JP2000031101A - Semiconductor wafer polishing / cleaning apparatus and method, and medium recording program thereof - Google Patents

Abstract

(57) [Problem] A conventional semiconductor wafer polishing apparatus and a semiconductor wafer cleaning apparatus are independent, the equipment including a clean room becomes large, and the distance between the polishing apparatus and the cleaning apparatus becomes long. During the movement of the wafer, there is a problem that the probability of adhesion of dust or the like increases. SOLUTION: The polishing apparatus and the cleaning apparatus are integrated, and a blocking wall provided with an opening / closing section is provided between the polishing apparatus and the cleaning apparatus, and the transfer of the wafer between the apparatuses is performed through the opening / closing section. A control device that controls these devices holds a lot number, polishing conditions, cleaning conditions, and the like, and executes polishing and cleaning according to the conditions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer polishing apparatus and a cleaning / drying apparatus, and more particularly to a semiconductor wafer polishing / cleaning apparatus and a semiconductor wafer polishing / cleaning method in which a polishing apparatus and a cleaning / drying apparatus are integrated. .

[0002]

2. Description of the Related Art In a conventional semiconductor wafer manufacturing line, a semiconductor wafer polishing apparatus and a semiconductor wafer cleaning / drying apparatus are installed as independent apparatuses. Therefore, when cleaning and drying after polishing a semiconductor wafer, first, a person or a robot carries the semiconductor wafer to a clean room having a polishing apparatus, loads the semiconductor wafer into the polishing apparatus, polishes the semiconductor wafer, and then removes the semiconductor wafer from the polishing apparatus. Next, a person or a robot carries the polished semiconductor wafer to a clean room where the cleaning device is located, loads the polished semiconductor wafer into the cleaning device, cleans the semiconductor wafer, removes the semiconductor wafer from the cleaning device, further loads the semiconductor wafer into the drying device, and allows the semiconductor wafer to dry. After that, the process of taking out from the drying device was sequentially performed.

[0003]

When the semiconductor wafer polishing apparatus and the semiconductor wafer cleaning / drying apparatus are independent from each other as in the prior art, the semiconductor wafer must be transported between the apparatuses. There has been a problem that the distance becomes longer and the probability of adhesion of dust or the like increases during the movement of the wafer.

Further, when the semiconductor wafer polishing apparatus and the semiconductor wafer cleaning / drying apparatus are simply integrated, there is a problem that scattered matter generated from the polishing apparatus at the time of polishing enters the cleaning / drying apparatus side.

[0005] Further, the semiconductor wafer polishing apparatus and the semiconductor wafer cleaning / drying apparatus have know-how in the processing steps of each apparatus. When integrating them, after developing each apparatus independently, two apparatuses are required. Combining or combining two existing devices will reduce development costs.

The present invention has been made in view of the above points, and integrates a semiconductor wafer polishing apparatus, a cleaning apparatus, and a drying apparatus, and scatters generated from the polishing apparatus during polishing enter the cleaning / drying apparatus. An object of the present invention is to provide a semiconductor wafer polishing / cleaning apparatus and a semiconductor wafer polishing / cleaning method having a configuration not to use.

[0007]

According to the present invention, there is provided a semiconductor wafer polishing / cleaning apparatus, comprising: a cleaning section for cleaning and drying a semiconductor wafer; a polishing section for polishing a semiconductor wafer;
Connected to the cleaning unit, a cleaning control unit for controlling the cleaning unit, connected to the polishing unit, a polishing control unit for controlling the polishing unit, connected to the cleaning control unit and the polishing control unit,
The cleaning control unit and a control terminal that controls the polishing control unit, the control terminal can set operating conditions of the cleaning unit and the polishing unit, the cleaning control unit and the polishing control unit,
The cleaning unit and the polishing unit are connected to each other and operate in conjunction with each other.

