JP2000013022A - Multilayer wiring circuit board and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a multilayer wiring circuit board capable of further increasing the density of wiring patterns and simplifying a manufacturing process. SOLUTION: In a multilayer wiring circuit board in which wiring patterns laminated in multiple layers via an insulating layer are electrically connected by vias penetrating the insulating layer, a main body of the multilayer wiring circuit board is formed. On at least one surface side of the main body substrate 10 to be formed, a fine wiring pattern 22 finer than the main body wiring pattern 16 formed on the main body substrate 10.
Is adhered by an adhesive layer 24, and the main body wiring pattern 16 and the fine wiring pattern 22 are bonded to the film substrate 12 and the adhesive layer 2.
4 and a via 1 formed in the main body substrate 10.
It is characterized by being electrically connected by a fine via 26 finer than 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring circuit board and a method of manufacturing the same, and more particularly, to a wiring pattern laminated in multiple layers with an insulating layer interposed therebetween, wherein each of the wiring patterns is electrically connected by a via passing through the insulating layer. And a method for manufacturing the same.

[0002]

2. Description of the Related Art As shown in FIG. 8, a multilayer wiring circuit board (hereinafter sometimes simply referred to as a wiring board) on which electronic components such as semiconductor devices are mounted is provided with insulating layers 300, 300,.
Are used, a wiring board on which wiring patterns 302, 302,. In the wiring board shown in FIG. 8, a via 304 for electrically connecting the wiring patterns 302, 302,... Is formed. This via 304
It is formed by plating the inner wall surfaces of the through holes formed in the insulating layers 300 using a tool such as a drill. The via 304 may be filled with a filler such as a conductive adhesive as needed.

In the wiring board shown in FIG. 8, the via diameter is determined by the size of a tool such as a drill.
There is a limit to the miniaturization of 04. Therefore, the wiring pattern 3
There is a limit to the reduction of the line width of the line constituting the line 02 in relation to the diameter of the via 304, and there is a limit to the miniaturization of the wiring pattern 302. On the other hand, electronic components such as semiconductor devices mounted on a wiring board have been reduced in size and the like, and the density of external connection terminals provided on the electronic components has also been increasing at the same time. For this reason, the wiring pattern of the wiring board,
In particular, there is a demand for higher density wiring patterns on the mounting surface side on which electronic components such as semiconductor devices are mounted. To meet such demands, a wiring board manufactured by a build-up method shown in FIG. 9 has been proposed. In this build-up method,
Copper foil 1 as metal foil bonded to both sides of resin layer 100
Patterns 01, 101 are formed by a photolithography method or the like to form desired wiring patterns 102, 102,... (Steps in FIGS. 9A and 9B). Further, after forming resin layers 104, 104 as insulating layers on the formed wiring patterns 102, 102,..., Via-forming recesses 103, 103,. Step c)). The wiring pattern 102 is exposed at the bottom of the recess 104.

Next, the entire surfaces of the resin layers 103, 103 on which the recesses 104, 104,.
After forming the copper layers 105 and 105 by electroless plating or sputtering on
Desired wiring patterns 106, 106,... Are formed on the copper layers 105, 105 by a photolithography method or the like [FIG.
Step (e)]. The formed wiring pattern 106 is connected to the wiring pattern 102 by a via 107 having a copper layer 105 formed along the inner wall of the recess 104. Then, after forming the resin layers 108 on the wiring patterns 106, 106,..., Recesses 109, 109,... For forming vias are formed at predetermined locations by etching or the like (FIG. 9 (f)). By repeating steps 9 (d) and (e), a multilayer wiring board can be formed.

