JP2000077898A - Component mounting equipment - Google Patents

Abstract

(57) Abstract: A component mounting apparatus capable of reliably and accurately mounting an elongated electronic component on a substrate is provided. SOLUTION: The component mounting apparatus includes a transport mechanism for transporting the film electronic component 21 supplied from a tray to a glass substrate to be mounted. The transport mechanism has a transport head 1 that sucks and holds the film electronic component 21. The transport head body 2 of the transport head 1 includes an extension 2b extending along the longitudinal direction of the film electronic component 21 and a projection 2c projecting from one end of the extension 2b toward the film electronic component 21. Have. A suction portion 3 for sucking the film electronic component 21 is provided on a contact surface 2a of the projecting portion 2c of the transfer head main body 2 which is in contact with the film electronic component 21. At two locations along the longitudinal direction of the film electronic component 21, suction pads 4 protruding toward the film electronic component 21 are attached.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel, and more particularly to a component mounting apparatus for mounting an elongated electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, as a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel,
2. Description of the Related Art A component mounting apparatus that mounts an electronic component formed on a film (hereinafter, referred to as “film electronic component”) on a glass substrate is known. As shown in FIG. 5 (a diagram illustrating the present invention), such a component mounting apparatus includes a tray 10 for supplying a plurality of film electronic components 21 and a transport head for transferring the film electronic components 21 supplied from the tray 10. 1 and a transport mechanism 11 for transporting the glass substrate 22 to the glass substrate 22 to be mounted by suction.

FIGS. 8 (a) and 8 (b) are views showing a transport head used in a conventional component mounting apparatus, and FIG. 8 (a) is a perspective view showing the transport head in a state where film electronic components are sucked and held. FIG. 8B is a view of the suction surface (contact surface) of the transport head shown in FIG. FIG. 8 (a)
As shown in (b), the transport head 1 has a transport head body 2, and a contact surface 2 a of the transport head body 2 that contacts the film electronic component 21 has a film electronic component 21.
Is provided. The suction portion 3 includes an oval suction recess 3a formed on the contact surface 2a, and a plurality of vacuum suction holes 6 arranged in the suction recess 3a.
The area near the electrode of the film electronic component 21 (see reference numeral 21a) is attracted.

[0006] Here, the transport head 1 having such a configuration is configured as shown in FIG.
, The film electronic component 21 is sucked and taken out, and the film electronic component 21 is sucked and held and transported to the glass substrate 22 to be mounted. Also, the transport head 1
The film electronic component 21 is temporarily attached to the glass substrate 22 via a connecting member such as an anisotropic conductive film while the film electronic component 21 is held by suction.

[0005]

As described above, in the transport head 1 used in the conventional component mounting apparatus,
The film electronic component 21 is conveyed by sucking and holding the film electronic component 21 by the suction unit 3. However, the film electronic component 21 mounted on the glass substrate 22 depends on the type of flat panel display to be manufactured.
Are often elongated, and in this case, the following problem is likely to occur due to the shape of the film electronic component 21.

That is, since the suction portion 3 of the transport head 1 suctions only the vicinity of the electrode of the film electronic component 21, the film electronic component 21 is easily drooped by its own weight or the like (see FIG. 9A). During the transportation of the component 21, the film electronic component 21 interferes with other units,
There is a problem that the film electronic component 21 easily falls from the transport head 1.

Further, since the suction force of the suction portion 3 of the transport head 1 is set to such an extent that the long film electronic component 21 can be sucked and held, if the film electronic component 21 is warped, the warp occurs. Since the warp cannot be sufficiently corrected (see FIG. 9B), the film electronic component 21 is temporarily attached to the glass substrate 22 when the film electronic component 21 is temporarily attached.
There is a problem that the hanging portion 21a of the film interferes with the glass substrate 22 to easily cause a displacement between the film electronic component 21 and the glass substrate 22, and it is difficult to realize high-precision mounting.

The present invention has been made in view of the above points, and has as its object to provide a component mounting apparatus capable of reliably and accurately mounting an elongated electronic component on a substrate.

