JP1699856S - 半導体素子 - Google Patents
半導体素子Info
- Publication number
- JP1699856S JP1699856S JP2020026987F JP2020026987F JP1699856S JP 1699856 S JP1699856 S JP 1699856S JP 2020026987 F JP2020026987 F JP 2020026987F JP 2020026987 F JP2020026987 F JP 2020026987F JP 1699856 S JP1699856 S JP 1699856S
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020026987F JP1699856S (ja) | 2020-12-15 | 2020-12-15 | 半導体素子 |
| US29/767,916 USD973029S1 (en) | 2020-12-15 | 2021-01-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020026987F JP1699856S (ja) | 2020-12-15 | 2020-12-15 | 半導体素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1699856S true JP1699856S (ja) | 2021-11-15 |
Family
ID=78508141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020026987F Active JP1699856S (ja) | 2020-12-15 | 2020-12-15 | 半導体素子 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD973029S1 (ja) |
| JP (1) | JP1699856S (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1034494S1 (en) * | 2020-07-31 | 2024-07-09 | Rohm Co., Ltd. | Semiconductor device |
| JP1695848S (ja) * | 2021-03-19 | 2021-09-27 | ||
| JP1695850S (ja) * | 2021-03-19 | 2021-09-27 | ||
| JP1695825S (ja) * | 2021-03-19 | 2021-09-27 | ||
| JP1695824S (ja) * | 2021-03-19 | 2021-09-27 | ||
| JP1695849S (ja) * | 2021-03-19 | 2021-09-27 | ||
| JP1695826S (ja) * | 2021-03-19 | 2021-09-27 | ||
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1049065S1 (en) * | 2021-07-12 | 2024-10-29 | Jmj Korea Co., Ltd. | Semiconductor package |
| JP1711418S (ja) * | 2021-10-13 | 2022-03-31 | 半導体素子 | |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1107671S1 (en) * | 2022-05-12 | 2025-12-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1055880S1 (en) * | 2022-12-13 | 2024-12-31 | Delta Electronics, Inc. | Power module |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| JP6069904B2 (ja) * | 2012-06-22 | 2017-02-01 | 富士通株式会社 | 磁気抵抗メモリ |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
| JP1593817S (ja) * | 2017-03-28 | 2017-12-25 | ||
| JP1603175S (ja) * | 2017-10-19 | 2018-05-07 | ||
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| JP1665773S (ja) * | 2018-11-07 | 2020-08-11 | ||
| JP1664528S (ja) | 2019-10-28 | 2020-07-27 | ||
| JP1664527S (ja) | 2019-10-28 | 2020-07-27 | ||
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
-
2020
- 2020-12-15 JP JP2020026987F patent/JP1699856S/ja active Active
-
2021
- 2021-01-26 US US29/767,916 patent/USD973029S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD973029S1 (en) | 2022-12-20 |
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