[0005]

The multilayer wiring board obtained by the build-up method shown in FIG. 9 has a higher density wiring pattern than the multilayer wiring board having vias formed by using a tool such as a drill. Can be formed. However, the manufacturing process is complicated, and the obtained wiring board is more expensive than the conventional wiring board. For this reason, as shown in FIG. 10, the present inventors made of a thermoplastic resin or a semi-cured thermosetting resin, and can exhibit adhesiveness by a heat treatment in order to simplify the manufacturing process of the wiring board. An attempt was made to use a film in which a copper foil was bonded to one side of a resin layer (hereinafter, sometimes referred to as a B-stage resin layer). In FIG. 10, as in the build-up method shown in FIG.
Are formed into desired wiring patterns 102, 102,... By a photolithography method or the like, and then the copper foil 2
The film to which No. 01 is bonded is bonded to both surfaces of the resin layer 100 (step of FIG. 9A). This joining is performed by the resin layer 10.
By performing a heat treatment while pressing the resin layer 200 on the wiring pattern formation surface of No. 0, bonding can be achieved by expressing the adhesive ability of the resin layer 200 in the B stage. Note that FIG.
5 shows a state in which a wiring pattern is laminated on one side of the resin layer 100.

[0006] In the step of FIG.
In the resin layer 200 laminated on the substrate, after removing the copper foil portion of the via formation portion by etching or the like, the resin layer portion exposed from the copper foil 201 is removed by a laser or the like to form a recess 202 for via formation. [FIG. 10 (b)]. After a copper layer 203 is formed on the inner wall surface of the concave portion 202 and the entire surface of the copper foil 201 by electroless plating or sputtering, a desired wiring pattern is formed on the copper foil 201 on which the copper layer 203 is laminated by a photolithography method or the like. Are formed [steps in FIGS. 10C and 10D]. The formed wiring pattern 204 is connected to the wiring pattern 102 by a via 205 having a copper layer 203 formed along the inner wall of the recess 202. Thereafter, by repeating the steps of FIGS. 10A to 10D, a multilayer wiring board can be obtained.

According to the method shown in FIG. 10, the manufacturing process can be simplified as compared with the build-up method shown in FIG. However, since the copper layer 203 is further formed on the copper foil 201, the metal layer to be etched or the like for forming the wiring pattern 204 becomes thick. Therefore, FIG.
It has been found that the wiring pattern of the wiring board obtained by the above method has a lower density than the wiring pattern that can be formed by the build-up method shown in FIG. In addition, it was also found that since the resin is filled in the via-forming recesses, the surface of the wiring board is likely to be uneven due to shrinkage of the resin. Therefore, an object of the present invention is to propose a multilayer wiring circuit board capable of further increasing the density of a wiring pattern and simplifying a manufacturing process, and a method of manufacturing the same.

[0008]

The present inventors have studied to solve the above-mentioned problems. As a result, the wiring board shown in FIG. 8 is lower than the wiring board obtained by the method shown in FIGS. It can be obtained at low cost and with a simple manufacturing process.
Also, compared to the mounting surface side of the wiring board on which the electronic components are mounted, the wiring pattern on the side opposite to the mounting surface and on the external connection terminal mounting surface side on which the external connection terminals and the like of the wiring board are mounted is: FIG. 8 does not require a higher density than the mounting surface side.
The wiring board shown in FIG. For this reason, the present inventor, in order to solve the above-mentioned problem, compared the wiring pattern and via formed on the wiring board shown in FIG. The inventors of the present invention have thought that it is effective to bond a film-like substrate capable of forming a film, and as a result, have arrived at the present invention.

That is, the present invention relates to a multilayer wiring circuit board in which wiring patterns laminated in multiple layers via an insulating layer are electrically connected by vias penetrating the insulating layer. A film-like substrate on which a fine wiring pattern finer than the main body wiring pattern formed on the main body substrate is formed is bonded to at least one surface of the main body substrate forming the main body of the substrate by an adhesive layer. In addition, the main unit wiring pattern and the fine wiring pattern penetrate the film substrate and the adhesive layer, and are electrically connected by fine vias finer than vias formed in the main unit substrate. The multilayer wiring circuit board is characterized in that: Further, according to the present invention, each of the wiring patterns stacked in multiple layers with an insulating layer interposed therebetween,
When manufacturing a multilayer wiring circuit board which is electrically connected by vias penetrating the insulating layer, at least one surface side of the main body substrate forming the main body of the multilayer wiring circuit board, the main body substrate A film substrate on which a fine wiring pattern finer than the formed main body wiring pattern is formed is adhered by an adhesive layer, and the main body wiring pattern and the fine wiring pattern are penetrated through the film substrate and the bonding layer. And a method of manufacturing a multilayer wiring circuit board, wherein electrical connection is made by fine vias finer than vias formed in the main body substrate.
Here, the “fine wiring pattern finer than the main body wiring pattern” means that the line width and the space between the lines constituting the fine wiring pattern are equal to the line width and the space between the lines forming the main body wiring pattern. Means smaller than the space.

