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JP2000020229A - Conductor proximity position detection device - Google Patents

Conductor proximity position detection device

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Publication number
JP2000020229A
JP2000020229A JP19963698A JP19963698A JP2000020229A JP 2000020229 A JP2000020229 A JP 2000020229A JP 19963698 A JP19963698 A JP 19963698A JP 19963698 A JP19963698 A JP 19963698A JP 2000020229 A JP2000020229 A JP 2000020229A
Authority
JP
Japan
Prior art keywords
conductor
signal
voltage
sensor
sensor conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19963698A
Other languages
Japanese (ja)
Inventor
Hiroshi Kobayashi
弘志 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentel Co Ltd
Original Assignee
Pentel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentel Co Ltd filed Critical Pentel Co Ltd
Priority to JP19963698A priority Critical patent/JP2000020229A/en
Publication of JP2000020229A publication Critical patent/JP2000020229A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To simplify the signal processing by a conductor approach position detecting device of a capacitance coupling type and to improve the noise resistance performance, coordinate precision, and operability. SOLUTION: A voltage vibration system is constituted including a sensor panel or sensor conductor array, a shield plate, a signal process circuit, and a ground and a current, and a ground signal process of electric vibration (AC signal) received equivalently from a conductor to be detected through electrostatic coupling is performed and the process result is transmitted to a non-vibration system through an isolator 15. Here, the vibration frequency is >=200 kHz.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は静電容量結合型の導
電体近接位置検出装置に関し、特に能動的に信号を発し
ない人体及びその指等に対応した近接位置検出装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitive proximity type conductor proximity position detecting device, and more particularly to a human body that does not actively emit a signal and a proximity position detecting device corresponding to a finger thereof.

【0002】[0002]

【従来の技術】従来、被検出導電体に対応した近接位置
検出装置として知られているものとして、抵抗性パネル
の4隅を演算増幅器により電圧駆動し、同時に駆動電流
を差動増幅器で検出する例として特許第1536723
号に開示されたものがある。また、指との結合容量を含
めてパネルの格子状導体のキャパシタンスの変化を検出
する例として、特許第1754522号及び同第203
7747号に開示されたものがある。また、指との結合
容量を含めて抵抗性パネルのインピーダンスを検出する
例として、詳細は不明瞭であるが、特許第260398
6号に開示されたものがある。他の例として、変成器に
より、タッチパネルの4点をAC電圧駆動し、同時に駆
動電流成分を差動増幅器へ印加する例として特許第18
81208号に開示された指の位置検出装置がある。
2. Description of the Related Art Conventionally, as a device for detecting a proximity position corresponding to a conductor to be detected, four corners of a resistive panel are voltage-driven by an operational amplifier, and at the same time, a driving current is detected by a differential amplifier. Patent No. 1536723 as an example
There is what was disclosed in the issue. As an example of detecting a change in capacitance of a grid-like conductor of a panel including a coupling capacitance with a finger, Japanese Patent Nos.
No. 7747. Although the details are not clear as an example of detecting the impedance of the resistive panel including the coupling capacitance with the finger, see Japanese Patent No. 260398.
No. 6 discloses an example. As another example, Patent Document 18 discloses an example in which four points of a touch panel are driven by an AC voltage by a transformer and a driving current component is simultaneously applied to a differential amplifier.
There is a finger position detecting device disclosed in Japanese Patent No. 81208.

【0003】[0003]

【発明の解決しようとする課題】上記、従来の技術に於
いてはセンサーパネルから、電気信号を人体等の被検出
導電体へ吸収させる考え方であったために、複雑な手段
による回路構成となり、理想的な信号プロセスとするこ
とが非常に困難であった。また、被検出導電体である指
が上記センサーパネル面に複数点接触あるいは近接した
場合に、該センサーパネルから検出される信号が該被検
出導体の信号から得られる位置が接触あるいは近接位置
の等価的に中心点となるため、例えば指が2カ所接触し
ていると、2点間の中心位置を示すこととなり、操作者
が指し示す位置と異なり作業効率が悪くなっていた。
In the above-mentioned prior art, since the concept of absorbing an electric signal from a sensor panel to a conductor to be detected such as a human body is used, the circuit configuration is complicated, and the ideal configuration is obtained. It was very difficult to achieve a typical signal process. Further, when a finger which is a conductor to be detected contacts or approaches the sensor panel surface at a plurality of points, a position where a signal detected from the sensor panel is obtained from a signal of the detection conductor is equivalent to a contact or proximity position. For example, when two fingers are in contact with each other, the center position is shown between the two points, and the work efficiency is poor unlike the position indicated by the operator.

