JP2000046903A - Duct connecting structure for ic testing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a duct connecting structure whose airtightness is superior and which can be loaded and unloaded easily, by a method wherein a first housing to which one end of a duct is connected and which is installed at a gas through hole, and a second housing which is coupled to the first housing, are tightened and fixed by a fixation means. SOLUTION: When a low-temperature thermal stress is applied to an IC to be tested so as to perform a performance test, an external duct 224 is connected to a handler. At this time, a second housing 311 which is fixed to the tip of the external duct 224 is inserted into a first housing 308 which is installed at a handler-side gas through hole 307 in the axial direction, and a toggle clamp 314 and a toggle clamp 315 are set, tightened and fixed. As a result, the airtightness between the first housing 308 and the second housing 311 is ensured, and a connecting operation can be performed with one motion of a finger. In addition, when the external duct 224 is removed, it is sufficient to remove the toggle clamps 314, 315. Especially, since it is sufficient to insert the second housing 311 in the axial direction, an O-ring 309 which is interposed and placed between both housings 308, 311 is not twisted, and its durability and its seal property are ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test apparatus for testing various electronic components (hereinafter, typically referred to as IC) such as semiconductor integrated circuit elements, and more particularly, to a temperature test apparatus outside a handler. The present invention relates to a duct connection structure of an IC test apparatus provided.

[0002]

2. Description of the Related Art In an IC test apparatus called a handler, a large number of ICs stored in a tray are transported into the test apparatus, and each IC is electrically contacted with a test head.
A test is performed by an IC test apparatus main body (hereinafter, also referred to as a tester). When the test is completed, each IC is taken out of the test head and placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

A conventional handler is roughly classified by a temperature application method. An IC under test is mounted on a dedicated tray called a test tray, and is loaded into a temperature application chamber to bring the IC under test to a predetermined temperature. A chamber-type handler for pressing an IC under test against a test head while being mounted on a test tray, and mounting the IC under test on a heat plate (also called a hot plate) to apply a high-temperature stress and adsorb it. There is a heat plate type in which a plurality of heads are suction-conveyed at a time and pressed against a test head.

In particular, when a test is performed by applying a low-temperature thermal stress, a chamber-type handler is mainly used. By introducing liquid nitrogen into the chamber, a low-temperature thermal stress of, for example, about -30.degree. Is applied.

[0005]

When a low-temperature thermal stress is applied by a handler, a supply source of liquid nitrogen is required as described above, and conventionally, a liquid nitrogen storage is provided separately from a factory. The pipe was drawn into the handler using a pipe, or a liquid nitrogen cylinder was installed near the handler, from which the pipe was supplied to the handler.

However, if liquid nitrogen is pressure-fed from a separately provided liquid nitrogen storage tank by a factory pipe, there is a problem that a space for arranging the factory pipe is restricted, and a cost for heat insulation and other facilities is increased. was there.
In addition, if a liquid nitrogen cylinder is installed near the handler, this problem is solved, but a new problem arises in that replacement of the liquid nitrogen cylinder is troublesome.

Further, liquid nitrogen is a substance that requires careful handling, and cannot be used carelessly. Therefore, it is necessary to pay sufficient attention to measures for that, and the cost is high in that sense.

Accordingly, the present inventors have developed an IC test apparatus provided with a temperature application device instead of liquid nitrogen. However, in order to supply cold air from the temperature application device to the temperature application chamber of the handler, the temperature application device was used. And the handler must be connected by a duct. In this case, it is necessary to remove the duct when performing maintenance in the temperature application chamber or replacing a change kit. It was desired to develop a new duct connection structure at the same time.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a duct connection structure of an IC test apparatus which is excellent in airtightness and can be easily attached and detached.

