JP2000150092A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket for burn-in embodied in a compact structure. SOLUTION: An IC socket 10 is equipped with a base member 12 where a support table 14 to admit placing of an IC thereon is provided protrusively, a pair of link members 20 in approx. L-form supported rotatably on a rotary shaft 30 positioned along the side of the support table 14 and isolated from the surface of the base member 12 and having a first leg 24 extending beyond the forefront face of the support table 14 and a second leg 26 extending as going apart from it 14, a rocking arm 14 supported rotatably by the first leg 24 of each link member 20 and having a drive arm 48 and a pressurizing arm 46 fitted with a pressure pad 50 to press the IC, and a cover 60 to rotate the link members 20 when movement is made toward the base member 12. At this time of rotating the link members 20 by the cover 60, the rocking arm 40 is guided by a guide rod 70 protruding from the cover 60 and a guide slot 72 formed in the drive arm 48.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket mounted on a socket board for mounting an IC in a test apparatus and mounting an IC having a large number of electrodes on one surface.

[0002]

2. Description of the Related Art It is becoming common practice to screen an IC having an initial failure by burning in the IC alone and forcibly causing an initial failure in a short period of time. The burn-in of such an IC is performed by mounting the IC on a board called a socket board or a burn-in board on which a large number of IC sockets are mounted, and setting the board on which these ICs are mounted in a burn-in device. I have. The burn-in device places the IC in a high temperature state of, for example, about 125 ° C., and applies the IC at a level of about 1.2 to 1.6 times the rated voltage / signal via the substrate and the IC socket. In this way, by burning in an IC alone, an IC having an initial failure can be identified and eliminated in advance, and the cost can be reduced at a lower cost than burning in each expensive board on which the IC is mounted. it can.

When the completed IC is mounted on an IC socket for burn-in, the electrodes of the IC are aligned with the corresponding contacts of the IC socket, and then the electrodes of the IC are pressed against the contacts of the IC socket. IC
And the test apparatus are electrically connected to each other. After the burn-in test, the IC is removed from the IC socket. It is common to manually attach and remove these ICs.

[0004]

As the package of the IC becomes smaller and the density of the electrodes increases, the mounting and mounting of the IC on the IC socket requires complicated operations. In particular, the IC socket is downsized,
When the socket is mounted on the board, each IC
It is desirable to form the socket in a compact structure and to mount it by mechanical operation instead of manual operation. I
The C socket is formed in such a compact structure,
Furthermore, when mounting an IC by mechanical operation, it is necessary to open the IC socket widely. However, in an IC socket having a compact structure, it is difficult to open the IC socket largely because the dimensions of each member and the moving distance thereof are short. If the size of each member is made large in order to make the opening large, and if each member is made large, the IC socket becomes large. The present invention has been made in view of such circumstances, and in particular, to provide an inexpensive IC socket having a simple structure in which an IC having a large number of electrodes arranged on one surface can be easily and efficiently attached and detached. With the goal.

[0005]

According to the present invention, there is provided an IC socket for mounting an IC having a large number of electrodes arranged on one surface thereof, the IC socket being mounted on a socket board on which the IC is installed in a test apparatus. The base on which the electrode-side surface is placed protrudes from the front side, and the back side is arranged along the base member attached to the socket board and the opposite end of the support base, and each A fulcrum rotatably supported on the base member on a common axis extending along one side of the support pedestal and spaced a predetermined distance from the surface of the base member; A pair of link members having a first leg portion extending beyond the distal end surface of the portion and a second leg portion extending from the fulcrum portion in a direction away from the support base, and disposed between the pair of link members. Of each link member An intermediate portion rotatably supported by one leg portion, a pressing arm portion having a pressure pad for pressing the IC against the support surface at a tip portion, and a driving arm portion extending from the intermediate portion to the opposite side of the pressing arm portion And a biasing arm in a direction away from the surface side of the base member,
When moving toward the surface side of the base member, an operating member that presses the second leg of each link member and rotates about the fulcrum, and one of the operating member and the swing arm member It has a protruding guide rod and a guide slot formed on the other side for guiding this guide rod, and from a position where the pressure pad presses the IC on the support base when the operating member rotates each link member. Guide means for guiding the swing arm member to a position where the pressure pad completely exposes the distal end face of the support base to the outside, and the first leg of each link member is configured such that the operating member is moved from the base member The intermediate portion of the swing arm member is supported at a position overlapping with the distal end surface of the support base when disposed at the separated position, and when the operating member is disposed at a position close to the base member, the distal end surface is From said one IC socket support in a retracted position in the direction of the side is provided.

