JP2000149788A - Manufacture of vacuum airtight container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a vacuum airtight container by which residual gases are sufficiently exhausted and a getter is stored therein for maintaining high vacuum. SOLUTION: A getter box 3 is provided for partially convering an outer surface of a cathode substrate 2 and a projecting portion of an anode substrate 1. A getter housing chamber for housing a getter 5 therein is provided between the getter box 3 and an under surface of the cathode substrate 2. The getter box 3 is sealingly attached to the cathode substrate 2 with a first frit seal 4 while the getter box 3 and cathode substrate 2 are sealingly attached to the anode substrate 1 with second frit seals 6. As a first seal material for the first frit seal 4, a material is used having a working temperature higher than that of a second seal material for the second frit seal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum hermetic container for keeping the inside of a vacuum chamber. In particular, the present invention is suitably applied to a vacuum hermetic container containing a cold cathode such as a field emission device.

[0002]

2. Description of the Related Art In recent years, vacuum microelectronics in which a cold cathode is built in a vacuum hermetic container such as glass and a microscopic vacuum microstructure is integrated has attracted attention. Applications of this vacuum microelectronics include active devices,
Various sensors for detecting magnetism and the like, vacuum airtight containers with built-in cold cathodes used for imaging tubes, electron beam devices for lithography, thin flat panel display devices, and the like have been researched and developed.

In a thin flat panel display device, a plurality of micro cold cathodes correspond to one pixel, and the micro cold cathodes include a field emission device, an MIM type electron emission device,
Various devices using a surface conduction electron-emitting device, a PN junction electron-emitting device, and the like have been proposed. Of these,
The most typical one is Nikkei Electronics, No. 6
54 (1996.1.29) p. This uses a field emission device as known from No. 89-98. As one example, a Spindt-type field emission device in which a cone-shaped emitter is formed on a cathode electrode of a cathode substrate is known. A display device using a field emission device is a field emission display (FE).
D: Field Emission Display).

FIG. 8 is an external view of a display device using a conventional field emission device. In the figure, 71 is an anode substrate, 72
Is a cathode substrate, 73 is a getter box, 74 is a frit seal, and 75 is a chip-cut exhaust pipe.
On the anode substrate 71, an anode electrode and a phosphor layer are already formed on a glass substrate. Cathode substrate 72
In this method, a cathode electrode, a gate electrode, a field emission emitter and the like are already formed on a glass substrate. The anode substrate 71 and the cathode substrate 72 are approximately 200 μm to 500 μm.
They are opposed to each other with a small gap of m and shifted in parallel. A getter box 73 is provided at the left edge of the cathode substrate 72 so as to partially cover the upper surface of the cathode substrate 72 and the protruding portion of the anode substrate 71. The getter box 73 accommodates a getter for adsorbing residual gas in the tube after the evacuation process and maintaining a high vacuum. Anode substrate 71, cathode substrate 7
2 and the getter box 73 are sealed with a frit seal 74. On the inner surface side of the anode substrate 71 and the cathode substrate 72 and at the exposed ends,
An electrode terminal is provided. A tip-cut exhaust pipe 75 protrudes from the getter box 73.

In a conventional method of manufacturing an FED, the interior is evacuated by drawing out gas with a vacuum pump through an exhaust pipe at the time of baking exhaust after sealing with a frit seal 74. However, since the gap between the anode substrate 71 and the cathode substrate 72 is very narrow, gas conductance is poor. As a result, there is a problem that it is not possible to sufficiently exhaust the residual gas attached to the inner wall surface or the like in a short time.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is possible to sufficiently exhaust residual gas as compared with degassing using an exhaust pipe and to achieve high vacuum. It is an object of the present invention to provide a method for manufacturing a vacuum-tight container capable of storing a getter for maintaining the pressure.