A semiconductor wafer polishing / cleaning apparatus according to the present invention comprises a cleaning unit for cleaning and drying a semiconductor wafer;
A polishing section for polishing a semiconductor wafer; one or more opening / closing sections provided on a blocking wall for blocking air flow between the cleaning section and the polishing section; a cleaning section, the polishing section, and the opening / closing section A cleaning unit connected to the cleaning unit; a polishing unit; and a control unit for controlling the opening / closing unit. The transfer of the semiconductor wafer between the cleaning unit and the polishing unit is performed through the opening / closing unit.

The control unit has at least one control terminal for inputting or selecting operating conditions of the cleaning unit and the polishing unit.

The control unit further includes a cleaning control unit connected to the control terminal for controlling the cleaning unit, and a polishing control unit connected to the control terminal for controlling the polishing unit,
The cleaning control unit and the polishing control unit are connected to each other,
The cleaning unit and the polishing unit are controlled in conjunction with each other.

[0011] The cleaning unit includes a first transport unit configured to transport one or more semiconductor wafers, and a cleaning unit configured to clean the semiconductor wafer.
A polishing unit for drying the semiconductor wafer; and a polishing unit, wherein the polishing unit includes one or more second conveyance units used for conveying the semiconductor wafer, and a polishing unit for polishing the semiconductor wafer. Means.

The cleaning section further includes one or more temporary storage sections for temporarily storing the semiconductor wafer.

The semiconductor wafer polishing / cleaning method comprises the steps of: allowing the first transfer means to take in a semiconductor wafer from an inlet; opening the opening / closing portion; and transferring the semiconductor wafer from the first transfer means to the second transfer means. Transferring the semiconductor wafer to the polishing means, closing the opening and closing section, and transferring the semiconductor wafer to the polishing means,
A step of causing the polishing means to polish the semiconductor wafer; a step of allowing the second transport means to remove the semiconductor wafer from the polishing means; opening the opening / closing section; Transferring the semiconductor wafer to the cleaning unit, closing the opening / closing unit, and transferring the semiconductor wafer to the cleaning unit, and causing the cleaning unit to clean the semiconductor wafer. A step of transferring the semiconductor wafer from the cleaning unit to the drying unit on the first transport unit; and a step of drying the semiconductor wafer on the drying unit.
Returning the semiconductor wafer from the drying unit to the intake port by the first transport unit.

According to the semiconductor wafer polishing / cleaning apparatus of the present invention, a procedure for transferring a semiconductor wafer from an inlet, a procedure for determining whether or not the polishing section is in a standby state waiting for a semiconductor wafer, A procedure for requesting reception of a semiconductor wafer, a procedure for determining whether one of the open / close sections is open, a procedure for transporting a semiconductor wafer from the cleaning section to the polishing section, and a step for polishing the semiconductor wafer A procedure for determining whether the cleaning section is not in a standby state, a procedure in which the cleaning section stops a request for receiving a semiconductor wafer with respect to the polishing section, and a step in which the cleaning section is in a standby state for waiting for a semiconductor wafer with respect to the polishing section. A step of notifying, a step of determining whether the polishing section has requested the cleaning section to receive the semiconductor wafer, and one of the opening / closing sections being opened. The procedure of determining whether or not, the procedure of transporting the semiconductor wafer from the polishing unit to the cleaning unit, the cleaning unit, the polishing unit, the procedure of notifying that the standby state is not waiting for the semiconductor wafer, and the semiconductor wafer Transferring the semiconductor wafer to the cleaning means, cleaning the semiconductor wafer by the cleaning means, transferring the semiconductor wafer to the drying means, drying the semiconductor wafer by the drying means, And a computer-readable recording medium on which a program for causing a computer to execute a procedure of returning a semiconductor wafer to a computer is recorded.

