JP2000058305A - Positive temperature coefficient thermistor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a positive temperature coefficient(PTC) thermistor device which is compact, power-saving and has high thermal efficiency. SOLUTION: A PTC thermistor device is provided with an electrically insulated flat substrate 7 with an extraction electrode 8 heat radiating member 1 of a material having higher thermal conductivity higher than that of the substrate 7, and two different electrodes 6a and 6b covering the portion of at least one principal surface, and comprises at least one PTC thermistor 5 positioned in the direction in which the principal surface is thermally connected to the substrate 7, the heat radiating member 1 and the PTC thermistor 5 which are thermally connected to the substrate 7 so that the heat generated is used efficiently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid electronic mosquito trap which heats an outer periphery of a core rod impregnated with an insecticide, thereby vaporizing the insecticide penetrating the core rod and releasing insecticide gas. The present invention relates to a positive temperature coefficient thermistor device used as a constant temperature heating element.

[0002]

2. Description of the Related Art In recent years, a positive temperature coefficient thermistor device is a liquid type electronic mosquito trap which heats an outer periphery of a core rod impregnated with an insecticide, thereby vaporizing the insecticide penetrating the core rod and dispersing insecticide gas. As the demand increases, high reliability and excellent mass productivity are required at the same time as being widely used. In addition, miniaturization of liquid electronic mosquito traps is also progressing,
There is an urgent need to reduce the size and power consumption of the PTC thermistor devices.

[0003] As a conventional positive temperature coefficient thermistor device, for example, a technique described in Japanese Utility Model Laid-Open No. 5-1803 is known. FIG. 6 shows an exploded perspective view of the PTC thermistor device described in the above publication. As shown in FIG. 6, the PTC thermistor device includes a case 61 and a case lid 6.
2, a disc-shaped positive temperature coefficient thermistor 63, an electrode terminal 64,
65 and a heat radiating member 66,
Has a concave portion 70 whose opening side is opposite to the bottom, the case lid 62 closes the opening surface of the case 61, and the positive temperature coefficient thermistor 63 has electrodes 67 on opposite main surfaces. 68, the recesses 70 such that the electrodes 67, 68 face the bottom and the opening surface.
The electrode terminals 64 and 65 are disposed in the recess 70.
Within the electrode 67 of the positive temperature coefficient thermistor 63,
The heat dissipating member 66 has a heat dissipating cylinder 69 and is superimposed on the heat dissipating cylinder 69.
Are arranged on the bottom outer surface of the case 61. At this time, the case 61 is made of an electrical insulator having excellent heat conductivity, for example, alumina, and the heat radiating member 66 is made of a metal plate having good heat conductivity, for example, an aluminum plate. The operation of the PTC thermistor thus configured is as follows. First, a predetermined voltage is applied to the positive temperature coefficient thermistor 63. At the start of application, a current flows because the resistance of the positive temperature coefficient thermistor 63 is low, and the current causes the correctness thermistor 63 to self-heat gradually. Is attenuated to reach an equilibrium state, and thereafter, this operation is repeated. And
In the positive temperature coefficient thermistor device described in the above publication, a plate-like electrode terminal 64 in contact with an electrode 67 on one main plane is connected to a case 6.
1 is brought into surface contact with the bottom of the heat radiation member 6.
The heat generated by the positive temperature coefficient thermistor 63 is efficiently conducted to the heat radiating member 66 by making a surface contact with the heat sink 6. At this time, the heat generated by the positive temperature coefficient thermistor 63 is transmitted to the heat radiation member 66 mainly from only one main plane side of the positive temperature coefficient thermistor 63. Heat dissipation member 66
, The insecticide-penetrated core rod (not shown), which is provided so as to be able to be taken in and out of the radiating cylinder 69, is heated, and the insecticidal gas is diffused from the core rod.

In the same manner as the positive temperature coefficient thermistor device described in Japanese Utility Model Laid-Open No. Hei 5-18003, a conventional positive temperature coefficient thermistor device is provided with an electrode on a main plane opposed to the positive temperature coefficient thermistor and mainly with the electrode. Only one of the main plane sides is thermally connected to the heat radiating member, and the heat generated by the PTC thermistor is transferred to the object to be heated via the heat radiating member made of aluminum or the like and the electrically insulating case made of alumina or the like. (For example, 5-15
404 and JP-A-9-161951).

