JP2000150360A - Substrate processing equipment - Google Patents

Abstract

(57) [Problem] To provide a substrate processing apparatus capable of controlling temperature and humidity with less energy consumption and space saving than in the past, and having a shorter time to reach a predetermined temperature and humidity than in the past. I do. SOLUTION: An air supply device 81 for supplying air of a predetermined temperature and humidity to a cup CP of a resist coating device 30 includes a cooling and dehumidifying unit 86 using a Peltier element, a heating unit 87, a humidifying unit 88, and a blower 89. Is provided. A second temperature / humidity sensor 92 and an inlet 83 are provided on the outlet 84 side of the air supply device 81.
A third temperature / humidity sensor 93 is provided on the side, and based on the difference between the temperature / humidity set at the point of the outlet 84 and the temperature / humidity detected by the third temperature / humidity sensor 93, the control device 94 performs cooling and dehumidification. The unit 86, the heating unit 87, and the humidifying unit 88 are controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus for processing a substrate.

[0002]

2. Description of the Related Art For example, a semiconductor wafer (hereinafter, "wafer")
In the photolithography process, a process of applying a resist to a wafer, exposing a pattern, and then performing development is performed. Conventionally, in performing such a series of processing, a coating and developing processing apparatus in which processing units for individually performing each processing are collectively arranged has been used.

In such a coating and developing apparatus, for example, in regard to resist coating processing, a substrate is rotated in a processing vessel to diffuse resist on the substrate by centrifugal force to form a resist film of a predetermined thickness on the substrate. Is performed. Since the thickness of the resist film is extremely sensitive to temperature and humidity, air set at a predetermined temperature and humidity is supplied into the processing container.

The air is supplied from an attached air supply device. A conventional air supply device introduces, for example, an atmosphere in a clean room and cools and dehumidifies the introduced air, A heating unit, a humidifying unit for humidifying, and a fan for supplying air to a processing container for performing a resist coating process. The cooling and dehumidifying unit is once cooled by a refrigerator to a temperature close to the dew point temperature, for example, 4 ° C., and then heated to achieve a predetermined temperature and relative humidity. Finally, water required for the predetermined relative humidity is removed. Humidify with a humidifier.

As described above, since the resist film thickness is sensitive to temperature and humidity, the supplied air is naturally controlled to a predetermined temperature and humidity. A temperature / humidity sensor for detecting humidity is installed, and based on the temperature / humidity detected by the temperature / humidity sensor, feedback control is performed to a predetermined temperature / humidity, for example, 23 ° C. and 45% (RH). The heating section and the humidifying section were controlled.

[0006]

However, in the prior art, the refrigerator is always operated at a predetermined output because the refrigerator is used. Therefore, for example, even when the humidity is insufficient and humidification is required, the humidification is performed after dehumidifying and cooling, and then humidification to a predetermined humidity. As a result, energy consumption is large and wasteful. In addition, the use of refrigerators has led to an increase in installation space. Furthermore, since the control is performed only by the temperature and humidity signal of the temperature and humidity sensor provided in the processing container for performing the resist coating process, it takes time to reach a predetermined temperature and humidity. In addition, a refrigerator conventionally used in this type of apparatus is not preferable for the global environment because it uses Freon as a refrigerant.

[0007] The present invention has been made in view of the above points, and it is possible to control the temperature and humidity with less energy and space than before, and to reduce the time required to reach a predetermined temperature and humidity. It is an object of the present invention to provide a new and shorter substrate processing apparatus to solve the above problem.

