JP2000022303A - Metal insert resin molded circuit board and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a metal insert resin molded circuit board which is less likely to warp and a method for manufacturing the same. SOLUTION: First and second resin sheets 51 and 52 are provided on a lower surface and an upper surface of a metal terminal material 41, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal insert resin molded circuit board and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventional metal insert resin molded circuit board and a method of manufacturing the same will be described below with reference to the drawings.

FIG. 7 is a view for explaining a method of manufacturing a conventional metal insert resin molded circuit board.

In a conventional metal insert resin molded circuit board, a sheet material 11 is provided on the lower surface of a metal terminal material 3 having an electric circuit portion 1 of a desired wiring or circuit or a terminal portion 2 electrically or mechanically connected to the outside. It is stuck.

[0005] This metal insert resin molded circuit board,
The sheet material 11 is placed in the cavity 21, and the terminal portion 2 is placed on the lower mold 23 having the notch 22.
3 through the metal terminal material 3 in the guide hole 24 provided in the upper die 3.
Insert the first guide pin 32 and heat-press and mold to form the lower mold 2
After the upper mold 3 and the upper mold 31 are integrated, the lower mold 23 and the upper mold 3
1 was removed.

[0006]

Here, when manufacturing a conventional metal insert resin molded circuit board, a metal terminal material 3 is required.
Since the sheet material 11 is fixed only to the lower surface of the sheet material 11, warpage occurs at the lower portion of the sheet material 11 and the metal terminal material 3 as shown in FIG. There was a problem that.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a metal insert resin molded circuit board which is less likely to warp and a method of manufacturing the same.

[0008]

In order to achieve the above object, the present invention provides a first resin sheet provided on a lower surface of a metal terminal material and a second resin sheet provided on an upper surface of the metal terminal material. It consists of:

Further, a first resin sheet, a metal terminal material, and a second resin sheet are stacked in this order on the upper surface of the heated lower mold, and the upper mold is heated and compressed from the upper surface of the second resin sheet. Things.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION
A metal terminal material having an electric circuit portion forming a desired wiring or circuit and a terminal portion electrically or mechanically connected to the outside, a first resin sheet provided on a lower surface of the metal terminal material, A second resin sheet to be adhered to the first resin sheet is provided on the upper surface of the metal terminal material, and has an effect of preventing warpage.

According to a second aspect of the present invention, the second resin sheet according to the first aspect has a mounting hole for mounting an electronic component in an electric circuit portion of a metal terminal material, and is provided with a predetermined interval. In addition, since the electronic component is provided with the mounting holes, the electronic component has an effect of being excellent in mountability when the electronic component is mounted on the electric circuit portion of the metal material.

According to a third aspect of the present invention, the first and second resin sheets of the first aspect are made by filling a thermosetting resin with a filler, and mounting electronic components at predetermined locations. Has the effect of being easy to warp and hardly causing warpage.

According to a fourth aspect of the present invention, the first and second resin sheets according to the third aspect of the present invention differ in the amount of filler to be filled, and have an effect of improving characteristics and quality. Things.

According to a fifth aspect of the present invention, the thickness of the second resin sheet according to the first aspect is made larger than the thickness of the first resin sheet.
This has the effect of making the tensile forces at 1, 52 uniform so that further warpage can be reduced.

According to a sixth aspect of the present invention, there is provided a metal terminal material having a first resin sheet on an upper surface of a heated lower mold, an electric circuit portion and a terminal portion on an upper surface of the first resin sheet,
A second resin sheet having a mounting hole for mounting an electronic component on an electric circuit portion of the first resin sheet is stacked on the upper surface of the metal terminal material in this order, and an upper mold is formed from the upper surface of the second resin sheet. The upper mold and the lower mold are removed after being heated and compressed by the method described above, and have an effect that warpage is hardly generated.

According to a seventh aspect of the present invention, the lower mold according to the sixth aspect has a cavity in which the first resin sheet is placed in a central portion, and a terminal portion of a metal terminal material is provided on a peripheral edge of the cavity. A metal terminal material holding frame provided with a terminal mounting portion on which the first resin sheet and the metal are placed in the lower mold cavity. Since the terminal member and the terminal member can be securely mounted, the terminal material has an effect of improving productivity.

