JP2000036674A - Wiring board mounting method and wiring board mounting apparatus - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To improve the impact resistance of a wiring board disposed inside a device housing. SOLUTION: Buffer plates 13 and 27 are provided in parallel with the substrate surfaces of wiring boards 29 and 33, and the buffer plates 13 and 27 hold the wiring boards 29 and 33 with the buffer plates 13 and 27.
27 is connected to the equipment housing 2 so that the wiring boards 29 and 33 are attached to the equipment housing 2 so that shocks applied to the equipment housing 2 are not directly transmitted to the wiring board. At the same time, the vibration of the wiring board can be suppressed by the buffer plate members 13 and 27 arranged in parallel to the board surfaces of the wiring boards 29 and 33.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a wiring board on a housing and an apparatus for mounting the wiring board on the housing.

[0002]

2. Description of the Related Art It is well known that a circuit component is mounted on a wiring board on which a wiring pattern is formed, and the wiring board is mounted on a housing.

When the wiring board is mounted on the housing as described above, the wiring board is mounted and positioned in the housing, and when the shock is applied to the housing, the wiring board is displaced from the mounted position in the housing. In order to prevent the wiring board from being damaged or damaging other wiring boards, a frame is assembled inside the housing (hereinafter referred to as a build-in frame), and the wiring board is mounted with this build-in frame. It is positioned and fixed inside the housing.

However, in a structure in which a wiring board is positioned and fixed by using a build-in frame, a space is required for assembling the build-in frame inside the housing. When a shock is applied to the housing, the wiring boards collide with each other. It is necessary to provide sufficient space between the wiring boards to prevent damage, and furthermore, when a shock is applied to the part that positions and fixes the wiring board, this fixed part will be damaged, so the wiring board will be damaged. In order to protect electronic devices, it is necessary to use a wiring board with a built-in metal substrate as the wiring board, so the weight of the wiring board must be increased and the strength of the build-in frame must be increased. Adopting a build-in frame is problematic.

[0005] Therefore, adoption of a structure in which a wiring board is positioned and fixed using a build-in frame is limited to a relatively large device, for example, a broadcast / business video camera, for example, and a small device, For example, adoption in small video cameras for consumers is currently being forgotten.

On the other hand, the mounting structure of the wiring board in this small-sized device has a frameless structure in which the wiring substrate is mounted and held by the internal structure of the housing of the device itself, and the wiring board is directly mounted inside the housing. The housing is downsized.

[0007]

In the case where a wiring board is mounted by such a frameless structure, if a shock exceeding a foreseeable allowable limit is applied to a device and the housing itself is deformed or broken, There has been a problem that the deformation or damage of the body itself extends to the wiring board itself.

[0008] In view of the above, it is an object of the present invention to improve the impact resistance of a wiring board provided inside an equipment housing.

[0009]

According to a method of mounting a wiring board according to the present invention, the buffer board member is connected to a housing of an apparatus in a state where the wiring board can be gripped in parallel with the buffer board member.
In a state where the buffer plate member is opposed to the wiring board, the wiring board is attached to the housing via the buffer plate member so that a shock applied to the housing of the electronic device is not directly transmitted to the wiring board. In addition, the buffer member is provided in parallel with the substrate surface of the wiring board so that the vibration of the wiring board can be suppressed.

Further, the wiring board mounting apparatus according to the present invention provides a buffer plate member, a holding portion for holding the wiring board in parallel with the buffer plate member, and a connection for connecting the buffer plate member to a housing of the device. And a connection portion for connecting the buffer board member to the housing at the connection portion, so that the wiring board is attached to the housing with the buffer board member facing the wiring board. To prevent the shock applied to the housing from being directly transmitted to the wiring board, and to arrange the buffer plate member in parallel to the board surface of the wiring board, It is possible to suppress the vibration of.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a perspective view showing an external appearance of a casing of a video camera apparatus as an example. In FIG.
The housing 2 includes a front part 3, an upper part 5, a right side part 7,
It has a substantially rectangular parallelepiped shape composed of a left side surface portion 9, a bottom surface portion 11, and a back surface portion 13.

An optical lens mounting portion 15 is formed slightly above the center of the front portion 3, and a decorative plate portion 17 is mounted on the front portion 3 so as to surround the optical lens mounting portion 15.

An upper surface portion 5, a right side surface portion 7 constituting the housing 2,
Each of the left side surface portion 9 and the bottom surface portion 11 forms a frame 19 integrally formed of a hard resin material, and the front portion 3 is attached to one surface of the frame 19 and the back surface is mounted on the other surface. Part 13
Is attached. Also, the front part 3 and the back part 13
Is formed by a buffer plate member. The details of the buffer plate member will be described later.