[0008]

According to one aspect of the present invention, there is provided an apparatus for processing a substrate in a processing container, comprising: an air supply device for supplying air to the processing container; A first temperature / humidity sensor for detecting temperature / humidity in the processing container, a second temperature / humidity sensor provided on an outlet side of the air supply device, and a second temperature / humidity sensor provided on an inlet side of the air supply device. 3, a cooling and dehumidifying unit for cooling and dehumidifying the air introduced from the inlet side using a Peltier element, and heating the air cooled and dehumidified by the cooling and dehumidifying unit. A heating unit for performing, a humidifying unit for humidifying the air heated by the heating unit, a blower for blowing the air humidified by the humidifying unit to the processing container, the cooling and dehumidifying units, and heating. And a control device for controlling the humidification unit, the control device, 2 based on the difference between the temperature and humidity set at the location of the temperature and humidity sensor 2, that is, the temperature and humidity set at the outlet of the air supply device and the temperature and humidity detected by the third temperature and humidity sensor. Characterized in that it is configured to control the unit or the humidifying unit,
A substrate processing apparatus is provided.

In the substrate processing apparatus according to the first aspect, the temperature and humidity set at the outlet side of the air supply device and the temperature and humidity detected by the third temperature and humidity sensor provided at the inlet side of the air supply device. The cooling and dehumidifying section, the heating section and the humidifying section are controlled based on the difference. Therefore, for example, when the temperature and humidity in the processing container are set to 23 ° C. and 45% (RH), the temperature and humidity on the outlet side of the air supply device are set to 23% in principle.
C., 45% (RH), and perform necessary control. In this case, the control of the cooling and dehumidifying unit, the heating unit, and the humidifying unit is controlled based on the difference from the inlet side of the air supply device. That is,
For example, the air introduced from the inlet side of the air supply device is 2
In the case of 4 ° C. and 50% (RH), cooling at 1 ° C. and dehumidification of 5% are performed as a result, but the cooling and dehumidifying unit performs cooling and dehumidification using a Peltier element. Therefore, it is possible to perform the dehumidification process to the amount of water required for the set target value. Therefore, only the minimum necessary energy is required.

In some cases, the air supply device is installed at a position distant from the processing container, and air is supplied from the outlet side of the air supply device to the processing container using a duct. Temperature and humidity may change depending on the surrounding environment while flowing through the duct. In this case,
Due to such disturbance, the temperature and humidity in the processing container may not reach the predetermined temperature and humidity. However, since the temperature and humidity in the processing container are monitored by the first temperature and humidity sensor that detects the temperature and humidity in the processing container, the temperature and humidity on the outlet side of the air supply device, the temperature and humidity in the processing container, If there is a difference between them, the temperature and humidity in the processing container are adjusted by changing the setting of the temperature and humidity on the outlet side of the air supply device. in this way,
A control point is set on the outlet side of the air supply device, and a temperature / humidity sensor is installed on the inlet side of the processing container and the air supply device, and control is performed based on a difference from a set target value. It is possible to shorten the time until the temperature and humidity in the inside reach a predetermined value as compared with the conventional case.

Further, since the cooling and dehumidifying section of the air supply device is configured to cool using a Peltier element, the cooling and dehumidifying section can be made more compact as compared with the configuration using a conventional refrigerator, and can save more space than before. Can be achieved. Of course, since it is Freonless, it is preferable for the global environment.

According to a second aspect of the present invention, there is provided an apparatus for performing a predetermined process on a substrate in a processing vessel, wherein the apparatus is installed in a relatively low humidity clean room and has a relatively high humidity processing vessel. An air supply device configured to supply air to the processing container, a first temperature / humidity sensor configured to detect temperature / humidity in the processing container, and an outlet side of the air supply device. A second temperature and humidity sensor provided on the side, a cooling and heating unit for cooling and heating the air in the clean room introduced from the inlet side of the air supply device, and cooled or heated by the cooling and heating unit. A humidifying unit that humidifies the heated air, a blower that blows the air humidified by the humidifying unit to the processing container, and a control device that controls the cooling and heating unit and the humidifying unit. The device is a second hot and humid Based on the temperature and humidity detected by the sensor, characterized in that it is configured to control at least the cooling and heating unit or humidifier, the substrate processing apparatus is provided.

