JP2000068301A - Packaging method in hybrid integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To check the leakage of a liquid synthetic resin charged into an opening in a frame plate by forming a plurality of slits along the peripheral sides of an upper surface area of a printed board, on which various electronic components are mounted with a narrow interval provided between the adjacent slits. SOLUTION: A plurality of slits 11a are formed along the peripheral sides of an upper surface area of a printed board 11 on which various electronic components 12 are mounted. A narrow interval 11b is provided between the adjacent slits 11a. Therefore, until a liquid synthetic resin charged into an opening in a frame plate is cured, these slits 11a stop the absorption of part of the synthetic resin caused by capillarity into a space between the underside of the frame plate and the upper surface of the board 11 from the entire periphery of the opening by exposing the synthetic resin to the atmosphere, and hence such absorption can be reliably checked. As a result, it does not occur that the frame body cannot be separated after packaging, and the shape after packaging can be stabilized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging various electronic components with a synthetic resin in a hybrid integrated circuit device having various electronic components mounted on a printed circuit board.

[0002]

2. Description of the Related Art Generally, in a hybrid integrated circuit device, in order to protect various electronic components mounted on the surface of a printed circuit board, these various electronic components are packaged with a synthetic resin. ing. One of the packaging methods using this synthetic resin is shown in FIG.
As shown in FIGS. 0 to 12, various electronic components 2 are mounted on the upper surface of the printed circuit board 1, and on the upper surface of the printed circuit board 1,
A hole 4 into which various electronic components 2 mounted on the upper surface fit.
Is placed such that the lower surface of the frame plate 3 is in close contact with the upper surface of the printed circuit board 1, and the synthetic resin is filled in a liquid state in the holes 4 of the frame plate 3. After drying and hardening, the frame plate 3 is removed so that various electronic components 2 on the printed circuit board 1 can be removed.
There is a method of packaging with the synthetic resin 5.

[0003] After packaging with the synthetic resin 5, the printed circuit board 1 is cut along cutting lines 6 to obtain a completed hybrid integrated circuit device.

[0004]

However, this packaging method uses a frame plate 3 having a hole 4 filled with a liquid synthetic resin, so that the shape after packaging can be changed to the surface of the printed circuit board 1. Although there is an advantage such that the same shape can be obtained even when a liquid synthetic resin is applied to various electronic components in the above, there are the following problems.

That is, the frame plate 3 is placed on the upper surface of the printed circuit board 1.
Is placed so that the lower surface of the frame plate 3 is in close contact, and when the synthetic resin is filled in a liquid state in the hole 4 of the frame plate 3, a part of the liquid synthetic resin is dried and hardened. In the meantime, the space between the lower surface of the frame plate 3 and the upper surface of the printed circuit board 1 is sucked by a capillary phenomenon.

In this state, the synthetic resin is dried and hardened, whereby the frame 3 is firmly adhered to the printed circuit board 1 over the entire perimeter of the perforated hole. In many cases, it cannot be separated from the substrate 1. In addition, since the amount of the synthetic resin decreases due to the leakage of the synthetic resin filled in the holes, there is a problem that the shape after packaging is not constant.

An object of the present invention is to provide a packaging method which solves these problems.

[0008]

In order to achieve this technical object, the present invention provides a printed circuit board having various electronic components mounted on an upper surface thereof, in a portion surrounding the various electronic components. A plurality of slit holes extending in the direction are drilled by providing narrow strips between the slit holes, and then various electronic components mounted on the upper surface are fitted on the upper surface of the printed circuit board. A frame plate formed with a round hole is placed so that the lower surface of the frame plate is in close contact with the upper surface of the printed circuit board, and then the synthetic resin is filled in a liquid state in the hole in the frame plate. After that, it is dried and cured. "

[0009]

As described above, a part of the liquid synthetic resin filled in the hole in the frame plate is moved from the entire periphery of the hole to the capillary tube between the lower surface of the frame and the upper surface of the printed circuit board. Even if you are sucked by the phenomenon,
Suction of the liquid synthetic resin by the above-mentioned capillary phenomenon,
Since it can be divided by opening to the atmosphere at the location of each slit hole formed in the printed circuit board, the liquid synthetic resin is sucked by the capillary phenomenon between the lower surface of the frame and the upper surface of the printed circuit board. Can be greatly reduced.

Therefore, according to the present invention, when various electronic components in a hybrid integrated circuit device are packaged with a synthetic resin using a frame, it is ensured that the frame plate cannot be separated. In addition, since the leakage of the synthetic resin filled in the hole can be prevented, the shape after the package can be stabilized.