[0010]

Means for Solving the Problems (1) In order to achieve the above object, a duct connection structure of an IC test apparatus according to the present invention includes a test device for transferring an IC under test to a temperature application chamber and applying a thermal stress to the test device. After performing the above, in an IC test apparatus including a handler for classifying ICs to be tested according to test results, and a temperature application device for supplying cold air or hot air to the temperature application chamber via a duct, A gas through-hole opened in the temperature application chamber and connected to one end of the duct, a first housing provided in the gas through-hole, and a first housing mounted on one end of the duct through a seal member to the first housing; And a fixing means for tightening and fixing the first housing and the second housing.

At this time, although not particularly limited, it is preferable that the engagement between the first housing and the second housing is a structure that is inserted only in the axial direction of the duct. It is more preferable that the fixing means for tightening and fixing the first and second housings has a structure for relatively pressing the first and second housings in the axial direction of the duct.

[0012] In the duct connection structure of the IC test apparatus of the present invention, a gas through-hole opened in the temperature application chamber of the handler and connected to one end of the duct; a first housing provided in the gas through-hole; A second housing attached to one end of the duct and engaged with the first housing via a seal body; and a fixing means for tightening and fixing the first housing and the second housing. 1
The second housing is engaged with the first housing, and the second housing can be fastened and fixed with a single touch by the fixing means. Further, the airtightness of the duct and the temperature application chamber of the handler is maintained by the seal body. In particular, if the structure is such that the seal is engaged and pressed only in the axial direction of the duct, there is no danger of the seal being twisted, and the attachment / detachment operation becomes extremely simple.

(2) Although not particularly limited in the above invention, in the duct connection structure for an IC test apparatus according to claim 2, the first and second housings are formed of a synthetic resin. I do.

In the duct connection structure of the IC test apparatus according to the present invention, since the first and second housings are formed of synthetic resin, the heat insulating property of the hot gas passing through the duct is ensured, and the heat efficiency and the dew condensation are excellent. It also contributes to prevention.

(3) Although not particularly limited in the above invention, in the duct connection structure for an IC test apparatus according to the third aspect, one end of the duct is air-tightly mounted to the second housing via a fastening band. It is characterized by having.

Since it is not necessary to attach / detach one end of the duct and the second housing, airtightness can be ensured if the duct is firmly fixed with a tightening band.

(4) In the above invention, the fixing means for tightening and fixing the first housing and the second housing include, for example, a toggle clamp and a crescent.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an IC test apparatus of the present invention, FIG. 2 is a circuit diagram showing a refrigeration cycle and a cold air supply system of FIG. 1, and FIG. 3 is a layout of an IC under test in the IC test apparatus of FIG. 7 is a flowchart of a tray showing a method.

The handler 10 initially for Torimawashi of the IC in the handler 10 with reference to the flowchart of FIG. 3 will be described. FIG. 3 is a diagram for understanding a method of handling the IC under test. In the actual handler 10, the vertical direction (Z
In some cases, members arranged side by side (in the axial direction) are shown in a plan view.

The handler 10 according to the present embodiment uses an IC under test.
A device that tests (tests) whether an IC operates properly in a state where high or low temperature stress is applied to the IC and classifies the IC according to the test result. In the operation test, the IC under test is replaced by a test tray TT transported in the IC test apparatus 1 from a tray (hereinafter, also referred to as a customer tray KT) on which a large number of ICs to be tested are mounted. Will be implemented.

For this reason, as shown in FIG. 1, the handler according to the present embodiment stores an IC under test to be tested and an IC storage unit 1 for classifying and storing tested ICs.
00, the loader unit 200 for sending the IC under test sent from the IC storage unit 100 to the chamber unit 300, the chamber unit 300 including the test head, and the tested ICs tested in the chamber unit 300. And an unloader section 400 for taking out.

The IC storage unit 100 stores the I under test I before the test.
A pre-test IC stocker for storing C and a tested IC stocker for storing ICs to be tested classified according to test results (these are collectively referred to simply as stocker 101) are provided. FIG. 3 shows a state where these stockers 101 are pulled out by dotted lines.