In the substrate processing apparatus according to the second aspect, the substrate is installed in a clean room having a relatively low humidity, and the substrate is processed in a processing container having a relatively high humidity, that is, a higher humidity atmosphere than the atmosphere in the clean room. An apparatus for processing, in which air in the clean room having a relatively low humidity is introduced into an attached air supply apparatus. Therefore, basically, the air supply device does not perform the dehumidification process. According to the substrate processing apparatus of the second aspect, the cooling / heating unit or the humidifying unit is controlled based on the temperature and humidity detected by the second temperature / humidity sensor provided on the outlet side of the air supply device.
Therefore, for example, if the temperature and humidity in the clean room are 24
℃, 40% (RH), the temperature and humidity in the processing vessel is 23 ℃,
In the case of 45% (RH), the temperature and humidity on the outlet side of the air supply device are set to 23 ° C. and 45% (RH), and necessary cooling and humidification control is performed. Therefore, it is possible to remarkably save energy as compared with a system in which the humidity is reduced to the dew point temperature using a conventional refrigerator. Further, since only necessary cooling and humidification control is performed, the time required to reach a predetermined temperature and humidity atmosphere is short.

Of course, in the substrate processing apparatus according to the second aspect, as described in the third aspect, a third temperature / humidity sensor is further provided on the inlet side of the air supply device, and the control device is provided with the second temperature / humidity sensor. Temperature and humidity set at sensor location and 3rd
If the cooling and heating unit and the humidifying unit are configured to be controlled based on the difference between the temperature and the humidity detected by the temperature and humidity sensor, the energy saving effect is higher as in the case of claim 1,
It is possible to perform control in which the time required to reach a predetermined temperature and humidity is short.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show the appearance of the coating and developing apparatus according to the present embodiment. FIG. 1 shows a plan view, FIG. 2 shows a front view, and FIG. 3 shows a back view.

As shown in FIG. 1, the coating and developing apparatus 1 carries a cassette C containing, for example, 25 wafers W into and out of the coating and developing apparatus 1 from outside, and transfers wafers W to and from the cassette C. Station 2 for loading and unloading wafers, processing station 3 in which various single-wafer processing apparatuses for performing predetermined processing on wafers W are arranged, processing station 3 and exposure apparatus (not shown)
And an interface unit 4 for receiving and transferring the wafer W between them.

In the cassette station 2, a plurality of cassettes C are placed at predetermined positions on the cassette mounting table 10.
1 with the entrance facing the processing station 3 in the X direction (FIG. 1).
It can be placed in a line in the vertical direction. A wafer carrier 11 movable in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction; vertical direction) of the wafers W accommodated in the cassette C is movable along the transfer path 12. Each cassette C can be selectively accessed.

The wafer carrier 11 is also rotatable in the θ direction.
And it is configured to allow transfer of the wafer to access alignment device 52 and the extension unit 53 belonging to the multi-stage unit of the processing unit group G ₃ in.

In the processing station 3, a main transfer device 23 having three tweezers 20, 21, and 22 for holding a wafer W in three stages in the upper and lower stages is disposed at a central portion thereof. The processing apparatuses constitute a processing apparatus group in which the processing apparatuses are stacked and arranged in multiple stages. In the coating and developing processing apparatus 1 according to the present embodiment, five processing apparatus groups G ₁ , G ₂ , G ₃ , G ₄ and G ₅ can be arranged, and the first and second processing apparatus groups G ₁ , G ₂ is disposed on the front side of the coating and developing apparatus 1, the third processing unit group G
₃ is located on the cassette station 2 side,
Processing unit group G ₄ of the are arranged in the interface unit 4 side. Further the fifth processing unit group G ₅ shown by the broken line can be arranged on the rear side of the coating and developing apparatus 1.

As shown in FIG. 2 in the first processing unit group G _1, 2 single spinner type processing apparatus for performing predetermined processing by placing the wafer W on a spin chuck in a cup CP, for example, a resist coating unit 30 and The developing devices 31 are stacked in two stages from the bottom. Even the second processing unit group G _2, a resist coating unit 40 and the developing unit 41 are two-tiered from the bottom in order.

