JP2000063310A - New bisphenol compound - Google Patents
New bisphenol compoundInfo
- Publication number
- JP2000063310A JP2000063310A JP10232886A JP23288698A JP2000063310A JP 2000063310 A JP2000063310 A JP 2000063310A JP 10232886 A JP10232886 A JP 10232886A JP 23288698 A JP23288698 A JP 23288698A JP 2000063310 A JP2000063310 A JP 2000063310A
- Authority
- JP
- Japan
- Prior art keywords
- bisphenol compound
- acid
- cyclohexyl
- compound
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 bisphenol compound Chemical class 0.000 title abstract description 48
- 229930185605 Bisphenol Natural products 0.000 title abstract description 41
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 13
- 150000001728 carbonyl compounds Chemical class 0.000 abstract description 11
- 239000002994 raw material Substances 0.000 abstract description 8
- 239000003377 acid catalyst Substances 0.000 abstract description 7
- ISDBWOPVZKNQDW-UHFFFAOYSA-N 4-phenylbenzaldehyde Chemical group C1=CC(C=O)=CC=C1C1=CC=CC=C1 ISDBWOPVZKNQDW-UHFFFAOYSA-N 0.000 abstract description 5
- 238000003756 stirring Methods 0.000 abstract description 5
- 239000007810 chemical reaction solvent Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- QISSLJRFUNYARC-UHFFFAOYSA-N 2-cyclohexyl-4-[(3-cyclohexyl-4-hydroxyphenyl)-(4-phenylphenyl)methyl]phenol Chemical group OC1=CC=C(C(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=C(C(O)=CC=2)C2CCCCC2)C=C1C1CCCCC1 QISSLJRFUNYARC-UHFFFAOYSA-N 0.000 abstract description 2
- 238000006482 condensation reaction Methods 0.000 abstract description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 abstract 1
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 235000010290 biphenyl Nutrition 0.000 description 12
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical group OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 11
- 239000004305 biphenyl Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 150000004074 biphenyls Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000000855 fungicidal effect Effects 0.000 description 5
- 239000000417 fungicide Substances 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000000844 anti-bacterial effect Effects 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 239000003899 bactericide agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003426 co-catalyst Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- QCZZSANNLWPGEA-UHFFFAOYSA-N 1-(4-phenylphenyl)ethanone Chemical group C1=CC(C(=O)C)=CC=C1C1=CC=CC=C1 QCZZSANNLWPGEA-UHFFFAOYSA-N 0.000 description 2
- SRGATTGYDONWOU-UHFFFAOYSA-N 2-cyclohexyl-5-methylphenol Chemical compound OC1=CC(C)=CC=C1C1CCCCC1 SRGATTGYDONWOU-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001350 alkyl halides Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001793 charged compounds Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- RXKJFZQQPQGTFL-UHFFFAOYSA-N dihydroxyacetone Chemical compound OCC(=O)CO RXKJFZQQPQGTFL-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- 230000002140 halogenating effect Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 238000001819 mass spectrum Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- AFIAIUIEAKCWCD-UHFFFAOYSA-N 2-cyclohexyl-4-[(5-cyclohexyl-4-hydroxy-2-methylphenyl)-(2-hydroxyphenyl)methyl]-5-methylphenol Chemical compound CC1=CC(O)=C(C2CCCCC2)C=C1C(C=1C(=CC(O)=C(C2CCCCC2)C=1)C)C1=CC=CC=C1O AFIAIUIEAKCWCD-UHFFFAOYSA-N 0.000 description 1