In particular, as described in claim 2, in addition to the above-mentioned configuration, by providing a recess at least in a portion corresponding to each narrow piece on the lower surface of the frame plate,
In addition to separating suction by capillary action at each slit hole formed in the printed circuit board,
Even at the location of each narrow piece between each slit hole, it can be performed even at a recess provided in at least a portion corresponding to each narrow piece on the lower surface of the frame plate,
Therefore, the separation of the suction by the capillary action can be achieved over the entire periphery of the hole, so that the occurrence of a situation where the frame plate cannot be separated can be further reduced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure, reference numeral 11 denotes a printed circuit board on which various electronic components 12 are mounted in the hybrid integrated circuit device. A portion of the printed circuit board 11 surrounding the various electronic components 12 includes Hole 11 extending in the direction of
A plurality of holes a are formed by providing narrow strips 11b between the slit holes 11a.

Reference numeral 13 denotes a frame plate. The frame plate 13 has a hole 14 into which the various electronic components 12 fit. The lower surface of the frame plate 13 has a recess 13.
a is provided so as to extend over the entire length of the hole 14 along the inner peripheral surface thereof. Then, the frame plate 13 is placed on the upper surface of the printed circuit board 11 such that the lower surface of the frame plate 13 is in close contact with the upper surface of the printed circuit board 11,
In this state, after the ultraviolet curable synthetic resin 15 is filled in a liquid state into the holes 14 in the frame plate 13, the resin is cured by irradiating ultraviolet rays.

Next, by cutting the narrow pieces 11b between the slit holes 11a in the printed circuit board 11, a completed hybrid integrated circuit device is obtained as shown in FIG. By the way, the frame plate 13
Until the liquid synthetic resin 15 filled in the hole 14 is hardened, a part thereof is formed between the entire periphery of the hole 14 and the lower surface of the frame 13 and the upper surface of the printed circuit board 11 until it hardens. Will be sucked by.

However, the suction caused by the capillary phenomenon is caused by the slit holes 11 formed in the printed circuit board 11.
Since each of the slits is separated by opening to the atmosphere at the point a, the liquid synthetic resin is sucked by the capillary action between the lower surface of the frame 13 and the upper surface of the printed circuit board 11. The presence of the holes 11a can surely reduce the number.

Further, a part of the liquid synthetic resin filled in the hole 14 extends from the entire narrow hole 11b between the slits 11a to the lower surface of the frame 13 from the entire periphery of the hole 14. And the upper surface of the printed circuit board 11 is sucked by capillary action. The suction by the capillary action is divided so as to be open to the atmosphere at a recess 13 a provided on the lower face of the frame 13. Therefore, the suction of the liquid synthetic resin between the lower surface of the frame 13 and the upper surface of the printed circuit board 11 from the location of each narrow piece by the capillary phenomenon can be reliably reduced by the presence of the recess 13a. is there.

It is needless to say that the slit hole 11a formed in the printed circuit board 11 may have a form as shown in FIG. The present invention is not limited to extending over the entire circumference of the hole 14.
The configuration may be such that it is provided only at the point b.

Further, the present invention is not limited to the case where the printed circuit boards are manufactured one by one as in the above-described embodiment.
It goes without saying that the present invention can be applied to a case where a plurality of printed circuit boards are manufactured in a row or in a matrix from a single material.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a printed circuit board according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a frame plate according to the embodiment of the present invention.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a perspective view showing a state in which the frame plate is overlaid on the printed circuit board in the embodiment of the present invention.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a sectional view taken along line VI-VI of FIG.

FIG. 7 is a perspective view showing a package state of various electronic components made of synthetic resin in the embodiment of the present invention.

FIG. 8 is a perspective view showing a hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 9 is a perspective view showing another embodiment of the present invention.

FIG. 10 is a perspective view showing a printed circuit board according to a conventional method.

FIG. 11 is a perspective view showing a state in which a frame plate is overlaid on the printed circuit board in a conventional method.

FIG. 12 is a perspective view showing a package state of various electronic components made of synthetic resin in a conventional method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Printed circuit board 11a Slit hole 11b Narrow piece 12 Electronic component 13 Frame plate 13a Depression 14 Drain hole 15 Synthetic resin

Claims (2)

[Claims] 1. A printed circuit board having various electronic components mounted on an upper surface thereof, a plurality of slit holes extending in the peripheral direction are formed in a portion surrounding the various electronic components, between the slit holes. A frame plate formed by forming a narrow strip on the upper surface of the printed circuit board and then forming a hole through which various electronic components mounted on the upper surface are fitted on the upper surface of the printed circuit board. A package in a hybrid integrated circuit device, wherein the package is placed so that the lower surface is in close contact with the upper surface of the printed circuit board, and then the synthetic resin is filled in a liquid state in the holes in the frame plate and then dried and cured. Method. 2. A printed circuit board having various electronic components mounted on an upper surface thereof, a plurality of slit holes extending in the peripheral direction are formed in a portion surrounding the various electronic components in a space between the slit holes. The printed circuit board is provided with a narrow strip, and a hole is formed in the upper surface of the printed circuit board. A frame plate provided with a recess in a portion corresponding to the width piece is placed so that the lower surface of the frame plate is in close contact with the upper surface of the printed circuit board, and then the synthetic resin is poured into the holes in the frame plate. A method for packaging in a hybrid integrated circuit device, wherein the package is filled and dried and cured in the state described above.