As shown in the third processing unit group G ₃ in FIG. 3, a cooling unit 50 for cooling the oven type processing units, for example, a wafer W to perform a predetermined process placed on a mounting table of the wafer W, the resist Adhesion processing device 51 for performing hydrophobic treatment for improving fixability, wafer W
An alignment device 52 for performing the alignment of the wafer W, an extension device 53 for holding the wafer W on standby, a pre-baking device 54 for heating the wafer W after applying the resist liquid,
55, post-baking apparatuses 56 and 57 for heating the wafer W after the development processing are stacked, for example, in eight stages from the bottom. In the fourth processing unit group G ₄ , a cooling device 60, an extension cooling device 61 for cooling the waiting wafer W, an extension device 62,
A cooling device 63, post-exposure baking devices 64 and 65 for heating the exposed wafer W,
Post baking devices 66 and 67 are stacked in order from the bottom, for example, in eight stages. The combination of these processing units and the order of lamination can be set arbitrarily.

A wafer carrier 71 is provided at the center of the interface section 4. The wafer transfer body 71, like the wafer transfer body 11, has an X along the transfer path 72.
Is configured such that rotation of the moving and θ direction in the direction of movement and the Z direction (vertical direction) is freely, the extension cooling unit 61 belonging to the fourth processing unit group G _4, and the extension device 62 The wafer can be exchanged with a peripheral exposure device 73 provided on the back surface side of the interface unit 4 for removing the resist film at the peripheral portion of the wafer.

As shown in FIG. 2, the coating and developing treatment apparatus 1 is usually installed on a grating 74 constituting a floor in a clean room, and an air supply device is provided in an underfloor space below the grating 74. 81 are installed.

The air supply device 81 has the structure shown in FIGS. That is, the inlet 8 in the chamber 82
In order from the 3 side to the outlet 84 side, a filter 85 for collecting particles, a cooling and dehumidifying section 86 for cooling and dehumidifying the air that has passed through the filter 85, and a cooling and dehumidifying air. A heating unit 87 for performing a heating process, a humidifying unit 88 for humidifying the heated air, and a blower 89 for supplying the humidified air from the outlet 84 to, for example, the resist coating device 30 are provided in the chamber 82. It is provided within.

The cooling and dehumidifying section 86 has a large number of fins 86b in a casing 86a installed in the chamber 82, as shown in detail in FIG. These fins 86b are attached so as to thermally conduct with a cooling body 86c using a Peltier element attached to both sides of the casing 86a. And cooling body 8
A water cooling plate 86d for cooling the heat radiating portion of the cooling body 86c is attached to the outside of 6c. This water cooling plate 86
Cooling water such as tap water is circulated and cooled in d. In the dehumidification control, fine control can be performed by electrical control of the Peltier element, for example, output control of a power supply.

The heating section 87 uses an electric heater. The humidifying section 88 is of a type in which pure water is heated and evaporated by an electric heater. Humidifier 8
7. Both the heating unit 88 and the heating unit 88 can be finely adjusted by electrical control such as output control of a power supply.

For example, a first temperature / humidity sensor 91 for detecting the temperature / humidity in the cup CP is provided near the cup CP of the resist coating device 30. At the outlet 84 of the air supply device 81, a second temperature / humidity sensor 92 for detecting the temperature and humidity of the air passing through the outlet is provided, and a second temperature sensor 92 is provided downstream of the filter 85 downstream of the inlet 83 of the air supply device 81. Is provided with a third temperature / humidity sensor 93 for detecting the temperature / humidity of the air passing through the entrance. The temperature and humidity detected by the second temperature and humidity sensor 92 and the third temperature and humidity sensor 93 are sent to the control device 94. The temperature / humidity signal from the first temperature / humidity sensor 9 is once sent to a control device 99 of the main body of the coating and developing treatment device 1, and, if necessary, the control device 99 controls the air supply device 81. Device 9
4 to output a feedback control signal. The air exiting from the outlet 84 is supplied to the cup CP of the resist coating device 30 through a duct 95, and the atmosphere in the resist coating device 30 is changed to an exhaust duct 96.
Through the exhaust gas, for example, to a factory centralized exhaust system (not shown).

