JP2000012760A - Solder terminals - Google Patents
Solder terminalsInfo
- Publication number
- JP2000012760A JP2000012760A JP10195012A JP19501298A JP2000012760A JP 2000012760 A JP2000012760 A JP 2000012760A JP 10195012 A JP10195012 A JP 10195012A JP 19501298 A JP19501298 A JP 19501298A JP 2000012760 A JP2000012760 A JP 2000012760A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- soldered
- electronic component
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【課題】 印刷配線基板に表面実装される電子部品につ
いて、信頼性の高い半田付性と、大きな半田付強度を得
ることができる半田付端子を提供する。
【解決手段】 先端が印刷配線基板に向かって傾斜又は
湾曲した第１半田付部と印刷配線基板から離れる方向に
傾斜又は湾曲した第２半田付部からなることを特徴とす
る印刷配線基板に表面実装される電子部品の半田付端子
とする。
(57) [Problem] To provide a soldered terminal capable of obtaining highly reliable solderability and high soldering strength for an electronic component surface-mounted on a printed wiring board. SOLUTION: The front surface of the printed wiring board has a first soldered portion inclined or curved toward the printed wiring board and a second soldered portion inclined or curved away from the printed wiring board. It is a soldered terminal of the electronic component to be mounted.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、印刷配線基板に表
面実装される電子部品の半田付端子に関する。特に、半
田付強度と信頼性を大きくできる半田付端子の形状に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldered terminal of an electronic component mounted on a surface of a printed circuit board. In particular, it relates to the shape of a soldered terminal capable of increasing soldering strength and reliability.
【０００２】[0002]
【従来の技術】従来、印刷配線基板に表面実装される電
子部品の半田付端子は、図８〜図１１に示した形状が知
られている。この様な電子部品の半田付端子は、小型化
や低コスト化の理由で、予めメッキが施された金属板を
プレスするために、プレスされた破断面にはメッキが無
く、素材がむき出しのままである場合が多い。2. Description of the Related Art Conventionally, soldered terminals of electronic components surface-mounted on a printed wiring board are known in the shapes shown in FIGS. In order to reduce the size and cost of such soldered terminals for electronic components, the pressed fractured surface has no plating, and the material is exposed, in order to press a pre-plated metal plate. Often it remains.
【０００３】[0003]
【発明が解決しようとする課題】この様に、従来の半田
付端子の形状の場合、プレス破断面は素材がむき出しの
ままであるため半田がのりにくく、不安定な半田付にな
ってしまうと言う問題点があった。As described above, in the case of the shape of the conventional soldering terminal, since the material of the press fracture surface is left unexposed, it is difficult for the solder to be applied and unstable soldering occurs. There was a problem to say.
【０００４】また、図１０や図１１に示した半田付端子
の形状の場合、半田付端子の加工が難しいが、半田フィ
レットを比較的大きく形成することができる。しかし、
その半田フィレットは１カ所にしか形成されないため、
半田付の強度になお不安が残るものであった。Further, in the case of the shape of the soldered terminal shown in FIGS. 10 and 11, it is difficult to process the soldered terminal, but a relatively large solder fillet can be formed. But,
Since the solder fillet is formed only in one place,
Anxiety still remained in the soldering strength.
【０００５】本発明の目的は、印刷配線基板に表面実装
される電子部品について、信頼性の高い半田付性と、大
きな半田付強度を得ることができる半田付端子を提供す
るものである。An object of the present invention is to provide a soldered terminal capable of obtaining a highly reliable solderability and a large soldering strength for an electronic component surface-mounted on a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】先端が印刷配線基板に向
かって傾斜又は湾曲した第１半田付部と印刷配線基板か
ら離れる方向に傾斜又は湾曲した第２半田付部からなる
ことを特徴とする印刷配線基板に表面実装される電子部
品の半田付端子とする。According to another aspect of the present invention, a first soldering portion has a tip inclined or curved toward the printed wiring board and a second soldered portion inclined or curved away from the printed wiring board. It is a soldered terminal of an electronic component that is surface-mounted on a printed wiring board.
【０００７】これにより、印刷配線基板に表面実装され
る電子部品について、信頼性の高い半田付性と、大きな
半田付強度を得ることができる。As a result, highly reliable solderability and high soldering strength can be obtained for an electronic component surface-mounted on a printed wiring board.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して詳細に説明する。第１図乃至第６図はそれぞ
れ本発明の半田付端子の形状を実施した電子部品の斜視
図、平面図、正面図、底面図、背面図、右側面図であ
る。なお、本実施の形態では、電子部品をスライドスイ
ッチを用いて説明するが、コネクタなどの印刷配線基板
に表面実装される半田付端子を有する電子部品であれ
ば、本発明の技術範囲に含まれるものであるため、スラ
イドスイッチの構成の説明は割愛することとする。Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 6 are a perspective view, a plan view, a front view, a bottom view, a rear view, and a right side view of an electronic component in which the shape of the soldered terminal according to the present invention is implemented, respectively. In the present embodiment, an electronic component is described using a slide switch. However, any electronic component having a soldered terminal surface-mounted on a printed wiring board such as a connector is included in the technical scope of the present invention. Therefore, the description of the configuration of the slide switch is omitted.
【０００９】電子部品１０の背面からは、印刷配線基板
３０の表面に印刷された所定の半田付パターン（図示省
略）に半田付される半田付端子２０が突出している。半
田付端子２０は導電性の金属板をプレス加工したもので
ある。From the back surface of the electronic component 10, a solder terminal 20 to be soldered to a predetermined solder pattern (not shown) printed on the surface of the printed wiring board 30 protrudes. The soldered terminal 20 is formed by pressing a conductive metal plate.
