JP2000077498A - Substrate holding device Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the inconvenience of an increase in the size of the treatment equipment as a whole, an outbreak and a scatter of particles, and to minimize the required cleaning solution. SOLUTION: A wafer-holder cleaning equipment 5, a second cleaning equipment 6, and a first cleaning equipment 7 are arranged in this order, a wafer transfer robot 8 for transferring a wafer in a range from the wafer-holder cleaning equipment 5 to the first cleaning equipment 7 is arranged, and the wafer-holder cleaning equipment 5 hermetically accommodates a wafer holder of the wafer transferring robot 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning a substrate holding device provided at a predetermined position of a substrate transfer means for transferring a plurality of substrates in a predetermined direction in an upright state.

[0002]

2. Description of the Related Art Conventionally, as a device for cleaning a substrate holding device, a device described in JP-A-7-58070 and a device described in JP-A-7-58074 are known. Proposed.

[0003] The apparatus described in Japanese Patent Application Laid-Open No. 7-58070 is provided with a substrate holding apparatus cleaning tank in parallel with a substrate processing tank for processing a substrate, and a transfer apparatus for controlling the position of the substrate holding apparatus. Provided. Here, the transfer device is configured to control the horizontal position of the substrate holding device and also control the vertical position. The substrate holding device cleaning tank is provided with a liquid ejecting unit and a gas ejecting unit.

In the case of employing this configuration, for example, a plurality of substrates (such as semiconductor wafers) are supplied to a substrate processing tank by operating a transfer device, and then the transfer device is operated again to set a substrate holding device. The substrate holding device can be moved to the substrate holding device cleaning tank to clean the substrate holding device. Therefore, the solution in the substrate processing tank inevitably adheres to the substrate holding device. By moving the substrate holding device into the substrate holding device cleaning tank and performing the cleaning process, the attached solution is removed. Degradation of substrate processing performance due to (for example,
This can prevent the substrate processing performance from being reduced due to the reaction of this solution with another solution).

[0005] The apparatus described in Japanese Patent Application Laid-Open No. 7-58074 is provided with a substrate holding device cleaning tank in parallel with a substrate processing tank for processing a substrate, and a transfer device for controlling the position of the substrate holding device. Provided. Here, the transfer device is configured to control the horizontal position of the substrate holding device. In addition, the substrate holding device cleaning tank is provided with a liquid ejecting unit and a gas ejecting unit, and is configured to be able to move up and down to accommodate each holding member constituting the substrate holding unit.

In the case of adopting this configuration, for example, a plurality of substrates (semiconductor wafers and the like) are supplied to a substrate processing tank by operating a transfer device, and then the transfer device is operated again to operate the substrate holding device. The substrate holding device can be moved to the cleaning position, and in this state, the substrate holding device cleaning tank can be moved up and down to clean the substrate holding device. Of course, since the substrate holding device cleaning tank can only accommodate each holding member, the operation of the transfer device and the elevation of the substrate holding device cleaning tank are repeated. Therefore, the solution in the substrate processing tank inevitably adheres to the substrate gripping device, but is moved by moving the substrate gripping device and moving the substrate gripping device cleaning tank up and down to perform the cleaning processing of the substrate gripping device, thereby causing the adhesion. By removing the solution, it is possible to prevent a decrease in substrate processing performance due to the solution (for example, a decrease in substrate processing performance due to reaction of this solution with another solution).

[0007]

In any of the above-mentioned apparatuses, a substrate holding apparatus cleaning tank must be provided in parallel with the substrate processing tank. There is a disadvantage of doing so.

Further, in any of the apparatuses, since the cleaning tank of the substrate holding device cannot be sealed, generation of particles due to scattering of a liquid and generation of particles due to release of a gas occur, and the surface of the substrate is prevented. However, there is an inconvenience that the particles adhere to the surface. Furthermore, since the volume of the cleaning tank of the substrate holding device is large, there is also an inconvenience that the required amount of the cleaning liquid increases.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can prevent the disadvantage that the size of a substrate processing apparatus is increased as a whole, prevent the generation of particles, and furthermore, prevent the cleaning liquid from being used. It is an object of the present invention to provide a cleaning device for a substrate holding device that can reduce the required amount.