【0004】[0004]

【課題を解決するための手段】本発明は如上の課題に鑑
みなされたもので、センサー導体アレイ、シールド板、
信号プロセス回路、グランド及び電源回路をも含めて電
圧振動系を作り、非振動系に属する人体等の導電体(本
出願に於いて、必要充分な電流を流し得る抵抗体は導電
体に含める)から静電容量結合を介して等価的に受信す
る電気振動(AC信号)を対グランド信号処理し、処理
結果をアイソレータを介して非振動系へ伝える導電体近
接位置検出装置であり、上記センサー導体アレイより被
検出導電体(指)から得られる信号で複数点あるいは指
先位置を判断する。尚、本出願に於いて、「近接」とは
5cm以下(0cmは接触)程度を意味するものとす
る。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a sensor conductor array, a shield plate,
A voltage oscillation system including a signal process circuit, a ground, and a power supply circuit is formed, and a conductor such as a human body belonging to a non-oscillation system (in the present application, a conductor capable of flowing a necessary and sufficient current is included in the conductor) A conductor proximity position detection device that processes an electric vibration (AC signal) equivalently received from the device via a capacitive coupling to a ground signal, and transmits a processing result to a non-vibration system via an isolator. A plurality of points or fingertip positions are determined based on signals obtained from the detected conductor (finger) from the array. It should be noted that in the present application, “close” means about 5 cm or less (0 cm is in contact).

【0005】[0005]

【作用】電圧振動系から非振動系に属する被検出導電体
を見る(観測/計測する)と、あたかも被検出導電体が
電圧振動しているように計測される。センサー導体アレ
イが、その被検出導電体から静電容量結合して等価的に
各々受信する電気振動(AC信号)を独立的、時系列的
に計測することにより、複数点検出や接触検出あるいは
接触する指先以外の影響を無くすことができる。
When the conductor to be detected belonging to the non-vibration system is viewed (observed / measured) from the voltage oscillation system, the measurement is performed as if the conductor to be detected is oscillating in voltage. The sensor conductor array measures the electric vibration (AC signal) received capacitively and independently from the conductor to be detected in an independent and chronological manner, thereby detecting a plurality of points, detecting a contact, or detecting a contact. It is possible to eliminate influences other than fingertips.

【0006】[0006]

