JP2000052495A - Release film - Google Patents
Release filmInfo
- Publication number
- JP2000052495A JP2000052495A JP10222782A JP22278298A JP2000052495A JP 2000052495 A JP2000052495 A JP 2000052495A JP 10222782 A JP10222782 A JP 10222782A JP 22278298 A JP22278298 A JP 22278298A JP 2000052495 A JP2000052495 A JP 2000052495A
- Authority
- JP
- Japan
- Prior art keywords
- film
- release
- group
- resin
- polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006267 polyester film Polymers 0.000 claims abstract description 26
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 18
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 12
- 229930192474 thiophene Natural products 0.000 claims abstract description 10
- 229920001577 copolymer Polymers 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 23
- 229920002050 silicone resin Polymers 0.000 claims description 18
- -1 alkyl isocyanate Chemical class 0.000 claims description 15
- 150000003577 thiophenes Chemical class 0.000 claims description 8
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 230000001747 exhibiting effect Effects 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 230000029936 alkylation Effects 0.000 claims description 2
- 238000005804 alkylation reaction Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 44
- 239000011347 resin Substances 0.000 description 44
- 238000000576 coating method Methods 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 31
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 29
- 229920000728 polyester Polymers 0.000 description 23
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 230000007704 transition Effects 0.000 description 15
- 238000001723 curing Methods 0.000 description 13
- 229920001225 polyester resin Polymers 0.000 description 12
- 239000004645 polyester resin Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- 229940048053 acrylate Drugs 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 10
- 239000010419 fine particle Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- 229920006243 acrylic copolymer Polymers 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 238000005299 abrasion Methods 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- QWDQYHPOSSHSAW-UHFFFAOYSA-N 1-isocyanatooctadecane Chemical compound CCCCCCCCCCCCCCCCCCN=C=O QWDQYHPOSSHSAW-UHFFFAOYSA-N 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 2
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 125000000466 oxiranyl group Chemical group 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 125000000475 sulfinyl group Chemical group [*:2]S([*:1])=O 0.000 description 2
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 241000566146 Asio Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- ZFDIRQKJPRINOQ-HWKANZROSA-N Ethyl crotonate Chemical compound CCOC(=O)\C=C\C ZFDIRQKJPRINOQ-HWKANZROSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 101150000971 SUS3 gene Proteins 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 125000005263 alkylenediamine group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000006297 carbonyl amino group Chemical group [H]N([*:2])C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- LLLCSBYSPJHDJX-UHFFFAOYSA-M potassium;2-methylprop-2-enoate Chemical compound [K+].CC(=C)C([O-])=O LLLCSBYSPJHDJX-UHFFFAOYSA-M 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- ZFDIRQKJPRINOQ-UHFFFAOYSA-N transbutenic acid ethyl ester Natural products CCOC(=O)C=CC ZFDIRQKJPRINOQ-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Polyesters Or Polycarbonates (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は離形フィルムに関
し、さらに詳しくはポリエステルフィルムをベースフィ
ルムとし、繰り出しや走行の際に帯電が少なく、粘着剤
フィルムや樹脂シート等の成形用キャリヤーフィルムに
用いた際に離形層上に形成された粘着剤フィルムや樹脂
シートに帯電障害を生じさせることなく、優れた剥離挙
動を有する離形フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a release film, and more particularly, to a polyester film as a base film, which is less charged during feeding and running, and is used for a carrier film for molding such as an adhesive film or a resin sheet. The present invention relates to a release film having an excellent peeling behavior without causing a charging failure in a pressure-sensitive adhesive film or a resin sheet formed on a release layer.
【0002】[0002]
【従来の技術】離形フィルムは、粘着剤被膜、樹脂シー
ト、樹脂被膜あるいはセラミックシート等の成形用キャ
リヤーフィルムとして用いられ、例えば、塩化ビニル樹
脂シートは塩化ビニル樹脂と溶媒からなる塗液を離形フ
ィルム(キャリヤーフィルム)上に塗工した後、溶媒を
加熱除去することにより塩化ビニルシート(例えばマー
キングシート用)として成形される。これらの粘着剤被
膜、樹脂シート、樹脂被膜あるいはセラミックシート
は、キャリヤーフィルム上に形成された積層フィルムの
まま搬送され、適当な大きさに裁断され、印刷等に供さ
れる。2. Description of the Related Art A release film is used as a carrier film for forming an adhesive film, a resin sheet, a resin film or a ceramic sheet. For example, a vinyl chloride resin sheet separates a coating liquid comprising a vinyl chloride resin and a solvent. After coating on a shaped film (carrier film), the solvent is removed by heating to form a vinyl chloride sheet (for example, for a marking sheet). These pressure-sensitive adhesive films, resin sheets, resin films, or ceramic sheets are conveyed as they are as a laminated film formed on a carrier film, cut into an appropriate size, and provided for printing or the like.
【0003】これらの搬送や裁断、印刷等の工程では上
記の積層フィルムは種々のロール、ベルトコンベヤーと
接触する。ところが、ポリエステルフィルムをベースフ
ィルムとした離形フィルムをキャリヤーフィルムに用い
た場合、ポリエステルフィルムが帯電しやすく、さらに
帯電電圧がある値以上になると、製品となる樹脂シート
等をキャリヤーフィルムから剥離した際に樹脂シート等
の表面に放電が起こり、特に放電が著しい場合には樹脂
シート等の表面に重大な物理的損傷を与える問題があっ
た。In the steps of transporting, cutting and printing, the above-mentioned laminated film comes into contact with various rolls and belt conveyors. However, when a release film using a polyester film as a base film is used as a carrier film, the polyester film is easily charged, and when the charging voltage is a certain value or more, when a resin sheet or the like as a product is peeled from the carrier film. In addition, discharge occurs on the surface of the resin sheet or the like, and particularly when the discharge is remarkable, serious physical damage is caused on the surface of the resin sheet or the like.
【0004】また、樹脂シート等をキャリヤーフィルム
と積層したまま、あるいは樹脂シート等をキャリヤーフ
ィルムから離形分離した後に所望の一定形状に裁断し、
この裁断された一定形状のシートをケース等に積み重ね
る場合、電気的反発によりきれいに積み重ねることがで
きなかったり、逆に電気的引き合いにより積み重ねられ
たシート同士が貼り付いてしまい、シートの角を揃えよ
うとしてもきれいに揃えられなかったり、シートを一枚
づつ拾い上げる場合に数枚のシートが貼り付いた状態で
拾い上げられてしまったりする等の不具合が生じてい
た。[0004] Further, the resin sheet or the like is cut into a desired constant shape while being laminated with the carrier film, or after the resin sheet or the like is separated and separated from the carrier film,
When stacking the cut sheets of a certain shape on a case etc., it is not possible to stack them neatly due to electrical repulsion, or conversely, the stacked sheets will stick together due to electrical inquiries, so try to align the corners of the sheets However, when the sheets are picked up one by one, there are problems such as being picked up with several sheets stuck together.
【0005】これらの問題を解決するために該離形フィ
ルムに次の通り、種々の帯電防止処理方法が提案されて
おり、その1つとしてシリコーン樹脂層に直接帯電防止
性のある化合物を添加する方法が提案されているが帯電
防止性のある化合物を添加した場合、シリコーン樹脂層
の架橋反応が阻害され、剥離特性、滑り性などの特性が
悪化するだけでなく、ロールに巻取った際にその背面と
ブロッキング(貼り付き現象)を起したり、ひどい場合
には工程のロールに転写し、工程汚染を引き起こす。さ
らに、樹脂シートなどのキャスティングに使用した場
合、シリコーン樹脂や帯電防止化合物の転写によりその
樹脂シートを汚染するという問題があった。これらの場
合、帯電防止性化合物の添加量を少なくする方法もある
が所望の帯電防止性能が得られなかったりする。In order to solve these problems, various antistatic treatment methods have been proposed for the release film as follows. As one of the methods, a compound having an antistatic property is directly added to a silicone resin layer. Although a method has been proposed, when a compound having an antistatic property is added, the crosslinking reaction of the silicone resin layer is inhibited, and not only properties such as peeling properties and slipperiness are deteriorated, but also when wound on a roll. Blocking (sticking phenomenon) occurs on the back surface, and in severe cases, it is transferred to a process roll to cause process contamination. Further, when the resin sheet is used for casting, there is a problem that the resin sheet is contaminated by transfer of a silicone resin or an antistatic compound. In these cases, there is a method of reducing the amount of the antistatic compound to be added, but a desired antistatic performance may not be obtained.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は、かか
る従来技術の欠点を改良し、繰り出しや走行の際に帯電
が少なく、粘着剤フィルムや樹脂シート等の成形用キャ
リヤーフィルムに用いた際に離形層に形成された粘着剤
フィルムや樹脂シートに帯電障害を生じることなく、ま
た適度の力で剥離が可能な(離形性がよい)離形層表面
を有する離形フィルムを提供することである。SUMMARY OF THE INVENTION An object of the present invention is to improve the drawbacks of the prior art, to reduce the charge during feeding or running, and to be used for a carrier film for molding such as an adhesive film or a resin sheet. The present invention provides a release film having a release layer surface (having good releasability) which can be peeled off by an appropriate force without causing a charging failure to an adhesive film or a resin sheet formed on the release layer. That is.
【0007】[0007]
【課題を解決するための手段】本発明の目的は、下記1
又は2の構成からなる表面保護フィルムによって達成さ
れる。The object of the present invention is to provide the following:
Or, it is achieved by the surface protective film having the configuration of 2.
【0008】すなわち第1の構成は、ポリエステルフィ
ルムの片面に表面固有抵抗値が1×105 〜1×1012
Ω/□の帯電防止層を設け、その帯電防止層の上に離形
層を設けてなる離形フィルムであって、帯電防止層中に
チオフェン及び/又はチオフェン誘導体を重合して得ら
れる導電性重合体を含むことを特徴とする離形フィルム
である。That is, in the first configuration, the surface resistivity of the polyester film is 1 × 10 5 to 1 × 10 12 on one side.