[0007]

According to the first aspect of the present invention, there is provided a first substrate, a second substrate provided with a gap from the first substrate, and a second substrate. A method for manufacturing a vacuum-tight container having a getter box forming a getter storage chamber between the getter box and an outer surface, wherein the first and second substrates and the getter box are sealed by a frit seal. A box is attached to the second substrate with a first frit sealing material, and the first substrate and the second substrate to which the getter box is attached are housed in a vacuum chamber,
The substrate and the second substrate to which the getter box is attached are baked and evacuated while keeping the conductance sufficient for vacuum baking degassing to perform the first substrate, and The second substrate to which the getter box is attached is sealed with a second frit seal material having a lower working temperature than the first frit seal material. Therefore, the residual gas can be exhausted sufficiently during manufacturing,
A vacuum-tight container capable of maintaining a high vacuum by the getter can be manufactured. In addition, since it has a complete chipless structure, there is no protruding portion, and the overall shape can be reduced.

According to a second aspect of the present invention, in the method for manufacturing a vacuum-tight container according to the first aspect, the first substrate and the getter box to which the getter box is attached are provided outside the vacuum chamber. Before accommodating the second substrate in the vacuum chamber, the first substrate and the second substrate to which the getter box is attached are respectively aligned with the first substrate after being aligned in the horizontal direction. , A second reference portion is processed and formed, and in the vacuum chamber, the first and second reference portions are horizontally regulated by using a positioning jig, so that the first and second reference portions are controlled.
And the second substrate to which the getter box is attached is aligned in the horizontal direction.
Therefore, the first substrate and the second substrate to which the getter box is attached are positioned with high precision in a limited space and in a vacuum chamber that cannot be freely operated from the outside. After sealing, it can be sealed.

According to a third aspect of the present invention, in the method for manufacturing a vacuum hermetic container according to the first aspect, first and second reference portions are formed, respectively, and the first and second substrates are horizontally moved. Using the first and second fixing jigs for moving and fixing in the directions, before being accommodated in the vacuum chamber, the first substrate and the second substrate to which the getter box is attached, respectively. The positioning is performed by moving the apparatus while being mounted on the first and second fixing jigs, and is fixed to the first and second fixing jigs. The position of the first substrate and the second substrate to which the getter box is attached are aligned by restricting the positions of the first and second reference portions in the horizontal direction by using. Therefore, the first substrate and the second substrate to which the getter box is attached are positioned with high precision in a limited space and in a vacuum chamber that cannot be freely operated from the outside. After sealing, it can be sealed. Further, for the first substrate and the second substrate to which the getter box is attached,
There is no need to process and form the alignment reference part.

According to a fourth aspect of the present invention, in the method for manufacturing a vacuum-tight container according to the first aspect, the first method comprises:
And a convex first reference portion is formed on one of the substrate and the second substrate to which the getter box is attached,
Before accommodating in the vacuum chamber, the first substrate;
And positioning the second substrate to which the getter box is attached in a horizontal direction, and then forming a concave second reference portion on a surface opposed to the convex first reference portion. , In the vacuum chamber, the first and second
By regulating the position in the horizontal direction using the reference part of
The first substrate and the second substrate to which the getter box is attached are aligned in a horizontal direction. Therefore, the first substrate and the second substrate to which the getter box is attached are positioned with high accuracy in a limited space and in a vacuum chamber that cannot be freely operated from the outside. Can be sealed. Further, there is no need for a positioning jig for regulating the positions of the first and second reference portions in the horizontal direction.

According to a fifth aspect of the present invention, in the method for manufacturing a vacuum-tight container according to any one of the first to fourth aspects, the vacuum-tight container has a built-in cold cathode. Therefore, it is possible to manufacture a vacuum-tight container with a built-in cold cathode suitable for a thin flat panel display device or the like.

[0012]

FIG. 1 is a sectional structural view of a first specific example of a vacuum-tight container manufactured by one embodiment of the method for manufacturing a vacuum-tight container according to the present invention. In the figure, 1 is an anode substrate, 2 is a cathode substrate, 3 is a getter box, 4
Denotes a first frit seal, 5 denotes a getter, and 6 denotes a second frit seal.

