IT1185286B - PROCEDURE AND DEVICE FOR THE TAPING OF ADAPTER FRAMES - Google Patents

PROCEDURE AND DEVICE FOR THE TAPING OF ADAPTER FRAMES

Info

Publication number: IT1185286B
Authority: IT; Italy
Prior art keywords: taping; procedure; adapter frames; adapter; frames
Prior art date: 1984-07-23

Application number

IT21638/85A

Other languages

Italian (it)

Other versions

IT8521638A0 (en

Inventor

Brett Sharenow

Original Assignee

Rogers Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-07-23

Filing date

1985-07-19

Publication date

1987-11-04

1985-07-19 Application filed by Rogers Corp filed Critical Rogers Corp

1985-07-19 Publication of IT8521638A0 publication Critical patent/IT8521638A0/en

1987-11-04 Application granted granted Critical

1987-11-04 Publication of IT1185286B publication Critical patent/IT1185286B/en

Classifications

- H10W70/435—

IT21638/85A 1984-07-23 1985-07-19 PROCEDURE AND DEVICE FOR THE TAPING OF ADAPTER FRAMES IT1185286B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US63334484A	1984-07-23	1984-07-23

Publications (2)

Publication Number	Publication Date
IT8521638A0 IT8521638A0 (en)	1985-07-19
IT1185286B true IT1185286B (en)	1987-11-04

Family

ID=24539266

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT21638/85A IT1185286B (en)	1984-07-23	1985-07-19	PROCEDURE AND DEVICE FOR THE TAPING OF ADAPTER FRAMES

Country Status (5)

Country	Link
JP (1)	JPS6136960A (en)
FR (1)	FR2568059A1 (en)
GB (1)	GB8518468D0 (en)
IL (1)	IL75877A0 (en)
IT (1)	IT1185286B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61296749A (en) *	1985-06-25	1986-12-27	Toray Silicone Co Ltd	Lead frame for semiconductor device
EP0213014B1 (en) *	1985-07-23	1990-09-19	Fairchild Semiconductor Corporation	Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
US4796080A (en) *	1987-07-23	1989-01-03	Fairchild Camera And Instrument Corporation	Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
JPH0226479Y2 (en) *	1987-08-28	1990-07-18
JPH0341679Y2 (en) *	1988-12-01	1991-09-02
JPH02170457A (en) *	1988-12-22	1990-07-02	Hitachi Cable Ltd	Lead frames for semiconductor devices and holding tapes used therein
US5098863A (en) *	1990-11-29	1992-03-24	Intel Corporation	Method of stabilizing lead dimensions on high pin count surface mount I.C. packages

1985
- 1985-07-11 FR FR8510630A patent/FR2568059A1/en active Pending
- 1985-07-18 JP JP15928585A patent/JPS6136960A/en active Pending
- 1985-07-19 IT IT21638/85A patent/IT1185286B/en active
- 1985-07-22 GB GB858518468A patent/GB8518468D0/en active Pending
- 1985-07-22 IL IL75877A patent/IL75877A0/en unknown

Also Published As

Publication number	Publication date
FR2568059A1 (en)	1986-01-24
IT8521638A0 (en)	1985-07-19
JPS6136960A (en)	1986-02-21
IL75877A0 (en)	1985-11-29
GB8518468D0 (en)	1985-08-29

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