The controller 94 is based on the difference between the target temperature and humidity set at the second temperature and humidity sensor 92 and the temperature and humidity introduced into the air supply device 81 detected by the third temperature and humidity sensor. , The cooling and dehumidifying unit 86, the heating unit 87, and the humidifying unit 88. The control device 94 is configured to control the cooling and dehumidifying unit 86, the heating unit 87, and the humidifying unit 88 also by a signal from the control device 99. Of course, the second temperature / humidity sensor 9
2. The temperature / humidity signal detected by the third temperature / humidity sensor 93 is sent to the control device 94 at all times. Further, the temperature / humidity signal from the first temperature / humidity sensor 91 may be directly transmitted to the control device 94 as needed or constantly.

The coating and developing apparatus 1 according to the present embodiment
Is configured as described above. Next, the operation and the like will be described. First, in the cassette station 2,
Unprocessed wafer W housed in the cassette C on the cassette mounting table 10 is first taken out by the wafer transfer body 11 is carried into the alignment device 52 included in the third processing unit group G _3. Wafer W which predetermined alignment has been completed is taken out by the main carrier unit 23 is carried into the adhesion processing unit 51, where it is hydrophobized, turn to the cooling unit 50 included in the third processing unit group G ₄ And cooled to a predetermined temperature.
Then the wafer W is transferred to the resist coating unit 30 belonging to the first processing unit group G _1, a resist film of predetermined thickness on the surface by a spin coating method is formed.

Since the thickness of the resist film is sensitive to temperature and humidity, the temperature atmosphere in the cup CP must be strictly controlled so as to have a predetermined temperature and humidity. In this regard, in the present embodiment, since air controlled at a predetermined temperature and humidity is supplied from the air supply device 81, a resist film having a desired film thickness can be formed.

As described above, the temperature and humidity of the air supply device 81 are controlled by the temperature and humidity detected by the second temperature and humidity sensor 92, that is, the temperature of the air set at the outlet 84 of the air supply device 81. Since the control is performed based on the difference between the humidity and the temperature and humidity detected by the third temperature and humidity sensor, that is, the temperature and humidity introduced into the air supply device 81, control with high energy saving effect is performed.

That is, the temperature and humidity in the cup CP are set to 23
When the temperature and the temperature are set to 45 ° C. and 45% (RH), necessary control is performed by setting a target so that the value detected by the second temperature and humidity sensor 92 becomes 23 ° C. and 45% (RH). The control of the cooling and dehumidifying unit 96, the heating unit 87, and the humidifying unit 88 is controlled based on the difference from the inlet side of the air supply device 81. That is, for example, when the air introduced from the inlet side of the air supply device is at 24 ° C. and 50% (RH), 1
Cooling and dehumidification of 5% are performed by cooling at 5 ° C. Since the cooling and dehumidifying unit uses a Peltier element to cool and dehumidify, it is necessary to lower the temperature to the dew point as in the conventional refrigerator. However, it is possible to perform the dehumidification process to the moisture amount required for the target value. Therefore, only the minimum necessary energy is required.

For example, if attention is paid to humidity, instead of performing the cooling and dehumidifying process to the vicinity of the dew point temperature as in the related art, the control is performed based on the difference between the inlet side and the outlet side of the air supply device 81. Therefore, the time required to reach a predetermined target value is shorter than that of the related art, and so-called “rise” is faster. Even if the entire apparatus is viewed, since a conventional refrigerator is not used, the apparatus can be made compact and the installation space can be saved.

