JP2000097997A - Ac measuring circuit using function of boundary scan test - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an AC measuring circuit capable of performing AC measurement for any device input pin and device output pin of an LSI device with the function of boundary scan tests independently of the circuit between an internal flip-flop and flip-flop. SOLUTION: An LSI device with a function of boundary scan tests is provided with both an interface circuit 1-1 between an internal circuit 1-5 and a boundary scan register 1-4 and a control circuit 1-2 to receive a signal obtained by decoding a personal command for executing AC measurement on device input pins and device output pins by a command decoder and to output a control signal. By this, it is possible to observe from the device input pins to a first-stage flop-flop and from a final-stage flip-flop to the device output pins.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test circuit incorporated in a semiconductor integrated circuit device, and more particularly, to an AC measurement circuit of a circuit incorporating a boundary scan function.

[0002]

2. Description of the Related Art Conventionally, in AC measurement of a device input pin of an LSI device, as shown in FIG. 6, the device output data is sufficiently stable while changing the input timing of the device input data with respect to an external system clock. A comparison is made between the expected value and the expected value, and the capability of the AC (AC) characteristics such as the setup / hold time is determined based on whether or not the data is output as expected.

On the other hand, in the AC measurement of a device output pin, as shown in FIG. 7, device input data is input at a timing when operation is assured, and a point at which the device output data is observed is compared with an expected value of the device output while changing the point. And
The ability of the AC, such as the propagation delay time, is determined based on whether data is output as expected.

[0004] For example, Japanese Patent Application Laid-Open No. 9-274067 discloses a register for a boundary scan provided for each input / output pin of an integrated circuit. The register is operated by a test clock at the time of a test, and the register is set in the register. A test circuit configured to make the value appear inside and outside the integrated circuit, and a switching mechanism for selectively switching and supplying one of a test clock and a system clock of the integrated circuit to this register. There has been proposed a test circuit in which delay diagnosis of an arbitrary portion in an integrated circuit can be performed reliably and easily in a test circuit of the system. In this circuit, AC measurement is performed from the internal IO macro to the flip-flop and from the flip-flop to the internal IO macro.

[0005]

FIG. 8 is a diagram for explaining AC measurement of an LSI device having a boundary scan register. As shown in FIG. 8, from the device input pin IN1, the first stage flip-flop 8-3, the internal flip-flop 8-3-flip-flop 8-
During the period 5, the input of a test pattern for activating the last stage flip-flop 8-5 to the device output pin OUT was required, so that the number of test patterns (the number of clocks) was large and the test time was long. .

[0006] In particular, the critical path 8-13
It took a long time to create a pattern for activating.

In recent years, as the scale of LSI devices has increased, test time and test time have been reduced with the conventional AC measurement method.
Since the test pattern capacity and the test pattern creation time are limited, it is required to improve these problems.

By the way, if the AC measurement of the device input pin can determine whether the data can be latched by the first stage flip-flop, or if the AC measurement of the device output pin can determine only the delay of the data from the last stage flip-flop, Should be good.

The present invention has been made based on the above findings, and has as its object to perform AC measurement of arbitrary device input pins and device output pins of an LSI device having a boundary scan test function by using an internal flip-flop. It is an object of the present invention to provide an AC measuring circuit which can be performed independently of between a flop and a flip-flop.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an LS having a boundary scan test function.
The I-device includes an interface circuit between an internal circuit and a boundary scan register, and a control circuit for controlling execution of a private instruction for performing an AC measurement on a device input pin and a device output pin. Using the register function, the operation from the device input pin to the first stage flip-flop and from the last stage flip-flop to the device output pin is independent of the operation between the internal flip-flop and the flip-flop. It was made observable.

[0011]

Embodiments of the present invention will be described. According to the present invention, a plurality of private instructions for an internal logic test of an LSI device and a control circuit for controlling the instructions, and an interface circuit between the internal logic and the boundary scan register are added to the private instructions in the boundary scan function. By providing this, the AC measurement of the device input pin and the device output pin of the LSI device is performed.

FIG. 1 is a block diagram for explaining an embodiment of the present invention. Referring to FIG. 1, an embodiment of the present invention is different from the circuit configuration of an LSI device having a boundary scan test function in that an internal circuit 1-5
An interface circuit 1-1 is provided between the interface and the boundary scan register 1-4, and a control circuit 1-2 for controlling a private instruction is added.

When the plurality of added private instructions are executed, it is possible to independently observe from the device input pin to the first stage flip-flop and from the last stage flip-flop to the device output pin.

Therefore, independent measurement of the AC of the device input pin or device output pin of the LSI using the boundary scan register function regardless of the operation between the internal flip-flops and the flip-flops. Can be.

