JP2000070887A - Supply of pure water containing carbon dioxide gas dissolved therein, unit for supplying pure water containing carbon dioxide gas dissolved therein, and substrate processing apparatus equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a unit for supplying pure water having carbon dioxide gas dissolved therein, which supplies pure water deprived of a metal ion originating from measurement by a relative resistance meter and containing carbon dioxide gas dissolved therein. SOLUTION: Pure water supplied from a pure water supply source is made to pass through a permeation section 40 of a carbon dioxide gas dissolving section 4 and is hanged into pure water containing carbon dioxide gas dissolved therein. The pure water containing carbon dioxide gas dissolved therein is supplied to a substrate processing unit 2 via a supply pipe 3. A part of the pure water containing carbon dioxide gas dissolved therein supplied to the substrate processing unit 2 is taken out by a branching pipe 5. Relative resistance value of the taken out pure water is measured by an electrode 6 as a measuring section of a relative resistance meter 8. A control section 7 controls the relative resistance value of the pure water containing carbon dioxide gas dissolved therein in response to the measured relative resistance value. Therefore, the pure water containing carbon dioxide gas dissolved therein does not include a metal ion and a specified relative resistance value is controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying carbon dioxide-dissolved pure water and a unit for supplying carbon dioxide-dissolved pure water for supplying a carbon dioxide-dissolved pure water generated by dissolving carbon dioxide in pure water to a substrate processing apparatus. In addition, the present invention relates to a substrate processing apparatus having the same, and more particularly to a technique for supplying carbon dioxide-dissolved pure water excluding metal ions and the like caused by measurement of a specific resistance value.

[0002]

2. Description of the Related Art In the process of manufacturing semiconductors and the like, in order to prevent various contaminations such as metal contamination of a substrate, pure water having extremely high specific resistance from which impurities such as metal ions, microorganisms and fine particles have been removed, or pure water or the like are used. Ultrapure water with higher purity than water is used. Pure water or ultrapure water (hereinafter, simply referred to as “pure water”) having such an extremely high specific resistance value is easily charged, and is charged during substrate processing or liquid sending, causing electrostatic breakdown on the substrate. It is known that there may be adverse effects.

In recent years, attempts have been made to lower the specific resistance of pure water by dissolving carbon dioxide gas in the pure water in order to prevent the pure water from being charged during substrate processing or liquid transport. The carbon dioxide-dissolved pure water in which carbon dioxide is dissolved in the pure water is generated by a carbon dioxide-dissolved pure water supply unit.
The carbon dioxide dissolved pure water supply unit supplies the generated carbon dioxide dissolved pure water to the substrate processing apparatus. At this time, the carbon dioxide dissolved pure water supply unit controls the specific resistance value of the carbon dioxide dissolved pure water to be supplied to the substrate processing apparatus at a predetermined value before supplying the carbon dioxide dissolved pure water to the substrate processing apparatus. The specific resistance is measured by a specific resistance meter.

[0004]

However, the prior art having such a structure has the following problems. In recent years, with the miniaturization of circuit elements and the reduction in power consumption, the driving of each element at a lower voltage has been progressing, and substrate processing in a cleaner state free of metal contamination and the like has been required. In the pure water system used for the cleaning process,
The device is configured so that metal parts are not used, that is, metal parts are not used in a portion where pure water touches. However, since the conventional carbon dioxide-dissolved pure water supply unit directly measures the specific resistance of the carbon dioxide-dissolved pure water to be supplied to the substrate processing apparatus by using a resistivity meter, the measurement is performed from an electrode which is a measuring unit of the resistivity meter. There is a problem that the metal ions are eluted and the carbon dioxide dissolved pure water is contaminated with the metal ions.

The present invention has been made in view of such circumstances, and has been made in consideration of the above circumstances, and provides a carbon dioxide-dissolved pure water for supplying a carbon dioxide-dissolved pure water, which excludes metal ions caused by measurement of a resistivity meter, to a substrate processing apparatus. An object of the present invention is to provide a water supply method, a carbon dioxide dissolved pure water supply unit, and a substrate processing apparatus including the same.