A release film comprising an antistatic layer of Ω / □ and a release layer provided on the antistatic layer, and a conductive film obtained by polymerizing thiophene and / or a thiophene derivative in the antistatic layer. A release film comprising a polymer.
【0009】そして第2の構成は、ポリエステルフィル
ムの一方の面に表面固有抵抗値が1×105 〜1×10
12Ω/□の帯電防止層を設け、他方の面に離形層を設け
てなる離形フィルムであって、帯電防止層中にチオフェ
ン及び/又はチオフェン誘導体を重合して得られる導電
性重合体を含むことを特徴とする離形フィルムである。[0009] The second structure is that the one side of the polyester film has a surface resistivity of 1 × 10 5 to 1 × 10 5
A release film comprising an antistatic layer of 12 Ω / □ and a release layer on the other surface, wherein the conductive polymer is obtained by polymerizing thiophene and / or a thiophene derivative in the antistatic layer. And a release film comprising:
【0010】また、前述の2つの構成以外に、ポリエス
テルフィルムの両面に帯電防止層を設け、一方の面に離
形層を設けたり、両面に離形層を設けた離形フィルムが
挙げられる。In addition to the above two constitutions, a release film in which an antistatic layer is provided on both surfaces of a polyester film and a release layer is provided on one surface, or a release layer is provided on both surfaces.
【0011】以下、本発明を具体的に説明する。Hereinafter, the present invention will be described specifically.
【0012】本発明におけるポリエステルフィルムと
は、ポリエステルからなるフィルムである。The polyester film in the present invention is a film made of polyester.
【0013】本発明においてポリエステルとは、ジカル
ボン酸成分とグリコール成分とからつくられる。ジカル
ボン酸成分としてはテレルタル酸、イソフタル酸、2,
6―ナフタレンジカルボン酸、ヘキサヒドロテレフタル
酸、4,4′―ジフェニルジカルボン酸、アジピン酸、
セバシン酸、ドデカンジカルボン酸、等を例示しうる。
特にフィルムの機械的性質の点からテレフタル酸、2,
6―ナフタレンジカルボン酸が好ましい。In the present invention, the polyester is formed from a dicarboxylic acid component and a glycol component. As dicarboxylic acid components, terephthalic acid, isophthalic acid, 2,2
6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, 4,4'-diphenyldicarboxylic acid, adipic acid,
Sebacic acid, dodecanedicarboxylic acid and the like can be exemplified.
In particular, terephthalic acid, 2,
6-Naphthalenedicarboxylic acid is preferred.
【0014】グリコール成分としてはエチレングリコー
ル、ジエチレングリコール、プロピレングリコール、
1,3―プロパンジオール、1,4―ブタンジオール、
ネオペンチルグリコール、1,6―ヘキサンジオール、
シクロヘキサンジメタノール、ポリエチレングリコール
等を例示しうる。特にフィルムの剛直性の点からエチレ
ングリコールが好ましい。As the glycol component, ethylene glycol, diethylene glycol, propylene glycol,
1,3-propanediol, 1,4-butanediol,
Neopentyl glycol, 1,6-hexanediol,
Examples include cyclohexane dimethanol, polyethylene glycol and the like. Particularly, ethylene glycol is preferred from the viewpoint of the rigidity of the film.
【0015】上記のポリエステルは、第3成分として上
記ジカルボン酸成分あるいはグリコール成分を共重合し
たコポリエステルであっても良く、三官能以上の多価カ
ルボン酸成分あるいはポリオール成分を含んでも良く、
得られるポリエステルが実質的に線状となる範囲(例え
ば5モル%以下)で少量共重合したポリエステルであっ
ても良い。The above-mentioned polyester may be a copolyester obtained by copolymerizing the above-mentioned dicarboxylic acid component or glycol component as the third component, or may contain a trifunctional or higher polyvalent carboxylic acid component or a polyol component.
A polyester obtained by copolymerizing a small amount in a range where the obtained polyester is substantially linear (for example, 5 mol% or less) may be used.
【0016】上記ポリエステルとしては、ポリエチレン
テレフタレートまたはポリエチレン―2,6―ナフタレ
ートが特に好ましい。As the above polyester, polyethylene terephthalate or polyethylene-2,6-naphthalate is particularly preferred.
【0017】かかるポリエステルは常法により作ること
ができ、ポリエステルの固有粘度(オルトクロロフェノ
ール中、35℃)が、0.45以上であるとフィルムの
剛性が大きい等の機械的特性が良好となるため好まし
い。Such a polyester can be produced by a conventional method. If the intrinsic viscosity of the polyester (in ortho-chlorophenol, at 35 ° C.) is 0.45 or more, the mechanical properties such as high rigidity of the film are improved. Therefore, it is preferable.
【0018】上記ポリエステルには、酸化珪素、酸化ア
ルミニウム、酸化マグネシウム、炭酸カルシウム、カオ
リン、タルク、酸化チタン、硫酸バリウム等のような無
機微粒子、架橋シリコーン樹脂、架橋ポリスチレン樹
脂、架橋アクリル樹脂、尿素樹脂、メラミン樹脂等のよ
うな耐熱性ポリマーからなる有機微粒子を含有させるこ
とができる。このほかに、ポリエチレン、ポリプロピレ
ン、エチレン・プロピレンコポリマー、オレフィン系ア
イオノマーのような他の樹脂、安定剤、酸化防止剤、紫
外線吸収剤、蛍光増白剤等を必要に応じて含有すること
もできる。The above polyester includes inorganic fine particles such as silicon oxide, aluminum oxide, magnesium oxide, calcium carbonate, kaolin, talc, titanium oxide, barium sulfate, etc., crosslinked silicone resin, crosslinked polystyrene resin, crosslinked acrylic resin, urea resin. And organic fine particles made of a heat-resistant polymer such as melamine resin. In addition, other resins such as polyethylene, polypropylene, ethylene-propylene copolymer, and olefinic ionomers, stabilizers, antioxidants, ultraviolet absorbers, fluorescent brighteners, and the like can be contained as necessary.
【0019】本発明におけるポリエステルフィルムは、
従来から知られている方法で製造することができる。例
えば、二軸延伸ポリエステルフィルムは、ポリエステル
を乾燥後、押出し機にて溶融し、ダイ(例えばT−ダ
イ、I−ダイ等)から回転冷却ドラム上に押出し、急冷
して未延伸フィルムを製造し、次いで該未延伸フィルム
を縦方向および横方向に延伸し、必要に応じて熱固定す
ることによって製造することができる。ポリエステルフ
ィルムの厚さは5μm〜250μmが好ましい。The polyester film of the present invention comprises:
It can be manufactured by a conventionally known method. For example, a biaxially stretched polyester film is produced by drying a polyester, melting it with an extruder, extruding it from a die (eg, T-die, I-die, etc.) onto a rotary cooling drum, and quenching to produce an unstretched film. Then, the unstretched film can be produced by stretching in the machine direction and the transverse direction and, if necessary, by heat setting. The thickness of the polyester film is preferably from 5 μm to 250 μm.
【0020】本発明において、ポリエステルフィルムの
片面に設ける帯電防止層は、帯電防止性を有する成分と
して、チオフェン及び又は/チオフェン誘導体を重合し
て得られる導電性重合体を含む塗液を塗布することによ
って形成される。In the present invention, the antistatic layer provided on one side of the polyester film is formed by applying a coating liquid containing a conductive polymer obtained by polymerizing thiophene and / or a thiophene derivative as a component having antistatic properties. Formed by
【0021】本発明に用いる導電性重合体は、チオフェ
ン及び/又はチオフェン誘導体を重合して得られる単独
重合体または共重合体である。この導電性重合体は、重
合単位として下記式(I)、式(II)、式(III )及び
/又は式(IV)で示される単位を主成分とする単独重合
体または共重合体であり、この他の重合単位を共重合成
分として少量含む共重合体であってもよい。The conductive polymer used in the present invention is a homopolymer or a copolymer obtained by polymerizing thiophene and / or a thiophene derivative. This conductive polymer is a homopolymer or a copolymer containing as a main unit a unit represented by the following formula (I), formula (II), formula (III) and / or formula (IV). Alternatively, a copolymer containing a small amount of other polymerization units as a copolymer component may be used.
