JP2000009574A - Sensor component and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a sensor component and a manufacturing method thereof, which can reduce the size of the entire outer shape and can easily reduce the number of working steps. A sensor component (1) according to the present invention includes a package (3) containing a sensor chip (2) and a cover (4) for closing an opening of the package (3), and an electrode (2a) provided on the sensor chip (2). And the electrode 6 provided on the cover 4 and drawn out to the outside, at least the electrode 2
a, 6 are electrically connected to each other via a conductive material 7 interposed therebetween. The method for manufacturing the sensor component 1 according to the present invention includes:
Alternatively, at least one of the electrodes 2a, 6 of one of the covers 4
An anisotropic conductive material 7 is applied thereon, and the electrodes 2a and 6 of the sensor chip 2 and the cover 4 are overlapped with each other, and then the anisotropic conductive material 7 is thermally cured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor component and a method of manufacturing the same, and more particularly, to a structure of a sensor component such as a pressure sensor and an acceleration sensor and a method of manufacturing such a sensor component. .

[0002]

2. Description of the Related Art Conventionally, as a sensor component of this type, a pressure sensor 21 having a structure shown in FIG. 7 has been known. This pressure sensor 21 includes a package 23 in which a sensor chip 22 is mounted and a package 23. And a cover for closing the sensor chip 22 by closing the opening of the sensor chip. That is, the package 23 and the cover 24 are manufactured using a hard resin or the like, and the pressure introduced through the pressure introduction hole 25a is detected on the inner surface of the bottom of the package 23 provided with the pressure introduction port 25. Chip 22 is die-bonded. An air introduction hole (not shown) required for the sensor chip 22 to detect pressure is provided in the package 23.
Of course, it is formed at any of the positions.

In this case, on both sides of the package 23, metal terminals 26 penetrating therethrough and extending to the outside are provided, and the electrodes provided on the sensor chip 22 and the metal terminals 26 are provided. The inner end, that is, the inner end of the metal terminal 26 that functions as a lead-out electrode to the outside, is connected after the corresponding ones are electrically connected by wire bonding. In addition, the code | symbol 27 in a figure has shown the wire.

Further, when manufacturing such a pressure sensor 21, although not shown, the sensor chip 22 is mounted on the inner surface of the bottom of the package 23 by die bonding, and the sensor chip 22 is mounted by wire bonding. Generally, a method is used in which after the electrodes are electrically connected to the inner ends of the metal terminals 26, the opening of the package 23 is sealed with a cover 24 using an adhesive. ing.

[0005]

However, in the pressure sensor 21 as a sensor component according to the conventional embodiment, the metal terminals 26 connected to the electrodes of the sensor chip 22 are provided.
Must be drawn into the package 23 and then wire-bonded, so that the sensor chip 2
The outer shape of the package 23 as compared with the outer shape of the pressure sensor 2 itself, that is, the entire outer shape of the pressure sensor 21 is increased,
A useless space exists in the package 23. Further, in the manufacturing method, it is necessary to connect the electrodes of the sensor chip 22 and the metal terminals 26 of the package 23 by wire bonding, and attach the cover 24 in a process different from the wire bonding. As a result, the manufacturing cost will increase.

The present invention has been made in view of these inconveniences, and it is possible to reduce the overall size of the sensor and to easily reduce the number of working steps, and to manufacture the sensor component. It is intended to provide a method.

[0007]

According to a first aspect of the present invention, there is provided a sensor component including a package in which a sensor chip is provided, and a cover for closing an opening of the package. Characterized in that the electrode provided and the electrode provided on the cover and drawn out to the outside are electrically connected to each other via at least a conductive material interposed between the electrodes. It is.

According to a second aspect of the present invention, there is provided a sensor component including a package in which a sensor chip is provided, and a cover for closing an opening of the package, wherein an electrode surface of the sensor chip and an electrode surface of the cover are provided. Are characterized in that they are bonded in close contact with each other via an anisotropic conductive material.

According to a third aspect of the present invention, in the method of manufacturing a sensor component, an anisotropic conductive material is applied to at least one of the sensor chip and the cover, and the electrodes of the sensor chip and the cover are connected to each other. It is characterized in that the anisotropic conductive material is thermally cured after being superposed on each other.

[0010]

FIG. 1 is a side sectional view showing the structure of a pressure sensor as an example of a sensor component according to the present embodiment, and FIG. 2 is an exploded perspective view showing the pressure sensor according to the present embodiment in an exploded manner. FIGS. 3, 3 and 4 are side sectional views each showing a mounting state of a pressure sensor on a wiring board, FIG. 5 is a side sectional view showing a mounting state of a pressure sensor according to a modification, and FIG. It is an exploded perspective view which shows the acceleration sensor as another example disassembled. 1 to 5, reference numeral 1 denotes a pressure sensor, and reference numeral 11 in FIG. 6 denotes an acceleration sensor.