[0006]

1 to 4 show an IC socket 10 according to a preferred embodiment of the present invention. The IC socket 10 is formed as an open-top type socket, and is particularly suitable for mounting and removing the IC 8 as shown in FIG. 5 from above using a mechanical mounting device such as a loading robot. ing. In the present embodiment, the IC 8 mounted on the IC socket 10 has a flat package structure in which a large number of electrodes 6 are arranged in a grid on one surface. The electrode 6 is formed of a spherical solder ball as shown in FIG. 4A or a flat land as shown in FIG. 4B, or has an appropriate shape such as a pin structure (not shown). It may have an electrode structure.

The IC socket 10 has a base member 12 attached to a board (not shown) such as a socket board or a burn-in board. The base member 12 has a support base 14 on which the IC 8 is mounted protruding from the upper surface side, and is attached to the substrate on the lower back surface. It is preferable that a front end surface of the support base 14 supporting the IC 8 is formed flat, and a projecting piece for positioning the IC socket 10 on a substrate is projected from the back surface of the base member 12.

As shown in FIGS. 2 and 3, the base member 12 has a large number of contacts 16 arranged so as to penetrate the support base 14 in the vertical direction in the figure. These contacts 16 have a tail portion on the lower end side protruding from the back surface of the base member 12, and a contact portion 16 a on the upper end side is connected to the support base 14.
From above. The tail part is a base member 1
2 is guided by a movable locator (not shown) relative to 2 and is aligned with the solder pads of the substrate. In addition, contact part 1
6A, when mounting an IC in which the electrode 6 is formed of a solder ball, the contact 6a is formed in a Y-shape which increases the contact area as shown in FIG. In the case of mounting an IC formed by the method shown in FIG.
It is preferable to form a pin as shown in FIG. These contact portions 16a are guided through through holes of a guide plate 18 placed on the distal end surface of the support base portion 14, and are arranged in an accurate position with respect to each electrode 6.

Further, a pair of link members 20 are disposed on the base member 12 along opposing ends of the support base 14. These link members 20 are rotatably supported on the base member 12 on a common axis extending along the side of the support base 14 and at a predetermined distance from the surface of the base member 12. It has a part 22. In the present embodiment, these fulcrum portions 22 are rotatably mounted on one side of the support base 14, that is, on a rotating shaft 30 supported by the base member 12. The axis of the rotating shaft 30 is aligned with the support base 14 on which the IC 8 is mounted.
Are arranged at positions shifted laterally from the front end surface of the. From the fulcrum portion 22 of each link member 20, the first leg portion 24 extends substantially upward beyond the tip end surface of the support base portion 14, and further, the second leg portion 26 extends in a direction away from the support base portion 14. Extend almost laterally. Therefore, this link member 20
The long first leg portion 24 and the short second leg portion 26 form an overall substantially L-shaped shape.

Each of the link members 20 is urged by a spring (not shown) in a direction in which the second leg 24 is separated from the surface of the base member 12. On the opposite side of the second leg 26, the link member 20 is in contact with the base member 12.
A stopper 28 is provided for preventing the rotation of the motor 20 from a predetermined position. At a position where the stopper portion 28 contacts the surface of the base member 12, the first leg 24 extends from the end of the support base portion 14 beyond the distal end surface of the support base portion 14, and It is arranged in an upright state. The second leg 26 is formed in a tapered shape. When the stopper 28 comes into contact with the surface of the base member 12, a gap is formed between the second leg 26 and the surface of the base member 12. The gap formed between the second leg 26 and the surface of the base member 12 is such that the link member 20
When rotating about the center, interference between the second leg 26 and the base member 12 is prevented.

In the present embodiment, the pair of link members 20, 20 are formed in an integral structure in which the second legs 26, 26 are connected by a connecting portion 32. FIG.
The notches 34 formed in the second leg portions 26 and the connecting portions 32 shown in FIG. 3 are for preventing interference with a cover member 60 described later.