The pre-test IC stocker and the tested I
The C stocker 101 includes a frame-shaped tray support frame 102 and an elevator 103 that can enter from a lower portion of the tray support frame 102 and move upward and downward. The tray support frame 102 includes a customer tray KT. (Shown by a dashed line in the figure) are stacked and supported, and only the stacked customer trays KT are lifted by the elevator 10.
3 to move up and down.

Since the pre-test IC stocker and the tested IC stocker have the same structure, the number of the pre-test IC stocker and the number of the tested IC stocker may be appropriately changed as necessary. Can be set. For example, in the example shown in FIG. 3, one stocker STK-B is allocated as a pre-test stocker, and an empty stocker STK-E to be sent to the unloader unit 400 next to it.
, And five stockers STK-1, STK-2,..., STK-
5 is allocated, and a maximum of five classifications can be sorted and stored according to the test result. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

The above-mentioned customer tray KT is carried from the lower side of the apparatus board 105 to the window 201 of the loader section 200 by the tray transfer arm 104 provided between the IC storage section 100 and the apparatus board 105. Then, in the loader unit 200, the IC under test loaded on the customer tray KT is once transferred to a preciser 204 by the XY transfer device 202, where the IC under test is
After correcting the mutual position of the
The IC under test transferred to the X.Y.
2, the test tray TT stopped on the loader unit 200 is reloaded.

From the customer tray KT to the test tray TT
The XY transfer device 202 for transferring the IC under test to
A movable head 203 movable in the X and Y directions shown in the figure is provided, and a suction head is attached to the movable head 203 downward (not shown). The suction head moves while sucking air, thereby sucking the IC under test from the customer tray KT and reloading the IC under test onto the test tray TT. For example, about eight such suction heads are mounted on the movable head 203,
As a result, eight ICs under test can be transferred to the test tray TT in one operation.

By the way, a precisor 204 provided between the window 201 of the loader unit 200 and the test tray TT.
Is a means for correcting the position of the IC under test, and once the IC under test mounted on the customer tray KT is dropped into the recess of the precisor 204, the mutual positions of the ICs under test are accurately determined and the positions are corrected. By sucking the IC under test again with the suction head and loading it on the test tray TT,
The IC under test can be accurately reloaded into the IC storage recess formed in the test tray TT.

The test tray TT is connected to the loader unit 2
After the IC under test is loaded at 00, the chamber section 300
, And each IC under test is tested while being mounted on the test tray TT.

The chamber section 300 includes a soak chamber (constant temperature chamber) 301 for applying a desired high or low temperature thermal stress to the IC under test loaded on the test tray TT;
A test chamber 302 for bringing an IC under test thermally stressed in the soak chamber 301 into contact with a test head 304, and an exit for removing the applied thermal stress from the IC under test tested in the test chamber 302 And a chamber (heat removal tank) 303.

A vertical transfer device (not shown) is provided in the soak chamber 301, and a plurality of test trays TT stand by while being supported by the vertical transfer device until the test chamber 302 becomes empty. Mainly, during this standby, high-temperature or low-temperature thermal stress is applied to the IC under test.

A test head 304 is disposed at the center of the test chamber 302, and a test tray TT is carried on the test head 304, and the input / output terminals of the IC under test are electrically connected to the contact pins of the test head 304. The test is performed by contacting

In the exit chamber 303, when a high temperature is applied in the soak chamber 301, the IC under test is cooled by blowing air to return to room temperature.
When a low temperature of, for example, about −30 ° C. is applied, the IC under test is heated to a temperature at which dew condensation does not occur by heating the IC under test with warm air or a heater, and then discharged to the unloader section 400.

The unloader section 400 also has a loader section 200
X having substantially the same structure as the XY transfer device 202 provided in
XY transport device 402 is provided.
The tested IC is transferred from the test tray TT carried out to the unloader section 400 to the customer tray KT by the movable head 403 provided in the customer tray KT.

The apparatus board 105 of the unloader section 400 has four windows 4 so that the customer tray KT carried to the unloader section 400 faces the upper surface of the apparatus board 105.
01 is provided. Although not shown, a lift table for raising and lowering the customer tray KT is provided below each window 401. Here, the tested ICs to be tested are reloaded and become full. The customer tray KT is placed and lowered, and the full tray is delivered to the tray transfer arm 104.