[0009]

According to the present invention, in a component mounting apparatus for mounting an elongated electronic component on a substrate, an electronic component supply section for supplying the electronic component, and an electronic component supply section for supplying the electronic component. A transport mechanism that transports the electronic component, the transport mechanism having a transport head that attracts and holds the electronic component, and the transport head that attracts the electronic component at multiple locations along its longitudinal direction. A component mounting apparatus characterized by having a suction section of (1). In addition,
In the present invention, a suction portion having a suction force sufficient to correct a warp of the electronic component is provided on a contact surface of the protrusion corresponding to one side end of the electronic component among the plurality of protrusions. Is preferred.

According to the present invention, the plurality of suction portions provided on the transport head suck the electronic component at a plurality of locations along the longitudinal direction of the elongated electronic component, so that the electronic component sags during the transport of the electronic component. And falling can be effectively prevented. In addition, when a suction portion having a suction force sufficient to correct the warp of the electronic component is provided on the contact surface of the protrusion corresponding to one end of the electronic component, the electronic component may be generated. Since the warp can be sufficiently corrected, it is possible to effectively prevent the electronic component from interfering with the substrate and causing a displacement between the electronic component and the substrate when the elongated electronic component is temporarily attached to the substrate. I can do it.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1A, 1B and 5 are views showing an embodiment of a component mounting apparatus according to the present invention.

First, an outline of the component mounting apparatus will be described with reference to FIG. The component mounting apparatus shown in FIG. 5 mounts an elongated film electronic component 21 on a glass substrate 22, and includes a tray (electronic component supply unit) 10 for supplying a plurality of film electronic components 21, and a tray 10. And a transport mechanism 11 for transporting the supplied film electronic component 21 to a glass substrate 22 to be mounted.

Here, the transport mechanism 11 includes a guide rail 12
And the transfer robot 1 moving along the guide rail 12
3 and a transport head 1 that is connected to the transport robot 13 via a cylinder 14 and a rod 15 and that sucks and holds the film electronic component 21. Further, on the lower surface side of the glass substrate 22, the glass substrate 2
A backup 16 for supporting the lower surface of the electronic component 2, an imaging camera 17 for recognizing the positions of the film electronic component 21 and the glass substrate 22 and aligning the electrode of the film electronic component 21 with the electrode of the glass substrate 22. Is provided.

Next, the details of the transport head 1 used in the component mounting apparatus shown in FIG. 5 will be described with reference to FIGS. Here, FIG. 1A is a perspective view showing the transport head in a state where the film electronic component is sucked and held.
FIG. 2B is a diagram of the suction surface (contact surface) of the transport head shown in FIG. As shown in FIGS. 1A and 1B, the transport head 1 has a transport head main body 2, and the transport head main body 2 has an extending portion 2b extending along the longitudinal direction of the film electronic component 21; And a projecting portion 2c projecting from one end of the extending portion 2b to the film electronic component 21 side. Here, a contact surface 2a of the projecting portion 2c of the transport head main body 2 that contacts the film electronic component 21 is provided with:
A suction unit 3 for sucking the film electronic component 21 is provided. At two locations along the longitudinal direction of the film electronic component 21 in the extending portion 2b of the transport head body 2, suction pads (projections) 4 protruding toward the film electronic component 21 are attached. The suction portion 3 provided on the projecting portion 2c of the transport head main body 2 includes an elliptical suction recess 3a formed on the contact surface 2a and a plurality of vacuum suction holes 6 arranged in the suction recess 3a. Consisting of a film electronic component 21
(See reference numeral 21a). Further, the suction pad 4 is provided with a suction portion 3 having a vacuum suction hole 6, and is provided at a predetermined position avoiding other components 24 such as chips and connectors mounted on the surface of the film electronic component 21 (see reference numeral 21b). Is to be adsorbed.

Next, the operation of this embodiment having such a configuration will be described with reference to FIGS. 1 (a) and 1 (b) and FIG.

First, the transfer robot 13 moves the transfer robot 13 to the extraction position A along the guide rail 12. When the transfer robot 13 arrives at the take-out position A, the cylinder 14 attached to the transfer robot 13
The rod 15 to which the transport head 1 is connected is lowered and raised. At this time, the plurality of suction portions 3 provided on the transport head 1 are evacuated, whereby the film electronic component 21 is sucked by the plurality of suction portions 3 of the transport head 1 and taken out of the tray 10.