The multilayer wiring circuit board according to the present invention has a finer pattern than the main body wiring pattern and the via formed on the main body substrate on at least one surface side of the main body substrate forming the main body of the multilayer wiring circuit board. The film-like substrate on which the fine wiring pattern and the via are formed is bonded by an adhesive layer while electrically connecting the main body wiring pattern and the fine wiring pattern. Thus, for example,
A fine wiring pattern of a desired pattern can be formed on a mounting surface side on which electronic components such as a semiconductor device are mounted so that a miniaturized semiconductor device such as a chip size package (CSP) or other electronic components can be mounted. . Further, the main body substrate mainly forming the multilayer wiring circuit board according to the present invention has an insulating layer in which a main body wiring pattern laminated in multiple layers via an insulating layer is perforated using a tool such as a drill. Can be used, and a multilayer wiring circuit board can be manufactured at a low cost. Thus, according to the present invention, for example, a multilayer wiring circuit board on which electronic components such as miniaturized semiconductor devices such as CSPs can be easily mounted can be provided at low cost.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer wiring circuit board (wiring board) according to the present invention comprises a main body substrate 10 and a film substrate 12, as shown in FIG. In the main body substrate 10, the main body wiring patterns 16, 16,... Are laminated via insulating layers 14, 14,. In the main body substrate 10, the vias 18 for electrically connecting the main body wiring patterns 16 to each other are formed by plating the inner walls of the through holes formed in the insulating layers 14, 14. It is formed by applying. The via 18 may be filled with a filler such as a conductive adhesive as needed.

The film substrate 12 adhered to one surface of the main body substrate 10 is made of a film 20 made of a resin such as polyimide. On one side of the film 20, the main body wiring pattern 1 formed on the main body substrate 10 is provided.
A fine wiring pattern 22 finer than 6 is formed, and an adhesive layer 24 made of a thermoplastic resin is formed on the other surface of the film 20. Further, vias 26, 26,... Having one ends connected to the fine wiring pattern 22,
It is formed penetrating the film 20 and the adhesive layer 24. The via 26 is finer than the via 18 formed in the main body substrate 10. Such a main body substrate 10
The film substrate 12 is bonded to the film substrate 12 by an adhesive layer 24 formed on the film substrate 12. At the time of such bonding, the via 2 formed on one surface side of the film-like substrate 12 is formed.
The other end of 6 contacts body wiring pattern 16 formed on one surface of body substrate 10, and fine wiring pattern 22 formed on one surface of film-like substrate 12 and body wiring pattern 16 are electrically connected. Connected to.

The main body substrate 10 forming the wiring board shown in FIG. 1 has a via 18 formed by plating a metal film on the inner wall of a through hole formed by a tool such as a drill. It can be obtained at lower cost than the wiring board formed by the build-up method shown in FIG. However,
In the main body substrate 10, as described above, the via diameter and the like are determined by the size and the like of the tool such as a drill.
There is a limit to miniaturization, and there is also a limit to miniaturization of the main body wiring pattern 16. In this regard, in the wiring board shown in FIG. 1, a film-like structure in which a fine wiring pattern 22 and a via 26 finer than the main body wiring pattern 16 and the via 18 of the main body substrate 10 are formed on one surface side of the main body substrate 10. By bonding the substrate 12, it is possible to mount an electronic component such as a CSP having a small size and external connection terminals arranged at a high density. As a result, the wiring board shown in FIG. 1 can be obtained at a lower cost than the wiring board formed by the build-up method shown in FIG.
It is possible to mount electronic components miniaturized such as