The pressure sensor 1 according to the present embodiment has a structure shown in FIG.
As shown in FIG. 2 and FIG. 2, the package includes a package 3 in which a sensor chip 2 is provided, and a cover 4 for closing an opening of the package 3, and is provided with a pressure introduction port 5. A sensor chip 2 for detecting the pressure introduced through the pressure introducing hole 5a is die-bonded on the inner surface of the bottom of the sensor 3. In this case, the cover 4 is provided with a pair of left and right metal terminals 6 that penetrate the top portion and are drawn out to the outside.
Since the inner ends of the metal terminals 6 need to function as the electrodes of the cover 4, the positions facing the electrodes 2 a of the sensor chip 2 are selected in advance and arranged. In addition,
The package 3 and the cover 4 are manufactured using a hard resin or the like, and an air introduction hole (not shown) required for the sensor chip 2 to detect a pressure is provided in one of the package 3 and the cover 4. Is formed at the position. In addition, the electrode surface of the sensor chip 2 housed in the package 3, that is, the upper surface of the sensor chip 2 on which the pair of electrodes 2a are formed, and the electrode surface of the cover 4, that is, the metal terminal 6 that functions as an electrode A thermosetting anisotropic conductive material 7 is interposed between the inner surface of the cover 4 having an exposed end, and the sensor chip 2 and the cover 4 are entirely interposed via the anisotropic conductive material 7. It is integrally joined after being in close contact. Therefore, the electrodes 2a of the sensor chip 2 and the inner ends of the metal terminals 6 which are opposed to each other are electrically connected to each other through the conductive particles contained in the anisotropic conductive material 7. The sensor chip 2 is sealed by the cover 4. The package 3 and the cover 4 may be joined with an adhesive or the like, and the adjacent electrodes 2a and 6 may be used as long as the anisotropic conductive material 7 is used.
The advantage that no short circuit occurs between them is ensured.

Further, as shown in FIGS. 3 and 4, the pressure sensor 1 in which the sensor chip 2 is built in the package 3 whose opening is closed by the cover 4 is as shown in FIGS.
It is to be mounted on the wiring board 9 in a posture corresponding to the shape of the wiring board 9, and the inner end 6 a is connected to the electrode 2 of the sensor chip 2 via the anisotropic conductive material 7.
The outer end of each of the metal terminals 6 connected to a is connected to each of the wiring patterns (not shown) formed on the wiring board 9 by soldering or the like. FIG. 3 shows an example in which the pressure sensor 1 is mounted on the wiring board 9 using a storage hole 9a formed in advance, and FIG. 4 shows a wiring board on which the storage hole 9a is not formed. 9 shows an example in which the pressure sensor 1 is mounted by surface mounting.

On the other hand, when manufacturing the pressure sensor 1 according to the present embodiment, although not shown, a manufacturing method according to the following procedure is adopted. That is, first, a thin silicone resin is applied on the inner surface of the bottom of the package 3, and the sensor chip 2 is placed on the inner surface of the bottom of the package 3 coated with the silicone resin while using the die bonder while keeping the sensor chip 2 in a horizontal posture. The silicone resin is thermally cured by heating using an oven. Next, the anisotropic conductive material 7 is applied to the entire upper surface of the sensor chip 2 contained in the package 3 and the opening of the package 3 is closed by the cover 4 provided with the metal terminals 6. After that, the anisotropic conductive material 7 is thermally cured by heating using a heater.

[0014] Then, when the cover 4 closes the opening of the package 3, the sensor chips 2 facing each other when the opening is closed.
The electrode 2a and the inner end of the metal terminal 6 are thermocompression-bonded to each other via the anisotropic conductive material 7, so that they are electrically connected to each other. Here, the electrode surface of the cover 4 is overlapped with the electrode surface of the sensor chip 2 to which the anisotropic conductive material 7 is applied,
Of course, the electrode surface of the cover 4 coated with the anisotropic conductive material 7 may be overlapped with the electrode surface of the sensor chip 2.

By the way, in the pressure sensor 1 according to the present embodiment, the metal terminals 6 connected to the electrodes 2a of the sensor chip 2 pass through the top of the cover 4 and are drawn out. The pair of left and right metal terminals 6 extends through both sides of the cover 4 as shown in a modified example of FIG. 5, and the outer ends of the respective metal terminals 6 are connected to the wiring board. 9 may be connected. Also, in the above description, the electrode surface of the sensor chip 2 and the electrode surface of the cover 4 are completely joined with the anisotropic conductive material 7, so that the electrode 2 a of the sensor chip 2 and the metal terminal 6 are joined together. Although it is connected to the inner end portion, it is not limited to such a structure, and although not shown, not between the sensor chip 2 and the cover 4 but between the two electrodes 2a, 6 Only, that is, the anisotropic conductive material 7 may be interposed only between the electrode 2 a of the sensor chip 2 and the inner end of the metal terminal 6. A protrusion of a predetermined height made of a conductive material may be provided in advance on only one of the inner ends of the sensor chip, and the electrode surface of the sensor chip 2 and the electrode surface of the cover 4 may be joined with an insulating material. Will be.