Incidentally, in the handler 10 of the present embodiment, although the maximum number of sortable categories is five, only four customer trays KT can be arranged in the window 401 of the unloader unit 400 at the maximum. Therefore, the categories that can be sorted in real time are limited to four categories. For this reason, in the handler 10 of this embodiment, the test tray TT of the unloader unit 400 and the window 40
1 and a buffer unit 404 is provided.
04 is temporarily stored with the IC under test of a category that rarely occurs.

Refrigerator 20 The IC test apparatus 1 of the present embodiment includes the above-described handler 10
And a refrigerating device 20 for supplying cool air to the soak chamber 301 and the test chamber 302. The refrigeration apparatus 20 is used when a low-temperature thermal stress is applied to an IC under test, and includes a refrigeration cycle 210 and a cold air supply system 220 therein.

The refrigerating cycle 210 mainly includes a compressor 211 driven by an electric motor to suck and compress the refrigerant into a high-temperature and high-pressure gas, and a heat exchange of the high-temperature and high-pressure gas with the outside air to condense and liquefy, thereby forming a low-temperature high-pressure gas. A condenser (condenser) 212 for forming a liquid mixture gas, a receiver tank 213 for separating the gas-liquid mixture gas and extracting only the liquid refrigerant, and a low-temperature and low-pressure mist refrigerant by rapidly expanding the high-pressure liquid refrigerant And an evaporator (evaporator) 215 for cooling air using the low-temperature and low-pressure mist refrigerant are connected by a refrigerant pipe 216 so as to form a closed loop circuit.

As shown in the external view of FIG. 1, the condenser 212 is provided with a fan 217 for sucking air from outside (the ceiling) of the casing 201 and cooling the high-temperature refrigerant. Further, the expansion valve 214 includes a temperature-sensitive cylinder 218 that detects the refrigerant temperature on the outlet side of the evaporator 215, and when the temperature detected by the temperature-sensitive cylinder 218 is high (that is, when the heat load of the evaporator 215 is large). Is the expansion valve 214
Is increased to increase the supply amount of the refrigerant to the evaporator 215. Conversely, when the refrigerant temperature at the outlet side of the evaporator 215 is low, the heat load on the evaporator 215 is not so large, and the amount of refrigerant supplied to the evaporator 215 is suppressed by reducing the opening of the expansion valve 214.

On the other hand, the cool air supply system 220 supplies air to the evaporator 215 of the refrigeration cycle 210 to cool it, supplies the cooled air to the soak chamber 301 of the handler 10, and tests the cool air. A closed loop circuit is returned from the chamber 302 to the refrigerator 20 again.

For this reason, the cool air supply system 220 is provided with ducts 222 and 224 having a blower fan 223. When the blower fan 223 is operated, the intake air is sent to the evaporator 215 via the internal duct 222 and heat exchange is performed. Cooling. The outlet side of the blower fan 223 and the soak chamber 301 of the handler 10 are connected by an external duct 224, and the test chamber 302 and the inlet side of the evaporator 215 are connected by an external duct 224. Then, the cool air cooled by the evaporator 215 is supplied to the soak chamber 301 via the internal duct 222 and the external duct 224, and then is supplied from the test chamber 302 to the external duct 224 and the internal duct 222.
Is supplied again to the evaporator.

In applying the low-temperature thermal stress, the cold air is circulated by making the cold air supply system 220 a closed loop as described above, but the test of the IC under test is terminated and the inside of the chamber 300 is returned to normal temperature. In this case, air at room temperature is taken in through an inlet 221 provided on the side of the casing 201 for taking in indoor air or an inlet 225 to which a compressed air pipe in a factory is connected. The cool air of the cool air supply system 220 is exhausted from the outlet 226 to the room.
In order to perform such air path switching, the cooling air circulation system 220 is provided with switching valves 227a to 227d.