- NAPCUFJCDHWQTD-UHFFFAOYSA-N 2-cyclohexyl-5-ethylphenol Chemical compound OC1=CC(CC)=CC=C1C1CCCCC1 NAPCUFJCDHWQTD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical group C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- KAUHJPQTXBQUGS-UHFFFAOYSA-N C(C)(C)C=1C=C(C(=CC1)C1CCCCC1)O Chemical compound C(C)(C)C=1C=C(C(=CC1)C1CCCCC1)O KAUHJPQTXBQUGS-UHFFFAOYSA-N 0.000 description 1
- DBPBMWGORVDGKV-UHFFFAOYSA-N C1(CCCCC1)C1=C(C=C(C=C1)C(C)(C)C)O Chemical compound C1(CCCCC1)C1=C(C=C(C=C1)C(C)(C)C)O DBPBMWGORVDGKV-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- CLBVNCVVRJOWDJ-UHFFFAOYSA-N OC1=CC=C(C=C1)C(C=1C(=C(C=CC=1)O)C)C=1C(=C(C=CC=1)O)C Chemical compound OC1=CC=C(C=C1)C(C=1C(=C(C=CC=1)O)C)C=1C(=C(C=CC=1)O)C CLBVNCVVRJOWDJ-UHFFFAOYSA-N 0.000 description 1
- 238000006085 Schmidt reaction Methods 0.000 description 1
- GPFIZJURHXINSQ-UHFFFAOYSA-N acetic acid;nitric acid Chemical compound CC(O)=O.O[N+]([O-])=O GPFIZJURHXINSQ-UHFFFAOYSA-N 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 239000012346 acetyl chloride Substances 0.000 description 1
- 230000021736 acetylation Effects 0.000 description 1
- 238000006640 acetylation reaction Methods 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000022244 formylation Effects 0.000 description 1
- 238000006170 formylation reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000000802 nitrating effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012264 purified product Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Inorganic materials O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 1
- OQJMGZJRJMANIW-UHFFFAOYSA-N tert-butyl 2-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethoxy]acetate Chemical group CC(C)(C)OC(=O)COCC(=O)OC(C)(C)C OQJMGZJRJMANIW-UHFFFAOYSA-N 0.000 description 1
- KUYMVWXKHQSIAS-UHFFFAOYSA-N tert-butyl 2-chloroacetate Chemical compound CC(C)(C)OC(=O)CCl KUYMVWXKHQSIAS-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/11—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
- C07C37/20—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms using aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
【0001】
【発明の属する技術分野】本発明は、新規なビスフェノ
ール化合物に関し、詳しくは、トリスフェニルメタン型
の骨格を有し、それぞれシクロヘキシル基を置換基とし
て有する2つのシクロヘキシルフェノール構造がビフェ
ニルアルキリデン基を介して結合されてなる新規な4−
〔1,1−ビス(3−シクロヘキシル−4−ヒドロキシフ
ェニル〕アルキル〕ビフェニル類に関する。
【0002】このようなビスフェノール化合物は、例え
ば、半導体用、LCD用等のフォトレジスト用原料、集
積回路の封止材料、電気絶縁材料等に用いられるエポキ
シ樹脂又は硬化剤の原料、ポリカーボネート樹脂原料、
アクリレート樹脂原料、感熱記録に用いられる顕色剤や
退色防止剤等に有用であり、このほか、殺菌剤、防菌防
カビ剤等の添加剤としても有用である。
【0003】
【従来の技術】ビスフェノール化合物は、従来より、種
々の電気電子機器の部品用材料のためのエポキシ樹脂や
そのための硬化剤の原料、ポリカーボネート樹脂原料、
アクリレート樹脂原料、感熱記録用の顕色剤のほか、酸
化防止剤、殺菌剤、防菌防カビ剤等の添加剤としても広
く有用に用いられている。特に、近年においては、電気
電子機器の部品の分野において、機器の小型化と高性能
化の要請に伴って、それらに用いられる有機材料につい
ても、従来の機械的特性や熱的特性の向上に止まらず、
耐湿長期安定性、電気絶縁性、低誘電性等、ますます諸
性能の向上が求められるに至っている。
【0004】従来、ビスフェノール化合物のなかで、ト
リスフェニルメタン型のビスフェノール化合物として
は、例えば、特開平6−199717号公報に4,4'−
〔(4−ヒドロキシフェニル)メチレン〕ビス〔2−メ
チルフェノール〕が、特開平6−1741号公報には4,
4'−〔(4−ヒドロキシフェニル)メチレン〕ビス〔2
−シクロヘキシル−5−メチルフェノール〕と4,4'−
〔(2−ヒドロキシフェニル)メチレン〕ビス〔2−シ
クロヘキシル−5−メチルフェノール〕がそれぞれ開示
されている。
【0005】これらのトリスフェニルメタン型のビスフ
ェノール化合物が分子中に多数のフェニル基を有すると
きは、即ち、フェニル核の密度が高いときは、そのよう
なビスフェノール化合物を原料として用いることによっ
て、低吸水性、低吸湿性等の耐水性や耐熱性のほか、絶
縁性や低誘電性等の電気特性にもすぐれる樹脂を与える
ことが期待される。
【0006】そこで、例えば、特開昭62−12278
2号公報や特開昭62−289536号公報には、分子
中にフェニル基に代えて、ビフェニル基を導入してなる
ビスフェノール化合物も提案されている。
【0007】しかしながら、トリスフェニルメタン型の
ビスフェノール化合物であって、それぞれシクロヘキシ
ルを置換基として有する2つのシクロヘキシルフェノー
ル構造がビフェニルアルキリデン基を介して結合されて
なる4−〔1,1−ビス(3−シクロヘキシル−4−ヒド
ロキシフェニル〕アルキル〕ビフェニル類は、従来、知
られていない。
【0008】
【発明が解決しようとする課題】本発明は、上述したよ
うな新規なビスフェノール化合物、4−〔1,1−ビス
(3−シクロヘキシル−4−ヒドロキシフェニル〕アル
キル〕ビフェニル類を提供することを目的とする。
【0009】
【課題を解決するための手段】本発明によれば、一般式
(I)
【0010】
【化2】
【0011】(式中、R1 は水素原子又はメチル基を示
し、R2 は炭素数1〜4のアルキル基を示し、mは0〜
2の整数である。)で表わされる新規な4−〔1,1−ビ
ス(3−シクロヘキシル−4−ヒドロキシフェニル〕ア
ルキル〕ビフェニル類が提供される。
【0012】
【発明の実施の形態】本発明による新規なビスフェノー
ル化合物、即ち、4−〔1,1−ビス(3−シクロヘキシ
ル−4−ヒドロキシフェニル〕アルキル〕ビフェニル類
は、前記一般式(I)で表わされ、ここに、アルキル基
(R2 )としては、例えば、メチル基、エチル基、直鎖
又は分岐鎖状のプロピル基又はブチル基等を挙げること
ができる。特に、本発明においては、このアルキル基
は、メチル基であることが好ましく、また、水酸基に対
してメタ位置にあることが好ましい。
【0013】従って、本発明によるこのようなビスフェ
ノール化合物としては、具体的には、例えば、(1)4
−〔1,1−ビス(3−シクロヘキシル−4−ヒドロキシ
フェニル〕メチル〕ビフェニル、(2)4−〔1,1−ビ
ス(3−シクロヘキシル−4−ヒドロキシ−6−メチル
フェニル〕メチル〕ビフェニル
(3)4−〔1,1−ビス(3−シクロヘキシル−4−ヒ
ドロキシフェニル〕エチル〕ビフェニル、(4)4−
〔1,1−ビス(3−シクロヘキシル−4−ヒドロキシ−
6−メチルフェニル〕エチル〕ビフェニル等を挙げるこ
とができるが、しかし、これらに限定されるものではな
い。
【0014】かかる本発明による新規なビスフェノール
化合物は、酸触媒と助触媒の存在下、一般式(II)
【0015】
【化3】
【0016】で表わされるカルボニル化合物、即ち、4
−ホルミルビフェニル又は4−アセチルビフェニルと、
一般式(III)
【0017】
【化4】
【0018】(式中、R2 は炭素数1〜4のアルキル基
を示し、mは0〜2の整数である。)で表わされるシク
ロヘキシルフェノール類とを脱水縮合反応させることに
よって得ることができる。
【0019】上記カルボニル化合物として、4−ホルミ
ルビフェニルを用いるときは、4−〔1,1−ビス(3−
シクロヘキシル−4−ヒドロキシフェニル〕メチル〕ビ
フェニル類を得ることができ、上記カルボニル化合物と
して、4−アセチルビフェニルを用いるときは、4−
〔1,1−ビス(3−シクロヘキシル−4−ヒドロキシフ
ェニル〕エチル〕ビフェニル類を得ることができる。
【0020】上記一般式(III)で表わされるシクロヘキ
シルフェノール類において、前述したように、アルキル
基としては、例えば、メチル基、エチル基、直鎖又は分
岐鎖状のプロピル基又はブチル基等を挙げることがで
き、特に、メチル基であることが好ましく、また、水酸
基に対してメタ位置にあることが好ましい。
【0021】従って、このようなシクロヘキシルフェノ
ール類としては、2−シクロヘキシルフェノール、2−
シクロヘキシル−5−メチルフェノール、2−シクロヘ
キシル−5−エチルフェノール、2−シクロヘキシル−
5−イソプロピルフェノール、2−シクロヘキシル−5
−t−ブチルフェノール等を挙げることができる。
【0022】本発明によるビスフェノール化合物の製造
において、シクロヘキシルフェノール類は、上記カルボ
ニル化合物1モル部に対して、少なくとも2モル部が用
いられ、通常、2〜30モル部の範囲で、好ましくは、
2〜20モル部の範囲で、特に好ましくは、3〜6モル
部の範囲で用いられる。
【0023】上記シクロヘキシルフェノール類と上記カ
ルボニル化合物との反応において、反応溶剤は用いても
よく、また、用いなくてもよい。反応溶剤を用いる場
合、例えば、脂肪族アルコール溶剤、脂肪族ケトン溶
剤、芳香族炭化水素溶剤又はこれらの混合溶剤が用いら
れる。
【0024】アルコール溶剤としては、用いる反応原
料、得られる生成物の溶解度、反応条件、反応の経済性
等を考慮して、メタノール、エタノール、イソプロピル
アルコール、n−プロピルアルコール、t−ブチルアル
コール、イソブチルアルコール、n−ブチルアルコール
等を挙げることができる。脂肪族ケトン溶剤としては、
例えば、イソプロピルケトン、メチルエチルケトン、メ
チルイソブチルケトン、ジイソプロピルケトン等を挙げ
ることができる。また、芳香族炭化水素溶剤としては、
例えば、トルエン、キシレン、クメン等を挙げることが
できる。
【0025】このような溶剤は、通常、用いる前記カル
ボニル化合物100重量部に対して、10〜1000重