[0010]

According to a first aspect of the present invention, there is provided a cleaning apparatus for a substrate holding device, comprising: a substrate holding device provided at a predetermined position of a substrate transfer means so as to transfer a plurality of substrates in a predetermined direction in an upright state. The cleaning device includes a holding device cleaning tank that can be housed in a closed state, and a cleaning liquid supply unit that supplies a cleaning liquid to the holding device cleaning tank.

According to a second aspect of the present invention, there is provided a cleaning apparatus for a substrate holding apparatus, wherein the cleaning tank for the holding apparatus is provided at a predetermined position in a reciprocating path of the substrate holding apparatus at the same height as the substrate holding apparatus. A device that accommodates the gripping device in a closed state is employed.

According to a third aspect of the present invention, there is provided a cleaning apparatus for a substrate holding device, wherein the substrate holding device includes at least two rods, an eccentric rotating mechanism for supporting each rod in a cantilever manner and rotating eccentrically,
A large-diameter flange provided at the base of each rod-shaped body is employed, and as the gripping device cleaning tank, a cleaning tank main body containing a rod-shaped body, and a large-diameter flange provided at an opening of the cleaning tank main body. And a sealing portion that abuts the inside of the cleaning tank main body in a sealed state.

According to a fourth aspect of the present invention, there is provided a cleaning apparatus for cleaning a substrate holding apparatus, wherein the cleaning tank for the holding apparatus is capable of directly facing a rod-shaped body in an eccentrically rotated state so as to make an interval narrower than that in a substrate holding state. Things.

According to a fifth aspect of the present invention, there is provided a cleaning apparatus for a substrate holding apparatus, wherein a plurality of cleaning liquid supply pipes arranged at a predetermined angle interval with respect to a rod to be housed therein as the holding apparatus cleaning tank. And one having a discharge pipe at the bottom.

[0015]

According to the first aspect of the present invention, the substrate holding apparatus cleaning apparatus operates the substrate transfer means to supply the substrate to the substrate processing tank, and then operates the substrate transfer means again to move the substrate holding apparatus to a predetermined position. . And, in this state, the substrate holding device is housed in a sealed state by the holding device cleaning tank,
The substrate holding device can be cleaned by supplying the cleaning liquid to the holding device cleaning tank by the cleaning liquid supply unit.

Therefore, it is possible to reliably prevent the cleaning liquid from scattering and the drying gas from being released, and to prevent inconvenience that particles adhere to the substrate.

According to the second aspect of the present invention, there is provided a cleaning apparatus for a substrate holding apparatus, wherein the holding apparatus cleaning tank is provided at a predetermined position in a reciprocating path of the substrate holding apparatus at the same height as the substrate holding apparatus, and moves horizontally. Therefore, in addition to the function of claim 1, it is not necessary to provide a holding device cleaning tank in parallel with the substrate processing tank, so that the size of the entire substrate processing device can be reduced. can do.

According to a third aspect of the present invention, there is provided the substrate holding apparatus cleaning apparatus, wherein the substrate holding apparatus includes at least two rods, an eccentric rotation mechanism for supporting each rod in a cantilever manner and eccentrically rotating, and each rod. A large-diameter flange provided at the base of the cleaning tank main body for accommodating the rod-like body as the gripping-device cleaning tank, provided at the opening of the cleaning tank main body, and abutting on the large-diameter flange. Because it employs a seal that seals the inside of the cleaning tank body,
In addition to the effect of the second aspect, the volume of the holding device cleaning tank can be reduced to reduce the required amount of the cleaning liquid.

According to a fourth aspect of the present invention, there is provided a cleaning apparatus for cleaning a substrate gripping apparatus, wherein the cleaning tank for the gripping apparatus is capable of directly facing a rod-like body which is eccentrically rotated so as to make an interval narrower than an interval in a substrate gripping state. Since it is adopted, in addition to the effect of the third aspect, the holding device cleaning tank can be downsized as a whole.