A swing arm member 40 is disposed between the pair of link members 20, 20. In the intermediate portion 42 of the swing arm member 40, a pivot pin 44
The link members 20 are pivotally attached to the distal ends of the first leg portions 24 of the link members 20 by these pivot pins 44. This pivot pin 44 is arranged parallel to the rotation axis 30. Further, from the intermediate portion 42, a pressing arm portion 46 and a driving arm portion 48 extend in opposite directions to each side. A pressure pad 50 is pivotally attached to the distal end of the pressing arm 46. A pivot pin 52 for pivotally connecting the pressing arm 46 to the pressure pad 50 includes a pivot pin 44.
When the pair of link members 20, 20 and the swing arm member 40 rotate about the rotation shaft 30 and the pivot pin 44, respectively, the pressure pad 50 Support base 14
Of the IC 8
Can be pressed with a parallel and uniform force.

In order to rotate the pair of link members 20 about the rotation shaft 30, a cover member 60 acting as an operating member surrounds the periphery of the support base 14 and the pair of link members 20. I have. This cover member 60 is
It has an outer shape overlapping the outer peripheral portion of the base member 12, and the opening 62 is open upward. The swing arm member 40 and its pressure pad 50 can freely enter and exit through the opening 62. Furthermore, this opening 6
The IC 8 can be placed on the distal end surface of the support base 14 via the base 2 and the tested IC 8 can be removed from the support base.

The cover member 60 has four guide projections 54 projecting from the surface of the base member 12 in this embodiment.
And guide holes 64 formed at four corners of the cover member 60 so as to open downward, and the base member 1
2 can be moved substantially parallel to the surface of the base member 12 between an upper position separated upward from the surface of the base member 2 and a lower position close to the surface of the base member 12. The cover member 60 is urged toward an upper position by, for example, a coil spring (not shown) housed in each guide hole 64. The lower end of this coil spring is
4 or the base member 12
It may be supported by the surface of.

From the inner surface of the cover member 60, toward the connecting portion 32 connecting the pair of link members 20, 20,
The protrusion 66 protrudes. In the present embodiment, the projection 66 is provided near the lower end of the cover member 60. The tip of the protrusion 66 is smoothly curved, and can slide smoothly along the upper surface of the connecting portion 32 when the cover member 60 moves between the upper position and the lower position. Between the protrusion 66 and the upper end of the cover member 60, when the swing arm member 40 swings, the drive arm 4
A concave portion 68 is formed so as not to interfere with 8.

Further, the cover member 60 and the drive arm 48 of the swing arm member 40 are connected by guide means. The guide means of the present embodiment includes a guide rod 70 provided on the cover member 60 and a guide slot 72 formed between the ends of the drive arm member 48. The guide rod 70 is connected to the rotation shaft 30 and the pivot pin 44 described above.
And both ends thereof are supported by the cover member 60. In addition, the guide slot 72 is
The guide rod 70 extends from the proximal end side close to the distal end to the distal end side, and guides the guide rod 70 between a position close to the pivot pin 44 and a position apart therefrom.

When the cover member 60 is located at the upper position, the guide rod 70 is located at the position farthest from the pivot pin 44, and therefore, the pressure pad 5
0 and the IC 8 on the guide plate 18 with a large force.
Can be pressed. When the pressure pad 50 contacts the guide plate 18 or the IC 8 mounted on the guide plate 18, the cover member 60 is locked to the base member 12 via the guide rod 70 and the drive arm 48. It is prevented from moving further upward from this upper position.

Next, the operation of the IC socket 10 thus formed will be described. This IC socket 10
Is mounted on the substrate of the burn-in device, and the base member 12
Is electrically connected to the test device via a tail portion of a contact 16 protruding from a lower surface of the test device. FIGS. 1 and 2A show a test position of the IC socket 10, that is, I
The arrangement state of each member when C8 is mounted is shown.
FIG. 3C shows an open position, that is, an arrangement state of each member when the IC 8 is attached or detached. FIGS. 2B and 2C and FIGS. 3A and 3B sequentially show the movement of each member when the cover member 60 is pressed downward. However, in order to simplify the drawing, the IC 8 is not shown except for FIG. 3C.