In the semiconductor wafer polishing / cleaning apparatus of the present invention, the polishing unit notifies the cleaning unit that the semiconductor wafer is in a standby state waiting for the semiconductor wafer, and the cleaning unit transmits the semiconductor wafer to the polishing unit. A procedure for determining whether a request has been received, a procedure for opening one of the opening / closing sections, a procedure for the polishing section to determine whether or not reception of a semiconductor wafer from the cleaning section has been completed, A procedure for notifying that the semiconductor wafer is not in a standby state waiting for a semiconductor wafer, a procedure in which the polishing unit stops a request for receiving a semiconductor wafer with respect to the cleaning unit, and the cleaning unit stops a request for receiving a semiconductor wafer with respect to the polishing unit. A procedure for determining whether or not the semiconductor wafer is in contact, a procedure for closing the opening / closing section, a procedure for transferring a semiconductor wafer to the polishing means, and a procedure for transferring the semiconductor wafer to the wafer polishing unit. A procedure for polishing the wafer; a procedure for determining whether the cleaning unit is in a standby state waiting for a semiconductor wafer; a procedure for the polishing unit to request the cleaning unit to receive a semiconductor wafer; A procedure to open one, a step in which the polishing unit determines whether the delivery of the semiconductor wafer to the cleaning unit has been completed, a step in which the cleaning unit is in a standby state waiting for the semiconductor wafer, and a step in which the polishing unit There is provided a computer-readable recording medium storing a program for causing a computer to execute a procedure for stopping a request for receiving a semiconductor wafer from the cleaning section and a procedure for closing the opening / closing section.

In the semiconductor wafer polishing / cleaning apparatus of the present invention, a procedure for determining whether the polishing section is in a standby state waiting for a semiconductor wafer, and a procedure for determining whether there is a semiconductor wafer from the cleaning section to the polishing section. A step of extracting individual information of the semiconductor wafer, a step of extracting polishing conditions corresponding to the individual information of the semiconductor wafer, a step of setting the individual information of the semiconductor wafer and the polishing condition in the polishing control unit, and the cleaning unit A procedure to determine whether the delivery of the semiconductor wafer has been completed, and a procedure to determine whether the polishing unit has completed the reception of the semiconductor wafer, and further,
A procedure for determining whether the cleaning unit is in a standby state waiting for a semiconductor wafer, a procedure for determining whether there is a semiconductor wafer from the polishing unit to the cleaning unit, a procedure for extracting individual information of the semiconductor wafer, A procedure for extracting the cleaning / drying conditions corresponding to the individual information, a procedure for setting the individual information of the semiconductor wafer and the cleaning / drying conditions in the cleaning control unit, and whether the polishing unit has completed the delivery of the semiconductor wafer. A computer-readable recording medium that records a program for causing a computer to execute a determining step and a step of determining whether the cleaning unit has completed receiving the semiconductor wafer is provided.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing the configuration of a semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention, and FIG. 2 is a diagram showing the connection relationship between a control device and a controlled device.

The semiconductor wafer polishing / cleaning apparatus of this embodiment includes a cleaning section, a polishing section, a cleaning control section 1 for controlling the cleaning section, a polishing control section 2 for controlling the polishing section, and a cleaning control section 1. And a control terminal 3 for controlling the polishing control unit 2. The cleaning control unit 1 may be included in the cleaning unit, and the polishing control unit 2 may be included in the polishing unit.

The cleaning section includes wafer transport units 4 to 8 as transport means for transporting semiconductor wafers, buffer cassettes 9 and 10 as temporary storage sections for temporarily storing semiconductor wafers, and cleaning means for cleaning semiconductor wafers. Wafer cleaning unit 11 and a wafer drying unit 12 as a drying unit for drying a semiconductor wafer
And a cassette as an intake. The polishing unit is
It comprises a wafer transport unit 13, 14 and a wafer polishing unit 15. The cleaning unit and the polishing unit are blocked by a blocking wall, and doors 16 and 17 are provided on the blocking wall.

In this embodiment, the doors 16 and 17
Is located in the polishing section and is controlled by the polishing control section 2, but its arrangement may be in the cleaning section or may be controlled by the cleaning control section 1. Further, the cleaning control unit 1, the polishing control unit 2, and the control terminal 3 may be integrated, each may be configured by a dedicated device, or may be configured by using a personal computer or the like. In addition, the control terminal 3 uses a GUI (Graphical Us).
er Interface), and a touch panel or the like may be used for data input.

Next, the overall operation of the semiconductor wafer polishing / cleaning apparatus of the present embodiment configured as described above will be described with reference to the flowchart of FIG.