[0005]

However, the conventional PTC thermistor device has the following problems.

As an insulating case, a member having high heat conductivity and large heat capacity, such as alumina porcelain, is widely used, so that heat conduction to unnecessary portions is increased and a large amount of heat is lost. It is difficult to maintain the temperature at a predetermined temperature. Therefore, in order to raise and maintain the surface temperature of the heat dissipating member to a predetermined temperature, a large positive temperature coefficient thermistor having a large heat generation must be used, and it is difficult to reduce the size, power consumption, and cost of the device. It is.

Further, since electrodes are provided on both main planes of the disc-shaped positive temperature coefficient thermistor, when one main plane is configured as a heat radiation main plane, the heat generation temperature difference due to the heat radiation direction and position inside the positive temperature coefficient thermistor and A resistance difference occurs,
Since the amount of power flowing through the positive temperature coefficient thermistor depends on the heat generation temperature in the unnecessary portion, it is difficult to maintain the surface temperature of the contact surface at a predetermined temperature. As a countermeasure, increasing the switching temperature (Ts) of the positive temperature coefficient thermistor or adopting a large positive temperature coefficient thermistor are disadvantageous in terms of miniaturization, reliability and cost. is there.

Further, since the power supply electrodes of the positive temperature coefficient thermistor are provided on both main planes of the positive temperature coefficient thermistor, at least one of the electrodes cannot come into contact with a case or a heat radiation member in which the positive temperature coefficient thermistor is installed. It is necessary to provide a lead portion.

The present invention has been made in view of the above problems, and has as its object to provide a positive temperature coefficient thermistor device which is smaller in power consumption and higher in heat utilization efficiency than in the prior art.

[0010]

In order to solve the above problems, a positive temperature coefficient thermistor device according to the present invention comprises a flat electrically insulating substrate having an extraction electrode, and a material having better heat conductivity than the substrate. And at least one positive temperature coefficient thermistor provided with two electrodes of different electrodes covering a part of at least one main plane, and arranged in a direction in which the main plane is thermally coupled to the substrate. The heat radiation member and the positive temperature coefficient thermistor are thermally coupled to the substrate.

According to the thermistor device of the present invention, the heat generated by the positive temperature coefficient thermistor can be efficiently used. It is possible to reduce the size and weight of the device using the positive temperature coefficient thermistor, and all the electrodes are installed in the direction of the board, so the cost of the positive temperature coefficient thermistor is reduced, and furthermore, it is only necessary to mount it on the board, especially Since there is no need to provide a lead portion, it is possible to reduce the manufacturing cost and the number of steps.

Preferably, in claim 1, a thermal coupling portion between the substrate and the heat radiating member, a thermal coupling portion between the substrate and the positive temperature coefficient thermistor, and a peripheral portion of the thermal coupling portion, wherein: The surface of the heat dissipation member and the positive temperature coefficient thermistor is coated or filled with a resin composition having thermal conductivity. With such a configuration, the heat utilization rate is improved, and the PTC thermistor device of the present invention and the PTC thermistor used in the PTC thermistor can be further reduced in size and power consumption.

[0013] Preferably, in claim 2, the resin composition having thermal conductivity is a silicone resin composition. With such a configuration, the heat utilization efficiency is significantly improved, and the PTC thermistor device of the present invention and the PTC thermistor used therein can be further reduced in size and power consumption.

Preferably, at least the positive temperature coefficient thermistor and the extraction electrode are covered with an electrically insulating resin composition.
With such a configuration, the connection between the substrate and the PTC thermistor is firmly ensured, and the weather resistance of the PTC thermistor of the present invention is improved.