Next, as an example of a cushioning plate member, a diagram of an example of a supporting structure of the cushioning member for disposing a cushioning plate member formed of a flexible polyurethane foam material in the housing 2 of the video camera device 1 is provided. 3,... Will be described with reference to FIG. The same parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description will be omitted.

FIG. 3 is a front view of the housing 2, and FIG. 4A is a view showing the inside of the housing 2 by cutting the housing 2 at a position indicated by cutting lines 22 A to 22 B in FIG. FIG. 4B is a diagram showing the inside of the housing 2 by cutting the housing 2 at the position shown by the cutting lines 23A-23B in FIG. And FIG.
FIG. 3 is a diagram showing the inside of the housing 2 by cutting the housing 2 at a position indicated by cutting lines 24A-24B.

At a position along the upper surface 5 and at a predetermined distance X from the rear portion 13 toward the front portion 3, a slight protrusion is made from the right side portion 7 toward the left side portion 9, and then an L-shaped front surface is formed. An L-shaped first locking portion 35 which is bent and extended in the direction of the portion 3 and a free end is formed at the extension end;
At a position along the bottom surface portion 11 and at a position at the same distance X from the back surface portion 13 toward the front surface portion 3 as the first locking portion 35, slightly project from the right side surface portion 7 toward the left side surface portion 9. An L-shaped second locking portion 3 which is bent and extended in an L-shape in the direction of the front portion 3 and a free end is formed at the extension.
7 is disposed inside the right side surface portion 7.

At a position along the upper surface 5 and at the same distance X as the first locking portion 35 from the back 13 to the front 3 from the back 13, a slight distance from the left side 9 to the right side 7. After projecting, it is bent and extended in the direction of the front portion 3 in an L shape, and an L-shaped third locking portion 36 having a free end formed at the extension thereof is disposed inside the left side portion 9, and the bottom portion is provided. 11 from the back portion 13 toward the front portion 3
At a position spaced by the same distance X as the locking portion 35, the left projection 9 slightly protrudes toward the right projection 7, and then L
An L-shaped fourth locking portion 38, which is bent and extended in the front portion 3 direction in the shape of a letter and has a free end formed at the extension end, is disposed inside the left side surface portion 9.

The first locking portion 35, the second locking portion 37, the third locking portion 36, and the fourth locking portion 38 allow the hook portion of the first cushioning member 25 (described below). In the description, this is referred to as a first hook portion).

In order to lock the first cushioning member 25 to the first hook portion, the first locking portion 35, the second locking portion 37, the third locking portion 36 and the fourth locking portion 36 are used. At a predetermined position where it can be engaged with each of the locking portions 38, the first buffer member 25 is provided with through-hole portions 41, 43, 42 and 44 in the hooked portion.
(Referred to as a first hooked portion in the following description).

Each of the through-holes 41, 43, 42 and 44R forming the first hooked portion is replaced with the first locking portion 35 and the second locking portion forming the first hook portion. 37, the first locking member 25 is locked to the L-shaped portions of the third locking portion 36 and the fourth locking portion 38, and the first cushioning member 25 is
By attaching the first buffer plate member 25 to the housing 2 at a position separated by a distance X from the rear surface portion 13 in parallel with each of the front surface portion 3 and the rear surface portion 13. Stop.

First locking portion 3 provided inside right side portion 7
A fifth locking portion 51 having the same shape as the first locking portion 35 is disposed at a position inside the right side portion 7 at a predetermined distance Y from the disposition position toward the front portion 3. And the right side 7
The first locking portion 35 has the same shape as the first locking portion 35 at a position inside the right side portion 7 at a predetermined distance Y from the arrangement position of the second locking portion 37 provided inside the right side toward the front portion 3. A sixth locking portion 53 is provided, and a predetermined distance Y is provided from the location of the third locking portion 36 provided inside the left side surface portion 9 toward the front portion 3.
A seventh locking portion 52 having the same shape as that of the first locking portion 35 is disposed at a position inside the left side portion 9 in which the fourth locking portion 38 is provided inside the left side portion 9. An eighth locking portion 54 having the same shape as the first locking portion 35 is disposed at a position inside the left side surface portion 9 at a predetermined interval Y from the disposition position toward the front portion 3. .

The fifth locking portion 51 and the sixth locking portion 5
Third, the seventh locking portion 52 and the eighth locking portion 54
Hook portion of the cushioning member 27 of FIG.
A hook portion).

In order to lock the second cushioning member 27 to the second hook portion, these locking portions 51, 53, 52 and 54 are used.
The second buffer member 27 is provided with a hooked portion (hereinafter, referred to as a second hooked portion) including the through-holes 55, 57, 56, and 58 at a predetermined position capable of engaging with each of the above. .

Each of the through holes 55, 57, 56 and 58 forming the second hooked portion is replaced with the fifth locking portion 51 and the sixth locking portion forming the second hook portion. 53, the seventh locking portion 52 and the eighth locking portion 54
The first buffer member 25 is locked to the housing 2 by attaching the second buffer member 27 to the housing 2 in a state where the second buffer member 27 is positioned with respect to the housing 2. A second cushioning member 27 is disposed parallel to each of the front part 3 and the back part 13 near the front part 3 side at a distance Y from 25.

The distances X and Y are shown in FIGS.
As shown in (2), the interval Z at which the third wiring board 33 can be disposed between the second buffer member 27 and the front portion 3 is set in consideration of the interval Z.

Next, a structure for holding the wiring board by these buffer plate members attached to the housing 2 will be described with reference to FIGS.
This will be described with reference to FIGS.

FIG. 1 is a view showing the internal structure of the housing 2 by cutting the housing 2 at the position shown by the cutting lines 24A-24B in FIG. 3, and FIG. 6A is a drawing showing the cutting lines 12A-12B in FIG. FIG. 6B is a diagram showing the internal configuration of the housing 2 by cutting the housing 2 at the position indicated by the dotted line 13A-1 in FIG.
FIG. 7 is a diagram showing the internal configuration of the housing 2 by cutting the housing 2 at the position indicated by 3B. FIG.
FIG. 8 is a diagram illustrating the internal configuration of the housing 2 by cutting the housing 2 at the position indicated by B, and FIG. 8 is a diagram illustrating a buffering action of the buffer plate member on the wiring board.

The same reference numerals are given to the same parts as those in FIGS. 2,..., And FIG.

In FIGS. 1, 6A and 6B, reference numerals 61, 6
3, 65 and 67 are first spacers, 71, 73, 75
And 77 are second spacers. In FIG. 7, a portion indicated by a dotted line shows a state where the first spacers 61, 63, 65, and 67 are provided by cutting a part of the first wiring board 29.

First, a portion where the first wiring board 29 is attached to the bottom portion 11 via the first spacers 61, 63, 65 and 67 will be described.

As shown in FIG. 7, the spacer 61 is provided on the inner surface of the bottom portion 11, the spacer 63 is provided on the inner surface of the right side portion 7, and the spacer 63 is provided on the inner surface of the left side portion 9. In the state where the respective side surfaces of the spacer 67 are in contact with the inner surface of the spacer 65 and the upper side surface portion 5,
The first wiring board 29 is spaced apart from the first cushioning member 25 via each of these spacers attached to the third wiring board 29.
Is arranged. Further, in this arrangement state, a play 80 is provided between the outer peripheral portion of the first wiring board 29 and the inner surface of each of these components constituting the housing 2, and the outer peripheral portion of the first wiring board 29 and the housing 2 are provided. Are not directly in contact with each other.

The spacers 61,..., 68 are spacers formed by using a cushioning packing material having a characteristic of absorbing vibration.

Next, the operation of suppressing the radial deformation of the first wiring board 29 by the buffering action of the back surface portion 13 when the first wiring board 29 is subjected to vibration and shock is shown in FIG.
The cross section indicated by -7B will be described with reference to FIG.

When the first wiring board 29 in a stationary state as shown in FIG. 8A receives vibration and shock, radial deformation occurs in the direction of vibration and shock as shown in FIG. 8B. According to the support structure of the first wiring board 29 shown and described, when the first wiring board 29 that has undergone radial deformation contacts the back surface 13 generated by the cushioning plate member, the buffer generated by the deformation of the back surface 13. The action suppresses this radial deformation, prevents excessive radial deformation of the first wiring board 29, and promptly returns to the original stationary state as shown in FIG. 8C.

Therefore, according to the structure for supporting the first wiring board 29 described with reference to FIG. 7, even if the first wiring board 29 is subjected to vibration or shock, -Damage due to impact can be reliably prevented.

Next, the structure of a portion where the third wiring board 33 is attached to the second buffer member 27 via the second spacers 71, 73, 35 and 37 will be described.

As in the case of the first wiring board described with reference to FIG. 7, the spacer 71 is provided on the inner surface of the bottom surface 11 constituting the housing 2 and the spacer 71 is provided on the inner surface of the right side surface 7. The spacer 73 and the spacer 7 are disposed on the inner surface of the left side surface 9.
Each of the spacers is attached to the second buffer member 27 with the respective side surfaces of the spacer 77 in contact with the inner surface of the upper side surface portion 5.