【発明の実施の形態】本発明は、インピーダンス計測方
式でもなく、キャパシタンス計測方式でもなく、電圧振
動系が非振動系に属する人体等の導電体から等価的に受
信するAC信号レベルにより検出する方式の装置であ
り、X方向及びY方向に格子状に配列されたセンサー導
体アレイと、該センサー導体アレイの各導体を順次接続
するアナログマルチプレクサと、該マルチプレクサの出
力を印加する信号処理部と、該信号処理部及び前記マル
チプレクサにも接続される電圧振動系グランド回路と、
該電圧振動系グランド回路に対し同振幅同位相で電圧振
動し、信号処理部及び前記マルチプレクサに接続される
電源回路とから成り、非振動系は、振動電圧発生器と導
電体から等価的に受信するAC信号をデジタル値に変換
するA/D変換器と該A/D変換器で数値化された信号
値を演算処理を行う制御部と外部装置とのインターフェ
ースとから成り、前記信号処理部と前記インターフェー
スとの間で、アイソレータを介してデジタルまたはアナ
ログ電気情報を受け渡しする導電体近接位置検出装置に
おいて、人体及び指及びペン等の被検出導体の近接する
複数点を認識する手段と前記複数点をコード化して外部
装置へ送出する導電体近接位置検出装置である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is not a method of measuring impedance or capacitance, but a method of detecting a voltage oscillation system based on an AC signal level equivalently received from a conductor such as a human body belonging to a non-oscillation system. A sensor conductor array arranged in a grid in the X and Y directions, an analog multiplexer for sequentially connecting the conductors of the sensor conductor array, a signal processing unit for applying an output of the multiplexer, A voltage oscillation ground circuit also connected to the signal processing unit and the multiplexer;
The voltage oscillation system oscillates voltage with the same amplitude and the same phase with respect to the ground circuit, and comprises a signal processing unit and a power supply circuit connected to the multiplexer. The non-oscillation system receives equivalently from an oscillation voltage generator and a conductor. An A / D converter that converts an AC signal to be converted into a digital value, a control unit that performs arithmetic processing on the signal value quantified by the A / D converter, and an interface with an external device. Means for recognizing a plurality of points near a conductor to be detected, such as a human body and a finger or a pen, in the conductor proximity position detection device for transferring digital or analog electrical information to and from the interface via an isolator; Is a conductor proximity position detection device that encodes and sends the code to an external device.

【0007】[0007]

【実施例】以下本発明の詳細な説明を添付図を参照して
説明する。まず始めに図1に示す導電体接近検出装置に
ついて説明する。本実施例に於いて、非振動系1内の振
動電圧発生器2が例えば460KHzの正弦波を発生す
る。その出力は、電圧振動系3内のすべてを周波数46
0KHzで同位相同振幅で電圧振動させるために、電圧
振動系3内のグランド回路4または電源5の電源回路に
接続されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A detailed description of the present invention will be described below with reference to the accompanying drawings. First, the conductor approach detection device shown in FIG. 1 will be described. In this embodiment, the oscillating voltage generator 2 in the non-oscillating system 1 generates a sine wave of, for example, 460 KHz. The output is the same as the frequency 46
In order to oscillate the voltage at the same phase and the same amplitude at 0 kHz, it is connected to the ground circuit 4 in the voltage oscillation system 3 or the power supply circuit of the power supply 5.

【0008】パネル面に配設されているX及びY方向検
出用センサー導体アレイ6及び7はX及びY方向のアナ
ログマルチプレクサ8及び9に接続され、該アナログマ
ルチプレクサ8及び9は非振動系1に設けられている制
御部10からの制御線により、順次切り替えて、電圧振
動系3に設けられている信号処理部11の入力回路に接
続されている。この入力回路は低入力インピーダンスと
してあり(詳細は後述)、従ってX及びY方向検出用セ
ンサー導体アレイ6及び7は電圧振動系3のグランド回
路4と同様に電圧振動する。
The sensor conductor arrays 6 and 7 for detecting the X and Y directions provided on the panel surface are connected to analog multiplexers 8 and 9 for the X and Y directions. Switching is sequentially performed by a control line from the provided control unit 10 and connected to the input circuit of the signal processing unit 11 provided in the voltage oscillation system 3. This input circuit has a low input impedance (details will be described later). Therefore, the sensor conductor arrays 6 and 7 for detecting the X and Y directions vibrate similarly to the ground circuit 4 of the voltage vibration system 3.

【0009】X及びY方向検出用センサー導体アレイ6
及び7は透明なガラス、樹脂、又は不透明なガラスエポ
キシ基板等の面上に塗布または蒸着により形成し、材料
は透明を必要とする場合はITO(インジウム錫酸化
物)やNESA(酸化錫)等であり、不透明なものはカ
ーボン等である。シールド板12は必ずしも必要とは限
らない。このように電圧振動系3はすべて同相同位相で
電圧振動しているが、電圧振動系3内に於いては、互い
のどの点間でも一切電気振動していない。電圧振動系3
以外から見た時だけ、系全体が電圧振動していることが
分かる。
[0009] Sensor conductor array 6 for detecting X and Y directions
And 7 are formed on the surface of a transparent glass, resin, or opaque glass epoxy substrate by coating or vapor deposition, and when the material needs to be transparent, ITO (indium tin oxide), NESA (tin oxide), etc. The opaque material is carbon or the like. The shield plate 12 is not always necessary. As described above, the voltage oscillation systems 3 all perform voltage oscillation in the same phase, but within the voltage oscillation system 3, there is no electrical oscillation between any points. Voltage oscillation system 3
Only when viewed from other than this, it can be seen that the entire system is oscillating in voltage.