Preferably, in any of the first to fourth aspects, a case for storing the positive temperature coefficient thermistor is not included. With such a configuration, there is an effect that the PTC thermistor device of the present invention can be reduced in size and weight.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a positive temperature coefficient thermistor device of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view showing a main part of one embodiment of a positive temperature coefficient thermistor device of the present invention. FIG.
1A is a front view, FIG. 1B is a top view, FIG. 1C is a side view of an embodiment similar to FIG. 1 except that the positive temperature coefficient thermistor device of the present invention has a configuration having three positive temperature coefficient thermistors. 2 (d) is a vertical sectional view taken along line II of FIG. 2 (a). FIG.
FIG. 2 is a schematic cross-sectional view taken along the line II-II of FIG. 2A, showing an installation state of a positive temperature coefficient thermistor and electrodes in the same embodiment as FIG. 2 of the positive temperature coefficient thermistor device of the present invention. FIG. 4 is a schematic partial cross-sectional view for explaining the positional relationship between the electrode on the positive-characteristic thermistor side and the substrate in the positive-characteristic thermistor device of the present invention.

The positive temperature coefficient thermistor device according to the embodiment shown in FIG. 1 has a heat radiation member 1 comprising a flat portion 2, a holding portion 3 and a heat radiation portion 4, positive temperature coefficient thermistors 5, 5 having electrodes 6a, 6b, a substrate 7, Extraction electrode (power supply path) 8, power supply unit 9,
It is roughly composed of a heat transfer auxiliary material 10, a conductive adhesive material 11, and / or a coating material 12.

When FIG. 1 is compared with FIG. 6 showing the prior art, since the heat transfer auxiliary material 10, the conductive adhesive material 11 and the coating material 12 are compositions, the PTC thermistor device of the present invention is constituted. The number of members to be used is significantly smaller than that of the device according to the related art, and it is understood that the PTC thermistor device of the present invention is advantageous in terms of miniaturization, cost, productivity, and the like. For example, as shown in FIGS. 1 and 2, in the positive temperature coefficient thermistor device of the present invention,
The case (exterior body) for storing the positive temperature coefficient thermistor, which has been conventionally used, is not adopted, and the positive temperature coefficient thermistor 5 is mounted on the surface of the rectangular plate-shaped substrate 7 and is protectively coated with the coating material 12 as required. . By not using the case, it is possible to reduce the number of members constituting the device, simplify the process, and reduce the size of the device.

Next, with reference to FIGS. 2A to 2D, an assembling structure of an embodiment of the positive temperature coefficient thermistor device of the present invention will be described.

In the illustrated positive temperature coefficient thermistor device, an extraction electrode 8 and a power supply portion 9 are provided by printing on the surface of a rectangular plate-like substrate 7, and a flat portion 2 is formed on the surface of the substrate 7 opposite to the electrode forming surface. The heat radiating member 1 is fixed by wrapping the substrate 7 with the holding portion 3 so as to be in close contact. The heat transfer auxiliary material 10 is applied and filled into the contact surface between the substrate 7 and the holding portion 2 of the heat radiating member 1 and the space between the substrate 7 and the heat radiating portion 4 in the vicinity of the holding portion 2 of the heat radiating member 1. Thermal coupling with the heat radiating member 1 is strengthened. Further, a positive temperature coefficient thermistor 5 having electrodes 6a and 6b at both ends is disposed on the extraction electrode 8 via a conductive adhesive material 11. The gap between the positive temperature coefficient thermistor 5, the extraction electrode 8 and the substrate 7 is filled with a heat transfer auxiliary material 10 to enhance the thermal coupling between the positive temperature coefficient thermistor 5 and the substrate 7. Further, a coating material 12 is applied so as to cover at least the positive temperature coefficient thermistor 5 and the extraction electrode 8.

Hereinafter, the above-mentioned members constituting the PTC thermistor device of the present invention will be described in detail.

