JP2000038560A - Moisture-curing adhesive composition excellent in transparency - Google Patents
Moisture-curing adhesive composition excellent in transparencyInfo
- Publication number
- JP2000038560A JP2000038560A JP10206640A JP20664098A JP2000038560A JP 2000038560 A JP2000038560 A JP 2000038560A JP 10206640 A JP10206640 A JP 10206640A JP 20664098 A JP20664098 A JP 20664098A JP 2000038560 A JP2000038560 A JP 2000038560A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- silica
- component
- silicone resin
- modified silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- 239000004839 Moisture curing adhesive Substances 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 79
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 35
- 229920002050 silicone resin Polymers 0.000 claims abstract description 19
- 125000000524 functional group Chemical group 0.000 claims abstract description 17
- -1 polyoxypropylene Polymers 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 10
- 239000007822 coupling agent Substances 0.000 claims abstract description 6
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 4
- 125000003277 amino group Chemical group 0.000 claims abstract description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 8
- 229910021485 fumed silica Inorganic materials 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 abstract description 7
- 238000001125 extrusion Methods 0.000 abstract description 4
- 229920001451 polypropylene glycol Polymers 0.000 abstract description 3
- 238000001723 curing Methods 0.000 abstract 3
- 230000002787 reinforcement Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000002835 absorbance Methods 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 5
- 150000003377 silicon compounds Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910002012 Aerosil® Inorganic materials 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000012973 diazabicyclooctane Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- MFWFDRBPQDXFRC-LNTINUHCSA-N (z)-4-hydroxypent-3-en-2-one;vanadium Chemical compound [V].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MFWFDRBPQDXFRC-LNTINUHCSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical class C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- IHEDBVUTTQXGSJ-UHFFFAOYSA-M 2-[bis(2-oxidoethyl)amino]ethanolate;titanium(4+);hydroxide Chemical compound [OH-].[Ti+4].[O-]CCN(CC[O-])CC[O-] IHEDBVUTTQXGSJ-UHFFFAOYSA-M 0.000 description 1
- MMGVVYCBXBYXRR-UHFFFAOYSA-L 2-acetyl-3-oxobutanoate;dibutyltin(2+) Chemical compound CCCC[Sn+2]CCCC.CC(=O)C(C(C)=O)C([O-])=O.CC(=O)C(C(C)=O)C([O-])=O MMGVVYCBXBYXRR-UHFFFAOYSA-L 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 1
- MZWXWSVCNSPBLH-UHFFFAOYSA-N 3-(3-aminopropyl-methoxy-methylsilyl)oxypropan-1-amine Chemical compound NCCC[Si](C)(OC)OCCCN MZWXWSVCNSPBLH-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- SUBDBMMJDZJVOS-UHFFFAOYSA-N 5-methoxy-2-{[(4-methoxy-3,5-dimethylpyridin-2-yl)methyl]sulfinyl}-1H-benzimidazole Chemical compound N=1C2=CC(OC)=CC=C2NC=1S(=O)CC1=NC=C(C)C(OC)=C1C SUBDBMMJDZJVOS-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101100377299 Arabidopsis thaliana ZHD13 gene Proteins 0.000 description 1
- PGYZWDRQAGSRTJ-UHFFFAOYSA-N C[Si](C)(C)OC[SiH3] Chemical compound C[Si](C)(C)OC[SiH3] PGYZWDRQAGSRTJ-UHFFFAOYSA-N 0.000 description 1
- OXYRDHQBMJBIMK-UHFFFAOYSA-N C[Si](OCCC(=O)O[SiH3])(C)C Chemical compound C[Si](OCCC(=O)O[SiH3])(C)C OXYRDHQBMJBIMK-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 102100027490 H2.0-like homeobox protein Human genes 0.000 description 1
- 101001081101 Homo sapiens H2.0-like homeobox protein Proteins 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000004965 Silica aerogel Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229960000686 benzalkonium chloride Drugs 0.000 description 1
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- AONDIGWFVXEZGD-UHFFFAOYSA-N diacetyloxy(methyl)silicon Chemical compound CC(=O)O[Si](C)OC(C)=O AONDIGWFVXEZGD-UHFFFAOYSA-N 0.000 description 1
- 229940100539 dibutyl adipate Drugs 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- FWPHTMLJYGTNJA-UHFFFAOYSA-N dichlorosilyloxy(trimethyl)silane Chemical compound C[Si](C)(C)O[SiH](Cl)Cl FWPHTMLJYGTNJA-UHFFFAOYSA-N 0.000 description 1
- CIQDYIQMZXESRD-UHFFFAOYSA-N dimethoxy(phenyl)silane Chemical compound CO[SiH](OC)C1=CC=CC=C1 CIQDYIQMZXESRD-UHFFFAOYSA-N 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- WNEDOMBPJDUQPS-BFIADXHOSA-L dioctyltin(2+);(z)-4-hydroxy-4-oxobut-2-enoate Chemical compound CCCCCCCC[Sn](OC(=O)\C=C/C(O)=O)(OC(=O)\C=C/C(O)=O)CCCCCCCC WNEDOMBPJDUQPS-BFIADXHOSA-L 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- ZWXYOPPJTRVTST-UHFFFAOYSA-N methyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](C)(OC(C)=C)OC(C)=C ZWXYOPPJTRVTST-UHFFFAOYSA-N 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- UIEKYBOPAVTZKW-UHFFFAOYSA-L naphthalene-2-carboxylate;nickel(2+) Chemical compound [Ni+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 UIEKYBOPAVTZKW-UHFFFAOYSA-L 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、透明性に優れた変
成シリコーン樹脂系湿気硬化型接着剤組成物に関する。The present invention relates to a modified silicone resin-based moisture-curable adhesive composition having excellent transparency.