【0010】導電体(例えば使用者の指)13がX及び
Y方向検出用センサー導体アレイ6及び7の比較的近く
にある場合、指13とX及びY方向検出用センサー導体
アレイ6及び7間に静電容量が存在する。また指13と
接地(アース)間には、主に容量による接地インピーダ
ンス(Ze)が存在し、通常は静電容量によるインピー
ダンスよりも接地インピ−ダンスZeの方が小さい(疑
似接地効果)。また、非振動系1のグランド14は通
常、容量を介しまたは商用電源供給ライン(AC100
V,AC200Vライン)を介して接地(アース)にZ
eよりも低インピーダンスで交流的に疑似接地されてい
る(図示せず)。従って使用者の指13は通常、非振動
系1に属している。また指13の導電抵抗は数KΩ〜1
0KΩと言われている。
When the conductor (for example, the user's finger) 13 is relatively close to the X and Y direction detecting sensor conductor arrays 6 and 7, the distance between the finger 13 and the X and Y direction detecting sensor conductor arrays 6 and 7 is increased. Has capacitance. A ground impedance (Ze) mainly due to capacitance exists between the finger 13 and ground (earth), and the ground impedance Ze is usually smaller than the impedance due to capacitance (pseudo-grounding effect). Further, the ground 14 of the non-vibration system 1 is usually connected via a capacitor or a commercial power supply line (AC100).
V, AC200V line) to ground (earth) through Z
It is AC-pseudo-grounded with an impedance lower than that of e (not shown). Therefore, the user's finger 13 usually belongs to the non-vibrating system 1. The conductive resistance of the finger 13 is several KΩ to 1
It is said to be 0KΩ.

【0011】故に指13とX及びY方向検出用センサー
導体アレイ6及び7間には振動電位差が生じ、結合容量
して微少ではあるがAC電流が流れる。実際にはX及び
Y方向検出用センサー導体アレイ6及び7が電圧振動し
ているのであるが、電気現象は相対的にどちらを基準に
して考えてもマクロ的にはよいので、逆に電圧振動系3
を基準にしてみると、指13の方が電圧振動して見える
(観測/計測される)。従ってX及びY方向検出用セン
サー導体アレイ6及び7は、等価的に電圧振動している
指13からの電気振動をAC信号として受信して、信号
処理部11の入力に印加する。
Therefore, an oscillating potential difference is generated between the finger 13 and the sensor conductor arrays 6 and 7 for detecting X and Y directions, and a small but AC current flows due to coupling capacitance. Although the sensor conductor arrays 6 and 7 for detecting the X and Y directions are actually oscillating in voltage, the electrical phenomena can be considered macroscopically based on either of them. System 3
As a reference, the finger 13 appears to vibrate in voltage (observed / measured). Accordingly, the sensor conductor arrays 6 and 7 for X and Y direction detection receive the electric vibration from the finger 13 equivalently vibrating in voltage as an AC signal and apply it to the input of the signal processing unit 11.

【0012】信号処理部11は、X及びY方向検出用セ
ンサー導体アレイ6及び7が等価的に受信したAC信号
を、シングルエンドの対グランド信号処理をするだけで
よい。従来行っていた差動バランスによる複雑な手段に
よる信号処理をする必要性は全くない。通常の対グラン
ド増幅、バンドパス・フィルタリング、AC/DC変換
(AM検波)等をすればよい。
The signal processing unit 11 only needs to perform single-ended ground signal processing on the AC signals equivalently received by the sensor conductor arrays 6 and 7 for detecting the X and Y directions. There is no need to perform signal processing by complicated means using differential balance, which has been conventionally performed. Normal amplification to ground, band-pass filtering, AC / DC conversion (AM detection), and the like may be performed.