The wiring board shown in FIG. 1 is, as shown in FIG.
It can be obtained by bonding the film substrate 12 to one surface side of the main body substrate 10 with the adhesive layer 24.
At the time of such bonding, one end is connected to the fine wiring pattern 22 in order to bond the main body substrate 10 and the film-like substrate 12 while electrically connecting the main body wiring pattern 16 and the fine wiring pattern 22 by the via 26. The other end of the connected via 26 is brought into contact with the main body wiring pattern 16, and the adhesive layer 24 made of a thermoplastic resin of the film substrate 12 is brought into contact with one surface of the main body substrate 10. Next, the two substrates can be bonded by heating to a temperature at which the adhesive force of the thermoplastic resin forming the adhesive layer 24 is developed while maintaining the state where the two substrates are in contact with each other and applying pressure.

Here, the main body substrate 1 shown in FIGS.
0 can be produced by a conventionally known method. For example, a main body wiring pattern 1 having a predetermined shape is formed on one surface side.
After laminating a plurality of resin plates formed with 6, through holes are formed with a tool such as a drill, and then plating is applied to the inner walls of the through holes to form vias 18. In this plating,
First, after performing flash plating of copper or the like on the inner wall surface of the through hole by electroless plating or the like, a copper layer is formed on the inner wall surface of the through hole by electrolytic plating using flash plating as one of the electrodes to form the via 18. . In addition, of the resin plates to be laminated,
After laminating some resin plates, the through holes
After that, the remaining resin plates may be laminated.

The film substrate 12 adhered to one surface of the main body substrate 10 can be obtained by the method shown in FIG. First, a metal foil 28 such as a copper foil is formed on one side, and an adhesive layer 24 made of a thermoplastic resin is formed on the other side.
In the film 20 made of a resin such as a polyimide resin on which is formed a concave portion 30 which is opened on the adhesive layer 24 side and the metal foil 28 is exposed on the bottom surface (FIGS. 3A and 3B). The recess 30 can be formed by laser processing such as a carbon dioxide laser. Next, the metal foil 2
A metal 32 such as copper is filled by electrolytic plating using 8 as one of the electrodes [FIG. 3 (c)]. The metal 32 is in the recess 30
3C, it is preferable to stop filling the metal 32 below the opening surface of the concave portion 30 and leave the remaining concave portion 33, as shown in FIG.

The remaining concave portion 33 is filled with a low melting point metal 34 such as solder which is melted at a temperature lower than the melting temperature of the thermoplastic resin forming the adhesive layer 24 by electrolytic plating using the metal foil 28 and the metal 32 as one of the electrodes. Then, a via 26 is formed (FIG. 3D). Thereafter, the metal foil 28 is patterned by a photolithography method or the like to form the fine wiring pattern 22.
To form Further, predetermined plating such as gold plating may be applied to a predetermined portion of the formed fine wiring pattern 22.
In addition, as the low melting point metal, other than the solder, a low melting point metal that melts at a temperature lower than the melting temperature of the thermoplastic resin forming the adhesive layer 24, specifically, tin, lead, zinc, bismuth, antimony, indium, etc. Or a metal alloy having a melting point of 400 ° C. or less can be used.

As described above, by forming the tip of the via 26 with the low melting point metal 34, the main body substrate 10 is formed.
When the film substrate 12 is bonded to one surface side by thermocompression bonding, the low melting point metal 34 forming the tip of the via 26 is melted, and the via 26 can be securely bonded to the main body wiring pattern 16. . Further, when forming the fine wiring pattern 22 by patterning the metal foil 28 by a photolithography method or the like, a low-melting-point metal, for example, a solder that serves as a protective layer against an etchant may be selected as the low-melting-point metal 34. preferable. Via 2 protects via 2
Since it is not necessary to cover the exposed surface 6 with a mask, the manufacturing process of the film substrate 12 can be simplified.