The wafer transfer unit 4 transfers the wafer from the cassette at the inlet to the buffer cassette 9 (step S301).

The wafer transfer unit 5 takes out the wafer from the buffer cassette 9 (step S302).

The door 16 is opened and the wafer transfer unit 1 is opened.
3 moves to the door 16 (step S303).

The wafer transfer unit 5 moves to the door 16 (Step S304).

The wafer transfer unit 5 transfers the wafer to the wafer transfer unit 13 (step S30).
5).

The wafer transfer unit 5 moves from the door 16, and the door 16 closes (step S306).

The wafer transfer unit 13 transfers the wafer to the wafer polishing unit 15 (step S30).
7).

The wafer polishing unit 15 polishes the wafer (step S308).

The wafer transfer unit 14 transfers the wafer from the wafer polishing unit 15 (step S3).
09).

The door 17 is opened and the wafer transfer unit 1 is opened.
4 moves to the door 17 (step S310).

The wafer transfer unit 6 transfers to the door 17 (step S311).

The wafer transfer unit 6 transfers the wafer from the wafer transfer unit 14 (step S31).
2).

The wafer transfer unit 6 moves from the door 17, and the door 17 closes (step S313).

The wafer transfer unit 6 transfers the wafer to the buffer cassette 10 (Step S314).

The wafer transfer unit 7 transfers the wafer in the buffer cassette 10 to the wafer cleaning unit 11 (Step S315).

The wafer cleaning unit 11 cleans the wafer (Step S316).

The wafer transfer unit 8 transfers the wafer from the wafer cleaning unit 11 to the wafer drying unit 12 (Step S317).

The wafer drying unit 12 dries the wafer (step S318).

The wafer transport unit 4 takes out the wafer from the wafer drying unit 12 and returns it to the cassette at the inlet (step S319).

Next, the operation of each unit under the control of the cleaning control unit 1 will be described with reference to the flowchart of FIG.

The wafer transfer unit 4 transfers the wafer from the cassette at the inlet to the buffer cassette 9 (step S401).

The wafer transfer unit 5 takes out the wafer from the buffer cassette 9 (Step S402).

The cleaning controller 1 repeats the determination whether the signal b is ON until the signal b is turned ON (step S).
403). The signal b is a signal that is turned on by the polishing control unit 2 when the polishing unit is waiting for the wafer.

If the signal b is ON in step S403, the cleaning control unit 1 turns ON the signal e (step S404). Note that when the polishing unit requests the polishing unit to receive a wafer, the cleaning control unit 1 outputs the signal e.
This signal is set to the N state.

The cleaning control unit 1 repeatedly determines whether or not the signal c is OPEN until the signal c becomes OPEN (step S405). The signal c is obtained by the polishing control unit 2.
When the door 16 is opened, it is set to OPEN.
Is set to CLOSE when is closed.

If the signal c is OPEN in step S405, the wafer transfer unit 5 moves to the door 16 (step S406).

The wafer transfer unit 5 transfers the wafer to the wafer transfer unit 13 (step S40).
7).

The wafer transfer unit 5 moves from the door 16 (step S408).

The cleaning controller 1 repeats the determination whether the signal b is OFF until the signal b is turned OFF (step S409).

If the signal b is OFF in step S409, the cleaning control unit 1 turns off the signal e (step S410).

Next, the cleaning control section 1 turns on the signal a (step S411). The signal a is a signal that is turned on by the cleaning control unit 1 when the cleaning unit is waiting for the wafer.

The cleaning control section 1 repeatedly determines whether or not the signal f is ON until the signal f is turned ON (step S).
412). The signal f is turned on by the polishing control unit 2 when requesting the cleaning unit to receive the wafer.
This is the signal to be set.

If the signal f is ON in step S412, the cleaning controller 1 repeats the determination whether the signal d is OPEN until the signal d becomes OPEN (step S4).
13). Note that the signal d is transmitted from the polishing control unit 2 to the door 17.
Is set to OPEN when is opened, and set to CLOSE when the door 17 is closed.

If the signal d is OPEN in step S413, the wafer transfer unit 6 moves to the door 17 (step S414).