【0002】[0002]
【従来の技術】珪素原子含有反応性基を有するポリマー
は、湿気の存在下で架橋硬化するが、このポリマーの中
で、例えば主鎖骨格がポリオキシプロピレンであるもの
を用いた硬化性組成物は、室温では液体で硬化によりゴ
ム弾性体となる特性を有し、建築用シーラント、工業用
シーラント、弾性接着剤等に広く用いられている。上記
のようなポリオキシプロピレン型変成シリコーン樹脂及
び硬化剤からなる組成物にシリカ微粉末を配合すること
で、粘性を改良し、その硬化物に補強効果、透明性の向
上を計る技術は知られている。しかし、上記配合系で
は、接着性に乏しいという欠点があり、接着性を向上す
る目的で一般にアミノシラン等のカップリング剤を配合
することが行われているが、該カップリング剤を配合す
ることにより硬化物の透明性を著しく低下させる。2. Description of the Related Art A polymer having a silicon atom-containing reactive group crosslinks and cures in the presence of moisture. Among these polymers, for example, a curable composition using a polymer having a main chain skeleton of polyoxypropylene is used. Is a liquid at room temperature and has the property of becoming a rubber elastic body upon curing, and is widely used in architectural sealants, industrial sealants, elastic adhesives and the like. By mixing silica fine powder with the composition comprising the polyoxypropylene-type modified silicone resin and the curing agent as described above, a technique for improving the viscosity, reinforcing the cured product, and improving the transparency is known. ing. However, in the above-mentioned compounding system, there is a defect that the adhesiveness is poor, and in order to improve the adhesiveness, it is common to mix a coupling agent such as aminosilane, but by adding the coupling agent. It significantly reduces the transparency of the cured product.
【0003】[0003]
【発明が解決しようとする課題】本発明は、硬化に至る
までは、カートリッジ、チューブ等の容器からの良好な
押出し性を示し、硬化後は、優れた透明性と硬化物の補
強性並びに良好な接着性を与える変成シリコーン樹脂系
湿気硬化型接着剤組成物を提供することを目的とする。The present invention shows good extrudability from containers such as cartridges and tubes until curing, and after curing, excellent transparency and reinforcing properties of the cured product and good It is an object of the present invention to provide a modified silicone resin-based moisture-curable adhesive composition that provides excellent adhesion.
【0004】[0004]
【課題を解決するための手段】本発明者らは、上記変成
シリコーン樹脂、硬化剤、シリカ微粉末及びアミノシラ
ンからなる組成物系において鋭意研究を行った結果、上
記変成シリコーン樹脂として珪素原子含有官能基を有す
るアクリルポリマーを含むポリオキシプロピレン型変成
シリコーン樹脂を、シリカ微粉末として疎水性シリカ微
粉末を用いることにより本発明の目的を達成し得ること
を見出だして本発明を完成した。更に、該シリカ微粉末
を特定の珪素化合物で処理した疎水性シリカ微粉末を用
いることにより、その硬化物の透明性が飛躍的に向上す
ることを見出だした。Means for Solving the Problems The present inventors have conducted intensive studies on a composition system comprising the above modified silicone resin, curing agent, silica fine powder and aminosilane. As a result, the modified silicone resin contains a silicon atom-containing functional group. The present inventors have found that the object of the present invention can be achieved by using a hydrophobic silica fine powder as a silica fine powder for a polyoxypropylene-type modified silicone resin containing an acrylic polymer having a group, and completed the present invention. Furthermore, it has been found that by using hydrophobic silica fine powder obtained by treating the silica fine powder with a specific silicon compound, the transparency of the cured product is remarkably improved.
【0005】すなわち、本発明は(1)珪素原子含有官
能基を有するアクリルポリマーを含むポリオキシプロピ
レン型変成シリコーン樹脂、(2)上記(1)の硬化
剤、(3)疎水性微粉末シリカ及び(4)アミノ基を有
するシランカップリング剤を含有する湿気硬化型接着剤
組成物を要旨とする。That is, the present invention provides (1) a polyoxypropylene-type modified silicone resin containing an acrylic polymer having a silicon atom-containing functional group, (2) the curing agent of the above (1), (3) a finely divided hydrophobic silica, (4) A moisture-curable adhesive composition containing a silane coupling agent having an amino group.
【0006】又、本発明の湿気硬化型接着剤組成物は、
上記変成シリコーン樹脂100重量部当り、上記硬化剤
が0.1〜10重量部、上記微粉末シリカが2〜50重
量部、上記カップリング剤が0.1〜10重量部である
ことを特徴とする。又、本発明の湿気硬化型接着剤組成
物は、上記微粉末シリカが煙霧質シリカをヘキサメチル
ジシラザンで処理したものであることを特徴とする。
又、本発明の湿気硬化型接着剤組成物は、上記微粉末シ
リカがシリカエアロゲルをジメチルシロキサン及び/又
はヘキサメチルジシラザンで処理したものであることを
特徴とする。[0006] The moisture-curable adhesive composition of the present invention comprises:
Per 100 parts by weight of the modified silicone resin, the curing agent is 0.1 to 10 parts by weight, the finely divided silica is 2 to 50 parts by weight, and the coupling agent is 0.1 to 10 parts by weight. I do. The moisture-curable adhesive composition of the present invention is characterized in that the finely divided silica is obtained by treating fumed silica with hexamethyldisilazane.