Via 26 formed on film substrate 12
As shown in FIG. 4A, the metal foil 2
After the protective metal 36 is filled in the bottom surface where the surface 8 is exposed, a metal 32 such as copper is filled by electrolytic plating, and the low melting point metal 34 described above is filled to form a three-layer structure. In such a three-layer structure, a layer made of a metal 32 such as copper mainly forms the via 26. The protective metal 36 is a low melting metal 3
4, but may be different metals, but nickel, tin, and solder can be suitably used. By forming the layer made of the protective metal 36 on the bottom surface of the concave portion 30 in this manner, when forming the fine wiring pattern 22 by patterning the metal foil 28 by photolithography or the like, as shown in FIG. As described above, even if the position where the via 26 is formed is shifted and a part of the via 26 protrudes from the fine wiring pattern 22, the via 26 can be protected from the etching solution by the protective metal 36. As shown in FIG. 5, the via 26 may be formed by filling only the low melting point metal 38 into the recess 30 by electrolytic plating.

As shown in FIG. 2, the film-like substrate 12 formed in the steps shown in FIGS. Can be obtained. Further, the wiring board shown in FIG.
The mounting surface on which the electronic component is mounted is as shown in FIG.
It is preferable to cover the electronic component with a protective film 40 made of a resin such as a solder resist except for a portion joined to the external connection terminal. This is because the protection film 40 can prevent oxidation and the like of the fine wiring pattern 22 and the like.

In FIGS. 1 to 6, a single-layer film substrate 12 has been described. However, as shown in FIG. 7, the film substrate 12 may be a multilayer film substrate.
The multilayer film substrate 12 shown in FIG. 7 includes a first layer film substrate 12a and a second layer film substrate 12b.
Adhesive layer 24 formed on second layer film substrate 12b
It is what is adhered by. The fine wiring patterns 22 of the multilayer film substrate 12 are electrically connected to each other by vias 26 penetrating the film 20 and the adhesive 24. In this way, by forming the film-like substrate 12 into multiple layers, the fine wiring pattern can be further miniaturized and increased in density. According to the wiring board shown in FIGS. 1 to 7 described above, the fine wiring pattern 22 can be formed on the film-like substrate 12, and it is not necessary to form the fine wiring pattern on the main body substrate 10. A wiring board on which a miniaturized electronic component such as the above can be mounted can be easily formed at low cost. In addition, since a non-defective product can be integrated by conducting a test such as a continuity test on each of the main body substrate 10 and the film substrate 12, the cumulative yield of the wiring substrate can be reduced as compared with the built-up method shown in FIG. Can be improved.
Although the description so far has been directed to a wiring board on which a miniaturized electronic component such as a CSP can be mounted, the wiring board according to the present invention can also be applied to a wiring board for a semiconductor device on which a semiconductor element is mounted.

[0022]

EXAMPLE 1 A 25 μm thick polyimide film 20 having a copper foil 28 bonded on one side and an adhesive layer 24 made of a thermoplastic resin formed on the other side is used. Substrate 12 was formed. In this film-shaped substrate 12, first, a concave portion 30 having a diameter of about 100 μm was formed in the adhesive layer 24 and the polyimide film 20 by a carbon dioxide gas laser. The copper foil 28 is exposed at the bottom of the recess 30. Next, the vias 26 are formed by filling the recesses 30 with a eutectic tin-lead alloy by electrolytic plating using the copper foil 28 as one of the electrodes, and then the copper foil 28 is patterned by photolithography or the like to form fine wiring. The film 22 was formed by forming the pattern 22. Film substrate 12
The fine wiring pattern 22 formed in
μm and the space width between lines was 30 μm.