As shown in FIG. 2, the heat radiating member 1 is a member that receives the heat generated by the positive temperature coefficient thermistor 5 through the substrate 7 and transmits the heat to a body to be heated (not shown). 5 is disposed so as to be thermally bonded firmly to the surface opposite to the installation surface, and a flat plate-shaped portion 2 which is a joint portion with the substrate 7, and both ends of the substrate 7 so as to wrap the heat radiation member 1 and the substrate 7. Holding portion 3 which is bent at the portion to secure the joint between heat radiating member 1 and substrate 7, and heat radiating portion 4 which is formed into a cylindrical shape protruding from substrate 7 and transmits heat to the object to be heated.
Consists of

The material of the heat dissipating member 1 is not particularly limited as long as it has high heat conductivity and small heat capacity, but a metal having high heat conductivity such as aluminum can be preferably used. Although the shape is not particularly limited, it is advantageous in terms of thermal efficiency that the contact area between the flat portion 2 and the substrate 7 and between the heat radiating portion 4 and the object to be heated be as large as allowable. . The holding portion 3 may be a member integrated with the flat portion 2 and the heat radiating portion 4 or may be an independent member. The shape of the holding portion 3 may be any as long as the heat radiating member 1 can be held on the substrate 7 while maintaining the necessary strength. The shape is not limited, and may be, for example, a shape bent at both ends of the substrate 7 to hold the heat radiating member 1 and the substrate 7 or a shape bent at a point penetrating a hole provided at an appropriate position of the substrate 7. it can. When attaching the heat radiating member 1 to the substrate 7, a heat transfer auxiliary material 10 such as a silicone resin composition is applied to the joint between the heat radiating member 1 and the substrate 7 and the vicinity thereof, thereby applying heat. By ensuring the coupling, the amount of heat conduction from the substrate 7 to the heat radiating member 1 can be increased, and the variation of each product can be suppressed.

The positive temperature coefficient thermistor 5 is a heat source,
In the present embodiment, the shape is a rectangular parallelepiped (square prism type) having a low height (thickness), but a cylindrical shape (disk type) having a low height may be similarly used. The positive temperature coefficient thermistor 5 is provided with two electrodes 6 a and 6 b of different electrodes covering at least a part of one main plane, and is arranged in a direction in which the main plane is thermally coupled to the substrate 7. For example, FIG.
As shown in (a) and (b), two electrodes 6a and 6b of different electrodes which are opposed to each other so as to cover the side surface in the thickness direction and the two main planes in the vicinity thereof are provided.
(See FIG. 4 (a)),
Alternatively, two electrodes 6a and 6b of different electrodes that cover only one part of one main plane in the thickness direction are provided, and the electrode installation surfaces are arranged in a direction thermally coupled to the substrate 7 (FIG. 4B).
See). In the present embodiment, as shown in FIG. 3 and FIG. 4A, two electrodes 6a and 6b of opposite electrodes which cover the side surface in the thickness direction of the positive temperature coefficient thermistor 5 and both main planes in the vicinity thereof are opposed to each other. And one of the main planes is arranged in a direction in which it is thermally coupled to the substrate 7.

Here, in this specification, "thermal coupling" means a thermal connection capable of transferring heat, and "thermal coupling direction" means a direction in which heat is connected so that heat can be transmitted. , That is, the approach direction.

As the PTC thermistor 5, one or more PTC thermistors having a high switching temperature may be used as before, but preferably the dimensions are 3.2 × 1. One or more small-sized, low-switching-temperature, positive-characteristic thermistors having a switching temperature (Ts) of 150 ° C. and a size of 6 × 1 mm are used. Further, when the positive temperature coefficient thermistor 5 is mounted on the substrate 7, a heat transfer assisting material such as a silicone resin composition or the like is applied to a joint formed between the positive temperature coefficient thermistor 5 and the substrate 7 and a void generated in the vicinity thereof. By applying the material 10 to secure thermal coupling over a large area, the positive temperature coefficient thermistor 5
In addition, it is possible to increase the amount of heat conducted to the device and to suppress variations among products.

In the present embodiment, as shown in FIG. 3, the electrodes 6a and 6b are provided so as to face each other so as to cover the side surface in the thickness direction of the positive temperature coefficient thermistor 5 and both main planes in the vicinity thereof. The portion of the positive characteristic thermistor 5 covering one main plane is placed so as to be in contact with the extraction electrode 8 on the substrate 7 via the conductive adhesive material 11, but as shown in FIG. One each is provided on one main plane in the thickness direction of the thermistor 5 at an appropriate interval,
It can be mounted so as to be in contact with the extraction electrode 8 on the substrate 7. There is no particular limitation on the electrode material and the forming method,
Electrode materials and forming methods commonly used in the art, such as, for example, spraying aluminum, can be used.