The moisture-curable adhesive composition of the present invention is characterized in that the finely divided silica is obtained by treating silica airgel with dimethylsiloxane and / or hexamethyldisilazane.
【0007】[0007]
【発明の実施の形態】本発明の組成物の1成分である珪
素原子含有官能基を有するアクリルポリマーを含むポリ
オキシプロピレン型変成シリコーン樹脂(以下、成分
(a)という。)は、珪素原子含有官能基を有するアク
リルポリマー(以下、成分(a−1)という。)とポリ
オキシプロピレン型変成シリコーン樹脂(以下、成分
(a−2)という。)との混合物である。BEST MODE FOR CARRYING OUT THE INVENTION A polyoxypropylene-type modified silicone resin containing a silicon atom-containing functional group-containing acrylic polymer (hereinafter referred to as component (a)), which is one component of the composition of the present invention, contains a silicon atom-containing compound. It is a mixture of an acrylic polymer having a functional group (hereinafter, referred to as component (a-1)) and a polyoxypropylene-type modified silicone resin (hereinafter, referred to as component (a-2)).
【0008】成分(a−1)は、一般式[−CH2 −C
(R)(COOR1 )−](但し、Rは水素原子又はメ
チル基、R1 は炭素数1〜20個のアルキル基を示
す。)で表される(メタ)アクリル酸エステルの繰り返
し単位の重合体であり、珪素原子含有官能基を有してい
る。R1 としては、メチル、エチル、プロピル、ブチ
ル、ヘキシル、オクチル、デシル、ドデシル、ヘキサデ
シル等が挙げられる。The component (a-1) has the general formula [-CH 2 -C
(R) (COOR 1 )-] (where R represents a hydrogen atom or a methyl group, and R 1 represents an alkyl group having 1 to 20 carbon atoms). It is a polymer and has a silicon atom-containing functional group. Examples of R 1 include methyl, ethyl, propyl, butyl, hexyl, octyl, decyl, dodecyl, hexadecyl and the like.
【0009】上記一般式で表される成分(a−1)は、
例えば、(1)一般式[CH2 =C(R)(COO
R1 )](但し、R及びR1 は上記と同意義。)で表さ
れる(メタ)アクリル酸エステルモノマーを、一般式
[CH2 =C(R)−Qn −Si(CH3 )
(X)3-n ](但し、Rは上記と同意義、Qは−COO
R2 −(R2 は炭素数1〜6個の2価のアルキレン
基)、nは0,1若しくは2の整数、Xは加水分解性基
(好ましくはハロゲン原子、アルコキシ基)を示す。)
で表される重合性不飽和結合と反応性珪素原子含有官能
基を有する化合物を存在させて重合するか、(2)上記
(メタ)アクリル酸エステルモノマーと、重合性不飽和
結合及び反応性官能基を有する化合物を共重合した後、
上記珪素原子含有官能基並びに該重合性不飽和結合及び
反応性官能基と反応し得る官能基を有する化合物と反応
させることによって製造することができる。The component (a-1) represented by the above general formula is
For example, (1) the general formula [CH 2 CC (R) (COO
R 1 )] (wherein, R and R 1 have the same meanings as described above) by converting the (meth) acrylate monomer represented by the general formula [CH 2 CC (R) —Q n —Si (CH 3 )
(X) 3-n ] (wherein R is as defined above, and Q is -COO
R 2- (R 2 is a divalent alkylene group having 1 to 6 carbon atoms), n is an integer of 0, 1 or 2, and X is a hydrolyzable group (preferably a halogen atom or an alkoxy group). )
The polymerization is carried out in the presence of a compound having a polymerizable unsaturated bond and a reactive silicon atom-containing functional group represented by the formula (2), or (2) the polymerizable unsaturated bond and the reactive functional group After copolymerizing a compound having a group,
It can be produced by reacting with a compound having a functional group capable of reacting with the silicon atom-containing functional group and the polymerizable unsaturated bond and the reactive functional group.