[0006]

The present invention has the following configuration in order to achieve the above object. Claim 1
The invention described in (1) generates carbon dioxide gas-dissolved pure water in which carbon dioxide gas is dissolved in pure water, and supplies the carbon dioxide gas-dissolved pure water whose specific resistance is measured by a resistivity meter to a substrate processing apparatus. A method for supplying carbon dioxide dissolved pure water, wherein carbon dioxide gas is dissolved in the pure water to generate carbon dioxide dissolved pure water, and a step of supplying the carbon dioxide dissolved pure water to the substrate processing apparatus. A step of extracting a part of the carbon dioxide dissolved pure water supplied to the substrate processing apparatus, and a step of measuring a specific resistance value of the extracted carbon dioxide dissolved pure water by the resistivity meter. It is assumed that.

According to a second aspect of the present invention, carbon dioxide dissolved pure water in which carbon dioxide is dissolved in pure water is generated,
A carbon dioxide gas-dissolved pure water supply unit for supplying the carbon dioxide gas-dissolved pure water whose specific resistance value is measured by a resistivity meter to a substrate processing apparatus, wherein the carbon dioxide gas is dissolved in the pure water to produce a carbon dioxide-dissolved pure water. CO2 dissolved pure water generating means for generating water, a supply pipe for supplying the CO2 dissolved pure water generated by the CO2 dissolved pure water generating means to the substrate processing apparatus, and the substrate processing apparatus by the supply pipe. A branch pipe for branching out a part of the carbon dioxide dissolved pure water supplied to the branch pipe, and a resistivity meter attached to the branch pipe and measuring a specific resistance value of the carbon dioxide dissolved pure water. It is characterized by the following.

According to a third aspect of the present invention, in the carbon dioxide dissolved pure water supply unit according to the second aspect, the unit further comprises a carbon dioxide dissolved pure water dissolving unit in the carbon dioxide dissolved pure water generating means. It has adjusting means for adjusting the amount of dissolution.

According to a fourth aspect of the present invention, in the carbon dioxide gas-dissolved pure water supply unit according to the third aspect, the unit further comprises a specific resistance value obtained by measuring with the specific resistance meter. And a control means for controlling the adjusting means.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus comprising the carbon dioxide dissolved pure water supply unit according to any one of the second to third aspects.

[0011]

The operation of the present invention is as follows. According to the first aspect of the present invention, carbon dioxide dissolved pure water generated by dissolving carbon dioxide in pure water is supplied to the substrate processing apparatus. At this time, a part of carbon dioxide dissolved pure water supplied to the substrate processing apparatus is taken out. A specific resistance value of a part of the removed carbon dioxide dissolved pure water is measured by a specific resistance meter. Therefore, the carbon dioxide-dissolved pure water in the portion not taken out is supplied to the substrate processing apparatus without directly touching the resistivity meter.

According to the second aspect of the present invention, the carbon dioxide dissolved pure water generating means dissolves carbon dioxide in the pure water to generate carbon dioxide dissolved pure water. The supply pipe supplies the carbon dioxide dissolved pure water generated by the carbon dioxide dissolved pure water generating means to the substrate processing apparatus. The branch pipe branches out a part of the carbon dioxide dissolved pure water that is being supplied to the substrate processing apparatus. The resistivity meter measures the resistivity value of a part of the carbon dioxide-dissolved pure water taken out from the branch pipe. Therefore, the carbon dioxide-dissolved pure water in the portion not taken out by the branch pipe is supplied to the substrate processing apparatus without directly touching the resistivity meter.

According to the third aspect of the invention, the adjusting means adjusts the amount of carbon dioxide dissolved in the pure water in the carbon dioxide dissolved pure water generating means.

According to the fourth aspect of the present invention, the control means controls the adjusting means so as to appropriately adjust the dissolved amount of the carbon dioxide dissolved in the pure water according to the specific resistance of the carbon dioxide-dissolved pure water. Control.

According to the fifth aspect of the present invention, the substrate processing apparatus is provided with the substrate processing apparatus when pure water is sent from outside the apparatus. Carbon dioxide-dissolved pure water is generated by the carbon dioxide-dissolved pure water supply unit according to the present invention, and the substrate is treated with the carbon dioxide-dissolved pure water.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram illustrating the substrate processing apparatus according to the embodiment.