The wafer transfer unit 6 transfers the wafer from the wafer transfer unit 14 (step S41).
5).

The wafer transfer unit 6 moves from the door 17 (step S416).

Next, the cleaning controller 1 turns off the signal a (step S417).

The wafer transfer unit 6 transfers the wafer to the buffer cassette 10 (Step S418).

The wafer transfer unit 7 transfers the wafer in the buffer cassette 10 to the wafer cleaning unit 11 (Step S419).

The wafer cleaning unit 11 cleans the wafer (Step S420).

The wafer transfer unit 8 transfers the wafer from the wafer cleaning unit 11 to the wafer drying unit 12 (Step S421).

The wafer drying unit 12 dries the wafer (step S422).

The wafer transport unit 4 returns the wafer of the wafer drying unit 12 to the cassette at the inlet (step S423).

Next, the operation of each unit under the control of the polishing control unit 2 will be described with reference to the flowchart of FIG.

The wafer transfer unit 13 moves to the door 16 (Step S501).

Next, the polishing controller 2 turns on the signal b (step S502).

The polishing control unit 2 repeatedly determines whether or not the signal e is ON until the signal e is turned ON (step S).
503).

If the signal e is ON in step S503, the door 16 is opened (step S504).

The polishing control unit 2 includes the wafer transfer unit 1
Until the completion of the reception of the wafer from the wafer transfer unit 5, the determination of whether the reception of the wafer is completed is repeated (step S505).

When it is determined in step S505 that the wafer transfer unit 13 has completed receiving the wafer, the polishing control unit 2 turns off the signal b (step S506).

Next, the polishing control unit 2 repeatedly determines whether or not the signal e is OFF until the signal e is turned OFF (step S507).

If it is determined in step 507 that the signal e is OFF, the door 16 is closed (step S50).
8).

The wafer transfer unit 13 transfers the wafer to the wafer polishing unit 15 (step S50).
9).

The wafer transfer unit 13 returns to the door 16 (Step S510).

The wafer polishing unit 15 polishes the wafer (Step S511).

The wafer transfer unit 14 transfers the wafer from the wafer polishing unit 15 (step S5).
12).

The wafer transfer unit 14 moves to the door 17 (Step S513).

The polishing control unit 2 repeats the determination whether the signal a is ON until the signal a is turned ON (Step S).
514).

If the signal a is ON in step S514, the polishing control unit 2 turns on the signal f (step S514).
515).

Next, the door 17 is opened (step S51).
6).

The polishing control unit 2 includes the wafer transfer unit 1
Until the transfer of the wafer to the wafer transfer unit 6 is completed, the determination as to whether the transfer of the wafer is completed is repeated (step S517).

If it is determined in step S517 that the transfer of the wafer has been completed, the polishing control unit 2 repeats the determination whether the signal a is OFF until the signal a is turned OFF (step S518).

If it is determined in step S518 that the signal a is OFF, the polishing control unit 2 turns off the signal f (step S519).

Next, the door 17 is closed (step S52).
0).

The wafer transfer unit 14 moves to the wafer polishing unit 15 (Step 521).

Next, the operation of the control terminal 3 will be described. In addition, the control terminal 3 responds to the lot number of the semiconductor wafer,
Equipped with a database to hold polishing conditions, cleaning conditions, etc.
These conditions are assumed to have been input by the operator using the control terminal 3.

First, control of the cleaning controller 1 of the control terminal 3 will be described with reference to the flowchart of FIG.

The control terminal 3 repeats the determination as to whether the polishing terminal is in the waiting state until the polishing unit waits for the wafer (step S601).

If the polishing unit is waiting for a wafer in step S601, the control terminal 3 determines whether there is a wafer from the cleaning unit to the polishing unit, and there is no wafer from the cleaning unit to the polishing unit. In this case, the process returns to step S601 (step S602).

If there is a wafer from the cleaning unit to the polishing unit in step S602, the lot number of the wafer existing in the cleaning unit is extracted (step S603). It is assumed that the cleaning unit can take out the lot number from the lot of the wafer existing therein, or the lot number is inputted in advance from the control terminal 3 and stored in the database.