【0010】上記(2)の方法において用いることがで
きる上記重合性不飽和結合及び反応性官能基を有する化
合物としては、(メタ)アクリル酸アリル、ネオペンチ
ルグリコールジ(メタ)アクリレート、1,6−ヘキサ
ンジオールジ(メタ)アクリレート、ポリエチレングリ
コールジ(メタ)アクリレート、ポリプロピレングリコ
ールジ(メタ)アクリレート等を、又上記珪素原子含有
官能基並びに該重合性不飽和結合及び反応性官能基と反
応し得る官能基を有する化合物としては、特にヒドロシ
ラン化合物としての、トリクロロシラン、メチルジクロ
ロシラン、トリメチルシロキシジクロロシラン等のハロ
ゲン化シラン、トリメトキシシラン、トリエトキシシラ
ン、フェニルジメトキシシラン等のアルコキシシラン、
メチルジアセトキシシラン、トリメチルシロキシメチル
アセトキシシラン等のアシロキシシラン、ビス(ジメチ
ルケトキシメート)メチルシラン、ビス(シクロヘキシ
ルケトキシメート)メチルシラン等のケトキシメートシ
ラン、ジメチルシラン、トリメチルシロキシメチルシラ
ン等のヒドロシラン、メチルトリ(イソプロペニルオキ
シ)シラン等のアルケニルオキシシラン等を、それぞれ
例示することができる。The compound having a polymerizable unsaturated bond and a reactive functional group which can be used in the method (2) includes allyl (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6 Hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate and the like, which can also react with the above-mentioned silicon atom-containing functional group and the polymerizable unsaturated bond and the reactive functional group. As the compound having a functional group, particularly as a hydrosilane compound, trichlorosilane, methyldichlorosilane, halogenated silane such as trimethylsiloxydichlorosilane, trimethoxysilane, triethoxysilane, alkoxysilane such as phenyldimethoxysilane,
Acyloxysilanes such as methyldiacetoxysilane and trimethylsiloxymethylacetoxysilane, ketoximesilanes such as bis (dimethylketoximeto) methylsilane, bis (cyclohexylketoxymate) methylsilane, and hydrosilanes such as dimethylsilane and trimethylsiloxymethylsilane And alkenyloxysilanes such as methyltri (isopropenyloxy) silane.
【0011】成分(a−2)は、その分子内に一般式
[−CH(CH3 )CH2 −O−]で表されるオキシプ
ロピレンの繰り返し単位を有する重合体であり、珪素原
子含有官能基、好ましくはメトキシシリル基、エトキシ
シリル基等のアルコキシシリル基、を有している。成分
(a−2)は、数平均分子量が4,000〜30,00
0のものが好適である。このような成分(a−2)は、
例えば、特公昭45−36319号、同46−1215
4号、特開昭50−156599号、同54−6096
号、同55−13468号、同55−13767号、同
57−164123号、同61−197631号、同6
1−215622、同61−215623号、同61−
218632号等の各公報に記載された方法で製造する
ことができるが、例えば、鐘淵化学工業社製商品名:サ
イリル5A03,MSポリマー、旭硝子社製商品名:エ
クスター2410等の市販品もあり、それらを使用する
こともできる。The component (a-2) is a polymer having a repeating unit of oxypropylene represented by the general formula [—CH (CH 3 ) CH 2 —O—] in its molecule, and comprises a silicon atom-containing functional group. Group, preferably an alkoxysilyl group such as a methoxysilyl group and an ethoxysilyl group. Component (a-2) has a number average molecular weight of 4,000 to 30,00.
A value of 0 is preferred. Such a component (a-2)
For example, Japanese Patent Publication Nos. 45-36319 and 46-1215.
No. 4, JP-A-50-156599, JP-A-54-6096
Nos. 55-13468, 55-13767, 57-164123, 61-197631, and 6
1-215622, 61-2215623, 61-
Although it can be manufactured by the method described in each gazette such as No. 218632, there are also commercially available products such as Kanebuchi Chemical Industry Co., Ltd. product name: Cyril 5A03, MS polymer, Asahi Glass Co., Ltd. product name: Exter 2410 etc. , They can also be used.
【0012】成分(a)は、上記成分(a−1)と上記
成分(a−2)との混合物であるが、両者の混合割合
は、上記成分(a−2)100重量部当り、上記成分
(a−1)10〜500重量部である。このような上記
成分(a−1)と上記成分(a−2)との混合割合から
なる成分(a)は市販されており、例えば鐘淵化学工業
社製、商品名:サイリルMA430,サイリルMA44
0等、それらを使用することができる。成分(a)は、
異種のものを2種以上併用することができる。The component (a) is a mixture of the above-mentioned component (a-1) and the above-mentioned component (a-2). The mixing ratio of the two is 100 parts by weight of the above-mentioned component (a-2). Component (a-1) is 10 to 500 parts by weight. Such a component (a) consisting of a mixture ratio of the above-mentioned component (a-1) and the above-mentioned component (a-2) is commercially available. For example, trade names: Cyril MA430, Cyril MA44, manufactured by Kanegafuchi Chemical Industry Co., Ltd.
They can be used, such as 0. Component (a) is
Two or more different types can be used in combination.