A substrate processing apparatus according to an embodiment provides a carbon dioxide-dissolved pure water in which carbon dioxide is dissolved in pure water supplied from a pure water supply source provided in a factory provided with the apparatus. The system includes a water supply unit 1 and a substrate processing unit 2 that performs processing such as cleaning and rinsing on a substrate such as a semiconductor wafer or a glass substrate using the carbon dioxide dissolved pure water.

The carbon dioxide dissolved pure water supply unit 1 circulates pure water sent from a pure water supply source, and dissolves carbon dioxide in the pure water.
A supply pipe 3 for supplying carbon dioxide-dissolved pure water, which is pure water in which carbon dioxide is dissolved. One end of the supply pipe 3 is connected to a liquid supply pipe (not shown) for supplying pure water from the pure water supply source to the carbon dioxide dissolved pure water supply unit 1, and the other end is connected to the substrate processing unit 2. (Not shown).

The supply pipe 3 is provided with a carbon dioxide gas dissolving section 4 for producing carbon dioxide dissolved pure water in which carbon dioxide is dissolved in pure water fed from a pure water supply source. When supplying the carbon dioxide-dissolved pure water generated in the gas dissolving section 4 to the substrate processing unit 2, a branch section 9 is provided for extracting a part of the carbon dioxide-dissolved pure water.

The carbon dioxide gas dissolving section 4 is formed substantially integrally with the supply pipe 3. Pure water flowing through the supply pipe 3 is passed through the permeation section 40 provided in the carbon dioxide gas dissolving section 4, so that the carbon dioxide is dissolved. It produces carbon dioxide dissolved pure water in which gas is dissolved. Further, the carbon dioxide dissolving section 4 includes a gas supply section 41 for supplying carbon dioxide gas to the permeation section 40 and a gas exhaust section for exhausting the supplied carbon dioxide gas and water vapor generated in the permeation section 40. 42 are formed. The gas supply unit 41 is connected to a carbon dioxide gas supply amount adjusting unit 10 for supplying a predetermined flow rate of carbon dioxide gas. The carbon dioxide gas dissolving unit 4 corresponds to the carbon dioxide dissolved pure water generating means of the present invention, and the carbon dioxide gas supply amount adjusting unit 10 corresponds to the adjusting means of the present invention.

The carbon dioxide gas supplied from the gas supply unit 41 to the permeation unit 40 is sent from a carbon dioxide gas supply source installed in a factory where the substrate processing apparatus is installed. Further, the carbon dioxide gas sent from the carbon dioxide gas supply source is sent to the carbon dioxide gas supply amount adjusting unit 10 at a substantially constant supply amount via the regulator. Further, the supply amount of carbon dioxide gas supplied to the gas supply unit 41 is controlled by the carbon dioxide supply amount adjustment unit 1.
Adjusted by 0.

The carbon dioxide supply amount adjusting unit 10 includes a plurality of (three in the figure) on-off valves 11a to 11c and a number (three in the figure) of resistance filters 12a to 1 corresponding to the number of on-off valves.
2c. The on-off valves 11a to 11c are controlled by the control unit 7 to open and close. The resistance filters 12a to 12c have different pressure loss values, and the amount of carbon dioxide gas passing through each of the resistance filters 12a to 12c depends on the set value of the regulator and the resistance filter 1
It is determined by each pressure loss value of 2a to 12c. The amount of carbon dioxide gas flowing out of the carbon dioxide supply amount adjusting unit 10 as a whole is determined by the combination of the open / close valves 11a to 11c that are opened.

Specifically, the flow rate of carbon dioxide gas passing through the resistance filter 12a is set to 10 Nl / min (or SCC
M), the flow rate of the carbon dioxide gas passing through the resistance filter 12b is set to 20 Nl / min (or SCCM),
When the flow rate of the carbon dioxide gas passing through c is 40 Nl / min (or SCCM), the above-described on-off valves 11 a to 11 c
The supply amount of carbon dioxide to the gas supply unit 41 is 0 to 70 Nl / min (or SCCM) depending on the combination of opening and closing.
Can be changed within the range. In this embodiment, the supply flow rate to the gas supply unit 41 is controlled by three on-off valves 11a to 11c and three resistance filters 12a to 12c.
, But is not limited to this.
The required number of on-off valves and resistance filters can be provided as appropriate.

