IT201800000607A1 - AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK - Google Patents
AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK Download PDFInfo
- Publication number
- IT201800000607A1 IT201800000607A1 IT201800000607A IT201800000607A IT201800000607A1 IT 201800000607 A1 IT201800000607 A1 IT 201800000607A1 IT 201800000607 A IT201800000607 A IT 201800000607A IT 201800000607 A IT201800000607 A IT 201800000607A IT 201800000607 A1 IT201800000607 A1 IT 201800000607A1
- Authority
- IT
- Italy
- Prior art keywords
- chip
- air chamber
- board led
- board
- heat sink
- Prior art date
Links
- 239000012141 concentrate Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Descrizione di Invenzione Industriale avente per titolo: Description of Industrial Invention entitled:
"CAMERA D'ARIA PER DISSIPATORE LED CHIP ON BOARD" "AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK"
DESCRIZIONE DESCRIPTION
Sono noti i sistemi e gli strumenti che consentono di ridurre il calore prodotto da un led chip on board montato su di un dissipatore termico per mezzo di ventole. Il sistema così concepito ha il notevole inconveniente di non essere efficiente e di non dissipare il maggior calore prodotto dal led chip on board montato sul dissipatore termico, con la conseguente necessità di utilizzare più energia per il funzionamento della ventola o l'impiego di una ventola più potente atta a dissipare più velocemente il calore prodotto dal detto led chip on board. Tale sistema di dissipazione è presente all'interno dei corpi illuminanti utilizzati in fotografia, incluso film, televisione. L'invenzione così come specificato nelle rivendicazioni, risolve tali inconvenienti, in quanto con l'invenzione si realizzano mediante l'utilizzo di una camera d'aria posta tra il dissipatore e la ventola, le seguenti funzioni principali, possibilità di utilizzare una ventola di maggiore potenza e concentrare di più il flusso d'aria al fine di ridurre il calore generato dal led chip on board montato sul dissipatore. Systems and tools are known which allow to reduce the heat produced by a led chip on board mounted on a heat sink by means of fans. The system thus conceived has the significant drawback of not being efficient and not dissipating the greater heat produced by the led chip on board mounted on the heat sink, with the consequent need to use more energy for the operation of the fan or the use of a fan. more powerful capable of dissipating the heat produced by said led chip on board faster. This dissipation system is present inside the lighting bodies used in photography, including film, television. The invention as specified in the claims solves these drawbacks, since with the invention the following main functions are achieved through the use of an air chamber placed between the heat sink and the fan, the possibility of using a more power and concentrate the air flow more in order to reduce the heat generated by the led chip on board mounted on the heatsink.
Essendo l'invenzione camera d'aria per dissipatore led chip on board costituito da un telaio avente due superfici aperte con relativi elementi di bloccaggio. The invention being an air chamber for a chip on board led heatsink consisting of a frame having two open surfaces with relative locking elements.
La presente invenzione sarà meglio descritta con l'ausilio dei disegni che ne rappresentano solo una delle possibili realizzazioni: The present invention will be better described with the aid of the drawings which represent only one of the possible embodiments:
La figura 1 è una vista frontale ortogonale della camera d'aria per dissipatore led chip on board; Figure 1 is an orthogonal front view of the air chamber for a chip on board LED heatsink;
La figura 2 è una vista frontale ortogonale della camera d'aria per dissipatore led chip on board; Figure 2 is an orthogonal front view of the air chamber for a chip on board led heatsink;
La figura 3 è una vista ortogonale della camera d'aria per dissipatore led chip on board; Figure 3 is an orthogonal view of the air chamber for a chip on board led heatsink;
La figura 4 è la vista laterale della camera d'aria per dissipatore led chip on board; Figure 4 is the side view of the inner tube for the chip on board led heatsink;
La figura 5 è la vista assemblata della camera d'aria per dissipatore led chip on board, della ventola e del dissipatore; Figure 5 is the assembled view of the air chamber for the chip on board led heatsink, the fan and the heatsink;
La figura 6 è la vista assemblata della camera d'aria per dissipatore led chip on board, della ventola e del dissipatore di lato; Figure 6 is the assembled view of the air chamber for the chip on board led heatsink, the fan and the side heatsink;
La figura 7 è la vista assemblata della camera d'aria per dissipatore led chip on board, della ventola, del dissipatore, del diffusore troncoconico e del led chip on board; Figure 7 is the assembled view of the inner tube for the chip on board led heatsink, of the fan, of the heatsink, of the truncated cone diffuser and of the led chip on board;
La figura 8 è una vista esplosa della figura 5 del dissipatore, della camera d'aria per led chip on board e della ventola dall'alto; Figure 8 is an exploded view of Figure 5 of the heat sink, of the air chamber for chip on board LEDs and of the fan from above;
La figura 9 è una vista esplosa della figura 5 del dissipatore, della camera d'aria per led chip on board e della ventola dal basso. Figure 9 is an exploded view of Figure 5 of the heatsink, of the inner tube for chip on board LEDs and of the fan from below.