【0022】[0022]
【化1】 Embedded image
【0023】[0023]
【化2】 Embedded image
【0024】[0024]
【化3】 Embedded image
【0025】[0025]
【化4】 Embedded image
【0026】上記式(I)および式(II)でR1 、R2
は同一または異なり水素元素(―H)、炭素数1〜20
の脂肪族炭化水素基、脂環族炭化水素基もしくは芳香族
炭化水素基、水酸基(―OH)、末端に水酸基を有する
基(―R3 OH:R3 は炭素数1〜20の2価の炭化水
素基(例えば、アルキレン基、アリーレン基、シクロア
ルキレン基、アルキレン・アリーレン基等))、アルコ
キシ基(―OR4 :R4 は炭素数1〜20の炭化水素
基)、末端にアルコキシ基を有する基(―R3 OR5 :
R5 は炭素数1〜4のアルキル基)、カルボキシル基
(―COOH)、カルボキシル塩基(―COOM:Mは
アルカリ金属元素、第4級アミンまたはテトラホスホニ
ウム)、末端にカルボキシル基を有する基(―R3 CO
OH)、末端カルボキシル塩基を有する基(―R3 CO
OM)、エステル基(―COOR5 )、末端にエステル
基を有する基(―R3 COOR5 )、スルホン酸基(―
SO3H)、末端にスルホン酸基を有する基(―R3 S
O3 H)、スルホン酸塩基(―SO3 M)、末端にスル
ホン酸塩基を有する基(―R3 SO3 M)、スルホニル
基(―SO2 R4 )、末端にスルホニル基を有する基
(―R3 SO2 R4 )、スルフィニル基(―S(=O)
R4 )、末端にスルフィニル基を有する基(―R3S
(=O)R4 )、アシル基(―C(=O)R6 :R6 は
炭素数1〜10の炭化水素基)、末端にアシル基を有す
る基(―R3 C(=O)R6 )、アミノ基(―N
H2 )、末端にアミノ基を有する基(―R3 NH2 )、
アミノ基の水素元素の一部または全部が置換された基
(―NR7 R6 、R7 は水素元素、炭素数1〜3のアル
キル基、―CH2 OHまたは―CH2 OR6 、R8 は炭
素数1〜3のアルキル基、―CH2 OHまたは―CH2
OR6 )、アミノ基の水素元素の一部または全部が置換
された基を末端に有する基(―R3 NR7 R8 )、カル
バモイル基(―CONH2 )、末端にカルバモイル基を
有する基(―R3 CONH2 または―R3 NHCONH
2 )、カルバモイル基の水素元素の一部または全部が置
換された基(―CONR7 R8 )、カルバモイル基の水
素元素の一部または全部が置換された基を末端に有する
基(―R3 CONR7 R8 )、ハロゲン基(―F、―C
l、―Br、―I)、R4 の水素元素の一部がハロゲン
元素で置換された基、―[NR1 R2 R9 + ][X- ]
で示される基(R9 は水素元素または炭素数1〜20の
炭化水素基、X- はF- 、Cl- 、Br- 、I- 、R1
OSO3 - 、R1 SO3 - 、NO3 - またはR1 COO
- で示されるイオン)、リン酸塩基(―P(=O)(O
M)2 )、末端にリン酸塩基を有する基(―R3 P(=
O)(OM)2 )、オキシラン基(下記式(V−1)で
示される基)または末端にオキシラン基を有する基(下
記式(V−2)で示される基)である。In the above formulas (I) and (II), R 1 , R 2
Are the same or different, hydrogen element (-H), carbon number 1-20
An aliphatic hydrocarbon group, an alicyclic hydrocarbon group or an aromatic hydrocarbon group, a hydroxyl group (—OH), and a group having a terminal hydroxyl group (—R 3 OH: R 3 is a divalent group having 1 to 20 carbon atoms) A hydrocarbon group (eg, an alkylene group, an arylene group, a cycloalkylene group, an alkylene arylene group, etc.), an alkoxy group (—OR 4 : R 4 is a hydrocarbon group having 1 to 20 carbon atoms), and an alkoxy group at a terminal. Group (—R 3 OR 5 :
R 5 is an alkyl group having 1 to 4 carbon atoms, a carboxyl group (—COOH), a carboxyl base (—COOM: M is an alkali metal element, a quaternary amine or tetraphosphonium), and a group having a terminal carboxyl group (— R 3 CO
OH), a group having a terminal carboxyl base (—R 3 CO
OM), an ester group (—COOR 5 ), a group having an ester group at the terminal (—R 3 COOR 5 ), a sulfonic acid group (—
SO 3 H), a group having a sulfonic acid group at a terminal (—R 3 S
O 3 H), a sulfonate group (—SO 3 M), a group having a terminal sulfonate group (—R 3 SO 3 M), a sulfonyl group (—SO 2 R 4 ), a group having a terminal sulfonyl group ( —R 3 SO 2 R 4 ), a sulfinyl group (—S (= O)
R 4 ), a group having a sulfinyl group at the terminal (—R 3 S
(= O) R 4 ), an acyl group (—C (= O) R 6 : R 6 is a hydrocarbon group having 1 to 10 carbon atoms), a group having an acyl group at a terminal (—R 3 C (= O)) R 6 ), an amino group (—N
H 2 ), a group having an amino group at the terminal (—R 3 NH 2 ),
A group in which a part or all of a hydrogen element of an amino group is substituted (—NR 7 R 6 and R 7 are a hydrogen element, an alkyl group having 1 to 3 carbon atoms, —CH 2 OH or —CH 2 OR 6 , R 8 Is an alkyl group having 1 to 3 carbon atoms, —CH 2 OH or —CH 2
OR 6 ), a group having a terminal in which a hydrogen atom of the amino group is partially or wholly substituted (—R 3 NR 7 R 8 ), a carbamoyl group (—CONH 2 ), a group having a carbamoyl group at the terminal ( -R 3 CONH 2 or -R 3 NHCONH
2 ), a group in which a part or all of a hydrogen element of a carbamoyl group is substituted (—CONR 7 R 8 ), a group having a group in which a part or all of a hydrogen element of a carbamoyl group is substituted (—R 3 CONR 7 R 8 ), halogen group (—F, —C
l, —Br, —I), a group in which part of the hydrogen element of R 4 has been replaced with a halogen element, — [NR 1 R 2 R 9 + ] [X − ]
(R 9 is a hydrogen element or a hydrocarbon group having 1 to 20 carbon atoms; X − is F − , Cl − , Br − , I − , R 1)
OSO 3 -, R 1 SO 3 -, NO 3 - or R 1 COO
- ), A phosphate group (-P (= O) (O
M) 2 ), a group having a phosphate group at the terminal (—R 3 P (=
O) (OM) 2 ), an oxirane group (a group represented by the following formula (V-1)) or a group having an oxirane group at a terminal (a group represented by the following formula (V-2)).
【0027】[0027]
【化5】 Embedded image
【0028】[0028]
【化6】 Embedded image
【0029】また、上記式(II)および式(IV)でY-
は、陰イオンを有する元素または化合物(Cl- 、Br
- 、I- 、F- 、R1 OSO3 - 、R1 SO3 - 、NO
3 -、R1 COO- 等)またはこれらの陰イオンを有す
る重合体を示す。Further, in the above formula (II) and formula (IV) Y -
Is an element or compound having an anion (Cl − , Br
-, I -, F -, R 1 OSO 3 -, R 1 SO 3 -, NO
3 -, R 1 COO - shows the like) or a polymer having these anions.
【0030】前記式(I)、式(II)、式(III )及び
/又は式(IV)で示される重合単位としては、例えば、
下記式(I−1)〜式(I−12)、下記式(II−1)
〜式(II−2)、下記式(III −1)および下記式(IV
−1)〜式(IV−2)を挙げることができる。The polymerized units represented by the formulas (I), (II), (III) and / or (IV) include, for example,
The following formulas (I-1) to (I-12), and the following formula (II-1)
To formula (II-2), the following formula (III-1) and the following formula (IV
-1) to Formula (IV-2).
【0031】[0031]
【化7】 Embedded image
【0032】[0032]
【化8】 Embedded image
【0033】[0033]
【化9】 Embedded image
【0034】[0034]
【化10】 Embedded image
【0035】[0035]
【化11】 Embedded image
【0036】[0036]
【化12】 Embedded image
【0037】[0037]
【化13】 Embedded image
【0038】[0038]
【化14】 Embedded image
【0039】[0039]
【化15】 Embedded image
【0040】[0040]
【化16】 Embedded image
【0041】[0041]
【化17】 Embedded image
【0042】[0042]
【化18】 Embedded image
【0043】[0043]
【化19】 Embedded image
【0044】[0044]
【化20】 Embedded image
【0045】[0045]
【化21】 Embedded image
【0046】[0046]
【化22】 Embedded image
【0047】[0047]
【化23】 Embedded image
【0048】なお、チオフェン及び/又はチオフェン誘
導体を重合して得られる導電性重合体には、制電性を更
に良好なものとするためドーピング剤を、例えば導電性
重合体100重量部に対し0.1〜500重量部配合す
ることができる。このドーピング剤としては、LiC
l、R10COOLi(R10:炭素数1〜30の飽和炭化
水素基)、R10SO3 Li、R10COONa、R10SO
3 Na、R10COOK、R10SO3 K、テトラエチルア
ンモニウム、I2 、BF3 Na、BF4 Na、HClO
4 、CF3 SO3 H、FeCl3 、テトラシアノキノリ
ン(TCNQ)、Na2 B10Cl10、フタロシアニン、
ポルフィリン、グルタミン酸、アルキルスルホン酸塩、
ポリスチレンスルホン酸Na(K、Li)塩、スチレン
・スチレンスルホン酸Na(K、Li)塩共重合体、ポ
リスチレンスルホン酸アニオン(例えば、前記式(II−
2a)、式(IV−1a)で示される重合体)、スチレン
スルホン酸・スチレンスルホン酸アニオン共重合体(例
えば、前記式(II−1a)、式(IV−2a)で示される
共重合体)等を挙げることができる。The conductive polymer obtained by polymerizing thiophene and / or a thiophene derivative may be doped with a doping agent, for example, with respect to 100 parts by weight of the conductive polymer in order to further improve the antistatic property. 0.1 to 500 parts by weight. As the doping agent, LiC
1, R 10 COOLi (R 10 : a saturated hydrocarbon group having 1 to 30 carbon atoms), R 10 SO 3 Li, R 10 COONa, R 10 SO
3 Na, R 10 COOK, R 10 SO 3 K, tetraethylammonium, I 2, BF 3 Na, BF 4 Na, HClO
4 , CF 3 SO 3 H, FeCl 3 , tetracyanoquinoline (TCNQ), Na 2 B 10 Cl 10 , phthalocyanine,
Porphyrin, glutamic acid, alkyl sulfonate,
Polystyrene sulfonic acid Na (K, Li) salt, styrene / styrene sulfonic acid Na (K, Li) salt copolymer, polystyrene sulfonic acid anion (for example, the above-mentioned formula (II-
2a), a polymer represented by the formula (IV-1a)), a styrenesulfonic acid / styrenesulfonic acid anion copolymer (for example, a copolymer represented by the formula (II-1a) or the formula (IV-2a)) ) And the like.
【0049】本発明において、ポリエステルフィルムと
帯電防止層との接着性をより良好なものとするため、導
電性重合体にバインダー樹脂を配合することができる。
このバインダー樹脂は、ポリエステル樹脂、アクリル系
樹脂、アクリル変性ポリエステル樹脂およびウレタン樹
脂からなる群から選ばれる少なくとも1種の二次転移点
が20〜150℃の樹脂であることが好ましい。この二
次転移点が20℃未満であると制電性塗膜の耐ブロッキ
ング性が悪くなり、150℃を超えると帯電防止層の耐
削れ性が不足する。In the present invention, a binder resin can be blended with the conductive polymer in order to improve the adhesion between the polyester film and the antistatic layer.