Therefore, the amount of carbon dioxide supplied to the gas supply unit 41 can be arbitrarily determined by the combination of opening the on-off valves 11a to 11c. The carbon dioxide gas whose flow rate has been adjusted by the carbon dioxide gas supply amount adjusting unit 10 is supplied from the gas supply unit 41 of the carbon dioxide gas dissolving unit 4 to the permeation unit 40.

The permeation section 40 is formed by bundling a plurality of hollow fiber membranes having permeability to carbon dioxide (carbon dioxide). Each hollow fiber of the permeation part 40 is formed with countless holes that allow only gas molecules to permeate without allowing water molecules to permeate. The carbon dioxide gas supplied to the gas supply unit 41 is supplied to the air chamber of each hollow fiber membrane, and the carbon dioxide gas penetrates the wall surface of the air chamber of the hollow fiber and contacts the pure water in contact with the outer flow wall surface. Dissolve. Therefore, when pure water passes through each hollow fiber liquid chamber of the permeation section 40, carbon dioxide dissolved pure water in which carbon dioxide is dissolved in the pure water is generated. Since the amount of carbon dioxide dissolved in pure water changes according to the flow rate of carbon dioxide flowing in the air chamber of each hollow fiber membrane, the amount of carbon dioxide dissolved in pure water can be changed by the supply flow rate. it can. That is, the amount of dissolved carbon dioxide dissolved in pure water can be changed in accordance with the flow rate adjusted by the carbon dioxide supply amount adjuster 10.

An exhaust valve 13 is provided in the carbon dioxide gas flow passage connecting the carbon dioxide gas supply amount adjusting unit 10 and the permeation unit 40 to branch off from the flow passage and exhaust the carbon dioxide gas therebetween. Have been. The opening and closing of the exhaust valve 13 is controlled by the control unit 7 and is closed in a normal use state. For example, if the specific resistance value of the carbon dioxide dissolved pure water becomes too low, the control unit 7 7 is an on-off valve 11a-
By closing 11c and opening the exhaust valve 13, carbon dioxide gas supplied to the air chamber of the hollow fiber membrane is stopped. Thereby, since the carbon dioxide gas no more dissolves in the pure water passing through the permeation section 40, a decrease in the specific resistance value of the carbon dioxide dissolved pure water is prevented.

The carbon dioxide gas-dissolved pure water in which the carbon dioxide gas is dissolved in the carbon dioxide gas dissolving section 4 is sent to the substrate processing unit 2 through the supply pipe 3. At the same time, the branch portion 9 provided in the supply pipe 3 takes out a part of the carbon dioxide dissolved pure water sent to the substrate processing unit 2.

The branch section 9 is provided with a carbon dioxide gas dissolving section 4 of the supply pipe 3.
One end side of the branch pipe 5 is connected and connected between the substrate processing unit 2. The branch pipe 5 is formed with a smaller diameter than the supply pipe 3, and takes out a part of the carbon dioxide dissolved pure water flowing in the supply pipe 3. Note that the branch pipe 5 is not necessarily limited to the case where the diameter is smaller than the diameter of the supply pipe 3.

The branch pipe 5 has one end connected to the supply pipe 3 and the other end connected to a waste liquid pipe (not shown) for draining carbon dioxide dissolved pure water. Further, in the middle of the branch pipe 5, a resistivity meter 8 for measuring the specific resistance value of the carbon dioxide dissolved pure water flowing toward the waste liquid pipe in the branch pipe 5 is provided.
The electrode 6 which is a measuring unit is mounted in the branch pipe 5.

The carbon dioxide-dissolved pure water taken out at the branch 9 flows through the branch pipe 5 toward the waste liquid pipe, and passes through the electrode 6 of the resistivity meter 8. At this time, the specific resistance of the carbon dioxide dissolved pure water is measured by the electrode 6 of the specific resistance meter 8. The carbon dioxide gas-dissolved pure water whose specific resistance was measured, that is, the carbon dioxide gas-dissolved pure water containing metal ions eluted from the electrode 6, is supplied to the branch pipe 5.
From the other end through a waste liquid pipe. That is, although the specific resistance of the carbon dioxide dissolved pure water is measured, the carbon dioxide dissolved pure water touching the electrode 6 of the resistivity meter 8 is not supplied to the substrate processing unit 2.

