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ITTO990288A0 - Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda. - Google Patents

Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda.

Info

Publication number
ITTO990288A0
ITTO990288A0 IT1999TO000288A ITTO990288A ITTO990288A0 IT TO990288 A0 ITTO990288 A0 IT TO990288A0 IT 1999TO000288 A IT1999TO000288 A IT 1999TO000288A IT TO990288 A ITTO990288 A IT TO990288A IT TO990288 A0 ITTO990288 A0 IT TO990288A0
Authority
IT
Italy
Prior art keywords
radiator
printed circuit
board
power components
circuit board
Prior art date
Application number
IT1999TO000288A
Other languages
English (en)
Inventor
Olivier Ploix
Original Assignee
Sagen Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagen Sa filed Critical Sagen Sa
Publication of ITTO990288A0 publication Critical patent/ITTO990288A0/it
Publication of ITTO990288A1 publication Critical patent/ITTO990288A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
IT1999TO000288A 1998-04-15 1999-04-13 Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda. ITTO990288A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9804666A FR2777734B1 (fr) 1998-04-15 1998-04-15 Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte

Publications (2)

Publication Number Publication Date
ITTO990288A0 true ITTO990288A0 (it) 1999-04-13
ITTO990288A1 ITTO990288A1 (it) 2000-10-13

Family

ID=9525243

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999TO000288A ITTO990288A1 (it) 1998-04-15 1999-04-13 Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda.

Country Status (2)

Country Link
FR (1) FR2777734B1 (it)
IT (1) ITTO990288A1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657866B2 (en) * 2002-03-15 2003-12-02 Robert C. Morelock Electronics assembly with improved heatsink configuration
DE50213799D1 (de) 2002-09-02 2009-10-08 Eberspaecher Catem Gmbh & Co K Elektrische Heizung für Kraftfahrzeuge
DE102005047025A1 (de) 2005-09-30 2007-04-05 Siemens Ag Leiterplatte
DE102012204133B4 (de) * 2012-03-16 2026-02-12 Schaeffler Technologies AG & Co. KG Verfahren zur Herstellung einer elektronischen Leistungsschaltung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383270A (en) * 1980-07-10 1983-05-10 Rca Corporation Structure for mounting a semiconductor chip to a metal core substrate
DE4240996C1 (de) * 1992-12-05 1994-06-16 Bosch Gmbh Robert Verfahren zur Herstellung einer Verbundanordnung
US5457605A (en) * 1993-11-23 1995-10-10 Motorola, Inc. Electronic device having coplanar heatsink and electrical contacts
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module

Also Published As

Publication number Publication date
ITTO990288A1 (it) 2000-10-13
FR2777734B1 (fr) 2004-07-09
FR2777734A1 (fr) 1999-10-22

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