The binder resin is preferably a resin having at least one secondary transition point of 20 to 150 ° C. selected from the group consisting of a polyester resin, an acrylic resin, an acryl-modified polyester resin, and a urethane resin. If the secondary transition point is less than 20 ° C., the blocking resistance of the antistatic coating film will be poor, and if it exceeds 150 ° C., the abrasion resistance of the antistatic layer will be insufficient.
【0050】ポリエステル樹脂としては、ジカルボン酸
成分とグリコール成分とからなる二次転移点が20〜1
50℃の共重合ポリエステルが好ましい。ジカルボン酸
成分としては、例えばテレフタル酸、イソフタル酸、
2,6―ナフタレンジカルボン酸、ヘキサヒドロテレフ
タル酸、4,4′―ジフェニルジカルボン酸、アジピン
酸、セバシン酸、ドデカンジカルボン酸、5―Naスル
ホイソフタル酸、5―Kスルホイソフタル酸等を挙げる
ことができる。また、グリコール成分としては、例えば
エチレングリコール、ジエチレングリコール、プロピレ
ングリコール、1,3―プロパンジオール、1,4―ブ
タンジオール、シクロヘキサンジメタノール、ポリエチ
レングリコール、ビスフェノールA・アルキレンオキシ
ド付加物等を挙げることができる。The polyester resin has a secondary transition point of 20 to 1 comprising a dicarboxylic acid component and a glycol component.
50 ° C copolyesters are preferred. As the dicarboxylic acid component, for example, terephthalic acid, isophthalic acid,
2,6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, 4,4'-diphenyldicarboxylic acid, adipic acid, sebacic acid, dodecanedicarboxylic acid, 5-Na sulfoisophthalic acid, 5-K sulfoisophthalic acid, and the like. it can. Examples of the glycol component include, for example, ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, cyclohexanedimethanol, polyethylene glycol, and bisphenol A / alkylene oxide adducts. .
【0051】尚、二次転移点が20〜150℃の共重合
ポリエステルは、ジカルボン酸成分として芳香族ジカル
ボン酸を主成分として用い、グリコール成分を二次転移
点が上記の範囲とすよるよう選ぶことにより得ることが
できる。The copolymerized polyester having a secondary transition point of 20 to 150 ° C. uses an aromatic dicarboxylic acid as a main component as a dicarboxylic acid component and selects a glycol component such that the secondary transition point falls within the above range. Can be obtained.
【0052】係るポリエステル樹脂は常法によりつくる
ことができる。平均分子量が10,000〜50,00
0であることが、帯電防止層の耐削れ性が良好となり、
帯電防止層の耐ブロッキング性が良好となるため好まし
い。The polyester resin can be produced by a conventional method. Average molecular weight of 10,000 to 50,000
0 means that the antistatic layer has good abrasion resistance,
This is preferable because the antistatic layer has good blocking resistance.
【0053】アクリル樹脂としては、アクリル酸エステ
ル系単量体を重合して得られる二次転移点が20〜15
0℃のアクリル系共重合体が好ましい。このアクリル酸
エステル系単量体としては、例えばメタクリル酸メチ
ル、メタクリル酸エチル、メタクリル酸ブチル、アクリ
ル酸メチル、アクリル酸エチル、アクリル酸ブチル、ク
ロトン酸エチル、メタクリル酸グリシジル、アクリル酸
2―ヒドロキシエチル、アクリル酸2―エチルヘキシル
等を挙げることができる。The acrylic resin has a secondary transition point of from 20 to 15 obtained by polymerizing an acrylate monomer.
Acrylic copolymers at 0 ° C. are preferred. Examples of the acrylate monomer include methyl methacrylate, ethyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, butyl acrylate, ethyl crotonate, glycidyl methacrylate, 2-hydroxyethyl acrylate And 2-ethylhexyl acrylate.
【0054】このアクリル系共重合体は、上記のアクリ
ル酸エステル系単量体の少なくとも1種とアクリルアミ
ド、メタクリルアミド、アクリル酸、メタクリル酸、ア
クリル酸ソーダ、メタクリル酸カリ、アクリル酸アンモ
ニウム、N―メチロールアクリルアミド、N―メトキシ
メチルアクリルアミド等のアクリル酸系単量体を重合し
て得られる共重合体であってもよい。The acrylic copolymer is obtained by mixing at least one of the above-mentioned acrylate monomers with acrylamide, methacrylamide, acrylic acid, methacrylic acid, sodium acrylate, potassium methacrylate, ammonium acrylate, It may be a copolymer obtained by polymerizing an acrylic acid monomer such as methylolacrylamide or N-methoxymethylacrylamide.
【0055】アクリル系共重合体には、この他に塩化ビ
ニル、酢酸ビニル、スチレン、ビニルエーテル、ブタジ
エン、イソプレン、ビニルスルホン酸ソーダ等の単量体
を共重合成分として用いることもできる。In addition to the acrylic copolymer, monomers such as vinyl chloride, vinyl acetate, styrene, vinyl ether, butadiene, isoprene, and sodium vinyl sulfonate can be used as copolymer components.
【0056】尚、アクリル系共重合体には、アクリル酸
塩成分、メタクリル酸塩成分、アクリル酸成分、アクリ
ルアミド成分、アクリル酸2―ヒドロキシエチル成分、
N―メチロールアクリルアミド成分等の親水性成分が共
重合成分として合まれることが、水性塗液中での分散性
や溶解性を良好なものとなるため好ましい。また、分子
側鎖に官能基を有する共重合体であってもよい。The acrylic copolymer includes an acrylate component, a methacrylate component, an acrylic acid component, an acrylamide component, a 2-hydroxyethyl acrylate component,
It is preferable that a hydrophilic component such as an N-methylol acrylamide component be combined as a copolymer component because the dispersibility and the solubility in the aqueous coating solution are improved. Further, a copolymer having a functional group in a molecular side chain may be used.
【0057】また、二次転移点が20〜150℃のアク
リル系共重合体は、メタクリル酸メチルやメタクリル酸
エチルのような硬質成分を主成分として用い、共重合成
分としてアクリル酸エステルのような軟質成分を二次転
移点が上記の範囲となる割合で共重合させることにより
得ることができる。更にアクリル系共重合体の二次転移
点は、メチロール基やメトキシメチル基等を有する成分
を共重合成分として用い、これらの基を架橋させること
により調整することができる。The acrylic copolymer having a secondary transition point of 20 to 150 ° C. uses a hard component such as methyl methacrylate or ethyl methacrylate as a main component and uses an acrylic copolymer such as an acrylate as a copolymer component. It can be obtained by copolymerizing the soft component at such a ratio that the secondary transition point falls within the above range. Further, the secondary transition point of the acrylic copolymer can be adjusted by using a component having a methylol group, a methoxymethyl group, or the like as a copolymer component and crosslinking these groups.
【0058】アクリル系共重合体の平均分子量は10,
000〜500,000であることが帯電防止性層の耐
削れ性が良好となり、帯電防止層の耐ブロッキング性が
良好となるため好ましい。The average molecular weight of the acrylic copolymer is 10,
The range of 000 to 500,000 is preferable because the antistatic layer has good abrasion resistance and the antistatic layer has good blocking resistance.
【0059】アクリル変性ポリエステル樹脂は、前記の
ポリエステル樹脂に前記のアクリル酸エステル系単量体
及び/又はアクリル酸系単量体を重合して得られる二次
転移点が20〜150℃の変性共重合体である。例え
ば、水性液中のポリエステル樹脂に、前記のアクリル酸
エステル系単量体及び/又はアクリル酸系単量体をラジ
カル開始剤を用いてグラフト重合させることにより得る
ことができる。この変性共重合体は、分子側鎖に官能基
を有するものであってもよい。また、変性共重合体の平
均分子量は10,000〜500,000であること
が、帯電防止層の耐削れ性が良好となり、帯電防止性層
の耐ブロッキング性が良好となるため好ましい。The acrylic modified polyester resin is a modified polyester resin having a secondary transition point of from 20 to 150 ° C. obtained by polymerizing the acrylate monomer and / or the acrylate monomer on the polyester resin. It is a polymer. For example, it can be obtained by graft-polymerizing the acrylate monomer and / or the acrylate monomer to a polyester resin in an aqueous liquid using a radical initiator. This modified copolymer may have a functional group in a molecular side chain. Further, the modified copolymer preferably has an average molecular weight of 10,000 to 500,000 because the antistatic layer has good abrasion resistance and the antistatic layer has good blocking resistance.
【0060】尚、二次転移点が20〜150℃のアクリ
ル変性ポリエステル樹脂は、二次転移点が20〜150
℃の共重合ポリエステルに対し、メタクリル酸メチルや
メタクリル酸エチルのような硬質成分と、アクリル酸エ
ステルのような軟質成分とをアクリル変性ポリエステル
樹脂の二次転移点が20〜150℃となる割合で共重合
させることにより得ることができる。The acrylic-modified polyester resin having a secondary transition point of 20 to 150 ° C. has a secondary transition point of 20 to 150 ° C.
With respect to the copolymerized polyester at ℃, a hard component such as methyl methacrylate or ethyl methacrylate, and a soft component such as an acrylate at a ratio at which the secondary transition point of the acrylic-modified polyester resin is 20 to 150 ° C. It can be obtained by copolymerization.
【0061】ウレタン樹脂としては、脂肪酸ポリエーテ
ルや脂肪族ポリエステル、ジイソシアネート、ジアミ
ン、グリコール、ジメチロールプロピオン酸塩等からつ
くられる二次転移点が20〜150℃のポリウレタン系
重合体が好ましい。ポリウレタン系重合体の平均分子量
は耐削れ性の点で5,000〜50,000であること
が帯電防止層の耐削れ性が良好となり、帯電防止層の耐
ブロッキング性が良好となるため好ましい。As the urethane resin, a polyurethane polymer having a secondary transition point of 20 to 150 ° C. made of fatty acid polyether, aliphatic polyester, diisocyanate, diamine, glycol, dimethylolpropionate or the like is preferable. The average molecular weight of the polyurethane polymer is preferably from 5,000 to 50,000 from the viewpoint of abrasion resistance, because the abrasion resistance of the antistatic layer becomes good and the antistatic property of the antistatic layer becomes good.