Based on the lot number extracted in step S603, the control terminal 3 extracts polishing conditions corresponding to the lot number from the database (step S604).

Next, the control terminal 3 sets the lot number and the polishing conditions in the polishing control unit 2 (step S605).

Next, the control terminal 3 repeats the determination as to whether or not the transfer of the wafer is completed until the cleaning unit completes the transfer of the wafer to the polishing unit (step S6).
06).

When the delivery of the wafer is completed in step S606, the control terminal 3 repeats the determination of whether or not the delivery of the wafer is completed until the polishing unit completes the delivery of the wafer from the cleaning unit (step S60).
7).

Next, control of the polishing controller 2 of the control terminal 3 will be described with reference to the flowchart of FIG.

The control terminal 3 repeats the determination as to whether or not the cleaning unit is in a waiting state until the cleaning unit enters a state of waiting for a wafer (step S701).

If the cleaning unit waits for a wafer in step S701, the control terminal 3 determines whether there is a wafer from the polishing unit to the cleaning unit, and determines whether there is a wafer from the polishing unit to the cleaning unit. If not, step S70
The process returns to 1 (step S702).

If there is a wafer from the polishing section to the cleaning section in step S702, the lot number of the wafer existing in the polishing section is extracted (step S703). It is assumed that the polishing unit can extract the lot number from the lot of the wafer existing inside, or the lot number is input in advance from the control terminal 3 and stored in the database.

Based on the lot number taken out in step S703, the control terminal 3 takes out the washing / drying conditions corresponding to the lot number from the database (step S70).
4).

Next, the control terminal 3 checks the lot number and the
The drying conditions are set in the cleaning controller 1 (Step S70)
5).

The control terminal 3 repeats the determination as to whether or not the wafer has been delivered until the polishing section has completed the delivery of the wafer to the cleaning section (step S70).
6).

Further, the control terminal 3 repeats the determination as to whether or not the wafer has been accepted until the cleaning section has completed the acceptance of the wafer from the polishing section (step S707).

The control of the cleaning controller 1 and the polishing controller 2 of the control terminal 3 is performed by repeating the above procedure.
The continuous operation of the semiconductor wafer polishing / cleaning apparatus of the present embodiment is performed.

The control terminal 3 holds the result of the previous polishing step in the polishing section, and when extracting the polishing conditions and cleaning conditions from the lot number, the result of the previous polishing step,
The polishing condition and the cleaning condition may be modified using the result of the current polishing process. In this case, in order to correct the polishing condition and the cleaning condition, a table or the like is separately provided to hold a correspondence relationship between the result of the polishing process, the polishing condition and the cleaning condition before the correction, and the polishing condition and the cleaning condition after the correction. Shall be.

The program for executing the above-described operation is recorded or stored in whole or in part on a portable medium such as a floppy disk, a CD-ROM, or a storage device such as a hard disk. The program is read by a computer, and all or a part of the operation is executed.

The recording medium according to the present invention is not limited to a medium in which a program is statically recorded, such as the above-mentioned optical disk or magnetic disk, but may be a program recorded through a communication line such as a dedicated line of the Internet or a telephone line. In this case, there is a communication line that transmits programs, which dynamically stores programs for a short period of time, and a server or computer internal memory that stores programs for a certain period of time. Shall be considered.

[0109]

When a semiconductor wafer is loaded into a semiconductor wafer polishing / cleaning apparatus, a series of steps of polishing, cleaning, and drying are performed inside the apparatus, and the semiconductor wafer can be recovered in a dry state. Can be prevented.

Since the cleaning section and the polishing section are separated from each other by the blocking wall, it is possible to prevent the scattered matter generated during polishing from entering the cleaning section.

Further, regarding the control of the apparatus, the cleaning section and the cleaning control section are separated from the polishing section and the polishing control section, so that they can be independently developed. Costs can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a semiconductor wafer polishing / cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a connection relationship between a control device and a controlled device of a semiconductor wafer polishing / cleaning apparatus according to an embodiment of the present invention.

