showing another example of the assembling process of the circuit metal substrate according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Aluminum board, 2, 3 ... Resin coating, 4 ... Lead frame, 5 ... Fillet shape, 6 ... Resin sheet, 7 ...
Polyester film, 8: printed circuit board, 9: semiconductor element, 10: electronic component, 11: bonding wire, 1
2: resin case, 13: epoxy resin, 14: first metal plate, 15, 16: resin layer, 17: second metal plate.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Naoto Saito 502 Kandachi-cho, Tsuchiura-shi, Ibaraki Pref. Machinery Research Laboratory, Hitachi, Ltd. Hitachi, Ltd. Hitachi Plant (72) Inventor Rikuo Kamoshida 7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture Inside Hitachi, Ltd. (72) Inventor Mitsufumi Iwanaka 3-1-1, Sachimachi, Hitachi-shi, Ibaraki Pref. Hitachi, Ltd.Hitachi Plant (72) Toshiyuki Kobayashi Toshiyuki Kobayashi Omika-cho, Hitachi-shi, Ibaraki F-term (reference) in Hitachi Research Laboratories, Hitachi Ltd. 5E315 AA03 AA13 BB03 BB14 CC01 DD25

Claims (4)

[Claims] 1. A circuit metal substrate formed by laminating a second metal plate made of a conductive metal plate formed in an electric circuit pattern on an insulating layer on a first metal plate. The insulating layer between one metal plate and the second metal plate is composed of two or more resin layers, and the resin layer in contact with the second metal plate is at least one side surface of the second metal plate. A metal substrate for a circuit, which covers a part. 2. The circuit metal substrate according to claim 1, wherein an organic printed circuit board is mounted on the insulating layer on the first metal plate together with the second metal plate. Characteristic metal substrates for circuits. 3. A method according to claim 1, wherein one or more resin layers are formed on the first metal plate by applying or laminating a resin film, and then a resin is applied to an exposed surface of the resin layer. A conductive metal plate formed in a circuit pattern, and optionally an organic printed circuit board placed on the resin, and a conductive metal plate formed in the electric circuit pattern by heating and pressing; and A method of manufacturing a circuit metal substrate, comprising: integrating an organic printed circuit board with the first metal plate via a resin layer. 4. A semiconductor device comprising an electronic / electrical component such as a semiconductor element mounted on the circuit metal substrate according to claim 1.