In this vacuum-tight container, the anode substrate 1 is opposed to the cathode substrate 2 with a small gap and laterally shifted. A getter box 3 is provided so as to partially cover the outer surface of the cathode substrate 2 and the protruding portion of the anode substrate 1. The getter box 3 does not have a chip-cut exhaust pipe 75 as compared with the conventional getter box 73 shown in FIG.

An evaporable and / or non-evaporable getter 5 is provided between the getter box 3 and the lower surface of the cathode substrate 2.
There is a getter storage room where is stored. The getter storage chamber communicates with a gap between the anode substrate 1 and the cathode substrate 2 through a passage formed between the left end of the cathode substrate 2 and the getter box 3. As an evaporable getter, there is a Ba getter. Examples of the non-evaporable getter 5 include Zr, Ti, an alloy of Zr and Al or Vr.
There is a material obtained by sintering (vanadium) powder to form a pellet. Initially, it is covered with a nitride film, but after storage, once activated by heating at a high temperature, the nitride diffuses from the surface and is taken in, and when the alloy surface is exposed on the surface, residual gas is removed. It will be taken inside.

The getter box 3 is sealed to the cathode substrate 2 by a first frit seal 4, and the getter box 3 and the cathode substrate 2 are sealed to the anode substrate 1 by a second frit seal 6. As the second sealing material of the second frit seal 6, a material having a low working temperature is used as in the case of the conventional frit seal 74 shown in FIG. 8, but the first frit seal 4 will be described later. First, a first sealing material having a higher working temperature is used.

A method for manufacturing the above-described vacuum hermetic container will be described. As a first step, a first sealant to be a first frit seal 4 is heated to get a getter 5 on the cathode substrate 2.
Is attached to the getter box 3 containing. A second seal material to be the second frit seal 6 is formed around the superposed surface of the cathode substrate 2 to which the getter box 3 is attached. As a second step, the anode substrate 1 and the cathode substrate 2 with the getter box 3 attached are housed in a vacuum chamber. With the anode surface and the cathode surface facing each other and separated by a distance that has sufficient conductance to perform sufficient vacuum degassing baking processing, degassing is performed by pulling a vacuum inside the vacuum chamber while performing vacuum baking. .

As a third step, in a vacuum chamber,
The anode substrate 1 and the cathode substrate 2 to which the getter box 3 has been attached are aligned in the horizontal direction of the two substrates, and approached while keeping the substrate surfaces parallel to each other.
The second sealant is vacuum heated to the working temperature. A large number of columns are provided on one of the anode substrate and the cathode substrate. In addition, when forming the second sealing material, a support is provided or a glass spacer is placed as needed. While pressing the anode substrate and the cathode substrate to which the getter box 3 is attached from above and below, a vacuum-tight container having a gap of a predetermined width between the anode substrate and the cathode substrate is formed by the heated second sealing material. It is sealed in the formed state.

In the above-described method, since the anode substrate 1 and the cathode substrate 2 can be disposed with a sufficient gap therebetween and evacuated by performing a vacuum baking process, a sufficient degassing effect can be obtained. However, if the first frit seal 4 is melted when heating the second sealing material to be the second frit seal 6, sealing including the getter box 3 becomes difficult. Therefore, as the second sealing material of the second frit seal 6, a material having a lower working temperature is used, but as the first sealing material of the first frit seal 4, a material having a higher working temperature is used. The working temperature for forming the first frit seal 4 to be used is selected to be higher than the working temperature of the second sealing material. An example of a sealing material used for the first and second frit seals 4 and 6 is shown.
As the first sealing material of the first frit seal 4, crystallized glass having a working temperature of 550 ° C. is used, and as the second sealing material of the second frit seal 6, the same working temperature as the conventional one is used. 480 ° C frit glass is used.