The resistivity meter 8 measures the resistivity of the carbon dioxide-dissolved pure water flowing through the branch pipe 5 through the electrode 6. The measured specific resistance value is sent to the control unit 7.

The control unit 7 is a so-called computer comprising a CPU, a memory, and the like.
3, the on-off valves 11a to 11 of the carbon dioxide gas supply amount adjusting unit 10
open and close c. The control unit 7 controls the supply amount of the carbon dioxide gas supplied to the permeation unit 10 of the carbon dioxide gas dissolving unit 4 so that the specific resistance value obtained by the specific resistance meter 8 maintains a predetermined set specific resistance value. Is what you do. The control unit 7
Corresponds to the control means in the present invention.

For example, the control unit 7 constantly monitors the specific resistance value of the specific resistance meter 8 and keeps the specific resistance value of the carbon dioxide-dissolved pure water supplied to the substrate processing unit 2 constant at the set specific resistance value. Thus, the carbon dioxide gas supply amount adjusting unit 10 is controlled. Specifically, when the specific resistance value of the carbon dioxide-dissolved pure water falls below the set specific resistance value, the carbon dioxide gas supply amount adjusting unit 10 is used to reduce the amount of carbon dioxide dissolved in the pure water. On-off valve 1
The opening and closing of 1a to 11c and the exhaust valve 13 are controlled to reduce the supply amount of carbon dioxide to the permeation section 40. On the other hand, when the specific resistance of the carbon dioxide-dissolved pure water is higher than the set specific resistance, the on-off valves 11a to 11c are controlled conversely to increase the amount of carbon dioxide dissolved in the pure water. Then, adjustment is performed so as to increase the supply amount of carbon dioxide gas supplied to the permeation section 40. That is, when the supply amount of the carbon dioxide gas supplied to the infiltration unit 40 increases, the amount of the carbon dioxide dissolved in the pure water increases, and the specific resistance of the carbon dioxide dissolved pure water decreases. On the other hand, when the supply amount of the carbon dioxide gas decreases, the amount of the carbon dioxide gas dissolved in the pure water decreases, and the specific resistance of the carbon dioxide dissolved pure water increases.

The carbon dioxide-dissolved pure water supply unit 1 supplies the carbon dioxide-dissolved pure water to the substrate processing unit 2 while keeping the specific resistance value substantially constant. The substrate processing unit 2 includes a processing unit that performs a cleaning process on a substrate that has been processed with, for example, a chemical solution, or performs a rinsing process on a substrate before and after a process such as resist coating. Substrate processing unit 2
Then, a cleaning process or the like is performed using the carbon dioxide dissolved pure water supplied from the carbon dioxide dissolved pure water supply unit 1. Thereby, it is possible to prevent electrostatic destruction due to electrification of pure water and metal contamination due to metal ions, which are generated in the substrate treatment unit 2. Note that the substrate processing unit 2 is an apparatus including a process or a processing unit for performing processing on a semiconductor substrate, a glass substrate, or the like using pure water.

According to the substrate processing apparatus described above, in the carbon dioxide-dissolved pure water supply unit 1, the carbon dioxide-dissolved pure water supplied to the substrate processing unit 2 is measured in order to measure the specific resistance of the carbon dioxide-dissolved pure water. By taking out a part, carbon dioxide-dissolved pure water for measuring a specific resistance value is separated from carbon dioxide-dissolved pure water to be supplied to the substrate processing unit 2. Therefore,
The carbon dioxide dissolved pure water supplied to the substrate processing unit 2 is:
While the specific resistance is adjusted to an optimum value, metal ions resulting from the measurement of the specific resistance are not included. As a result, it is possible to prevent the occurrence of adverse effects such as charging and metal contamination in the processing performed using carbon dioxide dissolved pure water on the substrate.

The present invention can be modified as follows. (1) In the above-described embodiment, the control unit 7 controls the amount of dissolved carbon dioxide dissolved in pure water in the carbon dioxide gas dissolving unit 4, but, for example, without using the control unit 7, the carbon dioxide dissolved pure water supply unit is used. 1 can also be configured as follows. FIG. 2 is a block diagram of a substrate processing apparatus according to this modification. About the part common to the above-mentioned example,
The same reference numerals are given and the description is omitted.