Con riferimento ai disegni un dispositivo camera d'aria per dissipatore led chip on board atto a essere posto tra la ventola e il dissipatore termico è indicato con 1. With reference to the drawings, an air chamber device for chip-on-board led heat sink suitable to be placed between the fan and the heat sink is indicated with 1.
Detto dispositivo 1 comprendente: Said device 1 comprising:
- Un telaio avente la superficie la aperta e la superficie in opposizione 1b aperta. Detta superfìcie lb dotata delle sedi per gli elementi di bloccaggio 2a,2b,2c,2d. - A frame having the surface 1a open and the opposite surface 1b open. Said surface 1b provided with the seats for the locking elements 2a, 2b, 2c, 2d.
La detta superficie lb atta a alloggiare la ventola 5. La detta superficie la di detta camera d'aria per dissipatore led chip on board atta a montare il detto dissipatore 4 sulla superficie 4b di detto dissipatore 4; Essendo almeno una delle superficie del detto dissipatore 4 non a contatto con la detta camera d'aria per dissipatore led chip on board 1, atta a montare il led chip on board 6 e il diffusore 7. Said surface 1b adapted to house the fan 5. Said surface 1a of said air chamber for led chip on board dissipator adapted to mount said dissipator 4 on the surface 4b of said dissipator 4; Since at least one of the surfaces of the said dissipator 4 is not in contact with the said air chamber for the chip on board led dissipator 1, suitable for mounting the led chip on board 6 and the diffuser 7.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT201800000607A IT201800000607A1 (en) | 2018-01-08 | 2018-01-08 | AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT201800000607A IT201800000607A1 (en) | 2018-01-08 | 2018-01-08 | AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT201800000607A1 true IT201800000607A1 (en) | 2019-07-08 |
Family
ID=62089834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT201800000607A IT201800000607A1 (en) | 2018-01-08 | 2018-01-08 | AIR CHAMBER FOR CHIP ON BOARD LED HEAT SINK |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT201800000607A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120043907A1 (en) * | 2010-08-20 | 2012-02-23 | Dicon Fiberoptics, Inc. | Compact high brightness led grow light apparatus, using an extended point source led array with light emitting diodes |
| US20130155688A1 (en) * | 2011-10-26 | 2013-06-20 | 0Energy Lighting, Inc. | Interlocking lighting fixture |
| JP2015088419A (en) * | 2013-11-01 | 2015-05-07 | オーウエル株式会社 | Lighting device |
| US20160245493A1 (en) * | 2013-09-12 | 2016-08-25 | Brian Eustace | Airflow Heatsink For Led Devices |
| US20170284648A1 (en) * | 2016-04-04 | 2017-10-05 | Shoichi Nakamura | Led illumination device |
-
2018
- 2018-01-08 IT IT201800000607A patent/IT201800000607A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120043907A1 (en) * | 2010-08-20 | 2012-02-23 | Dicon Fiberoptics, Inc. | Compact high brightness led grow light apparatus, using an extended point source led array with light emitting diodes |
| US20130155688A1 (en) * | 2011-10-26 | 2013-06-20 | 0Energy Lighting, Inc. | Interlocking lighting fixture |
| US20160245493A1 (en) * | 2013-09-12 | 2016-08-25 | Brian Eustace | Airflow Heatsink For Led Devices |
| JP2015088419A (en) * | 2013-11-01 | 2015-05-07 | オーウエル株式会社 | Lighting device |
| US20170284648A1 (en) * | 2016-04-04 | 2017-10-05 | Shoichi Nakamura | Led illumination device |
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