FIG. 2 is a sectional structural view of a second specific example of a vacuum-tight container manufactured by one embodiment of the method for manufacturing a vacuum-tight container according to the present invention. In the figure, the same parts as those in FIG. 11 is a cathode substrate, 11a is a through hole, and 12 is a getter box.
In this vacuum-tight container, a getter box 12 is provided so that the anode substrate 1 faces the cathode substrate 11 with a small gap therebetween and partially covers the outer surface of the cathode substrate 2. A getter storage chamber for storing the getter 5 is provided between the getter box 12 and the lower surface of the cathode substrate 11. The getter storage chamber is connected to the anode substrate 1 through the through hole 11a of the cathode substrate 2.
And the gap between the cathode substrate 11.

The getter box 12 is used for the cathode substrate 1
1 is sealed by a first frit seal 4, and the cathode substrate 2 is sealed to the anode substrate 1 by a first frit seal 6. The method of manufacturing the vacuum-tight container is the same as that of the first specific example described with reference to FIG.

FIG. 3 is a sectional structural view of a third example of the vacuum-tight container for explaining one embodiment of the method for manufacturing a vacuum-tight container according to the present invention. FIG. 3A is an exploded perspective view of a vacuum-tight container, FIG. 3B is a partially enlarged view, and FIG. 3C is a partially enlarged view of a modification. In the figure, the same parts as those in FIG. 21 is a cathode substrate, 22 is a step member, 23 is a bottom plate, 24 is a second sealing material, 25 is a cathode substrate, and 25a is a through hole.

As shown in FIGS. 3 (a) and 3 (b), in this vacuum-tight container, a rectangular notch is provided at the left end of the cathode substrate 21 by shaving the cathode substrate 21 or the like. An L-shaped step member 22 having the same thickness as the cathode substrate 21 is arranged in the notch. The anode substrate 1 faces the cathode substrate 21 and the step member 22 with a small gap. A concave portion is formed by the cathode substrate 21 and the step member 22, and a bottom plate 23 is provided on the outer surfaces of the cathode substrate 21 and the step member 22 so as to cover the concave portion. A getter box is formed by the step member 22 and the bottom plate 23, and the capped recess serves as a getter storage chamber, and is directly connected to the anode substrate 1 and the cathode substrate 2.
1 and communicates with the gap.

The cathode substrate 21, the step member 22 and the bottom plate 23 are sealed by the first frit seal 4. The frit seal 4 may be formed only on each joint surface, but in FIG. 3B, the frit seal 4 is formed on the entire cutout surface of the cathode substrate 21. The cathode substrate 21 and the step member 22 are sealed to the anode substrate 1 by the second frit seal 6. With such a structure, the thickness of the getter box can be reduced. As a modification, as shown in FIG. 3C, the through hole 2 is formed in the cathode substrate 25 without using the step member 22.
5a, a bottom plate 23 is provided on the outer surface side of the cathode substrate 25, and a first frit seal 4 is formed using a first seal material.
May be formed as a getter box, and a getter storage chamber in which the getter 5 is stored may be formed.

As a method of manufacturing this vacuum-tight container, as in the first and second specific examples described with reference to FIGS. After the frit seal 4 is formed, the frit seal 4 is placed in a vacuum chamber, the second frit seal 6 is formed by the second sealant 24, and the anode substrate 1 and the cathode substrate 2 to which the getter box 3 is attached are formed. Seal.

In order to manufacture the vacuum-tight containers of the above-described embodiments, the anode substrate side and the cathode substrate side must be precisely opposed to each other in the horizontal (substrate surface) direction and the vertical direction in the vacuum chamber. . However, both cannot be freely moved from outside in the vacuum chamber. For this reason, a mechanism is required in which both are positioned in advance outside the vacuum chamber, and the two can be easily and precisely positioned inside the vacuum chamber. FIG.
FIG. 7 to FIG. 7 are schematic explanatory diagrams of horizontal (substrate surface) direction alignment for precisely placing an anode substrate and a cathode substrate in a vacuum chamber. Although the illustration of the vertical alignment is omitted, a mechanism may be provided for bringing the anode substrate and the cathode substrate closer to each other with the substrate surfaces in a parallel state. Note that the drawings show a case where the positioning is performed without displacing the two. However, the same applies to the case where both are shifted in parallel to perform positioning. When positioning is performed outside the vacuum chamber, the positioning may be performed in a shifted state. The getter box attached to the cathode substrate is not shown.

