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IT1400085B1 - Modulo sensore - Google Patents

Modulo sensore

Info

Publication number
IT1400085B1
IT1400085B1 ITMI2010A000475A ITMI20100475A IT1400085B1 IT 1400085 B1 IT1400085 B1 IT 1400085B1 IT MI2010A000475 A ITMI2010A000475 A IT MI2010A000475A IT MI20100475 A ITMI20100475 A IT MI20100475A IT 1400085 B1 IT1400085 B1 IT 1400085B1
Authority
IT
Italy
Prior art keywords
sensor module
module
sensor
Prior art date
Application number
ITMI2010A000475A
Other languages
English (en)
Inventor
Klaus Offterdinger
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20100475A1 publication Critical patent/ITMI20100475A1/it
Application granted granted Critical
Publication of IT1400085B1 publication Critical patent/IT1400085B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/10—Elements for damping the movement of parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
ITMI2010A000475A 2009-03-27 2010-03-23 Modulo sensore IT1400085B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009001930.8A DE102009001930B4 (de) 2009-03-27 2009-03-27 Sensorbaustein

Publications (2)

Publication Number Publication Date
ITMI20100475A1 ITMI20100475A1 (it) 2010-09-28
IT1400085B1 true IT1400085B1 (it) 2013-05-17

Family

ID=42663851

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A000475A IT1400085B1 (it) 2009-03-27 2010-03-23 Modulo sensore

Country Status (4)

Country Link
US (1) US8584525B2 (it)
DE (1) DE102009001930B4 (it)
FR (1) FR2943790A1 (it)
IT (1) IT1400085B1 (it)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009000574B4 (de) * 2009-02-03 2017-07-27 Robert Bosch Gmbh Sensorvorrichtung
DE102010000848A1 (de) * 2010-01-13 2011-07-14 Robert Bosch GmbH, 70469 Trägermaterial mit einer mechanischen Filtereigenschaft und Verfahren zur Herstellung eines Trägermaterials
DE102011003195B4 (de) 2011-01-26 2019-01-10 Robert Bosch Gmbh Bauteil und Verfahren zum Herstellen eines Bauteils
US9175959B2 (en) 2011-02-22 2015-11-03 Trw Automotive U.S. Llc Measuring device mounting method and structure
DE102011080971A1 (de) 2011-08-16 2013-02-21 Robert Bosch Gmbh Sensor, Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit
DE102011054231B4 (de) * 2011-10-06 2015-03-26 Sick Ag Linearer Wegsensor
JP5818087B2 (ja) * 2011-10-31 2015-11-18 日立工機株式会社 電動工具
DE102012201486B4 (de) 2012-02-02 2020-08-06 Robert Bosch Gmbh Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung
US9227833B2 (en) * 2012-06-06 2016-01-05 Rosemount Aerospace Inc. Vibration isolated MEMS structures and methods of manufacture
DE102012224424A1 (de) * 2012-12-27 2014-07-17 Robert Bosch Gmbh Sensorsystem und Abdeckvorrichtung für ein Sensorsystem
US9250262B1 (en) * 2013-02-01 2016-02-02 Maxim Integrated Products, Inc. Method and apparatus for an integrated isolation mechanical filter with substrate based package
EP2840375A1 (en) * 2013-08-19 2015-02-25 Sensirion AG Device with a micro- or nanoscale structure
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
EP2871456B1 (en) 2013-11-06 2018-10-10 Invensense, Inc. Pressure sensor and method for manufacturing a pressure sensor
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
EP3614115B1 (en) 2015-04-02 2024-09-11 InvenSense, Inc. Pressure sensor
DE102016204914B4 (de) * 2016-03-24 2017-10-19 Schaeffler Technologies AG & Co. KG Geberzylinder für ein Kupplungsbetätigungssystem, Kupplungsbetätigungssystem und Sensoraufnahme
NL2017885B1 (en) * 2016-11-29 2018-06-11 Sencio B V Sensor package and method of manufacturing the same
DE102017206828A1 (de) * 2017-04-24 2018-10-25 Robert Bosch Gmbh Mechanischer Dämpfer für einen Stapel von Substraten; Verfahren zur Herstellung eines mechanischen Dämpfers
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
WO2020064092A1 (de) * 2018-09-25 2020-04-02 Fraba B.V. Sensorvorrichtung
CN111175967A (zh) * 2018-11-13 2020-05-19 台达电子工业股份有限公司 光学模块
WO2020236661A1 (en) 2019-05-17 2020-11-26 Invensense, Inc. A pressure sensor with improve hermeticity
CN112880667B (zh) * 2019-11-29 2023-12-08 精工爱普生株式会社 传感器单元、电子设备以及移动体
CN119768744A (zh) * 2022-07-28 2025-04-04 三星电子株式会社 包括电路板的阻尼结构的可穿戴电子装置

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US20070080458A1 (en) * 2005-10-11 2007-04-12 Tsuyoshi Ogawa Hybrid module and method of manufacturing the same
DE102006011753B4 (de) * 2006-03-13 2021-01-28 Infineon Technologies Ag Halbleitersensorbauteil, Verfahren zur Herstellung eines Nutzens und Verfahren zur Herstellung von Halbleitersensorbauteilen
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JP2010211179A (ja) * 2009-02-13 2010-09-24 Hitachi Ltd 光電気複合配線モジュールおよびその製造方法

Also Published As

Publication number Publication date
US8584525B2 (en) 2013-11-19
US20100242605A1 (en) 2010-09-30
ITMI20100475A1 (it) 2010-09-28
DE102009001930A1 (de) 2010-09-30
DE102009001930B4 (de) 2018-01-04
FR2943790A1 (fr) 2010-10-01

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