As shown in FIG. 2, the supply pipe 3 of the carbon dioxide dissolved pure water supply unit 1 is provided with an orifice 51 on the upstream side of the branch portion 9.
A bypass pipe 50 that bypasses 1 is provided. The bypass pipe 50 is provided with a carbon dioxide gas dissolving unit 4 for dissolving carbon dioxide in pure water flowing through the pipe. A relatively large flow rate of carbon dioxide gas supplied from a carbon dioxide gas supply source is supplied to the permeation section 40 of the carbon dioxide gas dissolving section 4, and pure water passing through the permeation section 40 contains substantially saturated carbon dioxide gas. Is dissolved. In other words, the pure water passing through the permeation section 40 is dissolved in the substantially saturated carbon dioxide gas, and becomes pure carbon dioxide dissolved pure water having a substantially constant specific resistance value. The carbon dioxide dissolving unit 4 is not provided with the gas exhaust unit 42.

The pure water supplied from the pure water supply source causes a pressure difference between before and after the orifice 51. Specifically, a branching section P which is a connection section between the supply pipe 3 and the bypass pipe 50
_A pressure difference of P ₁ > P ₂ is generated between ₁ and the junction P ₂ . Accordingly, to compensate for the pressure difference between the supply pipe 3, pure water, merges inside the bypass pipe 50 from the diverter P ₁ part P ₂
Flows towards The carbon dioxide gas dissolving section 4 provided in the bypass pipe 50 dissolves a substantially saturated amount of carbon dioxide in the pure water flowing in the bypass pipe 50, and provides a high-concentration carbon dioxide-dissolved pure water, that is, a relatively specific solution. Generates carbon dioxide dissolved pure water with low resistance. The low specific resistance carbon dioxide-dissolved pure water is supplied to the junction P
_{In 2} mixed with pure water that has passed through the orifice 51,
Carbon dioxide dissolved pure water having a predetermined specific resistance value is generated. The specific resistance of the carbon dioxide-dissolved pure water supplied to the substrate processing unit 2 can be appropriately changed by changing the pressure difference generated before and after the orifice 51. Further, for example, by adjusting the throttle amount of the orifice 51, the pressure difference can be changed.

The carbon dioxide dissolved pure water having a predetermined specific resistance value is supplied to the substrate processing unit 2 and its specific resistance value is measured by the specific resistance meter 8. Resistivity meter 8
Displays, for example, the measured specific resistance value of the carbon dioxide dissolved pure water, or issues an alarm when the specific resistance value exceeds a predetermined range.

Therefore, according to this modification, since the carbon dioxide-dissolved pure water supplied to the substrate processing unit has a predetermined specific resistance value by utilizing the law of partial pressure, the carbon dioxide-dissolved pure water supply The configuration of the unit 1 can be further simplified. That is, in the case where the specific resistance value of the carbon dioxide gas does not immediately affect the substrate processing, the specific resistance of the carbon dioxide dissolved pure water can be obtained without any special control by the control unit 7 as in the above-described embodiment. When the value deviates from the predetermined value, for example, an alarm may be issued to inform the operator of the abnormality.

(2) In the above embodiment, the flow rate of the carbon dioxide gas supplied to the permeation section 40 is controlled by the combination of the resistance filter and the opening / closing valve. However, the flow rate can be controlled by, for example, a mass flow controller.

(3) In the above-described embodiment, carbon dioxide-dissolved pure water whose specific resistance was measured, that is, carbon dioxide-dissolved pure water containing metal ions eluted from the electrode 6 was discarded.
It may be configured to regenerate into pure water by removing metal ions.

(4) In the above-described substrate processing apparatus, it has been described that the substrate processing apparatus is provided with the carbon dioxide-dissolved pure water supply unit 1 and the substrate processing unit 2, but each unit is used as a single unit. Can also. For example, the substrate processing unit 2 may be used as a substrate processing apparatus provided with a substrate transport mechanism, a substrate processing mechanism, and the like, and the carbon dioxide dissolved pure water supply unit 1 may be used as a single device.

(5) In the above-described embodiment, the carbon dioxide dissolved pure water flowing through the supply pipe 3 is branched by the branch pipe 5, so that a part of the carbon dioxide dissolved pure water supplied to the substrate processing apparatus is removed. Although it was configured to always take out, the present invention is not limited to this. For example, only when a specific resistance value is measured by attaching an on-off valve to the branch pipe 5 and opening and closing this on-off valve. Alternatively, it may be configured such that carbon dioxide dissolved pure water supplied to the substrate processing unit 2 is taken out.