Further, in the refrigeration apparatus 20 of the present embodiment, an electric heater 228 for finely adjusting the temperature of the air cooled by the evaporator 215 is provided in the duct 222 on the downstream side of the evaporator 215. This is used when it is difficult to control the cool air temperature only by the evaporator 215, and need not always be used. For example, there is a test performed under cryogenic conditions such as -30 ° C. even if it is referred to as a low-temperature thermal stress.
Some tests are performed at moderately low temperature conditions.

Therefore, the cooling capacity of the refrigeration cycle 210 is required to be able to realize the extremely low temperature condition of -30.degree.
When used under low temperature conditions of about ° C, the cooling capacity becomes too large. At this time, using the electric heater 228,
The supercooled air is heated to a target temperature by the evaporator 215 and supplied to the soak chamber 301.

In this embodiment, the soak chamber 30 is used.
A temperature sensor 229 is provided for detecting the temperature inside the heater 1, and the electric heater 228 is mainly controlled based on the actual temperature measured by the temperature sensor 229.

Note that the blower fan 223 of the present embodiment
Since the inverter control is possible, the soak chamber 30
A certain degree of temperature control is possible by adjusting the amount of cold air supplied to 1.

Further, in the IC test apparatus 1 of the present embodiment,
Control signals are exchanged between the handler 10 and the refrigeration apparatus 20, and setting and monitoring of the refrigeration apparatus 20 are mainly performed on the handler 10 side. That is, the refrigeration system 20
Input means for inputting the applied temperature by
The set temperature and the actual temperature data from the temperature sensor 229 are sent to the control unit of the refrigeration system. Further, an operation command signal and a stop command signal are also transmitted from the handler 10 to the refrigeration apparatus 20, and the operation of the refrigeration apparatus 20 is started and stopped by the handler 10 side. On the other hand, the refrigeration system 20
A signal indicating the operation state of the refrigeration apparatus 20 is transmitted from the side to the handler 10 side, and when an abnormality occurs in the refrigeration apparatus 20, a stop command signal is transmitted from the handler 10.

In particular, in the IC test apparatus 1 of the present embodiment, the connection between the external duct 224 and the handler 10 is configured as follows. FIG. 4 shows the chamber section 3 of the handler 10.
FIG. 5 is a front view showing the connection structure of the chamber door 305 and the duct 224 of FIG. 00, and FIG. 5 is a sectional view taken along the line VV of FIG.
Although FIG. 4 shows one duct connection part (cold air outlet side) of the chamber section 300, a similar structure is adopted for a connection part (cold air inlet side) between the external duct 224 and the soak chamber 301. I have.

First, as shown in FIGS. 4 and 5, a chamber door 305 is mounted on the wall surface of the chamber 300 so as to be openable and closable, and a window for inspecting the inside of the chamber 300 is provided on the chamber door 305. A part 306 is formed. Further, the chamber door 305 is provided with a gas through hole 307 communicating with the inside of the chamber section 300, and the first housing 308 is formed in the gas through hole 307.
Are fixed by bolts (not shown).

The first housing 308 is provided with the gas passage 30.
The housing is a synthetic resin housing having a circular through hole corresponding to No. 7, and a step portion 310 for sandwiching an O-ring (corresponding to a seal body of the present invention) 309 described later is formed. Examples of the synthetic resin include an epoxy resin reinforced with glass fiber.

On the other hand, one end of the external duct 224 is connected to the second housing 308 inserted in the first housing 308 described above.
Is fixed by a fastening band 312. External duct 224 and second housing 3
Since there is no need to attach and detach to and from 11, tightening band 312
Tighten tightly. This second housing 31
1 also has a circular through hole corresponding to the gas through hole 307, is made of glass fiber reinforced epoxy, or the like, and has an O-ring 309 sandwiched at the tip in cooperation with the step 310 of the first housing 308 described above. A step 313 is formed. In addition,
In the present embodiment, the O-ring 309 is used as the seal body. However, any member that can ensure the airtightness between the first and second housings 308 and 311 can be used instead. For example, a silicon sponge can be used instead.