The substrate 7 is a support member for the heat radiating member 1 and the positive temperature coefficient thermistor 5 and the like, and is a plate-like member for mediating heat conduction and ensuring electrical insulation. Also,
In the positive temperature coefficient thermistor of the present invention, the extraction electrode 8 and the power supply section 9 are formed on the substrate 7 by printing and firing.
Therefore, as the substrate material, a material having good thermal conductivity, high heat resistance and high insulation, for example, ceramic such as alumina porcelain is preferably used. In this embodiment, alumina porcelain is also used. Although the substrate 7 is made of the same material as the conventional PTC thermistor storage case, its size (the area and the thickness required to satisfy the required strength) is much smaller than the conventional case. Alternatively, it is possible to reduce the heat loss caused by heating of the substrate 7 to increase the thermal efficiency of the thermistor device of the present invention, and at the same time to reduce the size and power consumption. In addition, the surface on which the positive temperature coefficient thermistor 5 is installed is flattened by polishing or the like, so that the heat radiation efficiency can be improved and the variation of each product can be suppressed.

The extraction electrode 8 is provided on the power supply unit 9 provided on the substrate 7, directly on the substrate 7 so as to be adjacent to the power supply unit 9 while securing electrical connection with the power supply unit 9, or directly integrated with the power supply unit 9. An electrode pattern formed by printing and baking a conductive paste containing a conductive metal such as silver on the substrate 7, and electrically connected to the electrodes 6a and 6b provided on the positive temperature coefficient thermistor 5 reliably. Have been. By applying a conductive adhesive material 11 such as solder to a contact portion between the extraction electrode 8 and the electrodes 6a and 6b, or by providing a mechanical crimping means such as a leaf spring, electrical connection can be ensured. preferable. In the present embodiment, as shown in FIG.
The extraction electrode 8 was formed directly on the substrate 7 so as to be adjacent to the power supply section 9 while ensuring electrical connection, and solder was used to connect the extraction electrode 8 to the electrodes 6a and 6b.

The power supply unit 9 is provided on the substrate 7 by printing and baking a conductive paste containing a conductive metal such as silver or copper as a main component, prior to or simultaneously with the formation of the extraction electrode 8. And is electrically connected to both an external power supply (not shown) and the extraction electrode 8 to supply power to the positive temperature coefficient thermistor 5.

The heat transfer auxiliary member 10 is used for the purpose of strengthening the heat coupling between the members and increasing the heat utilization efficiency. The heat transfer auxiliary member 10 extends from the positive temperature coefficient thermistor 5 to the heat radiating portion 4 of the heat radiating member 1. In the heat conduction path, the heat conduction efficiency is improved by applying to the member joint and its peripheral portion as required, and the variation in the heat conduction efficiency of each product which may occur due to the member surface roughness, assembly accuracy, and the like. Can be suppressed. The heat transfer auxiliary material 10 is not particularly limited as long as it is a material having electrical insulation and good heat conductivity, but a good heat conductive resin composition such as a silicone resin composition can be suitably used. For example, in the thermal coupling portion between the substrate 7 and the heat radiating member 1, the thermal coupling portion between the substrate 7 and the positive temperature coefficient thermistor 5, and the peripheral portion of the thermal coupling portion, the substrate 7, the heat radiating member 1 and the positive temperature coefficient thermistor 5 A heat transfer auxiliary material 10 made of a resin composition having thermal conductivity can be applied or filled on the surface of the substrate. In the present embodiment, as shown in FIG. 3, the heat transfer auxiliary material 10 is provided with a gap formed between the positive temperature coefficient thermistor 5 and the substrate 7, a peripheral portion thereof, a bonding portion between the substrate 7 and the heat radiation member 1, and By appropriately filling and coating the peripheral portion and the like, the positive temperature coefficient thermistor 5
The aim is to use the heat generated at the plant efficiently. By improving the heat utilization rate, it is possible to further reduce the size and power consumption of the positive temperature coefficient thermistor device and the positive temperature coefficient thermistor 5 used for the same.