[0045]

As apparent from the above description, the present invention has the following effects. That is, according to the first aspect of the present invention, when measuring the specific resistance value of the generated carbon dioxide gas-dissolved pure water, the carbon dioxide gas-dissolved pure water supplied to the substrate processing apparatus and the specific resistance value are measured. Therefore, it is possible to prevent supply of the carbon dioxide-dissolved pure water contaminated with metal ions due to the resistivity meter to the substrate processing apparatus.

According to the invention described in claim 2, according to claim 1
Can be suitably implemented.

According to the third aspect of the present invention, further,
Since the amount of carbon dioxide dissolved in pure water is adjusted, carbon dioxide-dissolved pure water having an arbitrary specific resistance value can be supplied to the substrate processing apparatus.

According to the fourth aspect of the present invention,
The adjusting means is controlled so as to adjust the amount of carbon dioxide dissolved in pure water in accordance with the change in the specific resistance of the carbon dioxide-dissolved pure water. Pure water can be supplied to the substrate processing apparatus.

According to the invention set forth in claim 5, according to claim 2,
In addition, it is possible to realize a substrate processing apparatus provided with a carbon dioxide-dissolved pure water supply unit that can achieve the effects described in the invention according to any one of claims 4 to 7, so that metal ions caused by a resistivity meter in substrate processing can be realized. Adverse effects can be eliminated.

[Brief description of the drawings]

FIG. 1 is a block diagram schematically illustrating a substrate processing apparatus according to an embodiment.

FIG. 2 is a block diagram schematically illustrating a substrate processing apparatus according to a modification.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Carbon dioxide dissolved pure water supply unit 2 ... Substrate processing unit 3 ... Supply pipe 4 ... Carbon dioxide gas dissolution part 5 ... Branch pipe 6 ... Electrode 7 ... Control part 8 ... Resistivity meter 9 ... Branch part 10 ... Carbon dioxide gas supply amount Adjusting part 40… Penetration part

Claims (5)

[Claims] 1. A method for producing carbon dioxide gas-dissolved pure water in which carbon dioxide gas is dissolved in pure water, and for supplying carbon dioxide gas-dissolved pure water whose specific resistance is measured by a resistivity meter to a substrate processing apparatus. A method for supplying gas-dissolved pure water, comprising: dissolving carbon dioxide in the pure water to generate carbon dioxide-dissolved pure water; supplying the carbon dioxide-dissolved pure water to the substrate processing apparatus; A step of extracting a part of the carbon dioxide dissolved pure water supplied to the substrate processing apparatus, and a step of measuring a specific resistance value of the extracted carbon dioxide dissolved pure water by the resistivity meter. Carbon dioxide dissolved pure water supply method. 2. A method for producing carbon dioxide gas-dissolved pure water in which carbon dioxide gas is dissolved in pure water, and for supplying the carbon dioxide gas-dissolved pure water, whose specific resistance is measured by a resistivity meter, to a substrate processing apparatus. A gas-dissolved pure water supply unit, wherein the carbon dioxide gas is dissolved in the pure water to generate carbon dioxide-dissolved pure water; A supply pipe for supplying carbon dioxide-dissolved pure water to the substrate processing apparatus; a branch pipe for branching out a part of the carbon dioxide-dissolved pure water supplied to the substrate processing apparatus by the supply pipe; and the branch pipe And a specific resistance meter attached to the unit for measuring a specific resistance value of the carbon dioxide dissolved pure water. 3. The carbon dioxide-dissolved pure water supply unit according to claim 2, wherein the unit further adjusts a dissolved amount of the carbon dioxide dissolved in the pure water in the carbon dioxide-dissolved pure water generating unit. A carbon dioxide dissolved pure water supply unit comprising: 4. The carbon dioxide dissolved pure water supply unit according to claim 3, wherein the unit further controls the adjusting means in accordance with a specific resistance value obtained by measuring with the specific resistance meter. Carbon dioxide dissolved pure water supply unit provided with means. 5. A substrate processing apparatus comprising the carbon dioxide-dissolved pure water supply unit according to claim 2. Description: