JP2000033969A - Embossed carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an embossed carrier tape wherein an electronic part for an area package can be stably placed in a recessed part for storing by tapered face supporting and it can be applied widely to the variety of parts for the area package with such shapes as different dimensions or full grid, etc., and it can be transferred and handled without generating damages on ball terminals existing in the package. SOLUTION: A recessed part 1 for storing has a depth by which ball terminals B of a package P to be supported are not brought into contact with the inner bottom face 11 of the recessed part 1 for storing and a tapered face 12 for receiving the edge parts of the package outer shape is formed on the lower part of the side wall faces 13 of the recessed part 1 storing so as to intersect at an acute angles to the vertical face and to be continuous with the inner bottom face 11 and the angle of inclination θ of this tapered face 12 is formed in such a way that the ball terminals B are not brought into contact with the tapered face 12 in relation to the min. value of the distance between ball centers of the ball terminals from the outer end edge of the package, the max. value of the height of the balls and the max. value of the diameters of the balls.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case where an area package such as a CSP or BGA, that is, an electronic component with a lead is accommodated in an accommodating recess formed at an interval in the longitudinal direction, and is supplied to a mounting device for the electronic component. The present invention relates to an emboss carrier tape used for transportation and storage, and more particularly to an emboss carrier tape for stably storing electronic components in a storage recess and preventing damage to terminals.

[0002]

2. Description of the Related Art In general, packaging materials such as paper tapes, magazines, trays or embossed carrier tapes are used for packaging electronic components such as semiconductor packages. In recent years, packaging efficiency of electronic components has been high, and Embossed carrier tapes (hereinafter simply referred to as carrier tapes) have become mainstream for reasons such as easy handling. In particular, IC packages for semiconductor devices tend to shift to carrier tape packaging due to advances in miniaturization and fine pitch.

Conventionally, embossed carrier tapes use a sheet made of a thermoplastic resin such as polystyrene, polyvinyl chloride, amorphous polyester, or polycarbonate, and press-mold a recess for accommodating electronic components.
It is formed by vacuum forming, compressed air forming, vacuum compressed air forming or compressed air plug assist forming. Such a carrier tape stores electronic components in the storage recess. However, if the terminals of the electronic components stored in the storage recess are in direct contact with the bottom surface of the storage recess or the like, the terminals may be impacted during transportation or the like. May cause damage. Therefore, as shown in FIG. 6, a recent carrier tape a has a shelf c or a pedestal d formed by bulging and forming on a bottom surface of a storage recess b, and an electronic component is placed on the raised shelf c or pedestal d. The main body is placed so as to prevent the terminal from directly contacting the bottom surface or the like.

[0004]

However, an embossed carrier tape in which a shelf or a pedestal is formed in the storage recess described above, especially in a shelf structure, a package flange margin (a distance from an outer edge of a package to an outer edge of a terminal). When the size becomes smaller, the shelf and the terminal may come into contact with each other, or may protrude from the storage recess and become unusable.When the design is made in consideration of the tolerance of both the area package and the CT, the contact of the terminal is avoided, and the package is removed from the shelf. The dimensions that do not fall off are not determined,
An embossed carrier tape cannot be manufactured or cannot be made due to a small tolerance. In addition, the pedestal structure supports the package by raising the bottom of the inner bottom center, so that only those with terminals in the grid around the package or those without terminals in the center can be used, and full grid (package with terminals on the entire surface) It is not possible to use it, and it is not versatile and it is necessary to use a dedicated carrier tape corresponding to various packages.Especially all electronic components vary greatly between individual electronic components and manufacturers, so all electronic components In order to cope with the problems described above, the above-mentioned problems are remarkable, which is inconvenient and uneconomical. The present invention is intended to eliminate these conventional disadvantages, and it is possible to stably mount area packages having various dimensions on a carrier tape in a storage recess, and to apply a terminal to a terminal even if an impact or the like is applied in a biased state. An object of the present invention is to provide a versatile embossed carrier tape that can be held and stored without damage at low cost.

[0005]

In order to achieve the above object, according to the present invention, a large number of substantially rectangular parallelepiped storage recesses are formed at intervals in the longitudinal direction, and ball terminals protrude from the main body in these storage recesses. An embossed carrier tape for housing a package of electronic components, wherein the housing recess has a depth such that a ball terminal of the package supported in the housing recess does not contact an inner bottom surface of the housing recess, and the housing recess. At the bottom of the side wall surface, a tapered surface that receives the edge of the package outer shape is formed at an acute angle to the vertical plane and continues to the inner bottom surface, and the inclination angle of this tapered surface is
The ball terminal is formed at an angle such that the ball terminal does not contact the inclined surface due to the relationship between the minimum value of the ball center of the ball terminal closest to the package outer edge, the maximum value of the ball height, and the maximum value of the ball diameter. It was done.

In the embossed carrier tape according to the present invention, the tapered surface formed at the lower part of the side wall surface of the storage recess has an inclination angle represented by the following formula (1). An aspect in which the electronic component housing recess of the carrier tape has a tapered surface in which a side wall surface above the tapered surface expands to the outer periphery at an inclination angle of 5 to 20 degrees with respect to a vertical plane (Claim 3). Furthermore, the electronic component housing concave portion of the carrier tape is configured such that its corner portion is formed into an R-shaped curved surface, and the R-shaped curved surface is formed in one or both directions. can do.

In the embossed carrier tape, a large number of recesses are formed on one surface at a predetermined pitch in the longitudinal direction.
A large number of feed holes are formed at a predetermined pitch on one or both sides in the width direction. As described above, this embossed carrier tape is formed by molding a thermoplastic resin sheet such as polystyrene, polyvinyl chloride resin, polyethylene terephthalate or polypropylene by air pressure, press, vacuum molding, or the like, or by injection molding using the above material. Manufactured.

The storage recess is a three-dimensional space, for example, a cubic or rectangular parallelepiped space opened on the surface side having dimensions corresponding to the electronic component, and the storage recess is a package supported in the storage recess. The ball terminal has a depth such that it does not contact the inner bottom surface of the storage recess, and the tapered surface that receives the edge of the package outer shape at the lower side wall surface of the storage recess intersects the vertical surface at an acute angle to the inner bottom surface. It is formed continuously. The tapered surface is formed on the opposing side wall surface as long as the package can be mounted, and the inclination angle of the tapered surface is set to the minimum value of the distance from the outer edge of the package to the ball center of the ball terminal and the maximum value of the ball height. And the maximum value of the ball diameter, the ball terminal has an angle at which the ball terminal does not contact the tapered surface, that is, an inclination angle represented by the following equation 1.

[0009]

(Equation 1)

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In an embossed carrier tape according to an embodiment of the present invention, electronic components of an area package are supported on a tapered surface so that they can be stably mounted in a storage recess, and have different dimensions or full grids. It can be applied to a large number of other types of area packages, can be transported and handled without causing damage to the ball terminals in the package, can easily and reliably recognize the pattern of the package, and can judge the quality of the package. Can be done accurately.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an embossed carrier tape according to a first embodiment of the present invention, in which a large number of substantially rectangular parallelepiped storage recesses 1 are formed at intervals in the longitudinal direction of the tape, and balls are formed in these storage recesses 1. intended for accommodating storage areas package P which projects a large number of terminal B, has a depth that balls terminal B of the package P supported in the housing recess 1 is not in contact with the inner bottom surface 1 ₁ of the housing recess 1, and thereby forming continuous with the housing recess first sidewall surface 1 ₃ inner bottom surface 1 ₁ intersect at an acute angle to the tapered surface 1 ₂ for receiving an edge portion of the package outline at the bottom with respect to the vertical plane, the tapered surface 1 ₂ Is the minimum value of the distance between the outer edge of the package and the ball center of the ball terminal,
And maximum ball height, is formed on the inclined angle θ of the ball on the tapered surface 1 ₂ do not contact in relation to the maximum value of the ball diameter.

[0012] Examples housing recess taper surface 1 ₂ formed on the side wall surface bottom 1 ₃ 1, in connection as shown in FIG. 2 is configured in the form that has an inclination angle θ of the formula 1. In the embossed carrier tape 10, a large number of storage recesses 1 opening on one surface are formed at regular intervals in the tape longitudinal direction, and the area packages P are stored in these storage recesses 1 respectively. Although illustration and detailed description are omitted, the embossed carrier tape 10 has a storage recess 1.
A top tape is adhered to a surface (front surface) on the opening side of the storage recess 1 in a state where the electronic component is stored therein, and the opening of the storage recess 1 is closed. In addition, a detection hole 11 is formed in the inner bottom surface of the storage recess 1 and the embossed carrier tape 1 is formed.
On one side in the width direction of 0, there are provided feed holes 12 penetratingly formed at regular intervals in the longitudinal direction of the tape.

[0013] The electronic component housing recess 1 of the carrier tape 10, the side wall surface 1 located above the tapered surface 1 _2
3 to 5 to 20 degrees with respect to the vertical plane, preferably 5 to 10
It constitutes a tapered surface expanding to the outer periphery with a tilt angle α in degrees, easier to loading areas package P, and are to allow stable placement of the tapered surface 1 _2.

The electronic component housing recess 1 of the carrier tape may have a chamfered corner as shown in FIG. 1, but the corner may be curved in an R shape as shown in FIGS. The surface 2 may be configured so that the R-shaped curved surface 2 is escaped in one or both directions. Interference between the corner edge of the package and the corner of the carrier tape can be avoided, and the package can be supported in a stable state. This is a preferred example that can be easily manufactured.

For example, as shown in the example of FIG. 3, R-shaped curved surfaces 2 are formed at four corners of the storage recess, and
The corner edge of the area package and the carrier tape may be formed such that the curved surface is cut off in both directions, or the R-shaped curved surface 2 is cut out in one direction as in the examples of FIGS. Can be avoided, the package can be supported in a stable state, handling can be simplified, and the storage recess can be easily manufactured.

As an example, the thickness of the carrier tape 10 is 0.2 to 0.7 mm, preferably 0.3 to 0.7 mm.
0.5 mm, the depth of the storage recess 1 is 1.5-2.
0mm preferably as ball terminal B of the package P supported by the tapered surface _{1 2} does not contact the inner bottom surface _{1 1} 1.75～1.85Mm, sidewall surface _{1 3,}
A slightly smaller angle α (for example, 1.0 ° to
About 5.0 °: see FIG.
₂ has a projection width Z in plan view (see FIG. 1a) of 0.5 to
1.5 mm range, preferably 0.8-1.0 mm
In, and the distance between the inner bottom surface _{1 1} from the contact point of the ball terminal B of the area the package P 0.05～1.00Mm,
Preferably, it is formed to have a thickness of 0.1 to 0.4 mm. Further, a preferred embodiment, the boundary between the tapered surface and the sidewall surface 1 _3, the area package P ball terminals B
Is formed at a position higher by 0.2 to 0.7 mm than the tip of the target, more preferably, at a position higher by 0.2 to 0.4 mm. In any case, it is considered to increase the distance from the edge of the package to the center of the outermost ball terminal.

In the embossed carrier tape 10 according to this embodiment, the area package P is stored in the storage recess 1 by performing a function test or the like of the area package P, and the like.
Thereafter, the top tape is bonded. Here, the area package P, in the housing recess 1 of embossed carrier tape 10 is placed on the tapered surface 1 ₂ and without abutting on the inner bottom surface 1 ₁ and the tapered surface 1 ₂ and the like ball terminal B In other words, the ball package B is accommodated in a floating state, and the area package P can be stably accommodated without any deviation, so that the ball package B is reliably prevented from being damaged even if an impact is applied during transportation or the like.

The embossed carrier tape 10
In the state before the top tape is bonded, and in the state where the top tape is bonded, as described above, the area package P in the storage recess 1 is illuminated with an LED or the like as a visual inspection or a final inspection. Then, an image is taken by a CCD camera, and the image pickup signal of the CCD camera is processed to determine good / bad.

Further, the embossed carrier tape 10
Is the area the inclination angle of the tapered surface 1 ₂ package P
Since it is configured in a tapered surface 1 ₂ of the angular particularly relevant under the formula 1 that does not contact the ball terminal B of the even package flange margin becomes smaller, to be stored without ball terminals B comes into contact with the tapered surface 1 _2, for storage recess bottom surface 1 ₁ a stable carrier tape with a reliability can be supported in a state without contact, it may be used in a wide range in the form and dimensions of significantly different package manufacturers, etc. .

[0020]

According to the embossed carrier tape of the present invention, the recess of the electronic component has a depth such that the ball terminal of the package supported in the recess does not contact the inner bottom surface of the recess. A tapered surface that receives the edge of the package outer shape is formed at the lower part of the side wall surface of the housing recess at an acute angle with respect to the vertical plane and continues to the inner bottom surface, and the inclination angle of the tapered surface is set at an angle from the package outer edge. A minimum value of the distance between the ball centers of the ball terminals,
Due to the relationship between the maximum value of the ball height and the maximum value of the ball diameter, the ball terminal is formed at an angle such that the ball terminal does not come into contact with the tapered surface. It can be stored in a predetermined position without causing any inclination, etc., and can be stored even if the external dimensions of the area package change slightly, preventing damage to the terminals due to impact during transportation etc. Offers a low-cost, versatile embossed carrier tape that can stably place area packages of various dimensions in the storage recess and can hold and store the terminals without any damage to the terminals even if impact is applied in a biased state. I do.

[Brief description of the drawings]

FIG. 1 shows an embossed carrier tape according to a first embodiment of the present invention, wherein a is a plan view thereof, and b is an enlarged longitudinal sectional view taken along line AA.

2 shows the relationship between the tapered surface of the example of FIG. 1 and a ball terminal of an electronic article, where a is a cross-sectional view of a part of a state in which electronic components are housed, and b is a schematic diagram of the inclination angle of the tapered surface. .

FIG. 3 shows an embossed carrier tape according to a second embodiment of the present invention, wherein a is a plan view, b is a front view, and c.
Is a rear view, and d is an enlarged vertical sectional view.

FIG. 4 shows an embossed carrier tape according to a third embodiment of the present invention, wherein a is a plan view and b is an enlarged longitudinal sectional view.

FIG. 5 shows an embossed carrier tape according to a fourth embodiment of the present invention, wherein a is a plan view, b is a front view, and c
Is a rear view, and d is an enlarged vertical sectional view.

FIG. 6 shows a conventional example, where A is a plan view of one example, and A ′
Is a longitudinal sectional view, B is a plan view of another example, B 'is a longitudinal sectional view, C is a plan view of another example, and C' is a longitudinal sectional view.

[Description of Signs] 1 Storage recess 1 ₁ Inner bottom surface 1 ₂ Tapered surface 1 ₃ Side wall surface 2 R-shaped curved surface 10 Emboss carrier tape 11 Detection hole 12 Feed hole P Package B Ball terminal

Continuation of front page (72) Inventor Kazuya Sato 1-406, Yoshino-cho, Omiya-shi, Saitama Shin-Etsu Polymer Co., Ltd. Tokyo plant (72) Inventor Tomoyasu Kato 1-406-1, Yoshino-cho, Omiya-shi, Saitama Shin-Etsu Polymer Co., Ltd. Tokyo Plant F-term (reference) AA15 AA24 AA28 AC03 AG01 AG07 AG25 AG27 AH58 AR12 AR13 MA01 MA02 MA03 MB02 MC01 MC04 5E313 AA03 AA04 AA18 DD05

Claims (4)

[Claims] 1. An embossed carrier tape for accommodating a package of an electronic component in which a plurality of substantially rectangular parallelepiped storage recesses are formed at intervals in a longitudinal direction and ball terminals protrude from a main body in these storage recesses. The storage recess has a depth such that the ball terminals of the package supported in the storage recess do not contact the inner bottom surface of the storage recess, and a tapered surface that receives an edge portion of the package outer shape at a lower side wall surface of the storage recess. The tapered surface is formed so as to intersect with the vertical surface at an acute angle and continues to the inner bottom surface, and the inclination angle of the tapered surface is set so that the tapered surface side portion of the ball terminal closest to the package outer edge does not contact the tapered surface. An embossed carrier tape characterized by being formed on 2. A tapered surface formed in a lower portion of a side wall surface of the storage recess, The embossed carrier tape according to claim 1, which has an inclination angle represented by: 3. The electronic component housing concave portion of the carrier tape has a side wall surface above the tapered surface facing the vertical surface by a distance of 5%.
The embossed carrier tape according to claim 1 or 2, wherein the tapered surface is a tapered surface that expands to the outer periphery with an inclination angle of about 20 degrees. 4. The concave part for accommodating electronic parts of the carrier tape, wherein a corner portion thereof is formed into an R-shaped curved surface, and the R-shaped curved surface is formed in one or both directions. The embossed carrier tape according to claim 1, 2 or 3.