量部、好ましくは、30〜300重量部の範囲で用いら
れるが、これに限定されるものではない。
【0026】本発明において、上記酸触媒としては、反
応溶剤に溶解する酸が好ましく、従って、例えば、塩化
水素ガス、塩酸、硫酸、無水硫酸、リン酸、p−トルエ
ンスルホン酸、メタンスルホン酸、トリフルオロメタン
スルホン酸、シュウ酸、ギ酸、リン酸、トリクロロ酢
酸、トリフルオロ酢酸等を好ましい具体例として挙げる
ことができる。特に、塩酸が好ましく用いられる。この
ような酸触媒は、例えば、35%塩酸の場合は、前記カ
ルボニル化合物100重量部に対して、1〜500重量
部、好ましくは、20〜100重量部の範囲で用いられ
る。
【0027】本発明によるビスフェノール化合物の製造
においては、上記酸触媒と共に助触媒を用いることが好
ましい。この助触媒としては、例えば、炭素数1〜18
のメルカプタン類、硫化水素、チオフェノール類、チオ
酸類、ジアルキルサルファイド類等の無機又は有機イオ
ウ化合物を挙げることができる。このような助触媒は、
通常、前記カルボニル化合物1モル部に対して、通常、
0.005〜0.2モル部、好ましくは、0.01〜0.1モル
部の範囲で用いられる。
【0028】シクロヘキシルフェノール類と前記カルボ
ニル化合物との反応は、通常、10〜80℃、好ましく
は、20〜60℃の範囲の温度にて、窒素気流下に攪拌
しながら、2〜36時間程度、通常、10〜24時間程
度にわたって行なえばよい。
【0029】本発明の方法によれば、反応終了後、得ら
れた反応混合物に適宜の晶析溶剤を加えた後、水酸化ナ
トリウム等のアルカリを加えて、反応混合物をpHが5
〜7程度になるまで中和して、結晶が析出すれば、これ
を濾過し、乾燥すれば、本発明によるビスフェノール化
合物を得ることができる。必要に応じて、適宜の晶析溶
剤から再結晶すれば、一層の高純度品を得ることができ
る。また、反応終了後、得られた反応混合物に適宜の有
機溶剤を加えた後、水酸化ナトリウム等のアルカリを加
えて、反応混合物をpHが5〜7程度になるまで中和
し、水層を除去し、得られた油層を水洗した後、適宜の
晶析溶剤を加え、析出した粗結晶を濾過し、適宜の晶析
溶剤から再結晶すれば、目的とするビスフェノール化合
物の精製品を得ることができる。
【0030】本発明において、上記晶析溶剤としては、
通常、トルエン、キシレン、クメン等の芳香族炭化水素
や、n−ヘキサン、n−ヘプタン、n−オクタン等の脂
肪族炭化水素等が好ましく用いられる。
【0031】
【発明の効果】以上のように、本発明によるビスフェノ
ール化合物は、トリスフェニルメタン型の骨格を有し、
それぞれシクロヘキシル基を置換基として有する2つの
シクロヘキシルフェノール構造がビフェニルアルキリデ
ン基を介して結合されてなる。
【0032】従って、本発明によるビスフェノール化合
物は、これを原料として用いることによって、低吸水
性、低吸湿性のような耐水性、絶縁性や低誘電性等の電
気特性にもすぐれる樹脂を与え、かくして、例えば、半
導体用、LCD用等のフォトレジスト用原料、集積回路
の封止材料、電気絶縁材料等に用いられるエポキシ樹脂
又は硬化剤の原料、感熱記録に用いられる顕色剤や退色
防止剤等に有用であり、このほか、殺菌剤、防菌防カビ
剤等の添加剤としても有用に用いられる。
【0033】特に、本発明によるビスフェノール化合物
は、分子中の芳香核の密度が高いので、特に、これをポ
リカーボネート樹脂やポリアクリレート樹脂等の樹脂原
料、フォトレジスト原料として用いることによって、そ
れらの耐熱性や耐湿性等を改善することができる。
【0034】更に、本発明によるビスフェノール化合物
は、これを原料として用いて、種々の反応、例えば、フ
ェノール性芳香環に対する置換反応や水添反応、フェノ
ール水酸基に対する反応等を行なうことによって、種々
の誘導体とすることができる。
【0035】先ず、フェノール性芳香環に対する置換反
応によって誘導体を得る具体例としては、例えば、本発
明によるビスフェノール化合物にイソブテン等のオレフ
ィン類、アルコール類、カルボニル化合物、ハロゲン化
アルキル等を酸又は塩基触媒の存在下にアルキル化反応
させることによって、種々のアルキル置換誘導体を得る
ことができる。
【0036】例えば、塩化アセチル等のような酸ハロゲ
ン化物や酸無水物をルイス酸の存在下で反応させて、ア
シル置換ビスフェノール化合物を得ることができる。二
酸化炭素を加圧、加熱下で反応させるコルベ・シュミッ
ト反応によれば、カルボキシル置換ビスフェノール化合
物を得ることができる。硝酸−酢酸等のニトロ化剤を反
応させれば、ニトロ置換ビスフェノール化合物を得るこ
とができる。ホルムアルデヒドによってメチロール化反
応させれば、メチロール基を有するビスフェノール化合
物を得ることができる。アルカリ性水溶液中、無水酢酸
によってアセチル化すれば、アセチル置換ビスフェノー
ル化合物を、また、アルカリ性水溶液中、クロロホルム
によってホルミル化すれば、アルデヒド置換ビスフェノ
ール化合物を得ることができる。ハロゲン化試剤によっ
てハロゲン化すれば、ハロゲン置換ビスフェノール化合
物を得ることができ、ジアゾニウム塩を反応させれば、
アゾ置換ビスフェノール化合物を得ることができる。ホ
ルムアルデヒドと第2級アミンとを反応させれば、アミ
ノメチル置換ビスフェノール化合物を得ることができ
る。亜硝酸との反応によれば、ニトロソ置換ビスフェノ
ール化合物を得ることができる。酸又はアルカリ触媒の
存在下、他のフェノール類と反応させることによって、
ノボラック樹脂を得ることができる。
【0037】次に、フェノール性水酸基に対する反応に
よって誘導体を得る具体例としては、例えば、フェノー
ル性水酸基にハロゲン化アルキル、ハロゲン化アリル、
エピクロロヒドリン等を反応させることによって、それ
ぞれ対応するビスフェノールエーテル化合物を得ること
ができる。
【0038】特に、フェノール性水酸基をt−ブトキシ
カルボニルメチルエーテルとするには、本発明によるビ
スフェノール化合物を適当な溶媒に溶解させた後、得ら
れた溶液にクロロ酢酸t−ブチルと炭酸カリウムを加
え、攪拌下に加熱することによって得ることができる。
また、本発明によるビスフェノール化合物を適当な溶媒
に溶解させ、エピクロロヒドリンを反応させて得られる
グリシジルエーテルは、エポキシ樹脂として利用するこ
とができる。このようなグリシジルエーテルに更にアク
リル酸やメタクリル酸を反応させれば、エポキシ(メ
タ)アクリレートを得ることもできる。フェノール性水
酸基に酸無水物、酸塩化物等を反応させることによっ
て、ビスフェノールエステルを得ることができる。特
に、フェノール水酸基に、例えば、1,2−ナフトキノン
ジアジド−4−スルホニルクロライドを反応させれば、
ビスフェノール化合物のナフトキノンジアジドスルホン