【0013】上記成分(a)の硬化触媒(以下、成分
(b)という。)としては、有機錫、金属錯体、塩基性
物質及び有機燐酸化合物が使用できる。具体的には、有
機錫としては、ジブチル錫ジラウレート、ジオクチル錫
ジマレート、ジブチル錫フタレート、オクチル酸第一
錫、ジブチル錫メトキシド、ジブチル錫ジアセチルアセ
テート、ジブチル錫ジバーサテート等が挙げられる。金
属錯体としては、テトラブチルチタネート、テトライソ
プロピルチタネート、トリエタノールアミンチタネート
等のチタネート化合物類、オクチル酸鉛、ナフテン酸
鉛、ナフテン酸ニッケル、ナフテン酸コバルト等のカル
ボン酸金属塩、アルミニウムアセチルアセトナート錯
体、バナジウムアセチルアセトナート錯体等の金属アセ
チルアセトナート錯体等が挙げられる。塩基性物質とし
ては、テトラメチルアンモニウムクロライド、ベンザル
コニウムクロライド等の第4級アンモニウム塩類、三共
エアプロダクツ社製のDABCO(登録商標)シリー
ズ、DABCO BLシリーズ等の複数の窒素を含む直
鎖或いは環状の第三級アミン及び第四級アンモニウム塩
等が挙げられる。有機燐酸化合物としては、モノメチル
燐酸、ジ−n−ブチル燐酸、燐酸トリフェニル等が挙げ
られる。As the curing catalyst of the above component (a) (hereinafter referred to as component (b)), organotin, metal complexes, basic substances and organic phosphoric compounds can be used. Specifically, examples of the organic tin include dibutyltin dilaurate, dioctyltin dimaleate, dibutyltin phthalate, stannous octylate, dibutyltin methoxide, dibutyltin diacetylacetate, and dibutyltin diversate. Examples of the metal complex include titanate compounds such as tetrabutyl titanate, tetraisopropyl titanate, and triethanolamine titanate; metal carboxylate such as lead octylate, lead naphthenate, nickel naphthenate, and cobalt naphthenate; and aluminum acetylacetonate complex. And metal acetylacetonate complexes such as vanadium acetylacetonate complex. Examples of the basic substance include quaternary ammonium salts such as tetramethylammonium chloride and benzalkonium chloride, and a plurality of nitrogen-containing linear or cyclic salts such as DABCO (registered trademark) series and DABCO BL series manufactured by Sankyo Air Products. Of tertiary amines and quaternary ammonium salts. Examples of the organic phosphoric acid compound include monomethyl phosphoric acid, di-n-butyl phosphoric acid, and triphenyl phosphate.
【0014】本発明で用いられる疎水性微粉末シリカ
(以下、成分(c)という。)としては、例えば、接着
剤その他で揺変剤として多く用いられているヒュームド
シリカ(煙霧質シリカ)やシリカエアロゲル等の微粉末
シリカを有機珪素化合物、例えばジメチルジクロルシラ
ン、ヘキサメチルジシラザン、ジメチルシロキサン、ト
リメトキシオクチルシラン等で処理し、疎水性としたも
のが使用できるが、特に煙霧質シリカをヘキサメチルジ
シラザンで処理したもの並びにシリカエアロゲルをジメ
チルシロキサン及び/又はヘキサメチルジシラザンで処
理したものが好ましい。Examples of the hydrophobic fine powdered silica (hereinafter referred to as component (c)) used in the present invention include fumed silica (fumed silica) which is often used as a thixotropic agent in adhesives and the like. Fine powdered silica such as silica airgel is treated with an organic silicon compound, for example, dimethyldichlorosilane, hexamethyldisilazane, dimethylsiloxane, trimethoxyoctylsilane, etc., and can be made hydrophobic. Those treated with hexamethyldisilazane and those treated with silica airgel with dimethylsiloxane and / or hexamethyldisilazane are preferred.
【0015】疎水化処理は、微粉末シリカと上記有機珪
素化合物とを、100〜400℃程度の温度で高速攪拌
することによりなされる。両者の接触を均一に行うため
に、有機溶媒等の媒体中で行うのが望ましい。微粉末シ
リカと上記有機珪素化合物の接触割合は、通常微粉末シ
リカ100重量部当り、上記有機珪素化合物3〜40重
量部である。The hydrophobizing treatment is carried out by stirring the finely divided silica and the organic silicon compound at a high speed of about 100 to 400 ° C. It is desirable to carry out the contact in a medium such as an organic solvent in order to uniformly contact the two. The contact ratio between the finely divided silica and the organic silicon compound is usually 3 to 40 parts by weight of the organic silicon compound per 100 parts by weight of the finely divided silica.
【0016】本発明で用いられるアミノ基を有するシラ
ンカップリング剤(以下、成分(d)という。)として
は、第一級若しくは第二級アミノ基、好ましくは第一級
アミノ基を有し、アルコキシ基を有するシラン化合物が
好適であり、例えばγ−アミノプロピルトリエトキシシ
ラン、γ−アミノプロピルトリメトキシシラン、γ−ア
ミノプロピル−メチルジエトキシシラン、γ−アミノプ
ロピル−メチルジメトキシシラン、N−フェニル−γ−
アミノプロピルトリメトキシシラン、N−β(アミノエ
チル)−γ−アミノプロピルトリメトキシシラン、N−
β(アミノエチル)−γ−アミノプロピルトリエトキシ
シラン、N−β(アミノエチル)−γ−アミノプロピル
メチルジメトキシシラン、N−β(アミノエチル)−γ
−アミノプロピルメチルジエトキシシラン、この他特殊
アミノシランである信越化学工業社製、商品名:KBM
6063、X−12−896、KBM576、X−12
−565、X−12−580、X−12−806、X−
12−666、X−12−5263、KBM6123、
X−12−577、X−12−575、X−12−56
3B、X−12−562等が挙げられる。The silane coupling agent having an amino group (hereinafter referred to as component (d)) used in the present invention includes a primary or secondary amino group, preferably a primary amino group, A silane compound having an alkoxy group is preferable, for example, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyl-methyldiethoxysilane, γ-aminopropyl-methyldimethoxysilane, N-phenyl -Γ-
Aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-
β (aminoethyl) -γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyldimethoxysilane, N-β (aminoethyl) -γ
-Aminopropylmethyldiethoxysilane, and other special aminosilanes manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM
6063, X-12-896, KBM576, X-12
-565, X-12-580, X-12-806, X-
12-666, X-12-5263, KBM6123,
X-12-577, X-12-575, X-12-56
3B, X-12-562 and the like.
