ITRM990651A0 - Lega metallica per collegamenti elettrici a tensione di contatto nulla. - Google Patents
Lega metallica per collegamenti elettrici a tensione di contatto nulla.Info
- Publication number
- ITRM990651A0 ITRM990651A0 IT1999RM000651A ITRM990651A ITRM990651A0 IT RM990651 A0 ITRM990651 A0 IT RM990651A0 IT 1999RM000651 A IT1999RM000651 A IT 1999RM000651A IT RM990651 A ITRM990651 A IT RM990651A IT RM990651 A0 ITRM990651 A0 IT RM990651A0
- Authority
- IT
- Italy
- Prior art keywords
- electrical connections
- metal alloy
- contact voltage
- voltage
- contact
- Prior art date
Links
- 229910001092 metal group alloy Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT1999RM000651A IT1306731B1 (it) | 1999-10-25 | 1999-10-25 | Lega metallica per collegamenti elettrici a tensione di contatto nulla |
| JP2001533207A JP2003512534A (ja) | 1999-10-25 | 2000-03-20 | 無接触張力電気接続用金属合金 |
| PCT/IT2000/000089 WO2001031074A1 (en) | 1999-10-25 | 2000-03-20 | A metal alloy for electrical connections with nul contact tension |
| EP00911266A EP1149179A1 (en) | 1999-10-25 | 2000-03-20 | A metal alloy for electrical connections with nul contact tension |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT1999RM000651A IT1306731B1 (it) | 1999-10-25 | 1999-10-25 | Lega metallica per collegamenti elettrici a tensione di contatto nulla |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITRM990651A0 true ITRM990651A0 (it) | 1999-10-25 |
| ITRM990651A1 ITRM990651A1 (it) | 2001-04-25 |
| IT1306731B1 IT1306731B1 (it) | 2001-10-02 |
Family
ID=11407014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT1999RM000651A IT1306731B1 (it) | 1999-10-25 | 1999-10-25 | Lega metallica per collegamenti elettrici a tensione di contatto nulla |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1149179A1 (it) |
| JP (1) | JP2003512534A (it) |
| IT (1) | IT1306731B1 (it) |
| WO (1) | WO2001031074A1 (it) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6924044B2 (en) | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
| DE10216462A1 (de) * | 2002-04-12 | 2003-10-23 | Wolfgang Hornig | Oberflächenreaktor |
| DE102005059544A1 (de) * | 2005-12-13 | 2007-06-14 | Ecka Granulate Gmbh & Co. Kg | Sn-haltige hochbelastbare Materialzusammensetzung; Verfahren zur Herstellung einer hochbelastbaren Beschichtung und deren Verwendung |
| RU2365655C1 (ru) * | 2008-08-15 | 2009-08-27 | Юлия Алексеевна Щепочкина | Сплав на основе олова |
| TWI714825B (zh) * | 2018-02-07 | 2021-01-01 | 大瑞科技股份有限公司 | 焊料組成合金及錫球 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2535616C2 (de) * | 1975-08-09 | 1979-03-15 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Blei- und kadmiumfreies Schmierlot |
| DD220915A1 (de) * | 1984-01-20 | 1985-04-10 | Mansfeld Kom W Pieck Fi F Ne M | Verfahren zur herstellung von draht aus metallegierungen mit einer solidustemperatur unter 600 k |
| JP3027441B2 (ja) * | 1991-07-08 | 2000-04-04 | 千住金属工業株式会社 | 高温はんだ |
| US5405577A (en) * | 1993-04-29 | 1995-04-11 | Seelig; Karl F. | Lead-free and bismuth-free tin alloy solder composition |
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
-
1999
- 1999-10-25 IT IT1999RM000651A patent/IT1306731B1/it active
-
2000
- 2000-03-20 EP EP00911266A patent/EP1149179A1/en not_active Withdrawn
- 2000-03-20 JP JP2001533207A patent/JP2003512534A/ja active Pending
- 2000-03-20 WO PCT/IT2000/000089 patent/WO2001031074A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001031074A1 (en) | 2001-05-03 |
| EP1149179A1 (en) | 2001-10-31 |
| IT1306731B1 (it) | 2001-10-02 |
| JP2003512534A (ja) | 2003-04-02 |
| ITRM990651A1 (it) | 2001-04-25 |
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