酸エステルを得ることができる。
【0039】上記以外にも、本発明によるビスフェノー
ル化合物を、例えば、加圧下、気相反応によって、芳香
環を完全水素化又は部分環水素化することによって、種
々の多環芳香環水素化化合物を得ることができる。
【0040】
【実施例】以下に実施例を挙げて以下に本発明を説明す
るが、本発明はこれら実施例により何ら限定されるもの
ではない。
【0041】実施例1
(4−〔1,1−ビス(3−シクロヘキシル−4−ヒドロ
キシフェニル〕メチル〕ビフェニルの製造)o−シクロ
ヘキシルフェノール1584g、濃塩酸158g、メタ
ノール158g及びドデシルメルカプタン55gを四つ
口フラスコに仕込み、攪拌下、温度を40℃に保ちなが
ら、3時間かけて、4−ホルミルビフェニル546gを
加え、その後、温度40℃で6時間反応させた。
【0042】反応終了後、反応混合物にトルエンを加え
た後、水酸化ナトリウム水溶液を加え、酸触媒を中和し
て、析出した結晶を濾過して、目的とするビスフェノー
ル化合物953gを純度98.6%の橙色結晶として得
た。収率は、4−ホルミルビフェニルに対して、61.6
%であった。
【0043】融点:(示差走査熱量分析法(DSC法)
による測定ができなかった。)
マススペクトル(分子イオンピーク):516
プロトン核磁気共鳴スペクトル(溶媒DMSO−D6、
標準TMS):
【0044】
【化5】
【0045】
【表1】
【0046】実施例2
(4−〔1,1−ビス(2−メチル−4−ヒドロキシ−5
−シクロヘキシルフェニル〕メチル〕ビフェニルの製
造)2−シクロヘキシル−5−メチルフェノール136
gのメタノール(170g)溶液、濃塩酸170g、メ
タノール170g及びドデシルメルカプタン4gを四つ
口フラスコに仕込み、攪拌下、温度を40℃に保ちなが
ら、2時間かけて、4−ホルミルビフェニル434gを
加え、その後、温度40℃で6時間反応させた。
【0047】反応終了後、反応混合物にトルエンを加え
た後、水酸化ナトリウム水溶液を加え、酸触媒を中和し
て、70℃に昇温し、水層を分離した。得られた油層を
水洗した後、n−ヘプタンを加え、晶析し、析出した結
晶を濾過して、目的とするビスフェノール化合物の粗結
晶1253gを得た。これをトルエンから再結晶して、
純度99.7%の白色結晶987gを得た。収率は、4−
ホルミルビフェニルに対して、76.1%であった。
【0048】融点:203℃(DSC法)
マススペクトル(分子イオンピーク):544
プロトン核磁気共鳴スペクトル(溶媒DMSO−D6、
標準TMS):
【0049】
【化6】
【0050】
【表2】
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel bisphenol compound and, more particularly, to a novel bisphenol compound having a trisphenylmethane-type skeleton and each having a cyclohexyl group as a substituent. A novel 4-cyclohexylphenol structure linked via a biphenylalkylidene group
[1,1-bis (3-cyclohexyl-4-hydroxyphenyl] alkyl] biphenyls [0002] Such bisphenol compounds include, for example, materials for photoresists for semiconductors, LCDs, etc., and sealing of integrated circuits. Materials for epoxy resin or hardener used for anti-blocking materials, electrical insulating materials, etc., polycarbonate resin raw materials,
It is useful as an acrylate resin raw material, a developer used for thermal recording, an anti-fading agent, and the like. In addition, it is also useful as an additive such as a bactericide, a fungicide and a fungicide. [0003] Conventionally, bisphenol compounds have been used as raw materials for epoxy resins and curing agents therefor for various electrical and electronic device parts, polycarbonate resin raw materials, and the like.
It is widely and widely used as an acrylate resin material, a developer for thermal recording, and as an additive such as an antioxidant, a bactericide, and a fungicide. In recent years, in recent years, in the field of electrical and electronic equipment parts, with the demand for smaller and higher performance equipment, organic materials used for them have also been improved in conventional mechanical and thermal properties. Without stopping,
Improvements in various performances such as long-term stability against moisture, electrical insulation, and low dielectric properties are increasingly required. Conventionally, among bisphenol compounds, trisphenylmethane type bisphenol compounds are disclosed, for example, in JP-A-6-199717, 4,4'-.