Thereafter, the obtained film-like substrate 12 is
The printed wiring board 16 is aligned and laminated so that the via 26 is in contact with the main body wiring pattern 16 formed on one surface side of the main body substrate 10, and is vacuum-pressed at a pressure of 15 kgf / cm ² and a maximum temperature of about 200 ° C. Then, the wiring substrate shown in FIG. 1 was obtained. When the obtained wiring substrate was cut and the cut surface was observed, the via 26 formed in the film-like substrate 12 was formed.
Of the main body wiring pattern 16 of the main body substrate 10.
Was welded to. The main body substrate 10 used here includes:
The line width is 80 μm and the space width between the lines is 80
A main body wiring pattern 16 of μm is laminated via an insulating layer 14 made of resin, and the main body wiring patterns 16 are electrically connected to each other by a via 18 having an inner diameter of 300 μm penetrating the insulating layer 14. I have. As described above, the fine wiring patterns 22 and the vias 26 formed on the film substrate 12 are finer than the main wiring patterns 16 and the vias 18 formed on the main body substrate 10.

In this embodiment, the mounting surface of the electronic component of the wiring board shown in FIG. 1 is formed by applying a photosensitive solder resist except for the fine wiring pattern 22 connected to the external connection terminals of the electronic component. The wiring board shown in FIG. Further, the portion of the fine wiring pattern 22 where the protective film 40 was not formed was subjected to nickel plating, and further to gold plating. A chip sip package (CSP) could be mounted on the finally obtained wiring board.

Example 2 In Example 1, when forming the via 26 to be formed on the film-like substrate 12, tin plating was performed by electrolytic plating using a copper foil 28 as one of the electrodes, and then copper plating was performed. A wiring board was obtained in the same manner as in Example 1, except that the via 26 having a three-layer structure was formed by further performing solder plating.
When the obtained wiring board was cut and the cut surface was observed, the via 26 was mainly formed of copper, and the tip of the via 26 made of solder 34 was the main body wiring pattern 16 of the main body substrate 10. Was welded to. A chip sip package (CSP) could be mounted on the finally obtained wiring board.

Example 3 In Example 1, when forming the via 26 formed on the film-like substrate 12, copper plating was performed by electrolytic plating using a copper foil 28 as one of the electrodes, and then solder plating was performed. A wiring board was obtained in the same manner as in Example 1, except that the via 26 having a two-layer structure was formed. When the obtained wiring board was cut and the cut surface was observed, the via 26 was mainly formed of copper, and the tip of the via 26 made of solder 34 was the main body wiring pattern 16 of the main body substrate 10. Was welded to. A chip sip package (CSP) could be mounted on the finally obtained wiring board.

[0027]

The wiring board according to the present invention is formed by adhering a film-like substrate having a fine wiring pattern formed on the mounting surface side of the electronic component to the main body substrate. And other miniaturized electronic components can be mounted. Further, as the main body substrate to which the film-like substrate is adhered, the main body wiring patterns laminated in multiple layers via the insulating layer penetrate through the insulating layer pierced using a tool such as a drill. An inexpensive main body substrate formed by electrically connecting the inner wall of the through-hole with a via formed by plating or the like can be used. Therefore, the finally obtained wiring board can also be manufactured at a lower cost as compared with a wiring board formed by the build-up method.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of a wiring board according to the present invention.

FIG. 2 is an explanatory diagram for explaining a method for manufacturing the wiring board shown in FIG. 1;

FIG. 3 is a process chart for explaining a manufacturing process of a film-like substrate for forming the wiring board shown in FIG. 1;

FIG. 4 is a partial cross-sectional view for explaining another example of the film-like substrate shown in FIG.

FIG. 5 is a partial cross-sectional view for explaining another example of the film-like substrate shown in FIG.

FIG. 6 is a partial cross-sectional view for explaining another example of the wiring board according to the present invention.

FIG. 7 is a partial cross-sectional view for explaining another example of the wiring board according to the present invention.

FIG. 8 is a partial cross-sectional view of a conventional wiring board.

FIG. 9 is a partial cross-sectional view showing a step of manufacturing a wiring board by a built-up method.

