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IT1399285B1 - Sistema di lavorazione substrato - Google Patents

Sistema di lavorazione substrato

Info

Publication number
IT1399285B1
IT1399285B1 ITUD2009A000129A ITUD20090129A IT1399285B1 IT 1399285 B1 IT1399285 B1 IT 1399285B1 IT UD2009A000129 A ITUD2009A000129 A IT UD2009A000129A IT UD20090129 A ITUD20090129 A IT UD20090129A IT 1399285 B1 IT1399285 B1 IT 1399285B1
Authority
IT
Italy
Prior art keywords
processing system
substrate processing
substrate
processing
Prior art date
Application number
ITUD2009A000129A
Other languages
English (en)
Inventor
Marco Galiazzo
Andrea Baccini
Tommaso Vercesi
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000129A priority Critical patent/IT1399285B1/it
Priority to EP09736883.1A priority patent/EP2449576B1/en
Priority to US13/382,043 priority patent/US20120109355A1/en
Priority to KR1020127003141A priority patent/KR20120039695A/ko
Priority to JP2012516528A priority patent/JP2012531729A/ja
Priority to CN200980160266.XA priority patent/CN102473588B/zh
Priority to PCT/EP2009/062845 priority patent/WO2011000442A1/en
Priority to TW099121871A priority patent/TWI424581B/zh
Publication of ITUD20090129A1 publication Critical patent/ITUD20090129A1/it
Application granted granted Critical
Publication of IT1399285B1 publication Critical patent/IT1399285B1/it

Links

Classifications

    • H10P72/0456—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10P72/0464—
    • H10P72/0474—
ITUD2009A000129A 2009-07-03 2009-07-03 Sistema di lavorazione substrato IT1399285B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato
EP09736883.1A EP2449576B1 (en) 2009-07-03 2009-10-02 Substrate processing system
US13/382,043 US20120109355A1 (en) 2009-07-03 2009-10-02 Substrate processing system
KR1020127003141A KR20120039695A (ko) 2009-07-03 2009-10-02 기판 처리 시스템
JP2012516528A JP2012531729A (ja) 2009-07-03 2009-10-02 基板処理システム
CN200980160266.XA CN102473588B (zh) 2009-07-03 2009-10-02 基材处理系统
PCT/EP2009/062845 WO2011000442A1 (en) 2009-07-03 2009-10-02 Substrate processing system
TW099121871A TWI424581B (zh) 2009-07-03 2010-07-02 基材處理系統及處理基材之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato

Publications (2)

Publication Number Publication Date
ITUD20090129A1 ITUD20090129A1 (it) 2011-01-04
IT1399285B1 true IT1399285B1 (it) 2013-04-11

Family

ID=41683198

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000129A IT1399285B1 (it) 2009-07-03 2009-07-03 Sistema di lavorazione substrato

Country Status (8)