[(4-hydroxyphenyl) methylene] bis [2-methylphenol] is disclosed in
4 '-[(4-hydroxyphenyl) methylene] bis [2
-Cyclohexyl-5-methylphenol] and 4,4'-
[(2-hydroxyphenyl) methylene] bis [2-cyclohexyl-5-methylphenol] is disclosed. When the bisphenol compound of the trisphenylmethane type has a large number of phenyl groups in the molecule, that is, when the density of the phenyl nucleus is high, the use of such a bisphenol compound as a raw material enables low water absorption. It is expected to provide a resin having excellent electrical properties such as insulation properties and low dielectric properties, in addition to water resistance and heat resistance such as heat resistance and low moisture absorption. Accordingly, for example, Japanese Patent Application Laid-Open No. Sho 62-12278.
No. 2 and Japanese Patent Application Laid-Open No. 62-289536 also propose a bisphenol compound having a molecule in which a biphenyl group is introduced instead of a phenyl group. However, this is a trisphenylmethane type bisphenol compound in which two cyclohexylphenol structures each having cyclohexyl as a substituent are bonded via a biphenylalkylidene group, 4- [1,1-bis (3- Cyclohexyl-4-hydroxyphenyl] alkyl] biphenyls have not been known in the prior art [0008] The present invention relates to a novel bisphenol compound as described above, 4- [1, It is an object of the present invention to provide 1-bis (3-cyclohexyl-4-hydroxyphenyl] alkyl] biphenyls, according to the present invention. [0010] Wherein R 1 represents a hydrogen atom or a methyl group; R 2 represents an alkyl group having 1 to 4 carbon atoms;
It is an integer of 2. The present invention provides a novel 4- [1,1-bis (3-cyclohexyl-4-hydroxyphenyl] alkyl] biphenyl represented by the following formula: DETAILED DESCRIPTION OF THE INVENTION Novel bisphenol compound according to the present invention That is, 4- [1,1-bis (3-cyclohexyl-4-hydroxyphenyl] alkyl] biphenyls are represented by the general formula (I), wherein the alkyl group (R 2 ) is Examples thereof include a methyl group, an ethyl group, a linear or branched propyl group or a butyl group, etc. Particularly, in the present invention, the alkyl group is preferably a methyl group, and a hydroxyl group Therefore, the bisphenol compound according to the present invention is preferably, for example, (1) 4
-[1,1-bis (3-cyclohexyl-4-hydroxyphenyl] methyl] biphenyl, (2) 4- [1,1-bis (3-cyclohexyl-4-hydroxy-6-methylphenyl] methyl] biphenyl ( 3) 4- [1,1-bis (3-cyclohexyl-4-hydroxyphenyl] ethyl] biphenyl, (4) 4-
[1,1-bis (3-cyclohexyl-4-hydroxy-
6-methylphenyl] ethyl] biphenyl and the like, but are not limited thereto. The novel bisphenol compound according to the present invention can be obtained by reacting the bisphenol compound of the general formula (II) in the presence of an acid catalyst and a cocatalyst. A carbonyl compound represented by the formula:
-Formyl biphenyl or 4-acetyl biphenyl;
General formula (III) (Wherein R 2 represents an alkyl group having 1 to 4 carbon atoms, and m is an integer of 0 to 2), and can be obtained by a dehydration condensation reaction with a cyclohexylphenol represented by the following formula: . When 4-formylbiphenyl is used as the carbonyl compound, 4- [1,1-bis (3-
Cyclohexyl-4-hydroxyphenyl] methyl] biphenyl can be obtained, and when 4-acetylbiphenyl is used as the carbonyl compound,
[1,1-bis (3-cyclohexyl-4-hydroxyphenyl] ethyl] biphenyl can be obtained In the cyclohexylphenol represented by the general formula (III), as described above, the alkyl group Examples include, for example, a methyl group, an ethyl group, a linear or branched propyl group or a butyl group and the like, and particularly, a methyl group is preferable, and a methyl group is located at a meta position with respect to a hydroxyl group. Therefore, such cyclohexylphenols include 2-cyclohexylphenol and 2-cyclohexylphenol.
Cyclohexyl-5-methylphenol, 2-cyclohexyl-5-ethylphenol, 2-cyclohexyl-
5-isopropylphenol, 2-cyclohexyl-5
-T-butylphenol and the like. In the production of the bisphenol compound according to the present invention, the cyclohexylphenol is used in an amount of at least 2 parts by mol, usually in the range of 2 to 30 parts by mol, preferably 1 part by mol of the above carbonyl compound.
It is used in the range of 2 to 20 parts by mole, particularly preferably in the range of 3 to 6 parts by mole. In the reaction between the cyclohexylphenols and the carbonyl compound, a reaction solvent may or may not be used. When a reaction solvent is used, for example, an aliphatic alcohol solvent, an aliphatic ketone solvent, an aromatic hydrocarbon solvent, or a mixed solvent thereof is used. The alcohol solvent may be selected from methanol, ethanol, isopropyl alcohol, n-propyl alcohol, t-butyl alcohol, isobutyl alcohol in consideration of the reaction raw materials to be used, the solubility of the obtained product, reaction conditions, and the economics of the reaction. Alcohol, n-butyl alcohol and the like can be mentioned. As the aliphatic ketone solvent,
For example, isopropyl ketone, methyl ethyl ketone, methyl isobutyl ketone, diisopropyl ketone and the like can be mentioned. Also, as the aromatic hydrocarbon solvent,
For example, toluene, xylene, cumene and the like can be mentioned. Such a solvent is usually used in an amount of 10 to 1000 parts by weight, preferably 30 to 300 parts by weight, based on 100 parts by weight of the carbonyl compound used, but is not limited thereto. Absent. In the present invention, the acid catalyst is preferably an acid soluble in a reaction solvent. Therefore, for example, hydrogen chloride gas, hydrochloric acid, sulfuric acid, sulfuric anhydride, phosphoric acid, p-toluenesulfonic acid, methanesulfonic acid, Preferred specific examples include trifluoromethanesulfonic acid, oxalic acid, formic acid, phosphoric acid, trichloroacetic acid, and trifluoroacetic acid. Particularly, hydrochloric acid is preferably used. For example, in the case of 35% hydrochloric acid, such an acid catalyst is used in an amount of 1 to 500 parts by weight, preferably 20 to 100 parts by weight, based on 100 parts by weight of the carbonyl compound. In the production of the bisphenol compound according to the present invention, it is preferable to use a co-catalyst together with the above-mentioned acid catalyst. Examples of the co-catalyst include, for example, those having 1 to 18 carbon atoms.
And inorganic or organic sulfur compounds such as mercaptans, hydrogen sulfide, thiophenols, thioacids, and dialkyl sulfides. Such a co-catalyst is
Usually, based on 1 mol part of the carbonyl compound,
It is used in the range of 0.005 to 0.2 mol part, preferably 0.01 to 0.1 mol part. The reaction between the cyclohexylphenol and the carbonyl compound is usually carried out at a temperature in the range of 10 to 80 ° C., preferably 20 to 60 ° C., while stirring under a nitrogen stream for about 2 to 36 hours. Usually, it may be performed for about 10 to 24 hours. According to the method of the present invention, after completion of the reaction, an appropriate crystallization solvent is added to the obtained reaction mixture, and then an alkali such as sodium hydroxide is added to adjust the pH of the reaction mixture to 5 or less.
Neutralization until about 7 is obtained, and if crystals precipitate, they are filtered and dried to obtain the bisphenol compound according to the present invention. If necessary, a higher purity product can be obtained by recrystallization from an appropriate crystallization solvent. After completion of the reaction, an appropriate organic solvent is added to the obtained reaction mixture, and then an alkali such as sodium hydroxide is added to neutralize the reaction mixture until the pH becomes about 5 to 7. After removing and washing the obtained oil layer with water, an appropriate crystallization solvent is added, and the precipitated crude crystals are filtered and recrystallized from an appropriate crystallization solvent to obtain a purified product of the target bisphenol compound. Can be. In the present invention, the crystallization solvent includes
Usually, aromatic hydrocarbons such as toluene, xylene and cumene, and aliphatic hydrocarbons such as n-hexane, n-heptane and n-octane are preferably used. As described above, the bisphenol compound according to the present invention has a trisphenylmethane type skeleton,
Two cyclohexylphenol structures each having a cyclohexyl group as a substituent are linked via a biphenylalkylidene group. Therefore, the bisphenol compound according to the present invention, when used as a raw material, gives a resin having excellent water resistance such as low water absorption and low moisture absorption, and excellent electrical properties such as insulation and low dielectric properties. Thus, for example, materials for photoresists for semiconductors, LCDs, etc., materials for epoxy resins or hardeners used for sealing materials for integrated circuits, electric insulating materials, etc., developers for thermal recording and color fading prevention It is also useful as an additive such as a bactericide, a fungicide and a fungicide. In particular, the bisphenol compound according to the present invention has a high density of aromatic nuclei in the molecule. Therefore, by using this as a resin material such as a polycarbonate resin or a polyacrylate resin, or a photoresist material, the heat resistance of the bisphenol compound is increased. And moisture resistance and the like can be improved. Further, the bisphenol compound according to the present invention can be used as a starting material to carry out various reactions, for example, a substitution reaction or a hydrogenation reaction on a phenolic aromatic ring, a reaction on a phenolic hydroxyl group, etc., to give various derivatives. It can be. First, as a specific example of obtaining a derivative by a substitution reaction on a phenolic aromatic ring, for example, an olefin such as isobutene, an alcohol, a carbonyl compound, an alkyl halide or the like is added to the bisphenol compound of the present invention by an acid or base catalyst. Various alkyl-substituted derivatives can be obtained by an alkylation reaction in the presence of For example, an acyl-substituted bisphenol compound can be obtained by reacting an acid halide such as acetyl chloride or an acid anhydride in the presence of a Lewis acid. According to the Kolbe-Schmidt reaction in which carbon dioxide is reacted under pressure and heat, a carboxyl-substituted bisphenol compound can be obtained. By reacting a nitrating agent such as nitric acid-acetic acid, a nitro-substituted bisphenol compound can be obtained. By performing a methylolation reaction with formaldehyde, a bisphenol compound having a methylol group can be obtained. An acetyl-substituted bisphenol compound can be obtained by acetylation with acetic anhydride in an alkaline aqueous solution, and an aldehyde-substituted bisphenol compound can be obtained by formylation with chloroform in an alkaline aqueous solution. By halogenating with a halogenating reagent, a halogen-substituted bisphenol compound can be obtained, and by reacting a diazonium salt,
An azo-substituted bisphenol compound can be obtained. By reacting formaldehyde with a secondary amine, an aminomethyl-substituted bisphenol compound can be obtained. According to the reaction with nitrous acid, a nitroso-substituted bisphenol compound can be obtained. By reacting with other phenols in the presence of an acid or alkali catalyst,
A novolak resin can be obtained. Next, specific examples of obtaining a derivative by reacting with a phenolic hydroxyl group include, for example, alkyl halide, allyl halide,
By reacting epichlorohydrin or the like, the corresponding bisphenol ether compounds can be obtained. In particular, in order to convert the phenolic hydroxyl group to t-butoxycarbonylmethyl ether, the bisphenol compound according to the present invention is dissolved in an appropriate solvent, and t-butyl chloroacetate and potassium carbonate are added to the resulting solution. Can be obtained by heating under stirring.