Further, in the present embodiment, the sensor component is the pressure sensor 1, but the scope of the present invention is not limited to only the pressure sensor 1, and the acceleration sensor 11, the speed sensor, It goes without saying that the present invention can be applied to other sensor components such as an impact sensor and the like. That is, FIG. 6 is an exploded perspective view showing the acceleration sensor 11 as another example of the sensor component in an exploded manner. In this acceleration sensor 11, the electrode surface of the sensor chip 13 housed in the package 12,
The upper surface on which the three electrodes 13a are formed and the electrode surface of the cover 15 on which the three metal terminals 14 are provided, that is, the inner surface of the cover 15 in which the inner ends of the metal terminals 14 functioning as electrodes are exposed. And an anisotropic conductive material 16 is interposed therebetween. Therefore, in this case, the sensor chip 1
The inner electrodes of the third electrode 13a and the metal terminal 14 are electrically connected to each other through the conductive particles contained in the anisotropic conductive material 16, similarly to the pressure sensor 1 shown in FIG.

[0017]

As described above, in the sensor component according to the present invention, the electrode provided on the sensor chip and the electrode provided on the cover are formed of at least the conductive material interposed between the electrodes. Or the electrode surface of the sensor chip and the electrode surface of the cover are joined via an anisotropic conductive material. There is no need to wire-bond metal terminals to the inside of the package and then wire-bond them. Therefore, there is no useless space in the package, and the effect of reducing the overall outer shape of the sensor component can be obtained.

In the manufacturing method according to the present invention, an anisotropic conductive material is applied on at least one of the electrodes of the sensor chip or the cover, and the electrodes of the sensor chip and the cover are overlapped with each other. The sensor component is manufactured by simply heat curing the anisotropic conductive material. Therefore, if this manufacturing method is adopted, the steps of wire bonding and cover attachment, which were performed separately in the conventional embodiment, are simultaneously performed, and the number of working steps can be easily reduced. The advantage is obtained.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a structure of a pressure sensor which is an example of a sensor component according to the present embodiment.

FIG. 2 is an exploded perspective view showing an exploded state of the pressure sensor.

FIG. 3 is a side sectional view showing a mounting state of a pressure sensor.

FIG. 4 is a side sectional view showing a mounting state of the pressure sensor.

FIG. 5 is a side sectional view showing a modified structure of the pressure sensor.

FIG. 6 is an exploded perspective view showing an exploded state of an acceleration sensor which is another example of the sensor component.

FIG. 7 is a side sectional view showing the structure of a conventional pressure sensor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressure sensor (sensor part) 2 Sensor chip 2a electrode 3 Package 4 Cover 6 Metal terminal (electrode) 7 Anisotropic conductive material (conductive material)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takashi Toya 10 Hanazono Todocho, Ukyo-ku, Kyoto, Kyoto O Inside the Mron Corporation (72) Inventor Koichi Furusawa 10 Hanazono Todocho, Ukyo-ku, Kyoto, Kyoto Inside Mullon Co., Ltd. (72) Koji Yamaguchi, Inventor Koji Kyoto, Kyoto 10th Hanazono Todocho, Omron Co., Ltd. (72) Inventor Fumihiko Umeda, 10th Hanazono Todocho, Ukyo-ku, Kyoto, Kyoto O Mulon Co. (72) Inventor Kentaro Hara F-term (reference) 2F055 AA40 BB20 CC02 DD20 EE40 FF43 FF49 GG01 GG12 GG25 in Omron Co., Ltd.

Claims (3)

[Claims] 1. A package in which a sensor chip is provided, and a cover for closing an opening of the package. An electrode provided on the sensor chip, and an electrode provided on the cover and drawn out to the outside. Is a sensor component characterized in that it is electrically connected to each other via at least a conductive material interposed between the electrodes. 2. A package in which a sensor chip is provided, and a cover for closing an opening of the package, wherein an electrode surface of the sensor chip and an electrode surface of the cover are provided via an anisotropic conductive material. A sensor component characterized in that it is completely adhered and joined on the top. 3. An anisotropic conductive material is applied on at least one of the electrodes of the sensor chip or the cover, and the electrodes of the sensor chip and the cover are overlapped with each other, and then the anisotropic conductive material is heated. A method for producing a sensor component, comprising curing the composition.