After that, the transport robot 13 is moved to the mounting position B along the guide rail 12 by the transport mechanism 11. At this time, the plurality of suction portions 3 provided on the transport head 1 are evacuated, and thereby the film electronic component 21 is transported while being sucked and held by the plurality of suction portions 3 of the transport head 1.

When the transfer robot 13 arrives at the mounting position B, the cylinder 15 attached to the transfer robot 13 lowers and raises the rod 15 to which the transfer head 1 is connected. At this time, the film electronic component 2
Until the transfer head 1 is temporarily attached on the glass substrate 22.
Are sucked and held by the plurality of suction portions 3 of the transport head 1 so that the film electronic component 21 can be anisotropically conductive. Is temporarily attached on the glass substrate 22 via a connection member such as. When the film electronic component 21 is temporarily attached on the glass substrate 22 in this manner, the lower surface of the glass substrate 22 is attached to the backup 1 for temporary attachment.
6, the positions of the film electronic component 21 and the glass substrate 22 are recognized by the imaging camera 17, and the electrodes of the film electronic component 21 and the glass substrate 22 are aligned.

As described above, according to the present embodiment, the plurality of suction portions 3 provided on the transport head 1 suction the film electronic component 21 at a plurality of locations along the longitudinal direction of the film electronic component 21. It is possible to effectively prevent the film electronic component 21 from drooping or dropping during the transport of the film electronic component 21.

In the above-described embodiment, the contact surface 2a provided on the projecting portion 2c of the transfer head main body 2 has the same structure as the conventional contact surface 2a shown in FIGS. 8 (a) and 8 (b). However, if the film electronic component 21 is likely to be warped (such as a curve along a direction orthogonal to the longitudinal direction as shown in FIG. 9B), as shown in FIGS. , FIG.
(A) A suction concave portion 3a and a vacuum suction hole 6 are provided on a contact surface 2a having a larger area than the contact surface 2a of the protrusion 2c shown in FIG.
The contact surface 2a is formed by the plurality of suction portions 3 provided on the contact surface 2a.
It is preferable to have a suction force enough to correct one warp. When the area and the attraction force of the contact surface 2a are increased in this way, the warpage generated in the film electronic component 21 can be sufficiently corrected.
Electronic component 21 due to interference between
And the glass substrate 22 can be prevented from being displaced, and highly accurate mounting can be realized.

In the above-described embodiment, a plurality of suction pads 4 are provided separately from the suction portions 3 provided on the projecting portions 2c of the transfer head main body 2 of the transfer head 1, as shown in FIG. As described above, the extending portion 2b of the transport head body 2
A plurality of protrusions 2c projecting from
The suction portion 3 may be provided on the contact surface 2a. When other components 24 (see FIG. 1A) such as a chip and a connector are not mounted on the surface of the film electronic component 21, as shown in FIG. The surface 2a may be provided with a plurality of suction portions 3 each including a suction recess 3a and a vacuum suction hole 6.

Further, in the above embodiment,
Although the case where the film electronic component 21 taken out of the tray 10 is temporarily attached on the glass substrate 22 has been described as an example, the present invention is not limited to this, and the film electronic component 21 taken out of the tray 10 is fully pressed on the glass substrate 22. If you do,
The present invention can be similarly applied to a case where the film electronic component 21 taken out of the tray 10 is simply conveyed and no temporary attachment is performed. Further, as shown in FIG.
The film electronic component 21 taken out from the (unloading position A) is moved to the imaging camera 17 (recognition position C) to recognize the position of the film electronic component 21, and then the position is corrected and a backup for pasting is performed at the pasting position D. The same applies to the case where a connecting member 23 such as an anisotropic conductive film is attached to the film electronic component 21 on the film 18.