【0017】本発明の接着剤組成物は、上記変成シリコ
ーン樹脂(成分(a))、上記硬化剤(成分(b))、
上記微粉末シリカ(成分(c))及び上記カップリング
剤(成分(d))を含有して構成されるものであるが、
それらの構成割合は、成分(a)100重量部当り、成
分(b)が0.1〜10重量部、成分(c)が2〜50
重量部、成分(d)が0.1〜10重量部であるのが望
ましい。成分(a)100重量部当り、成分(b)が
0.1重量部未満では硬化速度が遅くなり、10重量部
を超えると硬化速度が速くなり過ぎいずれも作業性が低
下する。成分(c)が2重量部未満では効果物の補強効
果が充分得られず、50重量部を超えると組成物の粘性
が高くなり過ぎ作業性や容器からの押し出し性が悪くな
る。成分(d)が0.1重量部未満では接着性付与効果
が十分でなく、10重量部を超えると硬化性を低下させ
好ましくない。The adhesive composition of the present invention comprises the modified silicone resin (component (a)), the curing agent (component (b)),
It comprises the finely divided silica (component (c)) and the coupling agent (component (d)).
The component ratios are 0.1 to 10 parts by weight of component (b) and 2 to 50 parts by weight of component (c) per 100 parts by weight of component (a).
It is desirable that the amount of component (d) be 0.1 to 10 parts by weight. If the amount of the component (b) is less than 0.1 part by weight per 100 parts by weight of the component (a), the curing rate is too low. If the amount of the component (c) is less than 2 parts by weight, the effect of reinforcing the effected product cannot be sufficiently obtained. When the amount of the component (d) is less than 0.1 part by weight, the effect of imparting adhesiveness is not sufficient. When the amount exceeds 10 parts by weight, the curability is lowered, which is not preferable.
【0018】上記構成からなる本発明の組成物は、接着
剤に通常配合されることがある、例えば可塑剤、各種添
加剤、溶剤、脱水剤等を必要に応じて添加することがで
きる。 可塑剤としては、ジオクチルフタレート、ジブ
チルフタレート、ジオクチルアジペート、ジブチルアジ
ペート等、各種添加剤としては、老化防止剤、紫外線吸
収剤、顔料、各種タッキファイアー等、溶剤としては、
水分含有量が500ppm以下の各種有機溶媒、脱水剤
としては、生石灰、オルト珪酸エステル、無水硫酸ナト
リウム、メチルシリケート、エチルシリケート、ビニル
トリメトキシシラン等が挙げられる。The composition of the present invention having the above constitution may be added to an adhesive, for example, if necessary, for example, a plasticizer, various additives, a solvent, a dehydrating agent and the like. As a plasticizer, dioctyl phthalate, dibutyl phthalate, dioctyl adipate, dibutyl adipate, etc., as various additives, an antioxidant, an ultraviolet absorber, a pigment, various tackifiers, etc., as a solvent,
Examples of various organic solvents and dehydrating agents having a water content of 500 ppm or less include quicklime, orthosilicate, anhydrous sodium sulfate, methylsilicate, ethylsilicate, and vinyltrimethoxysilane.
【0019】[0019]
【実施例】以下、本発明を実施例により詳細に説明す
る。なお、実施例及び比較例において使用された各種化
合物は以下の通りである。成分(a) サイリルMA430:鐘淵化学工業社製商品名成分(b) No.918(ジブチル錫ジラウレート):三共有機合
成社製商品名成分(c) R972(ジメチルジクロルシランで疎水処理した煙霧
質シリカ):日本アエロジル社製商品名 R812(ヘキサメチルジシラザンで疎水処理した煙霧
質シリカ):日本アエロジル社製商品名 サイロホービック200(ジメチルシロキサンで疎水処
理したシリカエアロゲル):富士シリシア化学社製商品
名成分(d) KBE903(γ−アミノプロピルトリエトキシシラ
ン):信越化学工業社製商品名その他 MS203(ポリプロピレン型変成シリコーン樹脂):
信越化学工業社製商品名 A200(無処理の煙霧質シリカ):日本アエロジル社
製商品名 又、本発明の組成物の評価方法は以下に従った。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. Various compounds used in Examples and Comparative Examples are as follows. Component (a) Cyril MA430: trade name of Kanebuchi Chemical Co., Ltd. Component (b) No. 918 (dibutyltin dilaurate): product name (c) manufactured by Sankyoki Gosei Co., Ltd. R972 (fumed silica hydrophobically treated with dimethyldichlorosilane): product name R812 manufactured by Nippon Aerosil Co., Ltd. (hydrophobic treatment with hexamethyldisilazane) Smoke-free silica): Product name manufactured by Nippon Aerosil Co., Ltd. Silohovic 200 (Silica aerogel hydrophobically treated with dimethylsiloxane): Product name manufactured by Fuji Silysia Chemical Ltd. Component (d) KBE903 (γ-aminopropyltriethoxysilane): Shin-Etsu Chemical industry Co., trade name other MS203 (polypropylene type modified silicone resin):
A200 (untreated fumed silica) manufactured by Shin-Etsu Chemical Co., Ltd .: manufactured by Nippon Aerosil Co., Ltd. The evaluation method of the composition of the present invention was as follows.