In FIG. 1, the test mode select input TMS, test clock signal TCK, test reset TRST, test data input TDI, test data output TDO, TAP controller 1-10, shift register and instruction Instruction register (IR) 1 comprising a decoder
7. Boundary scan registers 1-4 such as a boundary scan register 1-4 and a bypass register 1-6 for bypassing the test data input TDI to the test data output TDO as it is.
The test function and its configuration are described in, for example, JTAG (Joint T
Since this is known as a boundary scan (JTAG) type built-in test circuit proposed as IEEE 1149.1 by the EST Action Group, its detailed configuration is omitted.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a diagram showing the configuration of one embodiment of the present invention. Referring to FIG. 2, in one embodiment of the present invention, an LSI having a boundary scan test function
For the device, the boundary scan test function has multiple private instructions (Mode_A
C_IN, Mode_AC_OUT) to the instruction register 2-1.
There is provided a control circuit 2-3 for inputting an output obtained by decoding the instruction by the instruction decoder 2-2 and outputting control output signals Select_IN and Select_OUT.

The control signal from the control circuit 2-3 causes the boundary scan register (BSR) 2-
First selector circuit 2 for switching data to be taken in
-4, a second selector circuit 2-5 for switching output data from the boundary scan register 2-9 according to a control signal from the control circuit 2-3, and a stage before the last flip-flop 2-12. A third selector circuit 2 for switching between normal data and test data
-6 is added.

The first selector circuit 2-4 inputs device input data and output data of a flip-flop (first-stage flip-flop) 2-11 which receives an output of a combinational circuit 2-14 which forms an internal circuit. Control circuit 2-3
The output is switched by the control output signal Select_IN from the controller and input to the boundary scan register (BSR) 2-9.

The second selector circuit 2-5 receives the normal output of the boundary scan register 2-9, and determines whether the output destination is a normal path according to a control output signal Select_OUT from the control circuit 2-3. 3 is switched to the input of the selector circuit 2-6.

The third selector circuit 2-6 inputs the test data selected by the second selector circuit 2-5 and the data of the normal path, and outputs a control output signal from the control circuit 2-3. Select_OUT to switch and output.

The operation of one embodiment of the present invention will be described. First, the operation of the AC measurement of the device input pin will be described with reference to the flowcharts of FIGS. 2 and 3 and the timing chart of FIG.

In the boundary scan test function, the test mode select input TMS is used to output the T from the Test-Logic-Reset state 3-1 of the TAP controller.
MS logic sequence and test data input TD
By I, private command Mode_ of AC measurement of device input pin
AC_IN is set in the instruction register 2-1.

In the Capture-DR state 3-4, the data output of the first-stage flip-flop 2-11 is transferred to the boundary scan register 2-9 by the private instruction Mode_AC_IN.
To control the first selector circuit 2-4.

Next, at a certain timing synchronized with the external system clock, the desired first-stage flip-flop 2
-11 inputs the data to be activated.

The data latched by the flip-flop 2-11 at the first stage is transferred to the test clock TCK of the Capture-DR state 3-4 via the first selector circuit 2-4.
At the rising edge of, the data is fetched into the boundary scan register 2-9, serially shifted at the rising edge of the test clock TCK in the Shift-DR state 3-5, and passed through the boundary scan register.
The selector 1-11 of FIG.
Observe at the test data output TDO via the -14 path and compare with the expected output value. Thus, for example, the setup time and the hold time of the device input with respect to the system clock can be measured. The data output of the first stage flip-flop 2-11 is tested.
When latching with the clock TCK, sufficient time is ensured so that latching can be performed reliably.

Next, the operation of the AC measurement of the device output pin will be described with reference to the flowcharts of FIGS. 2 and 3 and the timing chart of FIG.

In the boundary scan test function, the test mode select input TMS is output from the Test-Logic-Reset state 3-1 of the TAP controller 1-10.
TMS logic sequence and test data input by TDI, private instruction M of AC measurement of device output pin
Set ode_AC_OUT in the instruction register.

From the private instruction Mode_AC_OUT, in the Capture-DR state 3-4, the boundary scan register 2-9
Is output to the final stage flip-flop 2-12.
The second selector circuit 2-5 is controlled so as to input the data of the second flip-flop 2-1 in the Update-DR state 3-9.
The third selector circuit 2-6 so that the second data input is made.
Control.

At the rising edge of the test clock TCK in the Capture-DR state 3-4, the data for activating the device output pin is taken into the boundary scan register 2-9 from the last flip-flop 2-12, At the falling edge of the test clock TCK in Update-DR state 3-9, the last flip-flop 2
Set as 12 data inputs, external system
Input the clock, observe the device output, and compare it with the expected output value.

The TAP controller shown in FIG.
The state is a known state, and a detailed description thereof will be omitted.

[0031]

As described above, according to the present invention,
Since it is independent from the internal flip-flop to flip-flop, any final flip-flop from any device input pin to the first flip-flop can be used.
Only a test pattern for activating from the flop to the device output pin is required, and the effects of shortening the test time, reducing the number of test patterns, and shortening the test pattern creation time are achieved.