【0062】尚、二次転移点が20〜150℃のポリウ
レタン樹脂は、芳香族ポリエーテルまたはポリエステル
を含むプレポリマー、芳香族ジイソシアネート、アルキ
レンジアミン、アルキルグリコール、ジメチロールプロ
ピオン酸塩を用いて得ることができる。The polyurethane resin having a secondary transition point of 20 to 150 ° C. can be obtained by using a prepolymer containing an aromatic polyether or polyester, an aromatic diisocyanate, an alkylenediamine, an alkyl glycol, and a dimethylolpropionate. Can be.
【0063】本発明において用いるバインダー樹脂に
は、上記のポリエステル樹脂、アクリル樹脂、アクリル
変性ポリエステル樹脂およびポリウレタン樹脂から選ば
れる1種の樹脂を単独で用いることができ、或いは2種
以上の樹脂を混合して用いることもできる。As the binder resin used in the present invention, one resin selected from the above polyester resins, acrylic resins, acryl-modified polyester resins and polyurethane resins can be used alone, or two or more resins can be mixed. It can also be used.
【0064】本発明の第1、2の構成における帯電防止
層は、チオフェン又び/又はチオフェン誘導体を重合し
て得られる導電性重合体を含む水性塗液を塗布し、乾
燥、硬化してつくられるため表面固有抵抗率が1×10
5 〜1×1012Ω/□の塗膜である。この表面固有抵抗
率が1×105 Ω/□未満であると塗漠が脆くなり、1
×1012Ω/□を超えると制電性が不足する。The antistatic layer in the first and second constitutions of the present invention is formed by applying an aqueous coating solution containing a conductive polymer obtained by polymerizing thiophene and / or a thiophene derivative, followed by drying and curing. 1 × 10
It is a coating film of 5 to 1 × 10 12 Ω / □. If the surface resistivity is less than 1 × 10 5 Ω / □, the coating becomes brittle, and
If it exceeds × 10 12 Ω / □, the antistatic property will be insufficient.
【0065】また、本発明の第1、2の構成における帯
電防止層は、1〜95重量%(特に5〜70重量%)の
導電性重合体と、5〜99重量%(特に30〜95重量
%)の前記のバインダー樹脂からなる組成物を含む水性
塗液を塗布し、乾燥、硬化してつくられたものであるこ
とが好ましい。In the first and second constitutions of the present invention, the antistatic layer comprises 1 to 95% by weight (particularly 5 to 70% by weight) of a conductive polymer and 5 to 99% by weight (particularly 30 to 95% by weight). (% By weight) of an aqueous coating solution containing the composition comprising the above binder resin, followed by drying and curing.
【0066】導電性重合体と、バインダー樹脂の割合が
上記の範囲であると、ポリエステルフィルムと帯電防止
層との接着性が良好となり、帯電防止層の帯電防止性、
接着性や耐削れ性が良好となるため好ましい。When the ratio of the conductive polymer to the binder resin is in the above range, the adhesion between the polyester film and the antistatic layer becomes good, and the antistatic property of the antistatic layer is improved.
It is preferable because the adhesiveness and the abrasion resistance are improved.
【0067】導電性重合体とバインダー樹脂との組成物
は、例えば、導電性重合体とバインダー樹脂とを混合す
る方法により得ることができるが、微粒子のバインダー
樹脂の表面に導電性重合体を被覆する方法や、導電性重
合体に合まれる官能基とバインダー樹脂に合まれる官能
基とを化学的に結合させる方法によっても得ることがで
きる。The composition of the conductive polymer and the binder resin can be obtained by, for example, a method of mixing the conductive polymer and the binder resin, and the surface of the fine particle binder resin is coated with the conductive polymer. And a method of chemically bonding a functional group fitted to the conductive polymer to a functional group fitted to the binder resin.
【0068】帯電防止層の成分としては、前記成分以外
に帯電防止層の接着性、耐溶剤性、耐水性を調整する等
の目的でエポキシ樹脂、ビニル樹脂、ポリエーテル樹
脂、水溶性樹脂(例えばセルロース系樹脂)等を少量配
合することができる。The components of the antistatic layer include, in addition to the above components, epoxy resins, vinyl resins, polyether resins, and water-soluble resins for the purpose of adjusting the adhesion, solvent resistance, and water resistance of the antistatic layer. A small amount of cellulose-based resin).
【0069】帯電防止層の成分として、この他に塗膜の
滑り性や耐ブロッキング性を良好なものとするため、滑
剤として平均粒径が0.01〜20μm程度の無機や有
機の微粒子を、例えば0.001〜5重量%の配合割合
で含有させることができる。かかる微粒子の具体例とし
て、シリカ、アルミナ、酸化チタン、カーボンブラッ
ク、カオリン、炭酸カルシウム等の無機微粒子、ポリス
チレン樹脂、架橋ポリスチレン樹脂、アクリル樹脂、架
橋アクリル樹脂、メラミン樹脂粒子、シリコーン樹脂、
フッ素樹脂、尿素樹脂、ベンゾグアナミン樹脂等の有機
微粒子等を好ましく挙げることができる。この有機微粒
子は、塗膜内で微粒子の状態を保つことができる樹脂で
あれば、熱可塑性樹脂であっても熱硬化性樹脂であって
もよく、また目的に応じた架橋度で架橋された樹脂であ
ってもよい。As a component of the antistatic layer, inorganic or organic fine particles having an average particle size of about 0.01 to 20 μm are used as a lubricant in order to improve the slipperiness and blocking resistance of the coating film. For example, it can be contained at a mixing ratio of 0.001 to 5% by weight. Specific examples of such fine particles include silica, alumina, titanium oxide, carbon black, kaolin, inorganic fine particles such as calcium carbonate, polystyrene resin, cross-linked polystyrene resin, acrylic resin, cross-linked acrylic resin, melamine resin particles, silicone resin,
Organic fine particles such as a fluorine resin, a urea resin, and a benzoguanamine resin are preferably exemplified. The organic fine particles may be a thermoplastic resin or a thermosetting resin as long as the resin can maintain the state of the fine particles in the coating film, and may be cross-linked at a degree of cross-linking according to the purpose. It may be a resin.
【0070】前記微粒子以外にも界面活性剤、酸化防止
剤、着色剤、顔料、蛍光増白剤、可塑剤、架橋剤、有機
滑剤(滑り剤)、紫外線吸収剤、他の帯電防止剤等を必
要に応じて添加することができる。In addition to the fine particles, surfactants, antioxidants, colorants, pigments, fluorescent brighteners, plasticizers, crosslinking agents, organic lubricants (sliding agents), ultraviolet absorbers, other antistatic agents and the like can be used. It can be added as needed.
【0071】本発明においては、前記組成物を含む水性
塗液を用いて帯電防止層を塗設するが、水性塗液の固形
分濃度は1〜30重量%が好ましく、特に2〜20重量
%が好ましい。固形分濃度がこの範囲にあると水性塗液
の粘度が塗布に適したものになる。本発明に用いる水性
塗液は、水溶液、水分散液、乳化液等任意の形態で用い
ることができる。また、水性塗液には少量の溶剤が含ま
れていてもよい。In the present invention, the antistatic layer is formed using an aqueous coating solution containing the above composition. The solid content of the aqueous coating solution is preferably from 1 to 30% by weight, more preferably from 2 to 20% by weight. Is preferred. When the solid content concentration is within this range, the viscosity of the aqueous coating liquid becomes suitable for coating. The aqueous coating liquid used in the present invention can be used in any form such as an aqueous solution, an aqueous dispersion, and an emulsion. Further, the aqueous coating liquid may contain a small amount of a solvent.
【0072】本発明において、帯電防止層は上記塗液を
ポリエステルフィルムの一方の面に塗布しで形成するの
が好ましいが、該フィルムとしては、前述の方法で延伸
されて結晶配向が完了したポリエステルフィルム、ある
いは結晶配向が完了する前のポリエステルフィルムが好
ましく挙げられる。In the present invention, the antistatic layer is preferably formed by applying the above-mentioned coating solution on one surface of a polyester film. A film or a polyester film before completion of the crystal orientation is preferable.
【0073】結晶配向が完了したポリエステルフィルム
としては、ポリエステルを熱溶融してそのままフィルム
状とした未延伸フィルムを縦方向及び横方向に二軸延伸
し、熱固定処理をしたものを例示することができ、結晶
配向が完了する前のポリエステルフィルムとしては、ポ
リエステルを熱溶融してそのままフィルム状とした未延
伸フィルム、未延伸フィルムを縦方向または横方向のい
ずれか一方に配向せしめた一軸延伸フィルム、縦方向お
よび横方向の2方向に低倍率延伸配向させたもの(最終
的に縦方向および横方向に再延伸させて配向結晶化を完
了させる前の二軸延伸フィルム)を例示することができ
る。Examples of the polyester film in which the crystal orientation has been completed include a film obtained by biaxially stretching an unstretched film in a longitudinal direction and a transverse direction by heat-melting the polyester and then heat-setting. As a polyester film before the crystal orientation is completed, an unstretched film in which the polyester is hot-melted and directly formed into a film, a uniaxially stretched film in which the unstretched film is oriented in either the longitudinal direction or the transverse direction, An example is a film stretched and oriented at a low magnification in two directions, that is, a longitudinal direction and a lateral direction (a biaxially stretched film before being finally stretched again in a longitudinal direction and a lateral direction to complete oriented crystallization).
【0074】ポリエステルフィルムへの塗液の塗布方法
としては、公知の塗布方法が適用できる。例えばロール
コート法、グラビアコード法、マイクログラビアコード
法、リバースコート法、ロールブラッシュ法、スプレー
コート法、エアーナイフコート法、含浸法およびカーテ
ンコート法などを単独または組み合わせて適用するとよ
い。As a method of applying the coating liquid to the polyester film, a known coating method can be applied. For example, a roll coating method, a gravure code method, a microgravure code method, a reverse coat method, a roll brush method, a spray coat method, an air knife coat method, an impregnation method, a curtain coat method, or the like may be applied alone or in combination.