According to a fifth aspect of the present invention, there is provided a cleaning apparatus for cleaning a substrate holding apparatus, wherein a plurality of cleaning liquid supply pipes arranged at predetermined angular intervals with respect to a rod to be housed therein are provided as the cleaning tank for the holding apparatus. And a discharge pipe at the bottom is adopted.
Alternatively, in addition to the effect of the fourth aspect, the entire surface of the rod can be effectively cleaned with a small amount of cleaning liquid.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a cleaning apparatus for a substrate holding device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing the structure of a substrate processing apparatus to which the cleaning apparatus of the present invention is applied, and FIG. 2 is a perspective view showing a main part. This substrate processing apparatus performs a cleaning process on a semiconductor wafer as a substrate.

This substrate processing apparatus 1 is provided with a pair of substrate loading / unloading sections 2 at predetermined positions on the outer surface of one side wall, and a pair of substrate transfer robots 3 and a substrate lot The integration / separation device 4, the substrate gripping device cleaning device 5, the second cleaning device 6, and the first cleaning device 7 are arranged in this order, and in the range from the substrate lot integration / separation device 4 to the first cleaning device 7. A substrate transfer robot 8 for transferring a substrate is provided.

The substrate loading / collecting section 2 has a support table 22 for supporting a transfer clean container 21 accommodating a plurality of semiconductor wafers, and a substrate processing apparatus while maintaining a high degree of cleanness. 1 and a door member (not shown) for communicating the transfer clean container 21.

The substrate transfer robot 3 takes out the semiconductor wafer 23 from the clean transfer container 21 and supplies it to the substrate lot integration / separation device 4, and takes out the semiconductor wafer 23 from the substrate lot integration / separation device 4. It performs processing for supplying to the transport clean container 21 and has a sufficient arm configuration for performing these processings.

The substrate lot integration / separation device 4 converts the attitude of the semiconductor wafer 23 supplied from each substrate transfer robot 3 from a horizontal state to a vertical state, and causes the semiconductor wafer 23 to be supported on a semiconductor wafer support 41. Robot 42. Therefore, the semiconductor wafers 23 for two transfer clean containers are integrated to form the semiconductor wafer support 4.
1 and a semiconductor wafer support 4
The semiconductor wafer 23 supported on 1 can be separated corresponding to each transfer clean container.

The first cleaning apparatus 7 performs a cleaning process by, for example, guiding a cleaning liquid supplied through a cleaning liquid supply pipe (not shown) to a semiconductor wafer accommodating section through a rectifying plate (not shown). It has a lifter 71 for transferring the semiconductor wafer 23 to and from the semiconductor wafer accommodating section. In addition, 72 is a lid member.

The second cleaning device 6 has the same configuration as the first cleaning device 7. However, since it is necessary to finally perform the drying process, the fluid for the drying process is also supplied.

The substrate transfer robot 8 has a linear motion member 82 that can reciprocate along a guide rail 81 in a range from the substrate lot integration / separation device 4 to the first cleaning device 7. A support shaft 83 is provided above the member 82.
A pair of gripping / release drive mechanisms (not shown) are provided on the main body 84 supported through the main body. Further, as shown in FIG. 3 and FIG.
An eccentric arm member 86 extending in a direction perpendicular to the direction 5 is connected, and a rod 87 is connected to the tip of the eccentric arm member 86. The rod-shaped body 87 is formed such that a predetermined range near the base has a large diameter and the remaining part has a small diameter, and has a large-diameter flange member 88 at a boundary between the large-diameter part and the small-diameter part. . This large-diameter flange member 88
Can be omitted using the large diameter portion. A gripping groove 89 for gripping the plurality of semiconductor wafers 23 in an upright state over substantially the entire longitudinal range of the small diameter portion.
Is provided. In addition, the holding groove 89 may be formed only in a range where the rods 87 face each other in a predetermined eccentric rotation state, or may be formed in the entire range of the rods 87.

The substrate holding device cleaning device 5 includes a linear motion mechanism 51 (for example, a ball screw mechanism, a belt mechanism, a rack and pinion mechanism, not shown) which can reciprocate in a direction orthogonal to the moving direction of the linear member 82. An air cylinder mechanism, etc.), a pair of cleaning tanks 52 extending horizontally from the linear motion mechanism section 51 toward the main body section 84, and provided inside the cleaning tank 52 as shown in FIGS. And a plurality of cleaning liquid supply pipes 53. Here, the cleaning tank 52
The main component is a cylindrical body whose base is closed, and a sealing member 54 is provided on the periphery of the opening of the cylindrical body.
(For example, a ring-shaped member having an O-ring). Further, the plurality of cleaning liquid supply pipes 53 are arranged at predetermined angles with respect to the rod-shaped body 87 housed in the cylindrical body, and supply the cleaning liquid to each cleaning liquid supply pipe 53 through the base of the cylindrical body. A supply pipe 55 is provided, and a discharge pipe 56 for discharging the cleaning liquid from the cylindrical body.
Is provided. The nozzle angle of the supply pipe may be angled to improve the flow to the discharge pipe. The plurality of cleaning liquid supply pipes 53, the supply pipe 55, and the discharge pipe 56 are used not only for the cleaning liquid but also for a drying gas. Further, the linear motion mechanism 51 may reciprocate only the cleaning tank 52. further,
As the seal member 54, as shown in FIG. 14, a bellows made of a synthetic resin can be employed.

The operation of the substrate processing apparatus having the above configuration is as follows.

When the transfer clean container 21 is supported on the support table 22 of the pair of substrate loading / recovering sections 2, the door transfer member 3 is opened and the substrate transfer robot 3 is operated, whereby the transfer clean container 21 is operated. The semiconductor wafer 23 is taken out from the substrate 21 and supplied to the substrate lot integration / separation device 4. Then, in the substrate lot integration / separation device 4, the posture of each semiconductor wafer 23 supplied from each substrate transfer robot 3 is changed from a horizontal state to a vertical state, and the semiconductor wafer 23 is supported on the semiconductor wafer support 41. Accordingly, the semiconductor wafers 23 for two transfer clean containers can be integrated and supported on the semiconductor wafer support 41.

Next, the linear member 82 is integrated with the substrate lot.
The substrate transfer robot 8 is operated so as to face the separation device 4, and in this state, both rods 87 are eccentrically rotated to set the interval between them to be larger than the diameter of the semiconductor wafer 23, as shown in FIG. , Semiconductor wafer support table 41
After raising the semiconductor wafer support 41, as shown in FIG. 8, both rods 87 are eccentrically rotated upward to engage the semiconductor wafer 23 with the holding grooves 89, and finally, as shown in FIG. As shown in FIG. 9, the plurality of semiconductor wafers 23 can be transferred by lowering the semiconductor wafer support 41.

Thereafter, the substrate transfer robot 8 is operated such that the linear member 82 faces the first processing apparatus 7, and a process reverse to the above-described process of transferring the semiconductor wafer 23 is performed to remove the plurality of semiconductor wafers 23. It can be supplied to the first processing device 7 to perform a first-stage cleaning process.

After the semiconductor wafer 23 is supplied to the first processing apparatus 7, the substrate transport robot 8 is operated so that the direct-acting member 82 faces the substrate-gripping-apparatus cleaning apparatus 5. 87 is washed. This cleaning process is performed as follows.

First, as shown in FIGS. 10 and 11,
The rods 87 are eccentrically rotated upward to minimize the distance between them. At this time, each rod 87 faces the corresponding washing tank 52. However, each rod 87 and the cleaning tank 52
Are separated from each other as shown in FIG.

Next, by operating the linear motion mechanism 51, each rod 87 is accommodated in the corresponding washing tank 52,
By pressing the seal member 54 against the large-diameter flange member 88, the internal space of the cleaning tank 52 is sealed. In this state, the cleaning liquid (for example, pure water or the like) is supplied through the supply pipe 55 and the plurality of cleaning liquid supply pipes 53, and the cleaning liquid is discharged through the discharge pipe 56. The surface can be cleaned. Thereafter, the entire surface of the small-diameter portion of the rod 87 can be dried by employing a drying gas instead of the cleaning liquid.

After performing the series of cleaning processes, the linear motion mechanism 51 is operated to move the cleaning tank 52 backward, and the operation of the substrate transfer robot 8 is permitted.

After the rods 87 have been cleaned as described above, the substrate transport robot 8 is operated so that the linear motion member 82 faces the first cleaning device 7 and the first cleaning device 7
Then, the substrate transfer robot 8 is operated so that the linear member 82 faces the second cleaning device 6, and the plurality of semiconductor wafers 23 are transferred to the second cleaning device 6. The cleaning solution is supplied to the cleaning device 6 to perform a second-stage cleaning process and a drying process.

After the semiconductor wafer 23 is supplied to the second processing apparatus 6, the substrate transfer robot 8 is operated so that the direct-acting member 82 faces the substrate gripping apparatus cleaning apparatus 5. The body 87 is washed. Then, after each rod-shaped body 87 is cleaned, the linear motion member 82
Substrate transfer robot 8 so that
To perform a receiving process of a plurality of semiconductor wafers 23 cleaned and dried by the second cleaning device 6,
Next, the substrate transport robot 8 is operated so that the linear member 82 faces the substrate lot integration / separation device 4 to perform cleaning,
The plurality of semiconductor wafers 23 that have been dried are transferred to the semiconductor wafer support 41.

Then, the semiconductor wafers 23 on the semiconductor wafer support table 41 are separated corresponding to the respective transport clean containers, and returned to the corresponding transport clean containers 21 by the respective substrate transfer robots 3.

As is clear from the above description, since the cleaning tank 52 can be sealed while the rods 87 are being cleaned and dried, generation and scattering of particles can be prevented. Since the cleaning liquid is supplied from almost the entire circumference of each rod-shaped body 87 to efficiently perform the cleaning, the required amount of the cleaning liquid can be reduced. Further, since the substrate holding device cleaning device is not provided in parallel with the cleaning device, the size of the substrate processing device can be reduced as a whole. Further, since there is no need to provide a cleaning tank in parallel with the cleaning device, the corresponding portion can be effectively used as a maintenance space and a utility space.

FIG. 15 is a perspective view showing a main part of another configuration example of the substrate processing apparatus to which the cleaning apparatus for the substrate holding device of the present invention is applied.

This substrate processing apparatus is different from the substrate processing apparatus of FIG. 2 in that, in a state where the linear member 82 faces the second cleaning apparatus 6, the rod holding member 87 faces the cleaning tank 52. The only difference is that the cleaning device 5 is provided.

Therefore, when this configuration is employed, the size of the entire substrate processing apparatus can be further reduced, and the same operation as described above can be achieved.

Note that the substrate holding device is not limited to a rod-shaped member that is eccentrically rotated, and various types of conventionally known structures can be adopted. Further, instead of the cleaning tank that can store only one rod-shaped body, a cleaning tank that can store both rod-shaped bodies can be adopted.

[0047]

According to the first aspect of the present invention, it is possible to surely prevent the cleaning liquid from scattering and the gas for drying from being scattered and to prevent the occurrence of inconvenience that particles adhere to the substrate. .

According to the second aspect of the invention, in addition to the effect of the first aspect, it is not necessary to provide the holding device cleaning tank in parallel with the substrate processing tank. To play.

The third aspect of the invention has the unique effect that the required amount of the cleaning liquid can be reduced by reducing the volume of the cleaning tank of the gripping device in addition to the effect of the second aspect.

The invention of claim 4 has a unique effect that the holding device cleaning tank can be reduced in size as a whole in addition to the effect of claim 3.

According to the fifth aspect of the invention, in addition to the effect of the third or fourth aspect, a unique effect that the entire surface of the rod-shaped body can be effectively cleaned with a small amount of cleaning liquid is exhibited.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a substrate processing apparatus to which a substrate holding device cleaning apparatus of the present invention is applied.

FIG. 2 is a perspective view showing a main part of the above.

FIG. 3 is a plan view showing a substrate holding device of the substrate transfer robot.

FIG. 4 is a front view showing a substrate holding device of the substrate transfer robot.

FIG. 5 is a central vertical sectional side view showing the cleaning device for the substrate holding device.

FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;

FIG. 7 is a diagram illustrating a part of a process of transferring the semiconductor wafer from the semiconductor wafer support to the substrate holding device.

FIG. 8 is a diagram illustrating another part of the process of transferring the semiconductor wafer from the semiconductor wafer support to the substrate holding device.

FIG. 9 is a diagram illustrating the rest of the process of transferring the semiconductor wafer from the semiconductor wafer support to the substrate holding device.

FIG. 10 is a plan view showing a state in which the substrate holding device of the substrate transport robot is being washed.

FIG. 11 is a front view showing a state in which the substrate holding device of the substrate transfer robot is being washed.

FIG. 12 is a side view showing a state before cleaning of the substrate gripping device cleaning device and the substrate gripping device.

FIG. 13 is a side view showing a state where the substrate holding device cleaning device and the substrate holding device are being cleaned;

FIG. 14 is a vertical sectional side view of a main part showing another configuration of the cleaning device for the substrate holding device.

FIG. 15 is a perspective view showing a main part of another configuration of the substrate processing apparatus to which the substrate holding device cleaning apparatus of the present invention is applied.

[Explanation of symbols]

 8 Substrate transfer robot 23 Semiconductor wafer 52 Cleaning tank 53 Cleaning liquid supply pipe 54 Seal member 55 Supply pipe 56 Discharge pipe 86 Arm member 87 Rod body 88 Large diameter flange member

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 648 H01L 21/304 648C (72) Inventor Katsuhiro Tetsuya 3-12 Chikko Shinmachi, Sakai-shi, Osaka No. Daikin Industry Co., Ltd. Sakai Plant Rinkai Plant (72) Eiji Taguchi Inventor 3-12 Chikushinmachi, Sakai City, Osaka Prefecture Daikin Industry Co., Ltd. Sakai Plant Rinkai Plant F-term (reference) 3B116 AA47 AB42 BB02 BB03 BB23 BB34 BB62 CC03 CD31 CD33 3B201 AA47 AB42 BB02 BB03 BB23 BB34 BB62 BB92 CB12 CC12 CD36 3F061 AA03 BA03 BB03 BE12 BF00 DB04 DB06 5F031 BB05 CC01 CC13 CC43 EE01 EE03 EE04 KK02 LL07

Claims (5)

[Claims] 1. A substrate holding device (87) provided at a predetermined position of a substrate transfer means (8) can be hermetically accommodated to transfer a plurality of substrates (23) in a predetermined direction in an upright state. Gripping device cleaning tank (52) and cleaning liquid supply means (53) (55) for supplying a cleaning liquid to the gripping device cleaning tank (52)
And a cleaning device for a substrate holding device. 2. The holding device cleaning tank (52) is provided at a predetermined position in a reciprocating path of the substrate holding device (87) and at the same height as the substrate holding device (87), and is horizontally moved to move the substrate. The apparatus for cleaning a substrate gripping device according to claim 1, wherein the gripping device (87) is housed in a closed state. 3. The substrate holding device (87) includes at least two rods (87), an eccentric rotation mechanism (86) that cantileverly supports each rod (87) and eccentrically rotates each rod, and each rod. A large-diameter flange (88) provided at a base of the body (87), wherein the gripping device cleaning tank (52) includes a cleaning tank main body (52) for accommodating a rod-shaped body (87), and a cleaning tank. The large-diameter flange (8) is provided in the opening of the main body (52).
The cleaning apparatus according to claim 2, further comprising a seal portion (54) that comes into contact with the cleaning tank body (52) to seal the inside of the cleaning tank body (52). 4. The holding device cleaning tank (52) can be directly opposed to the rod-like body (87) in a state of being eccentrically rotated so as to make the space narrower than the space in the substrate holding state. The substrate gripping device cleaning device according to the above. 5. The holding device cleaning tank (52) has therein a plurality of cleaning liquid supply pipes (53) arranged at a predetermined angular interval with respect to a rod body (87) to be housed. The apparatus for cleaning a substrate holding apparatus according to claim 3 or 4, further comprising a discharge pipe (56) at the bottom thereof.