Further, in addition to the above effects, according to the present invention, since a part of the boundary scan test function is used, the device input pin and the device output pin can be connected without adding a complicated and large-scale test circuit. This has the effect that AC measurement can be performed.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of an embodiment of the present invention.

FIG. 3 is a state transition diagram of a TAP controller.

FIG. 4 is a timing chart illustrating AC measurement according to an embodiment of the present invention.

FIG. 5 is a timing chart illustrating AC measurement according to an embodiment of the present invention.

FIG. 6 is a timing chart illustrating AC measurement of a conventional device input.

FIG. 7 is a timing chart illustrating a conventional device output AC measurement.

FIG. 8 is a block diagram illustrating a conventional AC measurement.

[Explanation of symbols]

1-1 Interface circuit 1-2 Control circuit 1-3 Test data register 1-4 Boundary scan register 1-5 Internal circuit 1-6 Bypass register 1-7 Instruction register 1-8 Instruction decoder 1-9 Shift -Register 1-10 TAP controller 1-11, 1-12 Selector (multiplexer) 1-13 Flip-flop (D-type flip-flop) 1-14 Tri-state buffer 2-1 Instruction register 2-2 Instruction decoder 2-3 Control circuit 2-4, 2-5, 2-6 Selector 2-7 Boundary scan register group 2-8, 2-9, 2-10 Boundary scan register 2-11, 2-12, 2-13 Flip-flop 2-14, 2-15, 2-16 Combination circuit 8-1, 8-7, 8-8, 8-9, 8-1 2 Boundary scan register 8-2, 8-4, 8-6, 8-10 Combination circuit 8-11 Flip-flop 8-13 Critical path

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[Procedure amendment]

[Submission date] October 4, 1999 (1999.10.
4)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2G032 AA01 AA04 AD05 AD06 AE07 AE11 AG07 AH04 AH07 AK02 AK11 5B048 AA20 CC20 DD10 EE02 FF01

Claims (9)

[Claims] An LSI device having a boundary scan test function, comprising an interface circuit between an internal circuit and a boundary scan register, and a private device for performing AC measurement of a device input pin and a device output pin. A control circuit for controlling the execution of the instruction, and using a boundary scan register function, from the device input pin to the first stage flip-flop, and from the last stage flip-flop to the device output pin, Flip-flops that make up the internal circuit
A test circuit for an LSI device, wherein the test circuit can be observed independently of an operation between flip-flops. 2. An AC measurement of the device input pin is performed by determining whether device input data from the device input pin can be latched by the first-stage flip-flop. LSI described in 1
Test circuit for device. 3. The test circuit for an LSI device according to claim 1, wherein the AC measurement of the device output pin is performed by determining a delay of data from a flip-flop of a last stage. . 4. An LSI device having a boundary scan test function, comprising: a control circuit for controlling execution of a private instruction for executing an AC measurement on a device input pin and a device output pin; and a control signal output from the control circuit. And a selector group for switching a data path between an internal logic circuit and a boundary scan register. By executing a private instruction for performing AC measurement, the boundary scan register From the device input pin to the first stage flip-flop and from the last stage flip-flop to the device output pin, the operation between the flip-flop and the flip-flop forming the internal circuit can be observed independently. A test circuit for an LSI device, comprising: 5. The device according to claim 1, wherein said selector group includes device input data;
A first selector for inputting output data of a flip-flop of a first stage, switching a data to be taken into the boundary scan register by a control signal from the control circuit, and a control signal from the control circuit; A second selector for switching the output destination of the output data from the scan register to a normal path or a test bus; and a normal data and a test path data provided before the last flip-flop. A third selector that inputs the output of the second selector, and switches and outputs one of the outputs according to a control signal from the control circuit;
5. The test circuit for an LSI device according to claim 4, comprising: 6. The control circuit according to claim 1, wherein said control circuit is adapted to take in the data output of said first stage flip-flop into said boundary scan register when executing a private instruction of AC measurement of said device input pin. 6. The test circuit for an LSI device according to claim 5, wherein the test circuit controls a selector circuit. 7. The control circuit according to claim 1, wherein said control circuit causes a normal output of said boundary scan register to become a data input of said flip-flop of said last stage when executing a private instruction of AC measurement of said device output pin. An output destination of the second selector circuit is controlled, and the third selector circuit is controlled so that an output of the second selector circuit becomes a data input of the flip-flop of the last stage. A test circuit for an LSI device according to claim 5. 8. An LSI which uses a boundary scan register function to perform AC measurement of a device input pin and a device output pin independently of an operation between internal flip-flops and flip-flops. Test circuit for device. 9. An LSI device characterized in that an AC measurement of an arbitrary device input pin and a device output pin of the LSI device is performed independently from the internal flip-flop to the flip-flop. Test circuit.