【0075】本発明において、帯電防止層の厚みは、
0.01〜1μm、さらに0.02〜0.5μmである
のが好ましい。厚みが0.01μm未満であると十分な
帯電防止効果が得られないことがあり、他方1μmを超
えると耐ブロッキング性が低下することがある。In the present invention, the thickness of the antistatic layer is
It is preferably from 0.01 to 1 μm, more preferably from 0.02 to 0.5 μm. If the thickness is less than 0.01 μm, a sufficient antistatic effect may not be obtained, while if it exceeds 1 μm, the blocking resistance may decrease.
【0076】本発明の第1、2の構成において、ポリエ
ステルフィルムの片面に設ける離形層は、各種離形性を
発現する塗液を塗布し、乾燥又は硬化させることによっ
て形成される。In the first and second constitutions of the present invention, the release layer provided on one side of the polyester film is formed by applying a coating liquid exhibiting various releasability and drying or curing.
【0077】かかる離形を発現する成分として硬化型シ
リコーン樹脂が好ましい。この硬化型シリコーン樹脂例
えば縮合反応型のもの、付加反応型のもの、紫外線もし
くは電子線硬化型のもの等いずれの反応型のものも用い
ることができる。これらの硬化型シリコーン樹脂は一種
を単独で用いてもよいし、二種以上併用してもよい。As a component that exhibits such release, a curable silicone resin is preferable. Any of the curing type silicone resins such as condensation reaction type, addition reaction type, and ultraviolet or electron beam curing type can be used. One of these curable silicone resins may be used alone, or two or more thereof may be used in combination.
【0078】各種シリコーン樹脂の硬化反応は、次のよ
うに示すことができる。The curing reaction of various silicone resins can be shown as follows.
【0079】[0079]
【化24】 Embedded image
【0080】上記縮合反応型のシリコーン樹脂として
は、例えば末端−OH基を持つポリジメチルシロキサン
と末端に−H基を持つポリジメチルシロキサン(ハイド
ロジェンシラン)を有機錫触媒(例えば有機錫アシレー
ト触媒)を用いて縮合反応させ、三次元架橋構造をつく
るものが挙げられる。Examples of the condensation reaction type silicone resin include a polydimethylsiloxane having a terminal —OH group and a polydimethylsiloxane (hydrogensilane) having a terminal —H group as an organotin catalyst (eg, an organotin acylate catalyst). To form a three-dimensional cross-linked structure.
【0081】付加反応型のシリコーン樹脂としては、例
えば末端にビニル基を導入したポリジメチルシロキサン
とハイドロジェンシランを白金触媒を用いて反応させ、
三次元架橋構造をつくるものが挙げられる。As an addition reaction type silicone resin, for example, polydimethylsiloxane having a vinyl group introduced into a terminal and hydrogen silane are reacted using a platinum catalyst.
One that forms a three-dimensional crosslinked structure may be mentioned.
【0082】紫外線硬化型のシリコーン樹脂としては、
例えば最も基本的なタイプとして通常のシリコーンゴム
架橋と同じラジカル反応を利用するもの、アクリル基を
導入して光硬化させるもの、紫外線でオニウム塩を分解
して強酸を発生させ、これによりエポキシ環を開裂させ
て架橋させるもの、ビニルシロキサンへのチオールの付
加反応で架橋するもの等が挙げられる。電子線は紫外線
よりもエネルギーが強く、紫外線硬化の場合のように開
始剤を用いずともラジカルによる架橋反応が起こる。As the ultraviolet-curable silicone resin,
For example, the most basic type uses the same radical reaction as ordinary silicone rubber crosslinking, the one that introduces an acrylic group and cures it, and the one that decomposes an onium salt with ultraviolet rays to generate a strong acid, thereby forming an epoxy ring. Examples thereof include those that are cleaved and crosslinked, and those that are crosslinked by the addition reaction of thiol to vinylsiloxane. Electron beams have higher energy than ultraviolet rays, and a radical crosslinking reaction occurs without using an initiator as in the case of ultraviolet curing.
【0083】硬化型シリコーン樹脂としては、その重合
度が50〜20万程度、好ましくは千〜10万程度のも
のが好ましく、これらの具体例としては信越化学工業
(株)製のKS―718、―774、―775、―77
8、―779H、―830、―835、―837、―8
38、―839、―841、―843、―847、―8
47H、X―62―2418、―2422、―212
5、―2492、―2494、―470、―2366、
―630、X―92―140、―128、KS―723
A・B、―705F、―708A、―883、―70
9、―719、東芝シリコーン(株)製のTPR―67
01、―6702、―6703、―3704、―670
5、―6722、―6721、―6700、XSR―7
029、YSR―3022、YR―3286、ダウコー
ニング(株)製のDK―Q3―202、―203、―2
04、―210、―240、―3003、―205、―
3057、SFXF―2560、東レ・ダウコーニング
・シリコーン(株)製のSD―7226、―7320、
―7229、BY24―900、―171、―312、
―374、SRX―375、SYL―0FF23、SR
X―244、SEX―290、アイ・シー・アイ・ジャ
パン(株)製のSlLCOLEASE425等を挙げる
ことができる。また、特開昭47―34447号公報、
特公昭52―40918号公報等に記載のシリコーン樹
脂も用いることができる。The curable silicone resin preferably has a polymerization degree of about 500,000 to 200,000, preferably about 1,000 to 100,000. Specific examples thereof include KS-718 manufactured by Shin-Etsu Chemical Co., Ltd. -774, -775, -77
8, -779H, -830, -835, -837, -8
38, -839, -841, -843, -847, -8
47H, X-62-2418, -2422, -212
5, -2492, -2494, -470, -2366,
-630, X-92-140, -128, KS-723
A / B, -705F, -708A, -883, -70
9, -719, TPR-67 manufactured by Toshiba Silicone Co., Ltd.
01, -6702, -6703, -3704, -670
5, -6722, -6721, -6700, XSR-7
029, YSR-3022, YR-3286, DK-Q3-202, -203, -2 manufactured by Dow Corning Co., Ltd.
04, -210, -240, -3003, -205,-
3057, SFXF-2560, SD-7226, -7320, manufactured by Dow Corning Toray Silicone Co., Ltd.
-7229, BY24-900, -171, -312,
-374, SRX-375, SYL-0FF23, SR
Examples include X-244, SEX-290, and SILCOLASE 425 manufactured by ICI Japan Ltd. Also, JP-A-47-34447,
The silicone resin described in JP-B-52-40918 can also be used.
【0084】前記硬化型シリコーン樹脂塗膜をフィルム
表面に形成させる場合のコーティング方法としてはバー
コート法、ドクターブレード法、リバースロールコート
法またはグラビアロールコート法等の従来から知られて
いる方法が利用できる。As a coating method for forming the curable silicone resin coating film on the film surface, a conventionally known method such as a bar coating method, a doctor blade method, a reverse roll coating method or a gravure roll coating method is used. it can.
【0085】塗膜の乾燥及び硬化(熱硬化、紫外線硬化
等)は、それぞれ個別又は同時に行なうことができる。
同時に行なうときには100℃以上で行なうことか好ま
しい。乾燥及び硬化の条件としては100℃以上で30
秒以上が好ましい。乾燥温度が100℃未満及び硬化時
間が30秒未満では塗膜の硬化が不完全であり、塗膜か
脱落しやすくなるため好ましくない。The drying and curing (thermal curing, ultraviolet curing, etc.) of the coating film can be performed individually or simultaneously.
When performing simultaneously, it is preferable to perform at 100 degreeC or more. Drying and curing conditions are 100 ° C or higher and 30
Seconds or more are preferred. If the drying temperature is less than 100 ° C. and the curing time is less than 30 seconds, the curing of the coating film is incomplete and the coating film is apt to fall off, which is not preferable.
【0086】硬化型シリコーン樹脂塗膜の厚みは特に限
定されないが、0.05〜0.5μmの範囲が好まし
い。塗膜の厚みがこの範囲より薄くなると離形性能が低
下し満足すべき性能が得られない。逆に塗膜の厚みがこ
の範囲より厚くなるとキュアリングに時間がかかり生産
上不都合を生じる。The thickness of the curable silicone resin coating is not particularly limited, but is preferably in the range of 0.05 to 0.5 μm. If the thickness of the coating film is less than this range, the releasing performance is reduced and satisfactory performance cannot be obtained. Conversely, if the thickness of the coating film is larger than this range, it takes a long time for curing, which causes a disadvantage in production.
【0087】又、硬化性シリコーン離形剤を嫌う用途、
例えばはじき易い水系の粘着剤や樹脂溶液をシート化す
るためのキャスティング用支持フィルムとして用いる場
合やシリコーン成分の移行が少しでもあってはいけない
用途には長いアルキル側鎖を持つポリマーが好ましく、
炭素数12以上、特に16〜20のアルキル鎖を持つア
ルキルアクリレートとアクリル酸とのコポリマーがさら
に好ましい。アルキルアクリレートのアルキル鎖の炭素
数が12未満では十分な剥離性が得られないことがあ
る。In addition, applications that dislike curable silicone release agents,
For example, a polymer having a long alkyl side chain is preferable for use as a casting support film for sheeting a water-based pressure-sensitive adhesive or resin solution that is easy to repel or for applications where the migration of silicone components must not be small,
A copolymer of acrylic acid and an alkyl acrylate having an alkyl chain having 12 or more carbon atoms, particularly 16 to 20 carbon atoms, is more preferred. When the number of carbon atoms in the alkyl chain of the alkyl acrylate is less than 12, sufficient releasability may not be obtained.
