ITTO910929A1 - Procedimento per la fabbricazione di circuiti integrati in tecnologia mos. - Google Patents
Procedimento per la fabbricazione di circuiti integrati in tecnologia mos.Info
- Publication number
- ITTO910929A1 ITTO910929A1 IT000929A ITTO910929A ITTO910929A1 IT TO910929 A1 ITTO910929 A1 IT TO910929A1 IT 000929 A IT000929 A IT 000929A IT TO910929 A ITTO910929 A IT TO910929A IT TO910929 A1 ITTO910929 A1 IT TO910929A1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacture
- integrated circuits
- mos technology
- mos
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
- H10B41/42—Simultaneous manufacture of periphery and memory cells
- H10B41/49—Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0188—Manufacturing their isolation regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H10W10/0126—
-
- H10W10/0127—
-
- H10W10/13—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO910929A IT1250233B (it) | 1991-11-29 | 1991-11-29 | Procedimento per la fabbricazione di circuiti integrati in tecnologia mos. |
| EP92118785A EP0545082B1 (en) | 1991-11-29 | 1992-11-02 | Process for manufacturing MOS-type integrated circuits comprising LOCOS isolation regions |
| DE69231484T DE69231484T2 (de) | 1991-11-29 | 1992-11-02 | Verfahren zur Herstellung von Isolationszonen des LOCOS-Typs für integrierte Schaltungen vom MOS-Typ |
| JP4320695A JPH05251555A (ja) | 1991-11-29 | 1992-11-30 | Mos型集積回路の製造方法 |
| US08/475,555 US5696399A (en) | 1991-11-29 | 1995-06-07 | Process for manufacturing MOS-type integrated circuits |
| US08/524,080 US5663080A (en) | 1991-11-29 | 1995-09-06 | Process for manufacturing MOS-type integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO910929A IT1250233B (it) | 1991-11-29 | 1991-11-29 | Procedimento per la fabbricazione di circuiti integrati in tecnologia mos. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITTO910929A0 ITTO910929A0 (it) | 1991-11-29 |
| ITTO910929A1 true ITTO910929A1 (it) | 1993-05-29 |
| IT1250233B IT1250233B (it) | 1995-04-03 |
Family
ID=11409750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITTO910929A IT1250233B (it) | 1991-11-29 | 1991-11-29 | Procedimento per la fabbricazione di circuiti integrati in tecnologia mos. |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US5696399A (it) |
| EP (1) | EP0545082B1 (it) |
| JP (1) | JPH05251555A (it) |
| DE (1) | DE69231484T2 (it) |
| IT (1) | IT1250233B (it) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0788168A1 (en) | 1996-01-31 | 1997-08-06 | STMicroelectronics S.r.l. | Process of fabricating non-volatile floating-gate memory devices, and memory device fabricated thereby |
| JPH104182A (ja) * | 1996-06-14 | 1998-01-06 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| US5888871A (en) * | 1996-12-24 | 1999-03-30 | Samsung Electronics Co., Ltd. | Methods of forming EEPROM memory cells having uniformly thick tunnelling oxide layers |
| US6144064A (en) * | 1996-12-24 | 2000-11-07 | Samsung Electronics Co., Ltd. | Split-gate EEPROM device having floating gate with double polysilicon layer |
| US5943579A (en) * | 1997-02-14 | 1999-08-24 | Micron Technology, Inc. | Method for forming a diffusion region in a semiconductor device |
| US6624495B2 (en) * | 1997-04-23 | 2003-09-23 | Altera Corporation | Adjustable threshold isolation transistor |
| US6020222A (en) * | 1997-12-16 | 2000-02-01 | Advanced Micro Devices, Inc. | Silicon oxide insulator (SOI) semiconductor having selectively linked body |
| FR2778018B1 (fr) * | 1998-04-28 | 2000-06-23 | Sgs Thomson Microelectronics | Procede de fabrication de dispositifs eeprom |
| US6380016B2 (en) * | 1998-06-23 | 2002-04-30 | Ross Alan Kohler | Method for forming programmable CMOS ROM devices |
| US6362049B1 (en) * | 1998-12-04 | 2002-03-26 | Advanced Micro Devices, Inc. | High yield performance semiconductor process flow for NAND flash memory products |