In the test position shown in FIG. 2A, the cover member 60 is disposed at an upper position by the urging force of a coil spring or the like (not shown), and the link member 20 is stopped by the urging force of a spring (not shown). 28 is held in contact with the surface of the base member 12. The first leg portion 24 of each link member 20 is arranged upright from the surface of the base member 12, and the second end portion 26 has its tip end separated from the surface of the base member 12 and It is arranged below the protrusion 66.

The intermediate portion 42 of the swing arm member 40 is disposed at a position vertically overlapping the distal end surface of the support base portion 14 or the guide plate 18, and these first leg portions are connected via a pivot pin 44. It is pivotally held by the tip of 24. The drive arm portion 48 extending from the intermediate portion 42 in the direction of the second leg portion 26 of the link member 20 has its distal end urged upward by a guide rod 70. As a result, the pressing arm portion 46 of the swing arm member 40 urges the pressure pad 50 at the distal end thereof toward the guide plate 18 or the distal end surface of the support base 14, and the electrode 6 of the IC 8 is brought into contact with the contact 16. Close contact with the part. Since the pivot pin 52 for pivoting the pressure pad 50 to the pressing arm 46 is arranged in parallel with the rotation shaft 30 and the pivot pin 44, even when the thickness of the IC 8 is different from each other, the guide plate 18 or the support base is provided. It can be pressed on the part 14 with a uniform force.

When the IC 8 is attached to or removed from the IC socket 10,
A device such as a loading robot (not shown) is lowered from above the IC socket 10 and the cover member 60 is pressed downward.

As shown in FIGS. 2 (B) and 2 (C) and FIGS. 3 (A) and 3 (B), when the cover member 60 descends toward the surface of the base member 12, The protrusion 66 provided on the inner surface presses the second leg 26 of each link member 60 downward via the connecting portion 32, and the guide rod 70 presses the distal end of the drive arm 48 downward. I do.

Each link member 20 rotates clockwise about a rotation shaft 30 as viewed in the drawing. For this reason,
The distal end of the first leg portion 24 rotates the swing arm member 40 clockwise about the pivot pin 44 while moving the intermediate portion 4.
2 is the tip surface of the support base 14 or the guide plate 18
From the position vertically overlapping with the support member 14, the cover member 6 is moved while being drawn to the side of the support base portion 14, and as shown in FIG.
The lower end of the base member 12 or the lower edge of the second leg 26 of the link member 20 reaches an open position where it abuts against the surface of the base member 12. At this time, the distal end of the drive arm 48 is
It moves in the concave portion 68 formed on the inner surface of the cover member 60 and interference with the cover member 60 is prevented.

On the other hand, the guide rods 70 whose both ends are supported by the cover member 60,
When the intermediate portion 4 is rotated in this way around the drive arm 48 while sliding in the guide slot 72,
Move to the vicinity of 2. For this reason, as the cover member 60 descends, the distance between the axes between the guide rod 70 and the pivot pin 44 gradually decreases, and even if the cover member 60 descends only a small distance, the swing arm member 40 moves the pivot pin 44. It rotates largely as a center.

Therefore, the rotation of each link member 20 about the rotation shaft 30 and the rotation of the swing arm member 40 about the pivot pin 44 are combined, so that the cover member Even if the shaft 60 has moved down a small distance, the pressure pad 50 provided at the tip of the pressing arm 46 can be used as shown in FIG.
As shown in FIG. 3 (C), from the test position where the pressing surface is overlapped with the supporting surface of the guide plate 18 and the pressing surface thereof is arranged substantially horizontally, as shown in FIG. It can be largely moved to the open position, which is retracted laterally from the support surface of 18 and is arranged almost vertically upright. In the release position shown in FIG. 3C, the distal end surface of the support base portion 14 or the support surface of the guide plate 18 is largely and completely exposed.
Mounting and removal of C8 can be easily performed.

In the IC socket 10 of the present embodiment, the swing arm member 40 is rotatably supported by the first leg portions 24 of the pair of substantially L-shaped link members 20, and these link members 20 are commonly rotated. The cover member 60 and the oscillating arm member 40, which are rotatable about the driving shaft 30 and actuate the second leg of the link member 20, are provided with a guide rod 70 and a guide slot 72.
By interlocking with each other, the pressure pad provided at the distal end of the swing arm member 40 can be largely moved to form a large opening for mounting and removing the IC 8 even though it has a compact structure. it can.