【0013】信号処理部11の処理結果出力は、アイソ
レータ15を介して非振動系1へ伝えられる。アイソレ
ータ15が伝える電気情報はA/D変換器16、マイク
ロコンピュータを含む制御部10へ伝えられる。又、マ
イクロコンピュータは非振動系1及び電圧振動系3の両
方に配設してもよい。
The processing result output of the signal processing unit 11 is transmitted to the non-vibration system 1 via the isolator 15. The electrical information transmitted by the isolator 15 is transmitted to the control unit 10 including the A / D converter 16 and the microcomputer. The microcomputer may be provided in both the non-vibration system 1 and the voltage vibration system 3.

【0014】次に実際の導電体近接位置検出迄の制御部
の動作シーケンスを説明する。図2はセンサー導体アレ
イ切り替えシーケンスで、ステップS1は制御部よりア
ナログマルチプレクサ8、9へ制御線を介してセンサー
導体の1つを選択し、ステップS2は選択されたセンサ
ー導体から受信された被検出導体からの受信信号をA/
D変換器16により数値化し制御部10のメモリーに記
憶しておく。ステップS3では制御部10がX、Y方向
の全センサ導体を選択し、該受信信号がメモリーに記憶
されたか判定し、選択終了でなければステップS1へ戻
って動作を繰り返す。該センサー導体が選択終了であれ
ば、次のシーケンスへ進む。
Next, the operation sequence of the control unit until the actual conductor proximity position is detected will be described. FIG. 2 is a sensor conductor array switching sequence. Step S1 selects one of the sensor conductors from the control unit to the analog multiplexers 8 and 9 via a control line. Step S2 is a detection target received from the selected sensor conductor. A / A
The data is digitized by the D converter 16 and stored in the memory of the control unit 10. In step S3, the control unit 10 selects all sensor conductors in the X and Y directions, determines whether the received signal is stored in the memory, and returns to step S1 to repeat the operation if the selection is not completed. If the selection of the sensor conductor is completed, the process proceeds to the next sequence.

【0015】図3は近接する導電体(指13)が、複数
点を認識するシーケンスである。図4は指13がパネル
面17の複数点を近接したときの信号説明図である。図
2からのセンサー導体アレイ切り替えシーケンスを経
て、ステップS4(図3を参照)はX(Y)方向のしき
い値以上のセンサー導体18より得られた受信信号の数
を保持し、ステップS5ではもう一方のY(X)方向の
しきい値以上のセンサー導体18より得られた受信信号
の数を保持し、ステップS6でそれぞれのXとY方向の
受信信号数と比較し、同じであればステップS7でX、
Y方向のしきい値以上のセンサー導体18の配設された
位置(A、B点)より複数点のX、Y座標を求める。尚
必要ならば、センサー導体A、Bと隣りに位置するのセ
ンサー導体(C点)の受信信号で座標補間を行ってもよ
い。ステップS7は上記で得られた複数点を座標データ
とともにコード変換して外部装置(図示せず)へ出力す
る。
FIG. 3 shows a sequence in which a nearby conductor (finger 13) recognizes a plurality of points. FIG. 4 is a signal explanatory diagram when the finger 13 approaches a plurality of points on the panel surface 17. After the sensor conductor array switching sequence from FIG. 2, step S4 (see FIG. 3) holds the number of received signals obtained from the sensor conductors 18 that are equal to or larger than the threshold value in the X (Y) direction. The number of received signals obtained from the sensor conductor 18 which is equal to or larger than the threshold value in the other Y (X) direction is held, and in step S6, the number of received signals in each of the X and Y directions is compared. X in step S7,
The X and Y coordinates of a plurality of points are obtained from the positions (points A and B) where the sensor conductors 18 are arranged at a threshold value or more in the Y direction. If necessary, the coordinate interpolation may be performed using the reception signals of the sensor conductors (point C) located adjacent to the sensor conductors A and B. In step S7, the plurality of points obtained above are converted into codes together with the coordinate data and output to an external device (not shown).