According to an eighth aspect of the present invention, a guide hole is provided at each of the four corners of the lower die according to the sixth aspect, and a guide pin is provided on the upper die. The guide pin of the upper die is inserted into the guide hole to be heated and compressed, and since the upper die can be reliably heated and compressed to the lower die, it has an effect of further improving the productivity.

Hereinafter, a metal insert resin molded circuit board according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of a metal insert resin molded circuit board according to an embodiment of the present invention.

In the figure, reference numeral 41 denotes a metal terminal material made of plate-like copper, brass, aluminum, iron or an alloy thereof. The metal terminal material 41 has an electric circuit portion 42 for forming a desired wiring or circuit, a terminal portion 43 for electrically or mechanically connecting to the outside, and a peripheral edge of the terminal portion 43 and the electric circuit portion 42. Frame part 44,
A desired pattern is formed by pressing or etching.

A first resin sheet 51 is provided on at least the lower surface of the electric circuit portion 42 of the metal terminal material 41. The first resin sheet 51 is a thermosetting resin such as epoxy or phenol which is an insulating material. Is an unvulcanized sheet filled with a filler such as alumina, ferrite, and magnesium.

On the upper surface of the metal terminal material 41, there is provided a second resin sheet 52 to be adhered to the first resin sheet 51. This second resin sheet 52 is made of metal terminal material 41.
Electronic components (not shown in this drawing) are provided in the electric circuit portion 42 of FIG.
The terminal cutouts 54 are formed in advance on the mounting holes 53 for mounting the electronic components and, if desired, on the terminal portions 43 by securing the three-dimensional shape of the second resin sheet 52 on the mounting surface side of the electronic components and the like. I have.

A method of manufacturing the metal insert resin molded circuit board having the above-described structure will be described below with reference to the drawings.

2 to 5 are views for explaining a method for manufacturing a metal insert resin molded circuit board according to an embodiment of the present invention.

First, there is provided an electric circuit section 42 for previously forming desired wirings and circuits, and a terminal section 43 for electrically or mechanically connecting to the outside, and a frame which is a peripheral edge of the terminal section 43 and the electric circuit section 42. The metal terminal material 41 is formed by pressing or etching to provide the portion 44. Further, the first resin sheet 51 is formed into a desired shape, and the second sheet 52 is formed into a desired shape by pressing or the like so as to have the mounting hole 53 and the terminal cutout 54.

Next, as shown in FIGS. 2 and 3, a central portion has a cavity 62 in which the first resin sheet 51 is placed, and a peripheral portion of the cavity 62 has a terminal portion 43 of the metal terminal material 41. A lower die 61 having a metal terminal material holding frame 64 provided with a terminal mounting portion 63 for mounting the lower die 61 and having guide holes 65 at four corners and heated in advance to the thermosetting temperature of the first resin sheet 51 in advance. The first sheet 51 is placed in the cavity 62.

Next, substantially simultaneously with the previous step, the metal terminal material 41
Is placed on the terminal placement portion 63 of the metal terminal material holding frame 64 of the lower die 61.

Next, substantially simultaneously with the previous step, the metal terminal material 41
The second resin sheet 52 is placed at a desired position.

Next, almost at the same time as the previous step, an upper mold 71 previously heated to a temperature equal to or higher than the thermosetting temperature of the second resin sheet 52 is placed on the upper surface of the second resin sheet 52.
The guide pins 72 provided at the four corners are heated and compressed so as to be inserted toward the guide holes 65 of the lower mold 61, and as shown in FIG. 3, the first and second resin sheets 51 and 52 are metal terminals. It is crimped to the material 41. At this time, as shown in FIG.
1 has an upper mold projection 73 fitted to the electric circuit section 42 of the second resin sheet 52.