Glycidyl ether obtained by dissolving the bisphenol compound according to the present invention in an appropriate solvent and reacting with epichlorohydrin can be used as an epoxy resin. If such glycidyl ether is further reacted with acrylic acid or methacrylic acid, an epoxy (meth) acrylate can be obtained. By reacting an acid anhydride, an acid chloride, or the like with the phenolic hydroxyl group, a bisphenol ester can be obtained. In particular, if a phenolic hydroxyl group is reacted with, for example, 1,2-naphthoquinonediazide-4-sulfonyl chloride,
A naphthoquinonediazidesulfonic acid ester of a bisphenol compound can be obtained. In addition to the above, various polycyclic aromatic ring hydrogenated compounds can be obtained by subjecting the bisphenol compound according to the present invention to complete hydrogenation or partial ring hydrogenation of the aromatic ring by, for example, gas phase reaction under pressure. Obtainable. EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Example 1 (Production of 4- [1,1-bis (3-cyclohexyl-4-hydroxyphenyl) methyl] biphenyl) 1584 g of o-cyclohexylphenol, 158 g of concentrated hydrochloric acid, 158 g of methanol and 55 g of dodecylmercaptan 546 g of 4-formylbiphenyl was added over 3 hours while maintaining the temperature at 40 ° C. while stirring, and the mixture was reacted at 40 ° C. for 6 hours. After adding toluene, an aqueous sodium hydroxide solution was added to neutralize the acid catalyst, and the precipitated crystals were filtered to obtain 953 g of the desired bisphenol compound as orange crystals having a purity of 98.6%. The ratio was 61.6 with respect to 4-formylbiphenyl.
%Met. Melting point: (Differential scanning calorimetry (DSC method)
Measurement was not possible. ) Mass spectrum (molecular ion peak): 516 Proton nuclear magnetic resonance spectrum (solvent DMSO-D 6,
Standard TMS): [Table 1] Example 2 (4- [1,1-bis (2-methyl-4-hydroxy-5
-Cyclohexylphenyl] methyl] biphenyl 2-cyclohexyl-5-methylphenol 136
g of methanol (170 g) solution, 170 g of concentrated hydrochloric acid, 170 g of methanol and 4 g of dodecylmercaptan were charged into a four-necked flask, and 434 g of 4-formylbiphenyl was added over 2 hours while maintaining the temperature at 40 ° C. with stirring. Thereafter, the reaction was carried out at a temperature of 40 ° C. for 6 hours. After the completion of the reaction, toluene was added to the reaction mixture, and then an aqueous sodium hydroxide solution was added to neutralize the acid catalyst. The temperature was raised to 70 ° C., and the aqueous layer was separated. After the obtained oil layer was washed with water, n-heptane was added thereto for crystallization, and the precipitated crystals were filtered to obtain 1253 g of crude crystals of the target bisphenol compound. This is recrystallized from toluene,
987 g of white crystals having a purity of 99.7% were obtained. The yield is 4-
It was 76.1% based on formylbiphenyl. Melting point: 203 ° C. (DSC method) Mass spectrum (molecular ion peak): 544 Proton nuclear magnetic resonance spectrum (solvent DMSO-D 6 ,
Standard TMS): [Table 2]
Claims (1)
素数1〜4のアルキル基を示し、mは0〜2の整数であ
る。)で表わされるビスフェノール化合物。[Claim 1] A compound represented by the general formula (I): (Wherein, R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkyl group having 1 to 4 carbon atoms, and m is an integer of 0 to 2).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009035495A (en) * | 2007-07-31 | 2009-02-19 | Honshu Chem Ind Co Ltd | Bis(4-oxocyclohexyl) compound and tetrakisphenol compound derived from the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009035495A (en) * | 2007-07-31 | 2009-02-19 | Honshu Chem Ind Co Ltd | Bis(4-oxocyclohexyl) compound and tetrakisphenol compound derived from the same |
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