The conductive adhesive material 11 is applied to the junction between the extraction electrodes 8 and the electrodes 6a and 6b provided on the positive temperature coefficient thermistor 5 to secure electrical connection or to connect the positive temperature coefficient thermistor 5 and the substrate 7 to each other. Can be maintained. The use of the conductive adhesive 11 eliminates the need for other mechanical bonding and holding means, thereby reducing the number of steps and the number of required members, which is advantageous in terms of cost, and also reduces the size of the apparatus. It is advantageous. Solder or the like can be used as the conductive adhesive 11. In the present embodiment, solder is used as the conductive adhesive 11, and is soldered so as to cover the electrodes 6a and 6b of the positive temperature coefficient thermistor 5, as shown in FIG.

The coating material 12 is provided so as to cover the positive temperature coefficient thermistor 5 and the positive temperature coefficient thermistor mounting surface of the substrate 7 as required.
In addition, the support and insulation of the substrate 7 are ensured, and the PTC thermistor device of the present invention is protected from the external environment. When the coating material 12 is provided, it is preferable that at least the PTC thermistor 5 and the extraction electrode 8 be covered to reinforce the connection between the substrate 7 and the PTC thermistor 5. The coating material 12 is not particularly limited as long as it has excellent weather resistance, is electrically insulated and has good heat conductivity, and is preferably an electrically insulating resin composition having excellent weather resistance such as a silicone resin composition. Used for In the present embodiment, a part of the positive temperature coefficient thermistor 5, the extraction electrode 8, and the power supply unit 9 is covered by using a silicone resin as the coating material 12.

The PTC thermistor device of the present invention configured as described above may be provided with a member used for mounting and holding the device, if desired. Regarding the positive temperature coefficient thermistor device of the present invention provided with such a member,
This will be described with reference to FIG. 5 (a) is a front view, FIG. 5 (b) is a top view, and FIG. 5 (c) is a PTC thermistor device of the present invention.
FIG. 6D is a side view, and FIG. 5D is a vertical sectional view taken along the line III-III of FIG.

In this embodiment, the positive temperature coefficient thermistor device of the present invention includes a mounting member 13 in addition to the members described above.
This device is the same as the PTC thermistor device of the embodiment shown in FIGS.

The mounting member 13 is a holding member of the PTC thermistor device of the present invention. In the present embodiment shown in FIG. 5, it is formed of a PPS (polyphenylene sulfide) resin composition and covers the coating material 12. Protecting part 15 and square tube part 16 protruding from the center of said protecting part 15
The square tube portion 16 is provided with a mounting screw hole 14. And, this mounting member 13
Is fixed to the substrate 7 by pressing the end of the protection portion 15 with the holding portion 3 of the heat radiation member 1. The PTC thermistor device of the present invention can be easily mounted on an external member (not shown) by using the mounting screw holes 14. In the present embodiment, the mounting member 13 having the shape and the material as described above is used. However, the shape and the material of the mounting member 13 are not particularly limited, and may be selected according to characteristics and applications required for the product. This is a design item that is determined as appropriate.

The provision of the mounting member 13 in the PTC thermistor device of the present invention not only assists in supporting / holding the device, but also enables the PTC thermistor 5 and other energized parts to be used together with the coating material 12. The protection is doubled, and the weather resistance can be greatly improved.

Table 1 below shows the results of comparing the characteristics of the positive temperature coefficient thermistor device of the present invention shown in FIG. 1 with the characteristics of the conventional positive temperature coefficient thermistor device shown in FIG.

The conventional positive temperature coefficient thermistor device used here is described in Japanese Utility Model Laid-Open No. 5-180003, and is the device shown in FIG. The characteristics were compared by measuring the power consumption and the surface temperature of the heat radiating member.

[0041]

[Table 1]

From the above Table 1, it can be seen that the PTC thermistor device according to the present invention is smaller in size and lower in switching temperature than the prior art.
Using TC, it can be confirmed that the power consumption and the surface temperature of the heat radiating member exhibit better characteristics than before.