The second fixed to one end of the external duct 224
A toggle clamp lever 314 is fixed to the second housing 311 so as to engage the housing 311 of the chamber door 305 with the first housing 308 fixed to the chamber door 305. Is fixed to the toggle clamp hook 315. As shown in FIG. 4, three pairs of the toggle clamp lever 314 and the toggle clamp hook 315 are provided equidistantly in the circumferential direction of the first and second housings 308 and 311. Housing 30
8, the toggle clamp lever 314 is hooked on the toggle clamp hook 315 and set, whereby the first and second housings 308 and 311 are relatively compressed, and the O-ring 309 is clamped. .

Incidentally, the first and second housings 3
As means for making the 08 and 311 detachable with one touch, for example, a mechanism such as a crescent can be adopted in addition to the toggle clamps 314 and 315 of the present example. In this example, the toggle clamp lever 314 is
Of the toggle clamp hook 31
Although 5 is provided on the first housing 308, it is also possible to provide it in reverse. Further, in this example, the toggle clamp hook 315 is fixed to the chamber door 305, but one of the toggle clamps is at least in the first housing 308.
It is sufficient if the position is directly or indirectly fixed relative to.

The outer duct 224 of this embodiment has a structure in which a heat insulating material 224c is interposed between the inner sheet member 224a and the outer sheet member 224b, so that dew condensation due to cool air can be prevented.

Next, the operation will be described. When performing an operation test by applying a low-temperature thermal stress to the IC under test, first, the external duct 224 is connected to the handler 10. In this case, the first housing 308 fixed to the handler 10 side includes
The second housing 311 fixed to the tip of the external duct 224 is inserted in the axial direction, and the toggle clamps 314 and 31 are inserted.
Set 5 Thereby, the airtightness between the first and second housings 308 and 311 is ensured, the connection operation can be performed with one touch, and even if the external duct 224 needs to be removed, it is sufficient to remove the toggle clamps 314 and 315. . In particular, since the first housing 308 and the second housing 311 are only inserted in the axial direction,
The O-ring 309 interposed therebetween does not twist, and the O-ring has sufficient durability and sealing properties. In addition, when the refrigeration apparatus 20 is not required as in the case of performing a high temperature heat stress test or a normal temperature test,
The second housing 311 is removed, and a plug having a substantially identical shape and a closed circular through hole is attached instead.

When the external duct 224 is connected to the handler 10, the handler 10 is set to use the refrigerating apparatus 20, and then the applied temperature is set and the start button of the refrigerating apparatus 20 is input. As a result, the handler 1
From 0, the set temperature is sent to the refrigeration apparatus 20 together with the operation start signal.

In the refrigeration apparatus 20, upon receiving the operation start command, the compressor 211 and the condenser fan 217
Is activated to operate the refrigeration cycle 210, and the blower fan 223 is also activated to circulate the air.

When the compressor 211 is started, the refrigerant sucked into the compressor 211 is compressed to become a high-temperature and high-pressure gas, and is cooled by the condenser 212 to become a low-temperature and high-pressure gas-liquid mixed gas. From this gas-liquid mixed gas, only the liquid refrigerant is extracted in the receiver tank 213 and sent to the expansion valve 214. The expansion valve 214 rapidly expands the high-pressure liquid refrigerant into a low-temperature, low-pressure mist-like refrigerant, which is sent to the evaporator 215.

On the other hand, the supply of cold air to the soak chamber 301 is performed by opening the switching valve 227c and switching the switching valves 227a and 227a.
The heat exchange is performed after closing the 227b and 227d (the switching valve 227b may be open), and by passing air through the evaporator 215 through which the low-temperature and low-pressure mist refrigerant flows, for example, at -30 ° C. Cold air is in the soak chamber 301
Supplied to Since the soak chamber 301 and the test chamber 302 communicate with each other, the cool air supplied to the soak chamber 301 cools the IC under test (mounted on the test tray TT) conveyed into the soak chamber 301. While flowing into the test chamber 302, and further through the external duct 224.
It is returned to 5 and cooled again.