Then, the third wiring board 33 is provided with the gaps 80 between the inner surface of the housing 2 and the spacers 71 and 7.
3, 75 and 77, and the second buffer plate member 2
A structure in which the third wiring board 33 is supported by the second buffer member 27 in a state in which the third wiring board 33 is spaced from the third wiring board 33.

These second spacers are spacers formed using the same material as the first spacer.

Next, a description will be given of the operation of suppressing the radial deformation of the third wiring board 33 by the buffering action of the second buffering member 27 when the third wiring board 33 receives vibration and impact.

When the third wiring board 33 in the stationary state is subjected to vibration and shock, the vibration and shock are applied in the same manner as the case where the first wiring board 29 described with reference to FIG.
The third wiring board 33 undergoes radial deformation in the direction of impact. However, according to the support structure of the third wiring board 33 shown and described in FIGS. 1 and 6A and 6B, when the third wiring board 33 that has undergone radial deformation contacts the second buffer plate member 27. The amount of this radial deformation is weakened by the buffering action caused by the deformation of the second buffer plate member 27, so that excessive radial deformation of the third wiring board 33 is prevented, and the original state immediately returns to the stationary state.

Therefore, the third wiring board 33 is driven by the vibration
Damage due to impact can be reliably prevented.

Next, a description will be given of the operation of suppressing the radial deformation of the second wiring board 31 by the buffering action of the first buffering member 25 when the second wiring board 31 is subjected to vibration and shock.

As shown in FIGS. 2, 4 and 5, the second wiring board 31 is attached to the other end 23 of the hollow cylindrical state 21 in which one end is attached to the front part 3, and The first cushioning member 2 is supported by the front portion 3 through
5, the second wiring board 31 is arranged in a state where the board surface is parallel and close to the board.

When the second wiring board 31 arranged in such a state and in a stationary state receives vibration and shock, the second wiring board 31 undergoes radial deformation in the direction of the vibration and shock.
However, according to the support structure for the second wiring board 31 described with reference to FIGS. 2, 4, and 5, the second wiring board 31 that has undergone radial deformation contacts the first buffer member 25, and The amount of this radial deformation is reduced by the buffering action caused by the deformation of the first buffering member 25, and the second wiring board 3
1 prevents excessive radial deformation, and quickly returns to the original stationary state.

Therefore, even when the second wiring board 31 is subjected to vibration or shock, it is possible to reliably prevent the second wiring board 31 from being damaged by the vibration or shock.

In the examples shown in FIGS. 1,..., And 8, four spacers are used as the first spacer and the second spacer, respectively. In the embodiment, the number of the spacers used is not limited to four, but may be variously selected and used according to the substrate area of the wiring board. .

The size of the gap between the wiring board and the cushioning member may be of various dimensions set in accordance with the required value of the heat radiation of the wiring board. When there is no gap, the dimension of this gap may be set to zero.

Further, in the examples described with reference to FIGS. 1, ‥‥, and 8, these spacers are separate members from the cushioning member. However, the present invention is not limited to such a separate structure. For example, it is a matter of course that these spacers may be formed by integrally molding with the cushioning member.

Further, in the example described with reference to FIGS. 1, ‥‥ and 8, the front part 3 formed by the cushioning member is used.
The first buffer plate member 25 and the second buffer plate member 27 are connected directly to the housing 2 via hook portions (first and second hook portions). It is attached to the structure.

However, the first buffer plate member 25 and the second buffer plate member 27 may have a structure in which they are directly attached to the housing 2 without interposing these hook portions.
Of course, the front part 3 and the rear part 13 may also be attached to the housing 2 via these hook parts.

Further, in the examples described with reference to FIGS. 1, ‥‥, and 8, a wiring board is mounted on both sides of the first buffer plate member 25 and both sides of the second buffer plate member 27. Of course, a configuration may also be adopted in which a wiring board is attached, and a third buffer board member is provided between the wiring board attached to the first buffer board member 25 and the wiring board facing this wiring board. .

Further, these hook portions may be formed integrally with the housing 2, or a hook part formed separately from the housing 2 may be assembled to the housing 2. is there.

Further, if necessary, for example, a male screw is cut into the free end of the hook, a nut can be screwed into the male screw, and the buffer plate member locked to the hook does not come off. The hook portion may be deformed in shape and structure, and the direction of the free end portion of the hook portion with respect to the housing 2 is not limited to the direction toward the front portion 3 as in this example. There may be various orientations, such as turning in a direction that facilitates locking.