【0088】これらの中、特に好ましくは、ポリビニル
アルコールまたはポリエチレンイミンを塩素化アルキロ
イルまたはアルキルイソシアネートで長鎖アルキル化し
た共重合体が好ましく、具体的には、ポリビニルアルコ
ールとオクタデシルイソシアネートとの反応によって得
られるポリビニル―N―オクタデシルカルバメートや、
ポリエチレンイミンとオクタデシルイソシアネートとの
反応によって得られるポリエチレンイミン―N―オクタ
デシルカルバメートなどが挙げられる。Of these, particularly preferred are copolymers obtained by long-chain alkylation of polyvinyl alcohol or polyethyleneimine with chlorinated alkylol or alkyl isocyanate. Specifically, a copolymer obtained by reacting polyvinyl alcohol with octadecyl isocyanate is preferred. Polyvinyl-N-octadecyl carbamate,
Examples include polyethyleneimine-N-octadecylcarbamate obtained by the reaction of polyethyleneimine with octadecyl isocyanate.
【0089】本発明においては、支障の無い限りフッ素
系離形剤やパラフィンワックスやカルナバワックスと言
ったワックス系離形剤も用いることができる。In the present invention, a fluorine-based release agent or a wax-based release agent such as paraffin wax or carnauba wax can be used as long as there is no problem.
【0090】上記長いアルキル側鎖を持つポリマーを用
いる離形層には、層の強度、帯電防上層又はポリエステ
ルフィルムへの密着性、耐水性、耐溶剤性、ブロッキン
グ性などの向上のためにバインダーとしで熱可塑性ポリ
エステル樹脂、アクリル樹脂、ポリビニル樹脂などの熱
可塑性樹脂および/または熱硬化性アクリル樹脂、ウレ
タン樹脂、メラミン樹脂、エポキシ樹脂などの熱硬化性
樹脂などの高分子化合物を含有させることが好ましく、
さらに架橋剤としで、メチロール化あるいはアルキロー
ル化したメラミン系、尿素系、グリオキザール系、アク
リルアミド系などの化合物、エポキシ化合物、ポリイソ
シアネートから選ばれた少なくとも1種類を含有するこ
とが特に好ましい。The release layer using the polymer having a long alkyl side chain has a binder for improving the strength of the layer, adhesion to the antistatic upper layer or the polyester film, water resistance, solvent resistance, blocking property and the like. In addition, it may contain a thermoplastic compound such as a thermoplastic polyester resin, an acrylic resin, and a polyvinyl resin and / or a polymer compound such as a thermosetting resin such as a thermosetting acrylic resin, a urethane resin, a melamine resin, and an epoxy resin. Preferably
It is particularly preferable that the crosslinking agent contains at least one selected from methylolated or alkylolated melamine-based, urea-based, glyoxal-based, acrylamide-based compounds, epoxy compounds, and polyisocyanates.
【0091】また、離形層は、塗液の濃度、塗布方式お
よび塗布条件などの塗布方法は、帯電防止層の塗布方法
と同じ方法で実施することができる。The release layer can be coated in the same manner as the coating method of the antistatic layer, such as the concentration of the coating solution, the coating method and the coating conditions.
【0092】本発明の第1、2の構成においで、離形層
の厚みは、0.01〜1μm、さらに0.03〜0.5
μmであるのが好ましい。厚みが0.01μm未満であ
ると十分な離形効果が得られないことがあり、他方1μ
mを超える層は、過剰品質であり不経済である。In the first and second constitutions of the present invention, the thickness of the release layer is 0.01 to 1 μm, more preferably 0.03 to 0.5 μm.
It is preferably μm. If the thickness is less than 0.01 μm, sufficient release effect may not be obtained, while 1 μm
Layers above m are over-quality and uneconomical.
【0093】また、本発明の第1、2の構成とは別にポ
リエステルフィルムの両面に帯電防止層を設けても良
く、本発明の目的を十分に達成できるが、過剰品質であ
り不経済である。In addition to the first and second constitutions of the present invention, an antistatic layer may be provided on both surfaces of the polyester film, and the object of the present invention can be sufficiently achieved, but the quality is excessive and uneconomical. .
【0094】本発明の離形フィルムは、離形したときの
剥離耐電位が−5〜+5KVであることが好ましい。The release film of the present invention preferably has a peeling withstand voltage of -5 to +5 KV when released.
【0095】[0095]
【実施例】以下、実施例を挙げで本発明をさらに説明す
る。なお、各特性値は下記の方法で測定した。The present invention will be further described below with reference to examples. In addition, each characteristic value was measured by the following method.
【0096】(1)剥離強度 フィルムの離形層面にポリエステル粘着テープ(ニット
―31B)を貼り合わせ、5kgの圧着ローラーで圧着
し70℃、20時間の条件で維持した後、離形層と粘着
テープとの剥離力(RfO)を引張り試験機にて測定し
た。(1) Peel strength A polyester adhesive tape (nit-31B) was adhered to the release layer surface of the film, pressed with a 5 kg pressure roller and maintained at 70 ° C. for 20 hours. The peel force (R fO ) from the tape was measured with a tensile tester.
【0097】(2)残留接着率 ポリエステル粘着テープ(ニツト―31B)をJIS
G4305に規定する冷間圧延ステンレス板(SUS3
04)に貼り付けた後の剥離力を測定し、基礎接着力
(fO )とした。次に新しい前記ポリエステル粘着テー
プをサンプルフィルムの離形層面に5kgの圧着ローラ
ーで圧着し30秒間維持した後粘着テープを剥がした。
そして、この剥がしたポリエステル粘着テープを前記ス
テンレス板に貼り、該貼合部の剥離力を測定し残留接着
力(f)とした。得られた基礎接着力(fO )と残留接
着力(f)とから下記式を用いて残留接着率を求めた。(2) Residual Adhesion Rate The polyester adhesive tape (Nit-31B) was JIS
Cold rolled stainless steel sheet (SUS3
04) was measured for the peeling force after application, and the result was taken as the basic adhesive force (f O ). Next, the new polyester pressure-sensitive adhesive tape was pressed against the release layer surface of the sample film with a 5 kg pressure roller and maintained for 30 seconds, and then the pressure-sensitive adhesive tape was peeled off.
Then, the peeled polyester pressure-sensitive adhesive tape was stuck on the stainless steel plate, and the peeling force of the bonded portion was measured to obtain a residual adhesive force (f). From the obtained basic adhesive strength (f O ) and residual adhesive strength (f), a residual adhesive rate was determined using the following equation.
【0098】残留接着率(%)=(f/fO )×100 (3)帯電性(剥離帯電評価法) フィルムの離形層面にポリエステル粘着テープ(ニツト
―31B)を貼り合わせ、5kgの圧着ローラーで圧着
し70℃、20時間の条件で維持した後、離形フィルム
側を下にして固定し、ポリエステル粘着テープを500
mm/分のスピードで剥離し、剥離されたポリエステル
粘着テープの粘着剤面の電位を粘着剤面から3cmの距
離から測定し、剥離帯電位とした。Residual adhesion rate (%) = (f / f O ) × 100 (3) Chargeability (peeling charge evaluation method) A polyester pressure-sensitive adhesive tape (nit-31B) is adhered to the release layer surface of the film, and 5 kg is pressed. After being pressed with a roller and maintained at 70 ° C. for 20 hours, the release film side was fixed downward, and the polyester pressure-sensitive adhesive tape was
Peeling was performed at a speed of mm / min, and the potential of the pressure-sensitive adhesive surface of the peeled polyester pressure-sensitive adhesive tape was measured from a distance of 3 cm from the pressure-sensitive adhesive surface, and was determined as a peeling charge potential.
【0099】(4)表面固有抵抗値 タケダ理研社製固有低抗測定器を使用し、測定温度23
℃、測定湿度65%RH及び45%RHの条件で印可電
圧500Vで1分後の表面固有抵抗値を測定した。表面
固有抵抗値としては、1×1013Ω未満が好ましい。(4) Surface Specific Resistance Using a unique low resistance measuring device manufactured by Takeda Riken Co., Ltd.
The surface specific resistance value was measured after 1 minute at an applied voltage of 500 V under the conditions of ° C and a measurement humidity of 65% RH and 45% RH. The surface resistivity is preferably less than 1 × 10 13 Ω.
【0100】[実施例1]固有粘度0.64のポリエチ
レンテレフタレートを溶融して冷却ドラム上にキャスト
して未延伸フィルムとし、この未延伸フィルムを92℃
に加熱し縦方向に3.5倍延伸して一軸延伸フィルムと
した。次いでこの一軸延伸フィルムの片面に、前記式
(IV−2)を繰り返し単位とする共重合体(平均分子
量:12,600)15重量部に前記式(IV−2a)を
繰り返し単位とする共重合体(式(IV−2a)のaが4
0モル%、bが60モル%の共重合体、平均分子量:3
8,700)を25重量部ドーピングした導電性重合体
30重量部、ジカルボン酸成分としてテレフタル酸54
モル%、イソフタル酸37モル%、アジピン酸5モル%
および5―Naスルホイソフタル酸4モル%、グリコー
ル成分としてエチレングリコール92モル%、ジエチレ
ングリコール5モル%、1,4―ブタンジオール3モル
%を用いて得られた共重合ポリエステル(Tg59℃、
平均分子量20,660)70重量部、ノニオン界面活
性剤(ポリオキシエチレンノニルフェニルエーテル)を
10重量部からなる組成物の5重量%の水性塗液をグラ
ビアコーターで塗布した。次いで、104℃で乾燥後、
108℃で横方向に3.9倍延伸し、更に220℃で熱
処理して総厚さ38μm、帯電防止層の厚さ0.12μ
mの積層フィルムをつくった。[Example 1] Polyethylene terephthalate having an intrinsic viscosity of 0.64 was melted and cast on a cooling drum to obtain an unstretched film.
And stretched 3.5 times in the machine direction to obtain a uniaxially stretched film. Next, on one surface of the uniaxially stretched film, 15 parts by weight of a copolymer (average molecular weight: 12,600) having the above formula (IV-2) as a repeating unit was added to a copolymer having the above formula (IV-2a) as a repeating unit. Combination (a in the formula (IV-2a) is 4
0 mol%, b is 60 mol% copolymer, average molecular weight: 3
8,700), and 30 parts by weight of a conductive polymer doped with 25 parts by weight of terephthalic acid 54 as a dicarboxylic acid component.