【0016】図5は導電体(指13)がパネル面17に
接触したことを認識するシーケンス(S8)で、図2か
らのセンサー導体アレイ切り替えシーケンスを経て、ス
テップS9はX、Y方向それぞれのしきい値以上のセン
サー導体より得られた受信信号を数値化して記憶し、ス
テップS10では、ステップ9で得られた前回の受信信
号と新しく得られた同じ位置のセンサー導体の受信信号
を比較し、設定値以上に受信信号が増加した場合は導電
体(指13)がパネル面17に接触したと判断し、設定
値以下でしきい値以上の場合は接触状態と判断し、設定
値以上に減少すればパネル面17より離れたと判断す
る。ステップS11ではセンサー導体アレイより得られ
た受信信号でX、Y座標を算出し、接触情報とともに外
部装置(図示せず)へ出力する。パネル面17に導電体
(指)13が接触した時に受信信号が急に増加するの
は、本来センサー導体と被検出導体間の静電結合容量は
距離に反比例し、対向面積に正比例する、しかしながら
パネル面17に接触した場合空気中の誘電率よりパネル
の誘電率の方が数倍大きい、従ってパネル面接触時に受
信信号が急に増加する。
FIG. 5 is a sequence (S8) for recognizing that the conductor (finger 13) has come into contact with the panel surface 17. After the sensor conductor array switching sequence from FIG. 2, step S9 is performed in each of the X and Y directions. The received signal obtained from the sensor conductor equal to or larger than the threshold value is digitized and stored, and in step S10, the previous received signal obtained in step 9 is compared with the newly obtained received signal of the sensor conductor at the same position. When the received signal increases beyond the set value, it is determined that the conductor (finger 13) has touched the panel surface 17, and when the received signal is below the set value and is over the threshold value, it is determined that the contact state has been reached. If it decreases, it is determined that it is separated from the panel surface 17. In step S11, the X and Y coordinates are calculated from the received signals obtained from the sensor conductor array, and output to an external device (not shown) together with the contact information. The sudden increase in the received signal when the conductor (finger) 13 comes into contact with the panel surface 17 is that the electrostatic coupling capacitance between the sensor conductor and the detected conductor is originally inversely proportional to the distance and directly proportional to the facing area. When contacting the panel surface 17, the dielectric constant of the panel is several times greater than the dielectric constant in the air, so that the received signal suddenly increases upon contact with the panel surface.

【0017】図6は導電体(指)13が、パネル面17
の接触位置を認識するルーチンであり、S12〜S16
のように処理を行う。図7は指13がパネル面17に近
接したときの信号説明図である。図2からのセンサー導
体アレイ切り替えシーケンスを経て、ステップS13は
X、Y方向のセンサー導体より得られた受信信号を数値
化して保持し、ステップ14で最大受信信号Mの近隣の
センサー導体18からの受信信号(BとB’)がほぼ対
称になっているか確認する、ステップ15は上記した受
信信号が非対称であれば手の平や腕(図示せず)等の指
13以外の受信信号の影響を受けていると判断し(図7
の場合はA’及びB’側)、近隣のセンサー導体18の
受信信号BとB’の差分を最大のセンサー導体の隣にあ
る受信信号A’からマイナスする。ステップS16はス
テップS15で得られた受信信号よりX、Y座標を算出
し外部装置(図示せず)へ出力する。
FIG. 6 shows that the conductor (finger) 13 is
S12 to S16 are routines for recognizing the contact position of
The processing is performed as follows. FIG. 7 is an explanatory diagram of signals when the finger 13 approaches the panel surface 17. After the sensor conductor array switching sequence from FIG. 2, the step S13 digitizes and holds the received signal obtained from the sensor conductors in the X and Y directions. It is checked whether the received signals (B and B ') are substantially symmetric. If the received signal is asymmetric, the step 15 is affected by the received signal other than the finger 13 such as a palm or an arm (not shown). (Fig. 7
In the case of A ′ and B ′), the difference between the reception signals B and B ′ of the neighboring sensor conductor 18 is subtracted from the reception signal A ′ adjacent to the largest sensor conductor. In step S16, the X and Y coordinates are calculated from the received signal obtained in step S15 and output to an external device (not shown).