FIG. 4 is an explanatory diagram of a first example of horizontal alignment. 31 is an anode substrate, 31a is a through hole, 32 is a cathode substrate, 32a is a through hole, and 33 is a through pin. Outside the vacuum chamber, the anode substrate 31 and the cathode substrate 32
And are precisely aligned. In this state, through holes 31a and 32a are formed in the anode substrate 31 and the cathode substrate 32 to which the getter box 3 is attached by laser or ultrasonic drill at at least one place where the display screen is not affected. The anode substrate 31 thus processed and the cathode substrate 32 to which the getter box 3 is attached are housed in a vacuum chamber.
In the vacuum chamber, a through-pin 33 is inserted into both through-holes 31a and 32a, and the positions of the through-holes 31a and 32a in the horizontal direction are regulated by the through-pin 33. In this way, simple positioning can be performed in a vacuum by the two through holes 31a and 32a.

FIG. 5 is an explanatory diagram of a second example of horizontal alignment. FIG. 5A is a perspective view, and FIG. 5B is an enlarged view of a concave portion. 41 is an anode substrate, 41a is a recess, 42 is a cathode substrate, 42a is a recess, 43 is a first pin, and 44 is a second pin. Outside the vacuum chamber, the anode substrate 41 and the cathode substrate 42 are aligned. A concave portion 41a is formed in the anode substrate 41 in at least one place where the display is not affected by a laser or an ultrasonic drill. The concave portion 42a is also opened in the cathode substrate 42. Processed anode substrate 4
1 and the cathode substrate 42 are accommodated in a vacuum chamber, and the first and second pins 43 and 44 are inserted into the concave portions 41a and 42a, respectively, to restrict the positions of the concave portions 41a and 42a in the horizontal direction. Thus, the anode substrate 41 and the cathode substrate 42 are aligned. As a result, the concave portions 41a and 42a serve as reference points for positioning. The recesses 41a and 42a are formed as shown in FIG.
The tip is desirably cone-shaped.

FIG. 6 is an explanatory diagram of a third example of horizontal alignment. In the figure, 51 is an anode substrate, 52 is a cathode substrate, 53 is an anode substrate side fixing jig, 53a is a frame, 53b is a bar, 53c is a long hole, 53d is a substrate holding plate, 53e is an abutting portion, and 53f is A long hole, 53 g is a through hole, 54 is an elastic body, 55 is a fixing jig on the cathode substrate side, 5
5a is a frame, 55b is a bar, 55d is a substrate holding plate, 55e
Is an abutting portion, 55g is a through hole, 56 is an elastic body, 57 is a through pin, and 58 is a screw.

In the fixing jig 53 on the anode substrate side,
The screw 58 is fitted into the left and right long holes 53c of the bar 53b and screwed into the frame 53a, whereby the bar 53b is attached to the frame 53a. The bar 53b is provided with two substrate holding plates 53d. The screw 58 is fitted into the long hole 53e of the butting portion 53e, and the frame 5
3a is screwed into the rear part, so that the abutting part 53
e is attached to the frame 53a. Frame 53
An elastic body 54 using a compression coil spring or the like is attached to the front part of a.

In the fixing jig 55 on the cathode substrate side,
Similarly, a screw 58 is fitted into the left and right long holes of the bar 55b and screwed into the frame 55a, whereby the bar 55b is attached to the frame 55a. It is 2 in bar 55b
55 d of substrate holding plates are provided. The screw 58 is fitted into the long hole of the butting portion 55e, and the frame 55a
By being screwed into the rear part, the butting portion 55e is attached to the frame 55a. An elastic body 56 using a compression coil spring or the like is attached to a front portion of the frame 55a. Through hole 53 of anode-side fixing jig 53
g, the central axes of the through holes 55g of the cathode-side fixing jig 55 coincide with each other.