FIG. 3 is a flowchart showing an overall operation process of the semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention;

FIG. 4 is a flowchart showing an operation of a cleaning control unit of the semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention.

FIG. 5 is a flowchart showing an operation of a polishing control unit of the semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention.

FIG. 6 is a flowchart showing a control process for a cleaning control unit of a control terminal of the semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention.

FIG. 7 is a flowchart showing a control process for a polishing control unit of a control terminal of the semiconductor wafer polishing / cleaning apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning control part 2 Polishing control part 3 Control terminal 4-8 Wafer transfer unit 9, 10 Buffer cassette 11 Wafer cleaning unit 12 Wafer drying unit 13, 14 Wafer transfer unit 15 Wafer polishing unit 16, 17 Door SCR cleaning part CMP polishing part a SCR wafer waiting signal b CMP wafer waiting signal c Door 16 OPEN / CLOSE signal d Door 17 OPEN / CLOSE signal e CMP wafer receiving request signal f SCR wafer receiving request signal

Claims (10)

[Claims] A cleaning unit for cleaning and drying the semiconductor wafer; a polishing unit for polishing the semiconductor wafer; a cleaning control unit connected to the cleaning unit for controlling the cleaning unit; and a connection to the polishing unit. A polishing control unit that controls the polishing unit, and a control terminal that is connected to the cleaning control unit and the polishing control unit and controls the cleaning control unit and the polishing control unit. The operating conditions of the cleaning unit and the polishing unit can be set, the cleaning control unit and the polishing control unit are interconnected,
An apparatus for polishing and cleaning a semiconductor wafer, wherein the cleaning unit and the polishing unit are controlled in conjunction with each other. 2. A cleaning section for cleaning and drying a semiconductor wafer, a polishing section for polishing a semiconductor wafer, and one provided on a blocking wall for blocking air flow between the cleaning section and the polishing section. A plurality of opening / closing sections, and a control section connected to the cleaning section, the polishing section, and the opening / closing section, and controlling the cleaning section, the polishing section, and the opening / closing section. Semiconductor wafer transfer
An apparatus for polishing and cleaning a semiconductor wafer, wherein the processing is performed through the opening / closing section. 3. The semiconductor wafer polishing / cleaning apparatus according to claim 2, wherein the control unit includes at least one control terminal for inputting or selecting operating conditions of the cleaning unit and the polishing unit. 4. The cleaning control unit further includes: a cleaning control unit connected to the control terminal to control the cleaning unit; and a polishing control unit connected to the control terminal to control the polishing unit. The unit and the polishing control unit are connected to each other,
4. The semiconductor wafer polishing and cleaning apparatus according to claim 3, wherein the cleaning unit and the polishing unit are controlled in conjunction with each other. 5. The cleaning unit includes: a first transfer unit configured to transfer one or more semiconductor wafers; a cleaning unit configured to clean the semiconductor wafer; and a drying unit configured to dry the semiconductor wafer. Drying means, and the polishing section comprises: one or more second transfer means used for transferring a semiconductor wafer; and a polishing means for polishing the semiconductor wafer. The semiconductor wafer polishing / cleaning apparatus according to any one of claims 1 to 4, wherein: 6. The apparatus for polishing and cleaning a semiconductor wafer according to claim 5, wherein the cleaning unit further includes one or more temporary storage units for temporarily storing the semiconductor wafer. 7. A step of allowing the first transfer means to take in a semiconductor wafer from an inlet, and a step of opening the opening / closing section and transferring the semiconductor wafer from the first transfer means to the second transfer means. Closing the opening / closing section and transferring the semiconductor wafer to the polishing means on the second transport means; polishing the semiconductor wafer on the polishing means; Removing the semiconductor wafer from the polishing means, opening the opening / closing section, and transferring the semiconductor wafer from the second carrying means to the first transfer means; closing the opening / closing section; A step of transferring the semiconductor wafer to the cleaning unit in one transport unit; a step of cleaning the semiconductor wafer in the cleaning unit; Transferring the wafer from the cleaning unit to the drying unit; drying the semiconductor wafer in the drying unit; returning the semiconductor wafer from the drying unit to the intake port in the first transport unit; And a method of polishing and cleaning a semiconductor wafer. 