【0018】[0018]

【発明の効果】以上説明したように差動バランス等の複
雑な信号処理をせずに、対グランド信号処理により、シ
ンプル且つ耐ノイズ性に優れた導電体の近接位置検出装
置を得た。またX、Y方向に格子状にセンサー導体を配
設し、複数点の導電体位置や導電体のパネル面接触位置
を確実に識別する処理を行うことができ、操作性が向上
した。
As described above, a simple and excellent noise-tolerant conductor proximity position detecting device is obtained by signal processing to ground without performing complicated signal processing such as differential balance. In addition, the sensor conductors are arranged in a grid pattern in the X and Y directions, and a process of reliably identifying a plurality of conductor positions and the contact positions of the conductors on the panel surface can be performed, thereby improving operability.

【図面の簡単な説明】[Brief description of the drawings]

【図1】指等の導電体近接位置検出装置の構成概要図FIG. 1 is a schematic diagram of a configuration of a device for detecting a proximity position of a conductor such as a finger.

【図2】導電体位置検出迄の制御部の動作シーケンスFIG. 2 is an operation sequence of a control unit until a conductor position is detected.

【図3】導電体(指)が複数点近接したときの制御部の
動作シーケンス
FIG. 3 is an operation sequence of a control unit when a conductor (finger) approaches a plurality of points;

【図4】導電体(指)が複数点、パネル面に近接したと
きの信号説明図
FIG. 4 is a signal explanatory diagram when a plurality of conductors (fingers) approach a panel surface.

【図5】導電体(指)がパネル面に接触したことを認識
するシーケンス
FIG. 5 is a sequence for recognizing that a conductor (finger) has contacted the panel surface.

【図6】導電体(指)のパネル面の接触位置を認識する
ルーチン
FIG. 6 is a routine for recognizing a contact position of a conductor (finger) on a panel surface.

【図7】導電体(指)がパネル面に近接したときの信号
説明図
FIG. 7 is an explanatory diagram of a signal when a conductor (finger) approaches a panel surface.

【符号の説明】[Explanation of symbols]

1 非振動系 2 振動電圧発生器 3 電圧振動系 4 グランド回路 5 電源 6 X方向検出センサ導体アレイ 7 Y方向検出センサ導体アレイ 8 X方向のアナログマルチプレクサ 9 Y方向のアナログマルチプレクサ 10 制御部(CPU) 11 信号処理部 12 シ−ルド板 13 使用者の指 14 グランド 15 アイソレ−タ 16 A/D変換器 17 パネル面 18 センサ−導体 DESCRIPTION OF SYMBOLS 1 Non-vibration system 2 Vibration voltage generator 3 Voltage vibration system 4 Ground circuit 5 Power supply 6 X direction detection sensor conductor array 7 Y direction detection sensor conductor array 8 X direction analog multiplexer 9 Y direction analog multiplexer 10 Control unit (CPU) Reference Signs List 11 signal processing unit 12 shield plate 13 user's finger 14 ground 15 isolator 16 A / D converter 17 panel surface 18 sensor conductor