| JP2001168306A (ja) * | 1999-12-09 | 2001-06-22 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
| JP2003031797A (ja) * | 2001-07-12 | 2003-01-31 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| KR100935248B1 (ko) * | 2003-02-05 | 2010-01-06 | 매그나칩 반도체 유한회사 | Dmos 트랜지스터 및 그 제조 방법 |
| JP4346322B2 (ja) * | 2003-02-07 | 2009-10-21 | 株式会社ルネサステクノロジ | 半導体装置 |
| US7238563B2 (en) * | 2003-03-10 | 2007-07-03 | Kabushiki Kaisha Toshiba | Semiconductor device having isolation region and method of manufacturing the same |
| JP4540320B2 (ja) * | 2003-09-19 | 2010-09-08 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法 |
| US20060108641A1 (en) * | 2004-11-19 | 2006-05-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device having a laterally graded well structure and a method for its manufacture |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3319311A (en) * | 1963-05-24 | 1967-05-16 | Ibm | Semiconductor devices and their fabrication |
| NL136562C (it) * | 1963-10-24 | |||
| US3461360A (en) * | 1965-06-30 | 1969-08-12 | Ibm | Semiconductor devices with cup-shaped regions |
| GB1316555A (it) * | 1969-08-12 | 1973-05-09 | ||
| US3764396A (en) * | 1969-09-18 | 1973-10-09 | Kogyo Gijutsuin | Transistors and production thereof |
| NL7017066A (it) * | 1970-11-21 | 1972-05-24 | ||
| US3821776A (en) * | 1970-12-28 | 1974-06-28 | Kogyo Gijutsuin | Diffusion self aligned mosfet with pinch off isolation |
| US3845495A (en) * | 1971-09-23 | 1974-10-29 | Signetics Corp | High voltage, high frequency double diffused metal oxide semiconductor device |
| NL161305C (nl) * | 1971-11-20 | 1980-01-15 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderin- richting. |
| US3924265A (en) * | 1973-08-29 | 1975-12-02 | American Micro Syst | Low capacitance V groove MOS NOR gate and method of manufacture |
| US4001860A (en) * | 1973-11-12 | 1977-01-04 | Signetics Corporation | Double diffused metal oxide semiconductor structure with isolated source and drain and method |
| US3909320A (en) * | 1973-12-26 | 1975-09-30 | Signetics Corp | Method for forming MOS structure using double diffusion |
| US3986903A (en) * | 1974-03-13 | 1976-10-19 | Intel Corporation | Mosfet transistor and method of fabrication |
| JPS5148981A (ja) * | 1974-10-25 | 1976-04-27 | Nippon Electric Co | Zetsuengeetogatadenkaikokahandotaisochi |
| US4015278A (en) * | 1974-11-26 | 1977-03-29 | Fujitsu Ltd. | Field effect semiconductor device |
| JPS5185381A (it) * | 1975-01-24 | 1976-07-26 | Hitachi Ltd | |
| JPS52132684A (en) * | 1976-04-29 | 1977-11-07 | Sony Corp | Insulating gate type field effect transistor |
| JPS5366181A (en) * | 1976-11-26 | 1978-06-13 | Hitachi Ltd | High dielectric strength mis type transistor |
| US4055884A (en) * | 1976-12-13 | 1977-11-01 | International Business Machines Corporation | Fabrication of power field effect transistors and the resulting structures |
| JPS5374385A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Manufacture of field effect semiconductor device |
| DE2703877C2 (de) * | 1977-01-31 | 1982-06-03 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | MIS-Transistor von kurzer Kanallänge und Verfahren zu seiner Herstellung |
| US4145703A (en) * | 1977-04-15 | 1979-03-20 | Supertex, Inc. | High power MOS device and fabrication method therefor |
| JPS53135284A (en) * | 1977-04-30 | 1978-11-25 | Nec Corp | Production of field effect transistor |
| JPS54885A (en) * | 1977-06-03 | 1979-01-06 | Nec Corp | Manufacture of field effect transistor |
| US4148047A (en) * | 1978-01-16 | 1979-04-03 | Honeywell Inc. | Semiconductor apparatus |
| DK157272C (da) * | 1978-10-13 | 1990-04-30 | Int Rectifier Corp | Mosfet med hoej effekt |
| JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
| US4246593A (en) * | 1979-01-02 | 1981-01-20 | Texas Instruments Incorporated | High density static memory cell with polysilicon resistors |