[0043]

The positive temperature coefficient thermistor device of the present invention uses a high thermal conductivity and small heat capacity material such as aluminum as a heat radiating member, and uses a positive temperature coefficient thermistor instead of the case for storing a conventionally used positive temperature coefficient thermistor. The use of a mounting substrate allows efficient use of the heat generated by the positive temperature coefficient thermistor, reducing variations in the surface temperature of the heat dissipating member for each product, and reducing the size and power consumption of the device. Can be.

Further, the positive temperature coefficient thermistor is provided with two electrodes 6a and 6b of different electrodes covering at least one part of one main plane, and the positive temperature coefficient thermistor is arranged in a direction in which said main plane is thermally coupled to the substrate 7. The heat generation part of the positive temperature coefficient thermistor and the substrate are thermally bonded, and furthermore, a heat transfer auxiliary material is applied and filled in each of the heat connection parts and the vicinity thereof to strengthen the heat bonding, so that the heat generated by the positive temperature coefficient thermistor is reduced. It is possible to use the PTC thermistor efficiently and to use a small and lightweight PTC thermistor and to reduce the size and weight of an apparatus using such a PTC thermistor.

Further, it is possible to use a small and light chip type positive temperature coefficient thermistor, and since all the electrodes are arranged in the direction of the substrate, the cost of the positive temperature coefficient thermistor is reduced, and furthermore, the mounting of the temperature coefficient thermistor on the substrate is also possible. Since only a mount is required, and there is no need to particularly provide a lead portion, the manufacturing cost and the number of steps can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a main part of one embodiment of a positive temperature coefficient thermistor device of the present invention.

FIG. 2 is a view showing a PTC thermistor device according to an embodiment of the present invention, which is similar to FIG.

FIG. 3 is a schematic diagram illustrating the installation state of a positive temperature coefficient thermistor and electrodes in the same embodiment as FIG. 2 of the positive temperature coefficient thermistor device of the present invention.

FIG. 4 is a schematic diagram illustrating a positional relationship between an electrode on the positive-characteristic thermistor side and a substrate in the positive-characteristic thermistor device of the present invention.

FIG. 5 is a view showing one embodiment having a mounting member of the positive temperature coefficient thermistor device of the present invention.

FIG. 6 is an exploded perspective view of a conventional PTC thermistor device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 heat radiating member 2 flat portion 3 holding portion 4 heat radiating portion 5 positive temperature coefficient thermistor 6 a, 6 b electrode 7 substrate 8 extraction electrode 9 power feeding portion 10 heat transfer auxiliary material 11 conductive adhesive material 12 coating material 13 mounting member 14 mounting screw hole 15 Protection part 16 square tube part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroshi Nohara 1-13-1 Nihombashi, Chuo-ku, Tokyo TDC Corporation F-term (reference) 2B121 CA04 CA39 CA60 FA03 FA05 3K092 PP20 QA07 QB21 QB34 QB49 QC03 QC27 QC50 RF03 RF11 SS12 SS17 TT26 TT27 TT30 VV03 VV04 5E034 AA03 AA05 AA08 AB01 DA01 DA03 DB05 DB07

Claims (5)

[Claims] 1. A flat electrically insulating substrate having an extraction electrode, a heat dissipating member made of a material having better heat conductivity than the substrate, and a different electrode covering at least one portion of at least one main plane. An electrode is provided, and at least one PTC thermistor disposed in a direction in which the main plane is thermally coupled to the substrate; and the heat dissipation member and the PTC thermistor are thermally coupled to the substrate. Positive characteristic thermistor device. 2. A thermal coupling portion between the substrate and the heat radiating member,
Applying or filling a resin composition having thermal conductivity on the surfaces of the substrate, the heat dissipating member, and the positive temperature coefficient thermistor at the thermal coupling portion between the substrate and the positive temperature coefficient thermistor, and at the peripheral portion of the thermal coupling portion. 2. The positive temperature coefficient thermistor device according to claim 1, wherein: 3. The PTC thermistor device according to claim 2, wherein the resin composition having thermal conductivity is a silicone resin composition. 4. The PTC thermistor device according to claim 1, wherein at least the PTC thermistor and the extraction electrode are coated with an electrically insulating resin composition. 5. The method according to claim 1, wherein a case for storing the PTC thermistor is not included.
Item 7. The positive temperature coefficient thermistor device according to the above item.