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】電圧振動系と非振動系とを有する電気回路
と、該電圧振動系に属するセンサー導体アレイ面上に於
ける被検出導電体の近接及び近接位置を検出する装置で
あって、前記電圧振動系は200KHz以上の周波数の
振動電圧発生器により駆動されており、且つ、前記導電
体との間の静電容量結合でAC信号を等価的に受信し、
X方向及びY方向に格子状に配列された前記センサー導
体アレイと、該センサー導体アレイの各導体を順次接続
するアナログマルチプレクサと、該アナログマルチプレ
クサの検出出力信号を印加する信号処理部と、該信号処
理部及び前記マルチプレクサにも接続される電圧振動系
グランド回路と、該電圧振動系グランド回路に対し同振
幅同位相で電圧振動し、前記信号処理部及び前記マルチ
プレクサに接続される電源回路とから成り、前記非振動
系は、振動電圧発生器と受信信号をデジタル値に変換す
るA/D変換器と、該A/D変換器で数値化された信号
値を演算処理を行う制御部と外部装置とのインターフェ
ースとから成り、前記信号処理部と前記インターフェー
スとの間で、アイソレータを介してデジタルまたはアナ
ログ電気情報を受け渡しする導電体近接位置検出装置に
おいて、人体及び指及びペン等の被検出導体の近接する
複数点を認識する手段と被検出導体が、前記複数点をコ
ード化して外部装置へ送出することを特徴とする導電体
近接位置検出装置。
An electric circuit having a voltage oscillating system and a non-oscillating system, and an apparatus for detecting the proximity and proximity position of a conductor to be detected on a sensor conductor array surface belonging to the voltage oscillating system, The voltage oscillation system is driven by an oscillation voltage generator having a frequency of 200 KHz or more, and receives an AC signal equivalently by capacitive coupling with the conductor,
The sensor conductor array arranged in a grid in the X direction and the Y direction, an analog multiplexer for sequentially connecting the conductors of the sensor conductor array, a signal processing unit for applying a detection output signal of the analog multiplexer, and the signal A voltage oscillation ground circuit connected also to the processing unit and the multiplexer; and a power supply circuit connected to the signal processing unit and the multiplexer, which oscillates the voltage with the same amplitude and the same phase with respect to the voltage oscillation ground circuit. The non-vibrating system includes an oscillating voltage generator, an A / D converter for converting a received signal into a digital value, a control unit for performing arithmetic processing on a signal value digitized by the A / D converter, and an external device. Receiving digital or analog electrical information between the signal processing unit and the interface via an isolator. In the conductor proximity position detecting device to be delivered, means for recognizing a plurality of points near a conductor to be detected, such as a human body, a finger, and a pen, and the conductor to be detected encode the plurality of points and transmit the encoded points to an external device. Conductor proximity position detecting device.
【請求項2】人体及び指及びペン等の被検出導体とセン
サー導体アレイ面間の静電容量の急激な変化と前記セン
サー導体が受信するAC信号レベルの大きさで被検出導
体がセンサー導体アレイ面に接触したことを認識する手
段を有することを特徴とする請求項1記載の導電体近接
位置検出装置。
2. A sensor conductor array according to an abrupt change in capacitance between a conductor to be detected such as a human body, a finger, and a pen and a sensor conductor array surface and a level of an AC signal received by the sensor conductor. 2. The conductor proximity position detecting device according to claim 1, further comprising means for recognizing the contact with the surface.
【請求項3】センサー導体アレイが受信する各々のAC
信号レベルにより、手の平や腕等のセンサー導体アレイ
面に接触している指先以外からの受信信号の影響を無く
し、指先の位置を認識する手段を有することを特徴とす
る請求項1記載の導電体近接位置検出装置。
3. Each AC received by the sensor conductor array.
2. The conductor according to claim 1, further comprising means for recognizing a position of the fingertip by eliminating an influence of a received signal from a fingertip other than a fingertip in contact with a sensor conductor array surface such as a palm or an arm by a signal level. Proximity position detection device.
JP19963698A 1998-06-30 1998-06-30 Conductor proximity position detection device Pending JP2000020229A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19963698A JP2000020229A (en) 1998-06-30 1998-06-30 Conductor proximity position detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19963698A JP2000020229A (en) 1998-06-30 1998-06-30 Conductor proximity position detection device

Publications (1)

Publication Number Publication Date
JP2000020229A true JP2000020229A (en) 2000-01-21

Family

ID=16411152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19963698A Pending JP2000020229A (en) 1998-06-30 1998-06-30 Conductor proximity position detection device

Country Status (1)

Country Link
JP (1) JP2000020229A (en)

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