Outside the vacuum chamber, the anode substrate 51 is held by the substrate holding plate 53d,
The anode substrate 51 is attached to the anode substrate side fixing jig 53 by pressing with the e and the elastic body 54. Similarly, the cathode substrate 52 is fixed to the cathode substrate side fixing jig 5.
Attach to 5. The anode substrate 51 and the cathode substrate 52 can be fixed to the anode substrate-side fixing jig 53 and the cathode substrate-side fixing jig 55 by finely adjusting their positions in the horizontal direction by loosening the screws 58, respectively. . Therefore, using a precise alignment mechanism,
The anode substrate 31 and the cathode substrate 32 are precisely aligned in the horizontal direction and fixed with screws 58.

The anode substrate 41 fixed to the anode substrate side fixing jig 53 and the cathode substrate 42 fixed to the cathode substrate side fixing jig 55 are housed in a vacuum chamber, and the through holes of the anode side fixing jig 53 are provided. By inserting a pin 57 into the through-hole 55g of the cathode fixing jig 55 and the through-holes 55g and 55g in the horizontal direction, the anode-side fixing jig 53 and the cathode-side fixing jig 55 are positioned. Match. Therefore, the through hole 53
g and 55g are reference points for positioning. As a result, the anode substrate 51 and the cathode substrate 52 can be precisely positioned in the vacuum chamber without any processing on the anode substrate 51 and the cathode substrate 52. Instead of the through holes 53g and 55g described above, recesses are provided in the anode substrate-side fixing jig 53 and the cathode-side fixing jig 55, and positioning is performed by fitting the pins 43 and 44 from above and below as in FIG. It may be performed. That is, positioning with a certain precision is performed in advance outside the vacuum, and positioning with a final precision is performed at the time of vacuum sealing.

FIG. 7 is an explanatory diagram of a fourth example of horizontal alignment. 61 is an anode substrate, 61a is a concave portion,
62 is a cathode substrate and 63 is a metal sphere. A metal ball 63 is temporarily fixed or fixed to one of the anode substrate 61 and the cathode substrate 62, in the illustrated example, to the cathode substrate 62. Outside the vacuum chamber, the anode substrate 61 and the cathode substrate 62 are precisely positioned, and the anode substrate 61 is pressed against the metal sphere 63. By irradiating the metal sphere 63 with laser or infrared rays from outside the anode substrate 61 to heat the metal sphere 63, the anode substrate 61 facing the metal sphere 63 is melted to form the concave portion 61 a.

The processed anode substrate 61 and cathode substrate 62 are separated and housed in a vacuum chamber, and the anode substrate 61 and the cathode substrate 62 are brought close to each other with their substrate surfaces parallel to each other. The metal ball 63 and the recess 61 are moved relatively to each other.
When the position a coincides with the horizontal direction, the concave portion 61a fits into the metal ball 63, and the position is regulated, whereby the cathode substrate 62 and the anode substrate 61 are aligned. Therefore, the concave portion 61a and the metal sphere 63 are reference points for the first alignment.

In the above description, a non-evaporable getter is used as a getter, but an evaporable getter may be used. The evaporable getter is, for example, one in which BaAl ₄ powder is put in a ring-shaped metal case, heats the metal ring from the outside of the vacuum-tight container with high frequency, evaporates Ba from BaAl ₄ , A getter mirror (mirror surface) is deposited on the outer surface of the anode substrate. In the above description, the getter box is provided on the outer surface of the cathode substrate. Therefore, when used as a thin flat panel display device, there is no restriction on the display screen on the anode substrate side. However, a getter box may be provided on the anode substrate side depending on the application in which there is no restriction on the anode substrate side.

[0036]

As is clear from the above description, according to the present invention, since the baking of the cathode substrate and the anode substrate before evacuation can be performed before sealing, ideal baking can be performed. Therefore, there is an effect that the residual gas can be sufficiently exhausted at the time of manufacturing, and a getter for maintaining a high vacuum can be stored. In addition, since it is a completely chipless type, there is an effect that the outer shape has no protrusion and the shape can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional structural view of a first specific example of a vacuum-tight container manufactured by one embodiment of a method for manufacturing a vacuum-tight container according to the present invention.