Mol%, isophthalic acid 37 mol%, adipic acid 5 mol%
And a copolymer polyester obtained using 4 mol% of 5-Na sulfoisophthalic acid, 92 mol% of ethylene glycol, 5 mol% of diethylene glycol, and 3 mol% of 1,4-butanediol as glycol components (Tg 59 ° C.,
An aqueous coating solution of 5% by weight of a composition comprising 70 parts by weight of an average molecular weight (20,660) and 10 parts by weight of a nonionic surfactant (polyoxyethylene nonylphenyl ether) was applied by a gravure coater. Then, after drying at 104 ° C,
The film is stretched 3.9 times in the transverse direction at 108 ° C. and further heat-treated at 220 ° C. to a total thickness of 38 μm and a thickness of the antistatic layer of 0.12 μm.
m of laminated film was prepared.
【0101】次にこの帯電防止層上に離形層として付加
反応型シリコーン樹脂(信越化学工業(株)製;KS―
778、固形分30%トルエン溶解液)100重量部
と、白金触媒(信越化学工業(株)製;PL―50T)
1重量部とをトルエンに溶解して、全体の固形分が3重
量%のトルエン溶液(離形層塗設用)を調製した後、グ
ラビアコーターを用いて塗布し、150℃、30分秒間
塗膜を乾燥・硬化させ、厚み0.2μmの離形層を設
け、離形フィルムを作成した。この離形フィルムの特性
を表1に示す。Next, an addition-reaction silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd .; KS-
778, 100% by weight of a 30% solids solution in toluene) and a platinum catalyst (PL-50T, manufactured by Shin-Etsu Chemical Co., Ltd.)
1 part by weight was dissolved in toluene to prepare a toluene solution having a total solid content of 3% by weight (for releasing layer coating), and then applied using a gravure coater, and applied at 150 ° C. for 30 minutes. The film was dried and cured, and a release layer having a thickness of 0.2 μm was provided to form a release film. Table 1 shows the characteristics of the release film.
【0102】[実施例2]離形層として、ポリビニル―
N―オクデシルイソシアネート(アシオ産業(株)製、
アシオニールRA―585S)をトルエンに溶解して、
固形分が2重量%のトルエン溶液を用いた以外は実施例
1と同じ方法で離形フィルムを作成した。この離形フィ
ルムの特性を表1に示す。Example 2 As a release layer, polyvinyl-
N-Ocdecyl isocyanate (manufactured by Asio Sangyo Co., Ltd.
Asionyl RA-585S) is dissolved in toluene,
A release film was prepared in the same manner as in Example 1 except that a toluene solution having a solid content of 2% by weight was used. Table 1 shows the characteristics of the release film.
【0103】[実施例3]帯電防止層の反対面に離形層
を設ける他は実施例1と同じ方法で離形フィルムを作成
した。Example 3 A release film was prepared in the same manner as in Example 1 except that a release layer was provided on the surface opposite to the antistatic layer.
【0104】[実施例4]一軸延伸フィルムの代わりに
二軸延伸後のポリエステルフィルム(帝人(株)製テト
ロンフィルム、G2 ―38μm)の片面に実施例1と同
じ水性塗料をグラビアコーターを用いて塗布し、150
℃、1分間乾燥・硬化させ、帯電防止層の厚さ0.12
μmの積層フィルムを作成し、以下実施例1と同じ方
法、条件で離形層を積層し、離形フィルムを作成した。
この離形フィルムの特性を表1に示す。Example 4 Instead of a uniaxially stretched film, a biaxially stretched polyester film (Tetron film manufactured by Teijin Limited, G 2 -38 μm) was coated on one side with the same aqueous paint as in Example 1 using a gravure coater. And apply 150
Drying and curing for 1 minute at 0 ° C, thickness of antistatic layer 0.12
A μm laminated film was prepared, and a release layer was laminated under the same method and conditions as in Example 1 to prepare a release film.
Table 1 shows the characteristics of the release film.
【0105】[比較例1]帯電防止層を設けない以外は
実施例1と同様にて離形フィルムを作成した。この離形
フィルムの特性を表1に示す。Comparative Example 1 A release film was prepared in the same manner as in Example 1 except that the antistatic layer was not provided. Table 1 shows the characteristics of the release film.
【0106】[0106]
【表1】 [Table 1]
【0107】[0107]
【発明の効果】本発明によれば、繰り出しや走行の際に
帯電が少なく、粘着剤フィルムや樹脂シート等の成形用
キャリヤーフィルムに用いた際に離形層上に形成された
粘着剤フィルムや樹脂シート等に帯電障害を生じさせる
ことなく、また粘着剤フィルムや樹脂シート等を適度の
力で剥離できる離形フィルムを提供できる。According to the present invention, an adhesive film formed on a release layer when used for a carrier film for molding, such as an adhesive film or a resin sheet, is less charged during feeding or running. It is possible to provide a release film capable of peeling an adhesive film, a resin sheet, or the like with an appropriate force without causing a charging failure in the resin sheet or the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08G 63/189 C08G 63/189 C09D 175/00 C09D 175/00 183/04 183/04 Fターム(参考) 4F100 AA07B AH06 AK04C AK21C AK41A AK42A AK52C AL01C AR00B AR00C BA03 BA07 BA10B BA10C GB41 JG03 JG03B JG04B JK07 JL14 JL14C YY00B 4J029 AA03 AB07 AC01 AC02 AD01 AD07 AE03 BA03 BA04 BA05 BA08 BD06A BF09 BF25 BF26 BH02 BH06 BH07 CA02 CA06 CB05A CB06A CB10A CC06A CD03 DB01 DB14 HA01 HB01 JE182 JE193 JF032 4J032 BA03 BA04 BA05 BB01 BB03 BB04 BB08 CF02 CG01 CG08 4J038 CE022 CR072 DK001 DL032 NA10 NA20 PA07 PC08 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08G 63/189 C08G 63/189 C09D 175/00 C09D 175/00 183/04 183/04 F-term (Reference) 4F100 AA07B AH06 AK04C AK21C AK41A AK42A AK52C AL01C AR00B AR00C BA03 BA07 BA10B BA10C GB41 JG03 JG03B JG04B JK07 JL14 JL14C YY00B 4J029 AA03 AB07 AC01 AC02 BA03 BA03 BA03 BA08 BA03 BA03 DB14 HA01 HB01 JE182 JE193 JF032 4J032 BA03 BA04 BA05 BB01 BB03 BB04 BB08 CF02 CG01 CG08 4J038 CE022 CR072 DK001 DL032 NA10 NA20 PA07 PC08
Claims (6)
抵抗値が1×105〜1×1012Ω/□の帯電防止層を
設け、その帯電防止層の上に離形層を設けてなる離形フ
ィルムであって、帯電防止層中にチオフェン及び/又は
チオフェン誘導体を重合して得られる導電性重合体を含
むことを特徴とする離形フィルム。1. A releasing method comprising: providing an antistatic layer having a surface resistivity of 1 × 10 5 to 1 × 10 12 Ω / □ on one surface of a polyester film, and providing a release layer on the antistatic layer. A release film, comprising a conductive polymer obtained by polymerizing thiophene and / or a thiophene derivative in an antistatic layer.
固有抵抗値が1×105 〜1×1012Ω/□の帯電防止
層を設け、他方の面に離形層を設けてなる離形フィルム
であって、帯電防止層中にチオフェン及び/又はチオフ
ェン誘導体を重合して得られる導電性重合体を含むこと
を特徴とする離形フィルム。2. A release film comprising an antistatic layer having a surface resistivity of 1 × 10 5 to 1 × 10 12 Ω / □ on one surface of a polyester film and a release layer on the other surface. A release film, wherein the antistatic layer contains a conductive polymer obtained by polymerizing thiophene and / or a thiophene derivative.
位が−5〜+5kVであることを特徴とする請求項1又
は2に記載の離形フィルム。3. The release film according to claim 1, wherein the release charge potential when the release film is released is -5 to +5 kV.
ーン樹脂であることを特徴とする請求項1〜3のいずれ
かに記載の離形フィルム。4. The release film according to claim 1, wherein the component exhibiting releasability is a curable silicone resin.
ルコールまたはポリエチレンイミンを塩素化アルキロイ
ルまたはアルキルイソシアネートで長鎖アルキル化した
共重合体であることを特徴とする請求項1〜3のいずれ
かに記載の離形フィルム。5. The component according to claim 1, wherein the component exhibiting releasability is a copolymer obtained by long-chain alkylation of polyvinyl alcohol or polyethyleneimine with chlorinated alkylol or alkyl isocyanate. 4. The release film according to item 1.
テレフタレートフィルム又はポリエチレン―2,6―ナ
フタレートフィルムである請求項1〜5のいずれかに記
載の離形フィルム。6. The release film according to claim 1, wherein the polyester film is a polyethylene terephthalate film or a polyethylene-2,6-naphthalate film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10222782A JP2000052495A (en) | 1998-08-06 | 1998-08-06 | Release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10222782A JP2000052495A (en) | 1998-08-06 | 1998-08-06 | Release film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000052495A true JP2000052495A (en) | 2000-02-22 |
Family
ID=16787818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10222782A Pending JP2000052495A (en) | 1998-08-06 | 1998-08-06 | Release film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000052495A (en) |
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| JP2002192661A (en) * | 2000-12-25 | 2002-07-10 | Toyobo Co Ltd | Release film |
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| JP2003062939A (en) * | 2001-08-29 | 2003-03-05 | Fujimori Kogyo Co Ltd | Release film |
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| JP2002178454A (en) * | 2000-12-11 | 2002-06-26 | Toyobo Co Ltd | Release film |
| JP2002192661A (en) * | 2000-12-25 | 2002-07-10 | Toyobo Co Ltd | Release film |
| JP2002301790A (en) * | 2001-02-01 | 2002-10-15 | Toray Ind Inc | Release film |
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