FIG. 10 is a process chart for describing an improved method for improving the manufacture of the wiring board by the built-up method shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Main-body board | substrate 12 Film-shaped board 14 Insulating layer 16 Main-body wiring pattern 18, 26 Via 20 Film 22 Fine wiring pattern 24 Adhesive layer 28 Metal layer 30 Depression 32 Metal 34, 36, 38 Low melting metal 40 Protection film

Continued on the front page F term (reference) 5E346 AA02 AA16 AA26 AA43 CC08 CC10 CC32 CC33 CC37 CC40 CC41 DD03 DD12 DD17 DD25 DD32 EE12 EE13 EE18 EE33 EE38 EE44 FF06 FF07 FF15 FF18 GG15 GG28 HH26

Claims (12)

[Claims] 1. A multi-layer printed circuit board in which wiring patterns stacked in multiple layers with an insulating layer interposed therebetween are electrically connected by vias penetrating the insulating layer. A film substrate on which a fine wiring pattern finer than the main body wiring pattern formed on the main body substrate is adhered to at least one surface side of the main body substrate forming the main body substrate by an adhesive layer; The wiring pattern and the fine wiring pattern penetrate the film-shaped substrate and the adhesive layer, and are electrically connected by fine vias finer than vias formed in the main body substrate. Multilayer wiring circuit board. 2. The main body part wiring pattern of the main body part substrate,
2. The multilayer wiring circuit board according to claim 1, wherein the multilayer wiring circuit board is electrically connected by a via formed by forming a plated metal film on an inner wall of a through hole penetrating the insulating layer. 3. The multilayer wiring circuit board according to claim 1, wherein the bonding layer for bonding the main body substrate and the film substrate is formed of a thermoplastic resin. 4. A film-like substrate, wherein a fine wiring pattern and an adhesive layer are integrally formed via a film, and fine vias are formed through the film and the adhesive layer. The multilayer wiring circuit board according to claim 1. 5. The low-melting point of a solder or the like in which the other end of the fine via having one end connected to the fine wiring pattern formed on the film of the film-like substrate is melted at or below the melting temperature of the resin forming the adhesive layer. The multilayer wiring circuit board according to any one of claims 1 to 4, which is formed of a metal. 6. The film-like substrate according to claim 1, wherein the film-like substrate is a multilayer film-like substrate formed by laminating a plurality of film-like substrates on which fine wiring patterns are formed via an adhesive layer.
6. The multilayer wiring circuit board according to claim 5. 7. When manufacturing a multilayer wiring circuit board in which wiring patterns laminated in multiple layers via an insulating layer are electrically connected by vias penetrating the insulating layer, the multilayer wiring circuit is used. At least one surface side of the main body substrate forming the main body of the substrate, a film substrate on which a fine wiring pattern finer than the main body wiring pattern formed on the main body substrate is adhered by an adhesive layer, The multilayer wiring, wherein the main body wiring pattern and the fine wiring pattern penetrate the film-shaped substrate and the adhesive layer, and are electrically connected by fine vias finer than vias formed in the main body substrate. Manufacturing method of printed circuit board. 8. A main body substrate in which each of the main body wiring patterns is electrically connected to an inner wall of a through hole penetrating the insulating layer by a fine via formed with a plated metal film is used as the main body substrate. A method for manufacturing a multilayer wiring circuit board according to claim 7. 9. The method for manufacturing a multilayer wiring circuit board according to claim 7, wherein the main body substrate and the film substrate are adhered to each other by an adhesive layer formed on the film substrate. 10. A film-like substrate formed by integrally forming a fine wiring pattern and an adhesive layer via a film and forming a fine via through the film and the adhesive layer as the film-like substrate. Item 10. The method for manufacturing a multilayer wiring circuit board according to any one of Items 7 to 9. 11. The other end of a fine via having one end connected to a fine wiring pattern formed on a film-like substrate is formed of a low-melting metal such as solder which is melted at a melting temperature of a resin forming an adhesive layer or lower. The method for manufacturing a multilayer wiring circuit board according to any one of claims 7 to 10. 12. The multi-layer film substrate according to claim 7, wherein a plurality of film substrates on which fine wiring patterns are formed are laminated in multiple layers via an adhesive layer. A method for manufacturing the multilayer wiring circuit board according to the above.