FIG. 2 is a sectional structural view of a second specific example of a vacuum-tight container manufactured by one embodiment of the method for manufacturing a vacuum-tight container according to the present invention.

FIG. 3 is a sectional structural view of a third specific example of the vacuum-tight container for explaining one embodiment of the method for manufacturing a vacuum-tight container of the present invention.

FIG. 4 is an explanatory diagram of a first example of horizontal alignment.

FIG. 5 is an explanatory diagram of a second example of horizontal alignment.

FIG. 6 is an explanatory diagram of a third example of horizontal alignment.

FIG. 7 is an explanatory diagram of a fourth example of horizontal alignment.

FIG. 8 is an external view of a display device using a conventional field emission device.

[Explanation of symbols]

1, 31, 41, 51, 61 Anode substrate, 61a
Recesses, 2, 11, 21, 25, 32, 42, 52, 62
Cathode substrate, 11a through hole, 3, 12 getter box, 4th frit seal, 5 getter, 6
2nd frit seal, 22 steps, 23 bottom plate,
24 second sealing material, 43 first pin, 44 second
Pin, 53 Anode substrate side fixing jig, 54, 56
Elastic body, 55 cathode substrate side fixing jig, 57 through pin, 58 screw, 63 metal ball

Claims (5)

[Claims] A first substrate, a second substrate provided at a distance from the first substrate, and a getter box forming a getter storage chamber between the first substrate and an outer surface of the second substrate. A method for manufacturing a vacuum-tight container in which the first and second substrates and the getter box are sealed by a frit seal, wherein the getter box is provided on the second substrate with a first frit seal material. The first substrate and the second substrate to which the getter box is attached are accommodated in a vacuum chamber, and the first substrate and the second substrate to which the getter box is attached are attached. Baking and evacuation are performed in a state where the two substrates are separated to have sufficient conductance, and the first substrate and the second substrate to which the getter box is attached are attached. And the working temperature than the first frit seal material due to the low second frit sealing material,
A method for producing a vacuum-tight container, characterized by sealing. 2. The horizontal alignment of the first substrate and the second substrate to which the getter box is attached outside the vacuum chamber before being accommodated in the vacuum chamber. Forming first and second reference portions on the first substrate and the second substrate to which the getter box is attached, respectively; and a positioning jig in the vacuum chamber. The first substrate and the second substrate to which the getter box is attached are horizontally aligned by regulating the position of the first and second reference portions in the horizontal direction using The method for producing a vacuum-tight container according to claim 1, wherein: 3. A first reference portion and a second reference portion are formed, respectively.
Before using the first and second fixing jigs for moving and fixing the first and second substrates in the horizontal direction, the first substrate is stored in the vacuum chamber.
And performing positioning by moving the second substrate to which the getter box is attached while attaching the second substrate to the first and second fixing jigs, respectively. The first substrate and the getter box are fixed to a fixing jig, and the first and second reference portions are horizontally positioned in the vacuum chamber using an alignment jig. The method for manufacturing a vacuum-tight container according to claim 1, wherein the second substrate to which is adhered is aligned. 4. A first reference portion having a convex shape is formed on one of the first substrate and the second substrate to which the getter box is attached, and before being accommodated in the vacuum chamber, After aligning the first substrate and the second substrate to which the getter box is attached in the horizontal direction, a second concave substrate is formed on a surface facing the first convex reference portion. A reference portion is formed, and in the vacuum chamber, the first substrate and the getter box to which the getter box is attached are regulated by horizontally regulating the position using the first and second reference portions. The method for manufacturing a vacuum-tight container according to claim 1, wherein the second substrate is aligned in a horizontal direction. 5. The method for manufacturing a vacuum-tight container according to claim 1, wherein the vacuum-tight container has a built-in cold cathode.