| US4344081A (en) * | 1980-04-14 | 1982-08-10 | Supertex, Inc. | Combined DMOS and a vertical bipolar transistor device and fabrication method therefor |
| US4680853A (en) * | 1980-08-18 | 1987-07-21 | International Rectifier Corporation | Process for manufacture of high power MOSFET with laterally distributed high carrier density beneath the gate oxide |
| US4593302B1 (en) * | 1980-08-18 | 1998-02-03 | Int Rectifier Corp | Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide |
| CA1155969A (en) * | 1980-09-26 | 1983-10-25 | Clement A.T. Salama | Field effect transistor device and method of production thereof |
| US4399449A (en) * | 1980-11-17 | 1983-08-16 | International Rectifier Corporation | Composite metal and polysilicon field plate structure for high voltage semiconductor devices |
| US4412242A (en) * | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
| JPS5893347A (ja) * | 1981-11-30 | 1983-06-03 | Toshiba Corp | Mos型半導体装置及びその製造方法 |
| JPS59178746A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 半導体装置の製造方法 |
| US5194924A (en) * | 1984-05-23 | 1993-03-16 | Hitachi, Ltd. | Semiconductor device of an LDD structure having a floating gate |
| KR930007195B1 (ko) * | 1984-05-23 | 1993-07-31 | 가부시끼가이샤 히다찌세이사꾸쇼 | 반도체 장치와 그 제조 방법 |
| US4918501A (en) * | 1984-05-23 | 1990-04-17 | Hitachi, Ltd. | Semiconductor device and method of producing the same |
| IT1213249B (it) * | 1984-11-26 | 1989-12-14 | Ates Componenti Elettron | Processo per la fabbricazione distrutture integrate includenti celle di memoria non volatili con strati di silicio autoallineati ed associati transistori. |
| FR2583920B1 (fr) * | 1985-06-21 | 1987-07-31 | Commissariat Energie Atomique | Procede de fabrication d'un circuit integre et notamment d'une memoire eprom comportant deux composants distincts isoles electriquement |
| US4798810A (en) * | 1986-03-10 | 1989-01-17 | Siliconix Incorporated | Method for manufacturing a power MOS transistor |
| US4786614A (en) * | 1987-02-26 | 1988-11-22 | Siliconix Incorporated | Method of fabricating a high voltage semiconductor device having a pair of V-shaped isolation grooves |
| JPS6420866A (en) * | 1987-07-15 | 1989-01-24 | Kuraray Co | Artificial leather ball |
| JPH01194436A (ja) * | 1988-01-29 | 1989-08-04 | Nec Yamaguchi Ltd | 半導体装置 |
| JP2644275B2 (ja) * | 1988-05-11 | 1997-08-25 | 富士通株式会社 | 半導体装置の製造方法 |
| JP3013992B2 (ja) * | 1989-02-01 | 2000-02-28 | 住友電気工業株式会社 | 化合物半導体結晶の成長方法 |
| US4931408A (en) * | 1989-10-13 | 1990-06-05 | Siliconix Incorporated | Method of fabricating a short-channel low voltage DMOS transistor |
| US5151381A (en) * | 1989-11-15 | 1992-09-29 | Advanced Micro Devices, Inc. | Method for local oxidation of silicon employing two oxidation steps |
| US5153143A (en) * | 1990-02-26 | 1992-10-06 | Delco Electronics Corporation | Method of manufacturing CMOS integrated circuit with EEPROM |
| JPH0831539B2 (ja) * | 1990-05-17 | 1996-03-27 | 富士通株式会社 | 不揮発性メモリの製造方法 |
| US5192707A (en) * | 1991-07-31 | 1993-03-09 | Sgs-Thomson Microelectronics, Inc. | Method of forming isolated regions of oxide |
-
1991
- 1991-11-29 IT ITTO910929A patent/IT1250233B/it active IP Right Grant
-
1992
- 1992-11-02 EP EP92118785A patent/EP0545082B1/en not_active Expired - Lifetime
- 1992-11-02 DE DE69231484T patent/DE69231484T2/de not_active Expired - Fee Related
- 1992-11-30 JP JP4320695A patent/JPH05251555A/ja active Pending
-
1995
- 1995-06-07 US US08/475,555 patent/US5696399A/en not_active Expired - Lifetime
- 1995-09-06 US US08/524,080 patent/US5663080A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5663080A (en) | 1997-09-02 |
| ITTO910929A0 (it) | 1991-11-29 |
| JPH05251555A (ja) | 1993-09-28 |
| DE69231484D1 (de) | 2000-11-02 |
| EP0545082A3 (en) | 1994-10-12 |
| EP0545082B1 (en) | 2000-09-27 |
| US5696399A (en) | 1997-12-09 |
| IT1250233B (it) | 1995-04-03 |
| DE69231484T2 (de) | 2001-02-08 |
| EP0545082A2 (en) | 1993-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971129 |