In the above-described embodiment, as shown in FIG. 7, a suction pad for adjusting the mounting position of the suction pad 4 with respect to the extending portion 2b of the transfer head main body 2 is provided on the transfer head 1. It is preferable that an attachment position adjusting mechanism (adjusting means) 5 is provided. By providing the suction pad mounting position adjusting mechanism 5 in this manner, the shape and dimensions of the film electronic component 21 to be conveyed and other components (FIG. 1A) are changed by changing the type of flat panel display to be manufactured. (See reference numeral 24) can be handled without preparing a new transport head. The extension 2b of the transport head body 2
May be adjusted not only in the longitudinal direction of the transport head 1 but also in a direction perpendicular to the longitudinal direction. Further, the suction pads 4 may be provided not only in one line along the longitudinal direction but also in a plurality of lines along the longitudinal direction.

In the above-described embodiment, as shown in FIG. 7, the transfer head 1 has a heater (heating means) for heating the vicinity of the electrode of the film electronic component 21 on the projecting portion 2c of the transfer head main body 2. ) 7 is preferably provided. By providing the heater 7 in this manner, the vicinity of the electrode of the film electronic component 21 can be heated. Therefore, when the film electronic component 21 and the glass substrate 22 are connected via the connecting member as shown in FIG. , FIG.
When the film electronic component 21 and the connection member 23 are connected as described above, the connection strength can be improved.

Further, in the above embodiment,
Although the glass substrate 22 is used as the substrate, the material of the substrate is not limited to glass, and may be, for example, a resin material such as plastic.

[0026]

As described above, according to the present invention, it is possible to effectively prevent the electronic component from sagging or dropping during transport of the elongated electronic component, and to place the elongated electronic component on the substrate. It is possible to effectively prevent the electronic components from interfering with the substrate during temporary attachment and causing a displacement between the electronic components and the substrate, so that the elongated electronic components can be securely and accurately mounted on the substrate. can do.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of a transport head used in a component mounting apparatus according to the present invention.

FIG. 2 is a diagram showing a modification of the transport head shown in FIG.

FIG. 3 is a view showing another modification of the transport head shown in FIG. 1;

FIG. 4 is a view showing still another modified example of the transport head shown in FIG. 1;

FIG. 5 is a view for explaining an example of the operation of the transport head in the component mounting apparatus.

FIG. 6 is a view for explaining another example of the operation of the transport head in the component mounting apparatus.

FIG. 7 is a view showing still another modified example of the transport head shown in FIG. 1;

FIG. 8 is a view showing a transport head used in a conventional component mounting apparatus.

FIG. 9 is a view showing a state of transporting and temporarily attaching the film electronic component by the transport head shown in FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transport head 2 Transport head main body 2a Contact surface 2b Extension part 2c Projection part 3 Suction part 3a Suction concave part 4 Suction pad (projection part) 5 Suction pad mounting position adjustment mechanism (adjustment means) 6 Vacuum suction hole 7 Heater (heating) Means) 10 Tray (electronic component supply unit) 11 Transport mechanism 12 Guide rail 13 Transport robot 14 Cylinder 15 Rod 16 Temporary backup 17 Imaging camera 18 Paste backup 21 Film electronic component 22 Glass substrate 23 Connection member 24 Other components

Claims (5)

[Claims] 1. A component mounting apparatus for mounting an elongated electronic component on a substrate, comprising: an electronic component supply unit for supplying the electronic component; and a transport mechanism for transporting the electronic component supplied from the electronic component supply unit. Wherein the transport mechanism has a transport head that attracts and holds the electronic component, and the transport head has a plurality of attracting portions that attract the electronic component at a plurality of locations along the longitudinal direction. Component mounting equipment. 2. The electronic device according to claim 1, wherein the transport head includes an extending portion extending in a longitudinal direction of the electronic component, and a plurality of extending portions projecting toward the electronic component from a plurality of locations along the longitudinal direction of the electronic component. The component mounting apparatus according to claim 1, wherein each of the at least one protrusion is provided on a contact surface of each of the protrusions that contacts the electronic component. 3. An abutting portion having a suction force sufficient to correct a warp of the electronic component is provided on a contact surface of the one of the plurality of projections corresponding to one end of the electronic component. 3. The component mounting apparatus according to claim 2, wherein: 4. The component mounting apparatus according to claim 2, wherein said transport head further comprises adjusting means for adjusting a mounting position of each of said projecting portions with respect to said extending portion. 5. The component mounting apparatus according to claim 1, wherein said transport head further comprises a heating means for heating said electronic component sucked and held by said suction portions.