Country Link
US (1) US20120109355A1 (it)
EP (1) EP2449576B1 (it)
JP (1) JP2012531729A (it)
KR (1) KR20120039695A (it)
CN (1) CN102473588B (it)
IT (1) IT1399285B1 (it)
TW (1) TWI424581B (it)
WO (1) WO2011000442A1 (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102393609B (zh) * 2011-11-12 2014-03-05 哈尔滨工业大学 过梁式单/双导轨双驱步进扫描双工件台交换装置与方法
DE102012205249A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
DE102012205252A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
ITUD20120061A1 (it) * 2012-04-13 2013-10-14 Applied Materials Italia Srl Procedimento per il controllo di uno schema stampato su un substrato
KR101471130B1 (ko) * 2013-07-16 2014-12-11 숭실대학교산학협력단 평면 모터 장치 및 이를 이용한 공정 장치
KR102176282B1 (ko) 2013-07-25 2020-11-09 삼성전기주식회사 PCB 로딩/언로딩(loading/unloading) 장치
CN103779244B (zh) * 2014-01-21 2017-06-13 谢创 一种板上芯片封装键合自动生产线
CN112018010A (zh) * 2014-12-02 2020-12-01 应用材料意大利有限公司 在生产太阳能电池基板上印刷的装置及传输该基板的方法
TWI732285B (zh) 2015-01-23 2021-07-01 美商應用材料股份有限公司 半導體處理設備
ITUB20161142A1 (it) 2016-02-29 2017-08-29 Vismunda Srl Metodo e impianto produttivo automatico per la stampa su celle fotovoltaiche.
JP6703785B2 (ja) * 2016-05-09 2020-06-03 キヤノン株式会社 基板処理装置、および物品製造方法
WO2018048842A1 (en) * 2016-09-12 2018-03-15 Applied Materials, Inc. Semiconductor process equipment
DE102017204630A1 (de) * 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
KR101951187B1 (ko) * 2017-06-26 2019-04-29 주식회사 에스에프에이 인라인 잉크젯 시스템
US10507991B2 (en) * 2018-05-08 2019-12-17 Applied Materials, Inc. Vacuum conveyor substrate loading module
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
WO2020072507A1 (en) 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
CN111730968B (zh) * 2020-08-05 2021-06-18 苏州迈为科技股份有限公司 印刷装置
TWI767828B (zh) * 2021-08-27 2022-06-11 開必拓數據股份有限公司 應用於具有卷對卷機構的設備的馬達控制系統
US20240153802A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
JP3501559B2 (ja) * 1995-06-27 2004-03-02 キヤノン株式会社 リニア・モータ装置
JPH10223527A (ja) * 1996-12-06 1998-08-21 Nikon Corp 露光装置
DE69735016T2 (de) * 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
USRE40043E1 (en) * 1997-03-10 2008-02-05 Asml Netherlands B.V. Positioning device having two object holders
US6206964B1 (en) * 1997-11-10 2001-03-27 Speedline Technologies, Inc. Multiple head dispensing system and method
JP2001057325A (ja) * 1999-08-17 2001-02-27 Nikon Corp ステージ装置及び露光装置
EP1111471B1 (en) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographic projection apparatus with collision preventing device
JP2002116239A (ja) * 2000-10-06 2002-04-19 Yokogawa Electric Corp デバイス検査装置
US6927505B2 (en) * 2001-12-19 2005-08-09 Nikon Corporation Following stage planar motor
JP4096359B2 (ja) * 2003-03-10 2008-06-04 セイコーエプソン株式会社 製造対象物の製造装置
ATE429031T1 (de) * 2003-08-07 2009-05-15 Nikon Corp Belichtungsverfahren
JP4112472B2 (ja) * 2003-10-21 2008-07-02 株式会社東芝 半導体装置の製造方法及び半導体装置の製造装置
JP4345476B2 (ja) * 2003-12-26 2009-10-14 日本精工株式会社 露光装置
CN100552879C (zh) * 2004-02-02 2009-10-21 尼康股份有限公司 载台驱动方法及载台装置、曝光装置、及元件制造方法
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
JP2005294468A (ja) * 2004-03-31 2005-10-20 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
TWI454859B (zh) * 2006-03-30 2014-10-01 尼康股份有限公司 移動體裝置、曝光裝置與曝光方法以及元件製造方法
US7973910B2 (en) * 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
DE102007003224A1 (de) * 2007-01-15 2008-07-17 Thieme Gmbh & Co. Kg Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen
JP2009049377A (ja) * 2007-07-24 2009-03-05 Nikon Corp 移動体駆動システム、露光装置、露光方法、及びデバイス製造方法
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento
ITUD20070195A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Procedimento di produzione e controllo di piastre per elettronica e relativo apparato
JP2009136065A (ja) * 2007-11-29 2009-06-18 Canon Inc 平面モータおよびそれを用いたステージ
US8711327B2 (en) * 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP4871337B2 (ja) * 2008-09-18 2012-02-08 Ｎｓｋテクノロジー株式会社 露光装置
US8613134B2 (en) * 2008-11-19 2013-12-24 Illinois Tool Works Inc. Method of conveying printed circuit boards

Also Published As

Publication number Publication date
CN102473588A (zh) 2012-05-23
EP2449576A1 (en) 2012-05-09
WO2011000442A1 (en) 2011-01-06
ITUD20090129A1 (it) 2011-01-04
US20120109355A1 (en) 2012-05-03
JP2012531729A (ja) 2012-12-10
TW201110403A (en) 2011-03-16
KR20120039695A (ko) 2012-04-25
EP2449576B1 (en) 2017-01-25
CN102473588B (zh) 2015-06-03
TWI424581B (zh) 2014-01-21

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