【００１０】半田付端子２０の先端は、印刷配線基板に
向かって傾斜した第１半田付部２１と、印刷配線基板か
ら離れる方向に傾斜した第２半田付部２２が略Ｖ字状に
形成されている。なお、半田付端子２０の先端は、印刷
配線基板に向かって湾曲した第１半田付部と、印刷配線
基板から離れる方向に湾曲した第２半田付部が略Ｕ字状
に形成されていてもよい。At the tip of the soldering terminal 20, a first soldering portion 21 inclined toward the printed wiring board and a second soldering portion 22 inclined away from the printed wiring board are formed in a substantially V shape. ing. In addition, even if the tip of the soldering terminal 20 has a first soldering portion curved toward the printed wiring board and a second soldering portion curved away from the printed wiring board, a substantially U-shape is formed. Good.
【００１１】電子部品１０は印刷配線基板３０の所定の
位置に載置される。印刷配線基板３０の表面の半田付パ
ターン（図示省略）には、予めクリーム半田が塗布され
ている。なお、このクリーム半田が加熱・冷却され、電
子部品１０の半田付端子２０と半田付パターンとで図７
に示した半田フィレットＦを形成する。The electronic component 10 is placed at a predetermined position on the printed wiring board 30. A cream solder is applied to a soldering pattern (not shown) on the surface of the printed wiring board 30 in advance. The cream solder is heated and cooled, and the soldering terminals 20 of the electronic component 10 and the soldering pattern are used as shown in FIG.
Is formed.
【００１２】なお、本発明による半田付端子２０の形状
によれば、第１半田付部２１と第２半田付部２２の両方
に半田フィレットＦが形成される。According to the shape of the soldering terminal 20 according to the present invention, the solder fillet F is formed on both the first soldering portion 21 and the second soldering portion 22.
【００１３】[0013]
【発明の効果】本発明による半田付端子２０の形状によ
れば、印刷配線基板３０に表面実装される電子部品１０
について、半田フィレットＦは第１半田付部２１と第２
半田付部２２の両方に形成されるので、信頼性の高い半
田付性と、大きな半田付強度を得ることができる。According to the shape of the soldered terminal 20 according to the present invention, the electronic component 10 surface-mounted on the printed wiring board 30 is provided.
With respect to the solder fillet F, the first soldered portion 21 and the second
Since it is formed on both the soldering portions 22, it is possible to obtain highly reliable solderability and high soldering strength.
【００１４】[0014]
【図１】本発明の電子部品の斜視図FIG. 1 is a perspective view of an electronic component of the present invention.
【図２】同平面図FIG. 2 is a plan view of the same.
【図３】同正面図FIG. 3 is a front view of the same.
【図４】同底面図FIG. 4 is a bottom view of the same.
【図５】同背面図FIG. 5 is a rear view of the same.
【図６】同右側面図FIG. 6 is a right side view of the same.
【図７】本発明による半田付状態を示した図である。FIG. 7 is a diagram showing a soldered state according to the present invention.
【図８】従来の電子部品の半田付端子の形状を示した図
である。FIG. 8 is a diagram showing a shape of a soldered terminal of a conventional electronic component.
【図９】他の従来の電子部品の半田付端子の形状を示し
た図である。FIG. 9 is a diagram showing a shape of a soldered terminal of another conventional electronic component.
【図１０】他の従来の電子部品の半田付端子の形状を示
した図である。FIG. 10 is a diagram showing a shape of a soldered terminal of another conventional electronic component.
【図１１】他の従来の電子部品の半田付端子の形状を示
した図である。FIG. 11 is a view showing the shape of a soldered terminal of another conventional electronic component.
１０ 電子部品 ２０ 半田付端子 ２１ 第１半田付部 ２２ 第２半田付部 ３０ 印刷配線基板 Ｆ 半田フィレット DESCRIPTION OF SYMBOLS 10 Electronic component 20 Soldering terminal 21 First soldering part 22 Second soldering part 30 Printed wiring board F Solder fillet
Claims (1)
傾斜又は湾曲した第１半田付部（２１）と印刷配線基板
（３０）から離れる方向に傾斜又は湾曲した第２半田付
部（２２）からなることを特徴とする印刷配線基板（３
０）に表面実装される電子部品（１０）の半田付端子
（２０）。A first soldering portion (21) having a tip inclined or curved toward a printed wiring board (30) and a second soldered portion (22) inclined or curved away from the printed wiring board (30). ) Printed wiring board (3)
A soldered terminal (20) of an electronic component (10) surface-mounted on 0).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10195012A JP2000012760A (en) | 1998-06-25 | 1998-06-25 | Solder terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10195012A JP2000012760A (en) | 1998-06-25 | 1998-06-25 | Solder terminals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000012760A true JP2000012760A (en) | 2000-01-14 |
Family
ID=16334074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10195012A Pending JP2000012760A (en) | 1998-06-25 | 1998-06-25 | Solder terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000012760A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100816619B1 (en) | 2006-02-27 | 2008-03-24 | 스미토모 덴소 가부시키가이샤 | Board mounted terminal construction |
-
1998
- 1998-06-25 JP JP10195012A patent/JP2000012760A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100816619B1 (en) | 2006-02-27 | 2008-03-24 | 스미토모 덴소 가부시키가이샤 | Board mounted terminal construction |
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