Finally, the lower mold 61 and the upper mold 71 are removed, and as shown in FIG. 5, a metal terminal material 41 and first and second resin sheets 51 and 52 (not shown in this drawing). And a metal insert resin molded circuit board integrated with a resin molded portion 81 made of a resin.

As shown in FIG. 6, by making the thickness c of the second resin sheet 52 larger than the thickness d of the first resin sheet 51, the volume of the second resin sheet 52 is increased. , First and second resin sheets 51 and 52
And further warping can be reduced.

Further, the filler is lightly filled so that the irregular shape of the second resin sheet 52 can be easily formed, and the first resin sheet 51 is formed of a metal insert resin molded circuit board such as an electric, mechanical, chemical or the like. The filler may be highly filled to improve various properties.

[0033]

As described above, the present invention comprises the first resin sheet provided on the lower surface of the metal terminal material and the second resin sheet provided on the upper surface of the metal terminal material.
This has the effect of reducing warpage of the substrate and improving various characteristics such as electrical characteristics, mechanical characteristics, and heat dissipation.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a metal insert resin molded circuit board according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating the manufacturing method.

FIG. 3 is a view for explaining the manufacturing method.

FIG. 4 is a view for explaining the manufacturing method.

FIG. 5 is a view for explaining the manufacturing method.

FIG. 6 is a sectional view of a metal insert resin molded circuit board according to another embodiment of the present invention.

FIG. 7 is a view for explaining a conventional method for manufacturing a metal insert resin molded circuit board.

FIG. 8 is a view for explaining a relationship between a metal terminal material and a sheet material, which are the main parts.

[Explanation of symbols]

 Reference Signs List 41 metal terminal material 42 electric circuit part 43 terminal part 44 frame part 51 first resin sheet 52 second resin sheet 53 mounting hole 54 terminal cut 61 lower mold 62 cavity 64 metal terminal material holding frame 65 guide hole 71 Upper mold

Continuing on the front page (72) Inventor Hiroaki Higashino 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 5E343 AA02 BB67 DD52 DD57 DD62 GG20

Claims (8)

[Claims] 1. A metal terminal material having an electric circuit portion for forming a desired wiring or a circuit and a terminal portion for electrically or mechanically connecting to the outside, and a first terminal provided on a lower surface of the metal terminal material. A metal insert resin molded circuit board comprising: a resin sheet; and a second resin sheet adhered to the first resin sheet, provided on an upper surface of the metal terminal material. 2. The resin sheet according to claim 1, wherein the second resin sheet has a mounting hole for mounting an electronic component on an electric circuit portion of the metal terminal material.
The metal insert resin molded circuit board according to the above. 3. The metal insert resin molded circuit board according to claim 1, wherein the first and second resin sheets are formed by filling a thermosetting resin with a filler. 4. The metal insert resin molded circuit board according to claim 3, wherein the filling amounts of the fillers filled in the first and second resin sheets are different. 5. The metal insert resin molded circuit board according to claim 1, wherein the thickness of the second resin sheet is larger than the thickness of the first resin sheet. 6. A first resin sheet on the upper surface of the heated lower mold, a metal terminal material having an electric circuit portion and a terminal portion on the upper surface of the first resin sheet, and a first resin sheet on the upper surface of the metal terminal material.
A second resin sheet having a mounting hole for mounting an electronic component on the electric circuit portion of the resin sheet is stacked in this order, and after being heated and compressed from the upper surface of the second resin sheet by the upper mold, the lower mold and A method for manufacturing a metal insert resin molded circuit board from which an upper mold is removed. 7. A metal terminal having a cavity in which a first resin sheet is placed in a central portion and a terminal placement portion on which a terminal portion of a metal terminal material is placed on a peripheral edge of the cavity. 7. The method of manufacturing a metal insert resin molded circuit board according to claim 6, further comprising a material holding frame, wherein the first sheet is placed in the cavity of the lower die. 8. A guide hole is provided at each of the four corners of the lower mold, and a guide pin is provided at the upper mold.
7. The method for manufacturing a metal insert resin molded circuit board according to claim 6, wherein the upper die guide pin is inserted toward the lower die guide hole and heated and compressed.