By the way, due to the layout, the air supply device 81 and the resist coating device 30 are installed separately from each other, and the temperature of the air subjected to the temperature and humidity treatment that has exited the outlet 84 changes in the course of flowing through the duct 95. Then, as a result, the temperature and humidity in the cup CP may not reach a predetermined value. This means that the first temperature sensor 91 always has the cup C
Since the temperature and humidity in P are detected and sent to the control device 99, it can be confirmed. Also, if such a difference occurs,
An appropriate notification signal may be output to the outside. In any case, in such a case, the set target value may be offset at the second temperature sensor 92 and reset so that the temperature and humidity in the cup CP become a predetermined value.
The control may be performed automatically by the control device 99. Of course, the control device 94 may be configured so that all the functions of the control device 99 are performed by the control device 94.

The air supply device 81 performs cooling, dehumidification, heating, and humidification on the introduced air. However, the substrate such as a resist coating process is performed under a higher humidity than the introduced air. When performing the processing, FIGS. 7 and 8
May be used. That is, under the condition that the dehumidification process is not required, further energy saving and space saving can be achieved by using the simplified air supply device 101.

The air supply device 101 shown in FIGS.
Is a filter 105 for collecting particles in order from the inlet 103 side to the outlet 104 side in the chamber 102, a cooling / heating unit 106 for cooling / heating the air that has been cleaned through the filter 105, A humidifying unit 107 for humidifying the cooled or heated air, and a blower 108 such as a DC fan for supplying the humidified air from the outlet 104 to, for example, the resist coating device 30 are provided in the chamber 102. ing.

The cooling and heating unit 106 includes a cooling unit 106a and a heating unit 106b. The cooling unit 106a has a configuration using a Peltier element, like the cooling and dehumidifying unit 86 described above. The heating unit 106b uses an electric heater that generates heat by power supply.

When this air supply device 101 is used,
The temperature / humidity sensor detects a temperature / humidity inside the cup CP, for example, near the cup CP of the resist coating device 30.
Of the air supply device 101
Is provided with a second temperature / humidity sensor 112 for detecting the temperature / humidity of the air passing through the outlet. The temperature and humidity detected by the first temperature and humidity sensor 111 and the temperature and humidity detected by the second temperature and humidity sensor 112 are respectively determined by the controller 1
It is sent to 13. The air that has exited from the outlet 104 passes through the duct 115 through the cup CP of the resist coating device 30.
And the atmosphere in the resist coating apparatus 30 is exhausted through an exhaust duct 116 to a factory centralized exhaust system (not shown).

The controller 113 controls the cooling and heating unit by feedback control so that the temperature and humidity of the air from the outlet 104 of the air supply device 101 detected by the second temperature and humidity sensor 112 become the set target temperature and humidity. The humidifying unit 106 is controlled. Of course, the temperature / humidity signals from the first temperature / humidity sensor 111 and the second temperature / humidity sensor 112 are always sent to the control device 113.

According to the air supply apparatus 101 having such a configuration, since the humidity in the cup CP is higher than the air introduced from the inlet 103, the dehumidification process itself is not necessary. According to the air supply device 101, since the cooling unit 106a in the cooling and heating unit 106 is a cooling method using a Peltier element, it is possible to perform the minimum necessary cooling and use a conventional refrigerator. The energy saving effect is higher than that of the first embodiment, and the time to reach the target temperature and humidity is shorter. Of course, the entire device can be made compact.

When the air supply device 101 is used, a third temperature / humidity sensor is installed on the inlet 103 side of the air supply device 101, as in the case of the air supply device 81. As in the case of (1), the control device 113 controls the cooling and heating unit 106 and the humidifying unit 1 based on the difference from the temperature and humidity set at the location of the second temperature and humidity sensor 112.
07 may be configured to be controlled. Further, similarly to the case of the air supply device 81, the signal from the first temperature / humidity sensor 111 is once sent to the control device of the coating and developing processing device 1 so that the signal of the coating and developing processing device 1 is When the control device detects the difference from the final target value, that is, the target temperature and humidity in the cup CP, the control device 113 may be configured to output a necessary control signal.