【0020】硬化物の透明性 波長500nmでの吸光度を測定し、以下の基準で判定
した。 ◎:吸光度が0.2未満のもの ○:吸光度が0.2〜0.5未満のもの △:吸光度が0.5〜1.0未満のもの ×:吸光度が1.0以上のもの硬化物のダンベル物性 JIS K6301に準じ引っ張り強さを測定した。アクリル板へのビード接着性 アクリル樹脂製板上に組成物をビード状に塗布し、23
℃,RH50%で14日間静置した後、端部からビード
を手で剥離してその剥離状態を観察し、以下の基準で判
定した。 ○:凝集破壊 ×:界面破壊粘度 硬化前の組成物の粘度をBH型粘度計(ローター7)を
用い、回転数10rpm、23℃にて測定した。作業性 硬化前の組成物をチューブに入れたものを手により押し
出し、その際の押し出し易さを観察し、以下の基準で判
定した。 ○:押し出し易いもの。 ×:押し出し難いもの。The absorbance of the cured product at a wavelength of 500 nm was measured and evaluated according to the following criteria. ◎: what absorbance of less than 0.2 ○: what absorbance of less than 0.2 to 0.5 △: what absorbance of less than 0.5 to 1.0 ×: cured absorbance of 1.0 or more of It was measured of dumbbell physical properties JIS K6301 in accordance with tensile strength. Bead adhesion to acrylic plate The composition was applied in a bead form on an acrylic resin plate, and
After leaving still at 14 ° C. and RH 50% for 14 days, the bead was peeled off from the end by hand, and the peeled state was observed. :: cohesive failure ×: interfacial fracture viscosity The viscosity of the composition before curing was measured using a BH type viscometer (Rotor 7) at a rotation speed of 10 rpm and 23 ° C. Workability The composition in which the composition had not been cured was placed in a tube and extruded by hand, and the ease of extrusion at that time was observed, and judged according to the following criteria. :: easy to extrude. X: Hard to extrude.
【0021】(実施例1〜4)表1に示す成分(a)、
成分(b)、成分(c)及び成分(d)を表1に示す割
合(総て重量部、以下同じ)で混合して本発明の組成物
を得た。得られた組成物の物性を上記の通り測定し、そ
れらの結果を表1に示した。又、得られた組成物を硬化
させ、その硬化物についての物性を上記の通り測定し、
それらの結果を表1に示した。Examples 1-4 Components (a) shown in Table 1
The components (b), (c) and (d) were mixed in the proportions shown in Table 1 (all parts by weight, hereinafter the same) to obtain the composition of the present invention. The physical properties of the obtained composition were measured as described above, and the results are shown in Table 1. Further, the obtained composition is cured, and the physical properties of the cured product are measured as described above,
The results are shown in Table 1.
【0022】(比較例1,2)成分(c)を無処理の微
粉末シリカであるA200に替えた以外は実施例1又は
2と同様にして組成物を得た。得られた組成物及びその
硬化物の物性を上記の通り測定し、それらの結果を表1
に示した。(Comparative Examples 1 and 2) A composition was obtained in the same manner as in Example 1 or 2, except that the component (c) was changed to A200 which was untreated fine powdered silica. The physical properties of the obtained composition and its cured product were measured as described above, and the results are shown in Table 1.
It was shown to.
【0023】(比較例3)成分(a)をポリプロピレン
型変成シリコーン樹脂であるMS203に、成分(c)
を無処理の微粉末シリカであるA200にそれぞれ替
え、成分(d)であるKBE903を用いない以外は実
施例1と同様にして組成物を得た。得られた組成物及び
その硬化物の物性を上記の通り測定し、それらの結果を
表1に示した。(Comparative Example 3) Component (a) was added to MS203, which is a modified polypropylene resin, and component (c) was added.
Was replaced with A200 which is untreated fine powdered silica, and a composition was obtained in the same manner as in Example 1 except that KBE903 as the component (d) was not used. The physical properties of the obtained composition and its cured product were measured as described above, and the results are shown in Table 1.
【0024】(比較例4)成分(a)をポリプロピレン
型変成シリコーン樹脂であるMS203に、成分(c)
を無処理の微粉末シリカであるA200にそれぞれ替え
た以外は実施例1と同様にして組成物を得た。得られた
組成物及びその硬化物の物性を上記の通り測定し、それ
らの結果を表1に示した。(Comparative Example 4) Component (a) was added to MS203 which is a modified polypropylene resin of the type, and component (c) was added.
Was obtained in the same manner as in Example 1 except that A200, which was untreated fine powdered silica, was used. The physical properties of the obtained composition and its cured product were measured as described above, and the results are shown in Table 1.