Further, the exterior of the housing 2 may be protected by covering the portion except for the decorative plate portion 17 with a lightweight and tough thin plate material made of a magnesium alloy material. .

Next, an example of the cushioning material used for the first cushioning member 25, the second cushioning member 29, and the cushioning members used for the front part and the back part 13 described with reference to FIGS. Will be described.

Conventionally, the following buffer member (hereinafter referred to as S40) has been used as this type of buffer member.

Physical Properties of S40 S40 ‥‥ Flexible polyurethane foam “Moltoprene S
C "Applications ‥‥ Mainly used as heat insulation, soundproofing, cushioning packing material. Raw materials: Polyol and isocyanate Heat resistant temperature: Maximum operating temperature: 70 to 75 ° C Insulation: Electric resistance Insulation foam Density: 0.031 ± 0.005 (G / cm3) Number of cells: 33 ± 10 (cells / 25 mm) Tensile strength: 1 or more (kg / cm2) Elongation: 100 or more (%) Tear strength ···· 0.5 or more (kg / cm) UL standard ··· Test method F-02-001-00
(Soft urethane foam test method).

The following cushioning members are used for the first cushioning member 25, the second cushioning member 29, the front portion 3 and the back portion 13 described with reference to FIGS. (Referred to as HR30 in the following description).

Physical Properties of HR30 HR30 {Flexible polyurethane foam "Moltoprene HR" Application} Mainly used as heat insulating, soundproofing and cushioning packing material. Features ‥‥ Lightweight and easy to process, capable of processing complex shapes. Ingredients: Maltoprene, standard material Heat-resistant temperature: Maximum operating temperature: 105 to 110 ° C Insulation: Electrical resistance Insulation foam Number of cells: 27 or more 33 Below (pcs / 25m
m) Tensile strength: 1 or more (kg / cm2) Elongation: 200 or more (%) UL standard: Class 2 Test method F-02-001-00 (soft urethane) Foam test method).

That is, since the physical properties of the HR 30 are particularly excellent in the heat resistance temperature and the number of cells as compared with the physical properties of the S40, the first cushioning member 25 shown in FIGS. 2 buffer member 29, front part 3 and back part 13
It is most suitable as a shock-absorbing member to be used for a vehicle, and it is easy to realize recycling of the shock-absorbing member.

[0063]

According to the present invention, since the vibration of the wiring board caused by the shock applied to the housing of the device can be suppressed, it is possible to prevent the wiring board from being damaged.

[Brief description of the drawings]

FIG. 1 is a diagram showing an internal configuration of a casing of a video camera device as an example of an embodiment of the present invention.

FIG. 2 is a perspective view showing an appearance of a housing of the video camera device shown in FIG.

FIG. 3 is a front view of a housing of the video camera device shown in FIG. 2;

FIG. 4A is a cross-sectional view illustrating an internal configuration of the housing 2 at a position indicated by a cutting line 22A-22B in FIG. B
FIG. 4 is a cross-sectional view showing the internal configuration of the housing 2 at the position shown by the cutting lines 23A-23B in FIG.

FIG. 5 is a cross-sectional view showing an internal configuration of the housing 2 at a position shown by cutting lines 24A-24B in FIG.

FIG. 6A is a cross-sectional view showing the internal configuration of the housing 2 at the position shown by cutting lines 12A-12B in FIG. B
FIG. 3 is a cross-sectional view showing the internal configuration of the housing 2 at the position shown by the cutting lines 13A-13B in FIG.

FIG. 7 is a cross-sectional view showing an internal configuration of the housing 2 at a position shown by a cutting line 10A-10B in FIG.

8 is a cross-sectional view for explaining the radius suppressing operation of the first wiring board 29 shown at the position shown by the cutting lines 7A-7B in FIG.

[Explanation of symbols]

2 ‥‥ housing, 5,51 ‥‥ locking portion, 13,27 ‥‥ buffer plate member, 29,33 ‥‥ wiring board

Claims (2)

[Claims] 1. A buffer board member coupled to a housing of a device in a state in which a wiring board can be gripped in parallel with the buffer board member,
In a state where the buffer plate member is opposed to the wiring board,
A wiring board mounting method, wherein the wiring board is mounted on the housing via the buffer plate member. 2. A cushioning plate member, a gripping portion for gripping a wiring board in parallel with the cushioning plate member, and a coupling portion for coupling the cushioning plate member to a housing of a device, wherein the coupling portion The wiring board mounting apparatus, wherein the buffer board member is coupled to the housing so that the wiring board is mounted on the housing in a state where the buffer board member faces the wiring board.