8. A procedure for transferring a semiconductor wafer from an inlet, a procedure for determining whether the polishing unit is in a standby state waiting for the semiconductor wafer, and a step for requesting the cleaning unit to receive the semiconductor wafer from the polishing unit. A procedure for determining whether one of the opening and closing sections is open; a procedure for transferring a semiconductor wafer from the cleaning section to the polishing section; and a procedure for determining whether the polishing section is not in a standby state waiting for the semiconductor wafer. A procedure in which the cleaning unit stops receiving a semiconductor wafer reception request to the polishing unit; a procedure in which the cleaning unit notifies the polishing unit that the semiconductor wafer is in a standby state waiting for a semiconductor wafer; and A step of determining whether a request for receiving a semiconductor wafer is sent to the cleaning unit; a step of determining whether one of the opening / closing units is open; A procedure of transferring a semiconductor wafer from the cleaning unit to the cleaning unit, a procedure of notifying that the cleaning unit is not in a standby state waiting for the semiconductor wafer to the polishing unit, and a procedure of transferring the semiconductor wafer to the cleaning unit. A step of cleaning the semiconductor wafer by the cleaning unit; a step of transferring the semiconductor wafer to the drying unit; a step of drying the semiconductor wafer by the drying unit; and a step of returning the semiconductor wafer to the inlet. A computer-readable recording medium on which a program to be executed by a computer is recorded. 9. A procedure in which the polishing unit notifies the cleaning unit that the semiconductor wafer is in a standby state waiting for a semiconductor wafer, and determines whether the cleaning unit has requested the polishing unit to receive a semiconductor wafer. A procedure, a procedure for opening one of the opening / closing sections, a procedure for determining whether the polishing section has completed reception of the semiconductor wafer from the cleaning section, and a procedure in which the polishing section is not in a standby state waiting for the semiconductor wafer. A step of notifying, a step in which the polishing unit stops receiving a semiconductor wafer from the cleaning unit, a step of determining whether the cleaning unit stops receiving a semiconductor wafer from the polishing unit, and Closing the unit, transferring the semiconductor wafer to the polishing means, polishing the semiconductor wafer by the wafer polishing unit, and cleaning Is a waiting state for waiting for a semiconductor wafer, a procedure for determining whether or not the polishing section requests the cleaning section to receive a semiconductor wafer, a procedure for opening one of the opening / closing sections, A procedure for determining whether the delivery of the semiconductor wafer to the cleaning unit has been completed, a procedure for determining whether the cleaning unit is not in a standby state waiting for the semiconductor wafer, and a step in which the polishing unit receives a semiconductor wafer reception request for the cleaning unit. A computer-readable recording medium recording a program for causing a computer to execute a procedure of stopping and a procedure of closing the opening / closing unit. 10. A procedure for determining whether the polishing section is in a standby state waiting for a semiconductor wafer, a procedure for determining whether a semiconductor wafer exists from the cleaning section to the polishing section, and extracting individual information of the semiconductor wafer. A procedure, a procedure for extracting polishing conditions corresponding to the individual information of the semiconductor wafer, a procedure for setting the individual information of the semiconductor wafer and the polishing conditions in the polishing control unit, and whether the cleaning unit has completed the delivery of the semiconductor wafer. A step of determining, a step of determining whether the polishing unit has completed receiving the semiconductor wafer, and a step of determining whether the cleaning unit is in a standby state waiting for the semiconductor wafer, and from the polishing unit to the cleaning unit. To determine whether there is any semiconductor wafer, to retrieve the individual information of the semiconductor wafer, and to retrieve the individual information of the semiconductor wafer A procedure for extracting cleaning / drying conditions corresponding to the above, a procedure for setting the individual information of the semiconductor wafer and the cleaning / drying conditions in the cleaning control unit, and a procedure for determining whether the polishing unit has completed delivery of the semiconductor wafer. And a computer-readable recording medium recording a program for causing a computer to execute a procedure for determining whether the cleaning unit has completed receiving the semiconductor wafer.