At this time, the temperature sensor 229 provided in the soak chamber 301 causes the
The actual temperature in 01 is measured and sent out from the handler 10 to the refrigerating device 20 and fed back to the operation of the electric heater 228. For example, when the actual temperature of the soak chamber 301 is too lower than the set temperature (reference temperature), the electric heater 228 is operated to heat the supercooled cold air and supply it to the soak chamber 301. Such actual temperature data is sent from the handler 10 to the refrigerating apparatus 20 at regular intervals, and the control of the electric heater 228 described above is executed each time.

When the actual temperatures of the soak chamber 301 and the test chamber 302 reach the conditions, the test of the IC under test is started. During the test, the refrigeration apparatus 20 outputs the operating state of the refrigeration apparatus itself, for example, the compressor 2.
11. It sends to the handler 10 whether the condenser fan 217, the blower fan 223, the electric heater 228 and other components are operating normally. If an abnormality occurs, the operation stop command signal is sent from the handler 10 to the refrigerating apparatus 20 to stop the refrigerating apparatus 20, and an alarm is generated to alert the worker to that effect. When the alarm is released, the operation start command signal is sent again from the handler 10 to the refrigerating apparatus 20, and the test is restarted.

The embodiments described above are described for facilitating the understanding of the present invention, but are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the handler 10 according to the present invention
Is not at all limited to the type described above, and other handlers are within the scope of the invention. FIG.
The specific configurations of the refrigeration cycle 210 and the cool air supply system 220 shown in (1) can be appropriately changed without any particular limitation.

[0063]

As described above, according to the present invention, the first
The duct can be connected to the handler simply by engaging the second housing with the housing and tightening and fixing by the fixing means. The duct and the temperature application chamber of the handler are kept airtight by a seal body, and one-touch operation. The duct can be attached and detached.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an IC test apparatus of the present invention.

FIG. 2 is a circuit diagram showing a refrigeration cycle and a cool air supply system of FIG.

FIG. 3 is a flowchart of a tray showing a method for handling an IC under test in the IC test apparatus of FIG. 1;

FIG. 4 is a front view showing a duct connection portion.

FIG. 5 is a sectional view taken along the line VV of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC test apparatus 10 ... Handler 100 ... IC storage part 200 ... Loader part 300 ... Chamber part 307 ... Gas passage hole 308 ... First housing 309 ... O-ring (seal body) 311 ... Second housing 314 ... Toggle clamp Lever (fixing means) 315 Toggle clamp hook (fixing means) 400 Unloader section KT Customer tray TT Test tray 20 Refrigeration unit 201 Casing 210 Refrigeration cycle 211 Compressor 212 Condenser (condenser) 213 Receiver Tank 214 Expansion valve 215 Evaporator 216 Refrigerant piping 217 Condenser fan 218 Temperature sensing cylinder 220 Cold air supply system 221 Inlet 222 Internal duct 223 Blower fan 224 External duct 225 Inlet 226 ... outlet 227a to 227d: switching valve 228: electric heater (heater) 229: temperature sensor

Claims (3)

[Claims] 1. An IC under test is transported to a temperature application chamber.
An IC comprising: a handler for performing a test by applying a thermal stress and then classifying the IC under test according to the test result; and a temperature application device for supplying a cool air or a hot air to the temperature application chamber via a duct. In the test apparatus, a gas through-hole opened in the temperature application chamber of the handler and connected to one end of the duct, a first housing provided in the gas through-hole, and a first housing attached to one end of the duct, 2. A duct connection structure for an IC test apparatus, comprising: a second housing engaged with a first housing via a seal body; and fixing means for fastening and fixing the first housing and the second housing. . 2. The duct connection structure for an IC test apparatus according to claim 1, wherein said first and second housings are formed of a synthetic resin. 3. The duct connection structure for an IC test apparatus according to claim 1, wherein one end of the duct is air-tightly mounted to the second housing via a fastening band.