JP2000012985A - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration in the performance of a printed board by the heat generated from heat generating parts, such as the integrated circuit, etc., and peripheral electronic components by discharging the heat generated from the heat generating parts into the air through a plurality of through-holes by mounting the heat generating parts on a printed board and boring the through holes through the printed board within the extend covered by the heat generating parts. SOLUTION: Heat generating parts 1, such as the integrated circuit, etc., are mounted on a printed board 2 with a void 3 in between by soldering the terminals 1a of the parts 1 to the board 2. An array pattern is formed on the printed board 2 within the extent covered by the parts 1 by boring a plurality of through-holes 4 through the board 2 at regular intervals. The heat generated from the parts 1 is discharged directly into the outside air from the top face 1b of the part 1, and the warmed air existing in the void 3 under the bottom face 1c of the parts 1 is discharged into the outside air through the through- holes 4. Since the warmed air does not stay in the void 3 but is quickly discharged to the outside through the holes 4, a sufficient heat radiating effect can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used for an FM tuner or the like and having a heat radiation mechanism.

[0002]

2. Description of the Related Art In a conventional printed circuit board, as shown in FIG.
Are mounted above the printed circuit board 22 with a slight gap 23 interposed therebetween. For the heat radiation of the heat generating component 21, the heat is directly transmitted from the upper surface 21 b of the heat generating component 21 to the outside air and transmitted from the lower surface 21 c of the heat generating component 21 through the air existing in the gap 23 and further absorbed by the printed circuit board 22. Then, there is a path for radiating heat to the outside air.

[0003]

However, in the conventional printed circuit board, the heat of the lower surface 21c of the heat-generating component 21 is not immediately released to the air, and the heat is not emitted to the lower surface 21c of the heat-generating component 21.
When the temperature in the vicinity increases, there is a problem that the performance of the heat-generating component 21 and other electronic components (not shown) installed in the vicinity are hindered.

[0004] It is an object of the present invention to quickly release the heat from the heat-generating component 21 mounted on the printed circuit board 22 into the air.

[0005]

A printed circuit board according to the present invention includes a printed circuit board and a heat-generating component such as an integrated circuit mounted on the printed circuit board. A plurality of through holes were provided.

Further, in the present invention, the through hole is formed so as to extend around the area of the printed circuit board which is covered with the heat generating component.

Further, in the present invention, a conductive pattern is formed on a surface of the printed circuit board opposite to the surface where the heat-generating component is provided, in a range where the through-hole is provided.

In the present invention, the through holes are regularly arranged to form an array pattern.

According to the present invention, in the printed circuit board, the arrangement pattern of the through holes is rectangular or circular.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In the printed circuit board of the present invention,
As shown in FIG. 1, a heat-generating component 1 such as an integrated circuit is supported by soldering a terminal 1 a and is disposed above a printed board 2 with a small gap 3 between the printed board 2 and the printed board 2. As shown in FIG. 2, a plurality of through-holes 4 are regularly arranged and formed in an array pattern over the entire area of the printed circuit board 2 covered with the heat-generating component 1. , According to the rectangular heating component 1,
Shapes a rectangle. The diameter of the through hole 4 is about 1 mm, which is substantially equal to the diameter of the other through holes (not shown) for mounting components on the printed circuit board 2.

The heat radiation of the heat-generating component 1 includes a path for directly radiating heat from the upper surface 1b of the heat-generating component 1 into the outside air;
Warm air existing in the gap 3 from the lower surface 1c is
There is a path through the through-hole 4 for direct heat radiation into the outside air. That is, the warmed air in the gap 3 between the heat-generating component 1 and the printed circuit board 2 does not stay in the gap 3 but is quickly discharged to the outside through the through-hole 4, so that a sufficient heat radiation effect can be obtained.

FIG. 3 shows another embodiment of the present invention, in which a conductive pattern 5 is provided on the opposite surface of the printed circuit board 2 where the heat-generating component 1 is mounted, in a range where the through hole 4 is provided. Is formed. That is, by forming the conductive pattern 5 so as to sew between the plurality of through holes 4, the area in which the through holes 4 are formed can be effectively used as a region of the conductive pattern 5. it can.

In the printed circuit board 2, the through holes 4
May be provided only in a part of the area where the printed circuit board 2 is covered by the heat-generating component 1 or may be extended to the periphery of the area covered by the heat-generating component 2. Also,
The installation range of the through-hole 4 does not need to be the shape of the range covered by the heat-generating component 1, and may be circular or rectangular.

[0014]

The heat from the lower surface of the heat-generating component 1 is quickly released into the air from the through-hole, thereby suppressing the temperature rise around the heat-generating component and deteriorating the performance of the heat-generating component and peripheral electronic components due to the heat. Can be prevented.

Further, by forming a circuit pattern on the opposite surface of the printed circuit board on which the heat-generating components are installed, a through hole 4 is formed on the opposite surface of the printed circuit board 2 on which the heat-generating components 1 are mounted. The set range can be effectively used also as a range where the conductive pattern 5 is formed.

The range in which the through hole is provided is determined by
By spreading to the entire surface covered with the heat-generating component and further to the peripheral portion, the heat radiation becomes faster, and the influence of the heat on the performance of the heat-generating component and peripheral electronic components (not shown) is reduced.

By arranging the through-holes regularly, heat from the heat-generating component can be uniformly radiated.

The appearance of the printed circuit board can be improved by forming the figure formed by the arrangement pattern of the through holes into a rectangle or a circle having a shape close to the range in which the heat-generating component covers the printed circuit board.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a printed circuit board structure according to the present invention.

FIG. 2 is a plan view showing a printed circuit board structure of the present invention, as viewed from the printed circuit board side.

FIG. 3 shows another embodiment of the printed circuit board structure of the present invention, and shows a main part of the surface on the opposite side of the printed circuit board 2 on which the heat generating component 1 is mounted.

FIG. 4 is a sectional view showing a conventional printed circuit board structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generating component 1a Terminal 1b Upper surface 1c Lower surface 2 Printed circuit board 3 Void 4 Through hole 5 Circuit pattern

Claims (5)

[Claims] 1. A printed circuit board, comprising: a heat-generating component such as an integrated circuit mounted on the printed circuit board; and a plurality of through holes provided in a range of the printed circuit board covered by the heat-generating component. And printed circuit board. 2. The printed circuit board according to claim 1, wherein the through-hole is formed around the area of the printed circuit board covered by the heat-generating component. 3. The printed circuit board according to claim 1, wherein a conductive pattern is formed on a surface of the printed circuit board opposite to the surface on which the heat-generating component is provided. Printed circuit board. 4. The printed circuit board according to claim 1, wherein the through holes are regularly arranged to form an arrangement pattern. 5. The printed circuit board according to claim 1, wherein the arrangement pattern of the through holes in the printed circuit board is rectangular or circular.