Although the above embodiment has been described in connection with the case where air is supplied to the resist coating device in the coating and developing processing device, the present invention is not limited to this. Of course, there is an application when supplying air. In addition, although an example using a wafer as the substrate has been described, the present invention is not limited to such an example.
For example, it can be applied to an LCD substrate or another substrate.

[0043]

According to the substrate processing apparatus of claims 1 to 3,
Compared with the conventional system of performing dehumidification cooling using a refrigerator, the energy saving effect is high, and the time until the inside of the processing container reaches a predetermined temperature and humidity is short. In addition, the apparatus can be made more compact than before, and the space saving effect is high. It is also favorable for the global environment.

[Brief description of the drawings]

FIG. 1 is a plan view of a coating and developing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the coating and developing apparatus of FIG. 1;

FIG. 3 is a rear view of the coating and developing apparatus of FIG. 1;

FIG. 4 is an explanatory diagram schematically showing a cross section of an air supply device used in the coating and developing apparatus of FIG. 1;

FIG. 5 is an explanatory diagram illustrating a configuration of the air supply device of FIG. 5;

FIG. 6 is a perspective view of a cooling and dehumidifying unit used in the air supply device of FIG.

FIG. 7 is an explanatory diagram schematically showing a cross section of another air supply device.

FIG. 8 is an explanatory diagram illustrating a configuration of the air supply device of FIG. 7;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 coating / developing device 30, 40 resist coating device 81 air supply device 83 inlet 84 outlet 86 cooling / dehumidifying unit 87 heating unit 88 humidifying unit 89 blower 91 first temperature / humidity sensor 92 second temperature / humidity sensor 93 third Temperature / humidity sensor 94 Controller CP Cup W Wafer

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Nobuyuki Jinnai 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. Kumamoto Office F-term (reference) LA01 LA13 LA18 LA19

Claims (3)

[Claims] 1. An apparatus for processing a substrate in a processing container, comprising: an air supply device for supplying air to the processing container; and a first temperature and humidity sensor for detecting temperature and humidity in the processing container. A second temperature / humidity sensor provided on an outlet side of the air supply device, a third temperature / humidity sensor provided on an inlet side of the air supply device, and an air introduced from the inlet side. A cooling and dehumidifying unit that performs cooling and dehumidifying using a Peltier element, a heating unit that heats the air that has been cooled and dehumidified by the cooling and dehumidifying unit, and humidifies the air that is heated by the heating unit A humidifying unit, a blower for blowing air humidified by the humidifying unit to the processing container, and a control device for controlling each of the cooling and dehumidifying units, a heating unit and a humidifying unit, and the control device includes: The temperature and humidity set at the location of the second temperature and humidity sensor and the third temperature and humidity sensor A substrate processing apparatus configured to control at least the cooling and dehumidifying unit, the heating unit, or the humidifying unit based on a difference between the temperature and the humidity detected by the cooling unit. 2. An apparatus for performing a predetermined process on a substrate in a processing container, wherein the device is installed in a relatively low humidity clean room and processes the substrate in a relatively high humidity processing container. An air supply device for supplying air to the processing container, a first temperature and humidity sensor for detecting the temperature and humidity in the processing container, and a second air supply device provided at an outlet side of the air supply device. 2, a cooling / heating unit for cooling and heating the air in the clean room introduced from the inlet side of the air supply device, and humidifying the air cooled or heated by the cooling / heating unit. A humidifying unit for performing the following, a blower for blowing the air humidified by the humidifying unit to the processing container, and a control device for controlling the cooling and heating unit and the humidifying unit, the control device, the second Detected by temperature and humidity sensor A substrate processing apparatus configured to control at least the cooling / heating unit or the humidifying unit based on the temperature and humidity to be performed. 3. A third temperature / humidity sensor is provided on the inlet side of the air supply device, and the control device detects the temperature / humidity set at the location of the second temperature / humidity sensor and the third temperature / humidity sensor. 3. The substrate processing apparatus according to claim 2, wherein at least the cooling / heating unit or the humidifying unit is controlled based on a difference between the temperature and the humidity. 4.