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IT1110092B - Stampo e procedimento per l'incapsulamento a trasferimento di dispositivi elettronici a semiconduttori - Google Patents

Stampo e procedimento per l'incapsulamento a trasferimento di dispositivi elettronici a semiconduttori

Info

Publication number
IT1110092B
IT1110092B IT19830/79A IT1983079A IT1110092B IT 1110092 B IT1110092 B IT 1110092B IT 19830/79 A IT19830/79 A IT 19830/79A IT 1983079 A IT1983079 A IT 1983079A IT 1110092 B IT1110092 B IT 1110092B
Authority
IT
Italy
Prior art keywords
mold
procedure
semiconductor devices
electronic semiconductor
transfer encapsulation
Prior art date
Application number
IT19830/79A
Other languages
English (en)
Other versions
IT7919830A0 (it
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of IT7919830A0 publication Critical patent/IT7919830A0/it
Application granted granted Critical
Publication of IT1110092B publication Critical patent/IT1110092B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H10W40/778—
    • H10W74/016—
    • H10W74/111—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
IT19830/79A 1978-08-07 1979-02-01 Stampo e procedimento per l'incapsulamento a trasferimento di dispositivi elettronici a semiconduttori IT1110092B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9641678A JPS5480079A (en) 1978-08-07 1978-08-07 Method of forming semiconductor seal

Publications (2)

Publication Number Publication Date
IT7919830A0 IT7919830A0 (it) 1979-02-01
IT1110092B true IT1110092B (it) 1985-12-23

Family

ID=14164360

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19830/79A IT1110092B (it) 1978-08-07 1979-02-01 Stampo e procedimento per l'incapsulamento a trasferimento di dispositivi elettronici a semiconduttori

Country Status (4)

Country Link
JP (1) JPS5480079A (it)
DE (1) DE2900114A1 (it)
IT (1) IT1110092B (it)
NL (1) NL7903254A (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128835A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Molding method and mold used therefor
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
GB2096825A (en) * 1981-04-09 1982-10-20 Sibbald Alastair Chemical sensitive semiconductor field effect transducer
DE3138555A1 (de) * 1981-09-28 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von kunststoffgehaeusen
NL8203255A (nl) * 1982-08-19 1984-03-16 Arbo Handel Ontwikkeling Matrijs voor het met kunststof omhullen van delen van elementen.
US4504435A (en) * 1982-10-04 1985-03-12 Texas Instruments Incorporated Method for semiconductor device packaging
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
DE3439145A1 (de) * 1983-10-26 1985-05-09 Reliability Inc., 77218 Houston, Tex. Entlade/sortier-automat fuer ic-bauteile auf einer burn-in-platine
IT1252575B (it) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
DE4333415C2 (de) * 1993-09-30 1999-03-04 Siemens Ag Vorrichtung zum Umhüllen eines Halbleiterbauelements und einer damit verbundenen Wärmesenke mit Kunststoffen
DE69414846T2 (de) * 1994-09-20 1999-05-20 Stmicroelectronics S.R.L., Agrate Brianza, Mailand/Milano Methode zur elektrische Isolation von Kühlkörpern in elektronischen Leistungsschaltungen
JP4118353B2 (ja) * 1996-10-11 2008-07-16 株式会社デンソー 樹脂封止型半導体装置の製造方法およびモールド金型

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460565A (en) * 1977-10-21 1979-05-16 Nec Home Electronics Ltd Parts molding method

Also Published As

Publication number Publication date
NL7903254A (nl) 1980-02-11
IT7919830A0 (it) 1979-02-01
JPS5480079A (en) 1979-06-26
JPS5622372B2 (it) 1981-05-25
DE2900114A1 (de) 1980-02-14

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