【0025】[0025]
【表1】 表1から、本発明の組成物の硬化物は優れた透明性を示
し、特に疎水性微粉末シリカとしてヘキサメチルジシラ
ザンで処理した煙霧質シリカ及びジメチルシロキサンで
処理したシリカエアロゲルを用いた組成物でその効果が
顕著であることが判る。しかも、本発明の組成物は、押
し出し作業性に優れ、又、その硬化物も補強性、接着性
に優れていることが判る。更に、ジメチルシロキサンで
処理したシリカエアロゲルを増量して用いることによ
り、粘性(作業性)を損なわずにより強靭な硬化物を得
ることができる。[Table 1] From Table 1, it can be seen that the cured product of the composition of the present invention shows excellent transparency, and in particular, a composition using fumed silica treated with hexamethyldisilazane and silica airgel treated with dimethylsiloxane as hydrophobic finely divided silica. It can be seen that the effect is remarkable. In addition, it can be seen that the composition of the present invention is excellent in extrusion workability, and the cured product is also excellent in reinforcing property and adhesiveness. Furthermore, by using an increased amount of silica airgel treated with dimethylsiloxane, a tougher cured product can be obtained without impairing the viscosity (workability).
【0026】これに対して、疎水性処理を行わない微粉
末シリカを用いたものでは、粘性が高く従って作業性に
劣り、透明性も劣る。そしてその微粉末シリカを増量す
ると、硬化物作成が非常に困難となり、その透明性極め
て悪化する。又、変成シリコーン樹脂として、ポリプロ
ピレン型変成シリコーン樹脂を用いアミノシランを用い
ないと、硬化物の透明性は優れるが、その剛性も低く、
接着性に劣る。そして、アミノシランを用いると、接着
性は改良されるものの、透明性が悪化する。On the other hand, those using finely divided silica which is not subjected to a hydrophobic treatment have a high viscosity and are therefore inferior in workability and poor in transparency. When the amount of the fine powder silica is increased, it becomes extremely difficult to prepare a cured product, and the transparency is extremely deteriorated. Also, as a modified silicone resin, if a polypropylene-type modified silicone resin is used and no aminosilane is used, the transparency of the cured product is excellent, but its rigidity is low,
Poor adhesion. When aminosilane is used, adhesiveness is improved, but transparency is deteriorated.
【0027】[0027]
【発明の効果】本発明の組成物は押し出し作業性に優れ
ており、又、その硬化物は極めて優れた透明性を示すと
共に補強性、接着性に優れている。The composition of the present invention is excellent in extrusion workability, and its cured product exhibits extremely excellent transparency, as well as excellent reinforcing properties and adhesiveness.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4J040 DF041 DF051 DF061 DF062 DN061 DN062 EF042 EF052 EK111 EK112 GA03 GA08 GA29 GA31 HA306 HB07 HB20 HB24 HB27 HC01 HC20 HD24 HD27 HD36 HD42 HD43 JB04 KA03 KA07 KA16 KA25 LA01 LA10 NA12 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J040 DF041 DF051 DF061 DF062 DN061 DN062 EF042 EF052 EK111 EK112 GA03 GA08 GA29 GA31 HA306 HB07 HB20 HB24 HB27 HC01 HC20 HD24 HD27 HD36 HD42 HD43 JB04 KA03 KA07 KA07
Claims (4)
リルポリマーを含むポリオキシプロピレン型変成シリコ
ーン樹脂、(2)上記(1)の硬化剤、(3)疎水性微
粉末シリカ及び(4)アミノ基を有するシランカップリ
ング剤を含有する湿気硬化型接着剤組成物。1. A polyoxypropylene-type modified silicone resin containing an acrylic polymer having a silicon atom-containing functional group, (2) the curing agent of the above (1), (3) a finely divided hydrophobic silica, and (4) A moisture-curable adhesive composition containing a silane coupling agent having an amino group.
り、上記硬化剤が0.1〜10重量部、上記微粉末シリ
カが2〜50重量部、上記カップリング剤が0.1〜1
0重量部であることを特徴とする請求項1記載の湿気硬
化型接着剤組成物。2. The curing agent is 0.1 to 10 parts by weight, the finely divided silica is 2 to 50 parts by weight, and the coupling agent is 0.1 to 1 part by weight per 100 parts by weight of the modified silicone resin.
2. The moisture-curable adhesive composition according to claim 1, wherein the amount is 0 part by weight.
サメチルジシラザンで処理したものであることを特徴と
する請求項1又は2記載の湿気硬化型接着剤組成物。3. The moisture-curable adhesive composition according to claim 1, wherein the fine silica powder is obtained by treating fumed silica with hexamethyldisilazane.
ジメチルシロキサン及び/又はヘキサメチルジシラザン
で処理したものであることを特徴とする請求項1又は2
記載の湿気硬化型接着剤組成物。4. The finely divided silica obtained by treating silica airgel with dimethylsiloxane and / or hexamethyldisilazane.
The moisture-curable adhesive composition as described in the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20664098A JP3435351B2 (en) | 1998-07-22 | 1998-07-22 | Moisture-curable adhesive composition with excellent transparency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20664098A JP3435351B2 (en) | 1998-07-22 | 1998-07-22 | Moisture-curable adhesive composition with excellent transparency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000038560A true JP2000038560A (en) | 2000-02-08 |
| JP3435351B2 JP3435351B2 (en) | 2003-08-11 |
Family
ID=16526711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20664098A Expired - Lifetime JP3435351B2 (en) | 1998-07-22 | 1998-07-22 | Moisture-curable adhesive composition with excellent transparency |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3435351B2 (en) |
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-
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