The guide rod 70 and the guide slot 72 for interlocking the cover member 60 and the swing arm member 40 are different from the above embodiment in that the guide slot 72 is formed in the cover member 60 and the swing arm is formed. A guide rod 70 may be provided on the drive arm 48 of the member 40. Further, the connecting portion 32 for connecting the link members 20 may be omitted, or may be provided in a portion different from the second leg.

[0028]

As is apparent from the above, according to the present invention,
Despite its extremely compact structure, the pressure pad can be largely moved by moving the operating member a short distance, the support base can be exposed to the outside, and the IC can be easily and efficiently attached and detached. An inexpensive burn-in IC socket having a compact structure is provided.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a part of an IC socket according to a preferred embodiment of the present invention by imaginary lines.

2A and 2B are explanatory views showing the movement of each member of the IC socket of FIG. 1, wherein FIG. 2A is a schematic cross-sectional view of a test position in a state where an IC is tested, and FIG. FIG. 4C is a schematic sectional view when the cover member is further lowered, and FIG.

3A is an explanatory view showing the movement of each member of the IC socket shown in FIG. 1; FIG. 3A is a schematic cross-sectional view when the cover member is further lowered from the state of FIG. 2 toward the base member;
(B) is a schematic cross-sectional view when further lowered.
(C) is a schematic sectional view when the front end surface of the support base is completely exposed to the outside.

FIG. 4 is an explanatory diagram showing a contact state between a contact portion of a contact of the IC socket shown in FIG. 1 and an electrode structure of the IC;
(A) is a diagram of a contact state between an electrode formed with solder balls and a Y-shaped contact portion, and (B) is a diagram showing a contact state between a flat electrode land portion and a pin-shaped contact portion.

5A and 5B are explanatory views of an IC that can be mounted on the IC socket of FIG. 1, wherein FIG. 5A is a schematic side view, and FIG.
Schematic sectional view along the -B line.

[Explanation of symbols]

8 IC, 10 IC socket, 12 base member, 1
4 ... Support base part, 16 ... Contact, 16a ... Contact part, 1
8 Guide plate, 20 Link member, 22 Support part, 24, 26 Leg part, 28 Stopper part, 30 Rotation shaft, 32 Connection part, 34 Notch part, 40 ... Harmonic arm member, Reference numeral 42: middle part, 44, 52: pivot pin, 46: pressing arm, 48: driving arm, 50: pressure pad, 54
... Guide projection, 60 ... Cover member, 62 ... Opening, 64
Guide holes, 66: projections, 68: recesses, 70: guide rods, 72: guide slots.

Claims (1)

[Claims] 1. An IC socket mounted on a socket board for mounting an IC on a test apparatus and mounting an IC having a large number of electrodes arranged on one surface, wherein the surface of the IC on the electrode side is mounted. A support member protruding from the front side, and a back side attached to the socket board, and a base member arranged along opposing ends of the support base, each of which is provided on one side of the support base. A fulcrum portion rotatably supported on the base member along a common axis extending along and at a predetermined distance from the surface of the base member; and a fulcrum extending from the fulcrum portion beyond the distal end surface of the support base. A pair of link members having one leg portion and a second leg portion extending from the fulcrum portion in a direction away from the support base portion; and a first leg of each link member disposed between the pair of link members. Rotatably supported in the part A swing arm member having an intermediate portion, a pressing arm portion having a pressure pad for pressing an IC against the support surface attached to the distal end portion, and a driving arm portion extending from the intermediate portion to the opposite side of the pressing arm portion; Actuating member that is urged in a direction away from the front surface side of the base member and presses the second leg of each link member and rotates about the fulcrum when moving toward the front surface side of the base member. And a guide rod protruding from one of the operating member and the swing arm member, and a guide slot formed on the other to guide the guide rod, and when the operating member rotates each link member, Guide means for guiding the swing arm member from a position where the pressure pad presses the IC onto the support base to a position where the pressure pad completely exposes the distal end surface of the support base to the link. Part No. The leg supports the intermediate portion of the swing arm member at a position overlapping with the distal end surface of the support base when the operating member is disposed at a position separated from the base member, and the operating member is positioned close to the base member. When placed in
An IC socket that is supported at a position where it is drawn from the front end surface toward the one side.