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IT1184535B - Processo di ricavo di linee in film sottile - Google Patents

Processo di ricavo di linee in film sottile

Info

Publication number
IT1184535B
IT1184535B IT20567/85A IT2056785A IT1184535B IT 1184535 B IT1184535 B IT 1184535B IT 20567/85 A IT20567/85 A IT 20567/85A IT 2056785 A IT2056785 A IT 2056785A IT 1184535 B IT1184535 B IT 1184535B
Authority
IT
Italy
Prior art keywords
thin film
recovery process
film lines
lines recovery
thin
Prior art date
Application number
IT20567/85A
Other languages
English (en)
Other versions
IT8520567A0 (it
Inventor
Giampiero Ferraris
Antonio Tersalvi
Original Assignee
Gte Telecom Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gte Telecom Spa filed Critical Gte Telecom Spa
Priority to IT20567/85A priority Critical patent/IT1184535B/it
Publication of IT8520567A0 publication Critical patent/IT8520567A0/it
Priority to AU54852/86A priority patent/AU585955B2/en
Priority to EP86200415A priority patent/EP0200237A3/en
Priority to NO861090A priority patent/NO861090L/no
Priority to ZA862336A priority patent/ZA862336B/xx
Priority to CN86102448A priority patent/CN1006597B/zh
Priority to JP61097067A priority patent/JPS61255029A/ja
Priority to US07/102,302 priority patent/US4812388A/en
Application granted granted Critical
Publication of IT1184535B publication Critical patent/IT1184535B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
IT20567/85A 1985-05-03 1985-05-03 Processo di ricavo di linee in film sottile IT1184535B (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT20567/85A IT1184535B (it) 1985-05-03 1985-05-03 Processo di ricavo di linee in film sottile
AU54852/86A AU585955B2 (en) 1985-05-03 1986-03-14 Process to obtain thin film lines
EP86200415A EP0200237A3 (en) 1985-05-03 1986-03-17 Process to obtain thin film lines
NO861090A NO861090L (no) 1985-05-03 1986-03-20 Fremgangsmaate for aa tilveiebringe tynne filmlinjer.
ZA862336A ZA862336B (en) 1985-05-03 1986-03-27 Process to obtain thin film lines
CN86102448A CN1006597B (zh) 1985-05-03 1986-04-19 制造薄膜线条的方法
JP61097067A JPS61255029A (ja) 1985-05-03 1986-04-28 細いフイルム状の線を得る方法
US07/102,302 US4812388A (en) 1985-05-03 1987-09-25 Process to obtain thin film lines

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20567/85A IT1184535B (it) 1985-05-03 1985-05-03 Processo di ricavo di linee in film sottile

Publications (2)

Publication Number Publication Date
IT8520567A0 IT8520567A0 (it) 1985-05-03
IT1184535B true IT1184535B (it) 1987-10-28

Family

ID=11168906

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20567/85A IT1184535B (it) 1985-05-03 1985-05-03 Processo di ricavo di linee in film sottile

Country Status (8)

Country Link
US (1) US4812388A (it)
EP (1) EP0200237A3 (it)
JP (1) JPS61255029A (it)
CN (1) CN1006597B (it)
AU (1) AU585955B2 (it)
IT (1) IT1184535B (it)
NO (1) NO861090L (it)
ZA (1) ZA862336B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006656A2 (en) * 1995-08-09 1997-02-20 Philips Electronics N.V. Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors
ES2327009T3 (es) * 2002-03-21 2009-10-22 Basf Se Mezclas fungicidas.
CN110028670A (zh) * 2019-04-11 2019-07-19 明士新材料有限公司 低介电损耗负性光敏聚酰胺酸酯树脂、树脂组合物、其制备方法及应用
CN115568118A (zh) * 2022-10-20 2023-01-03 Oppo广东移动通信有限公司 制作方法、电路板、防抖组件以及摄像模组

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2428373C2 (de) * 1974-06-12 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von weichlötbaren Anschlußkontakten auf einer Halbleiteranordnung
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4451971A (en) * 1982-08-02 1984-06-05 Fairchild Camera And Instrument Corporation Lift-off wafer processing
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
JPS59202636A (ja) * 1983-05-04 1984-11-16 Hitachi Ltd 微細パタ−ン形成方法
US4523976A (en) * 1984-07-02 1985-06-18 Motorola, Inc. Method for forming semiconductor devices
JPS61242044A (ja) * 1985-04-19 1986-10-28 Matsushita Electronics Corp 半導体装置の製造方法
US4606998A (en) * 1985-04-30 1986-08-19 International Business Machines Corporation Barrierless high-temperature lift-off process

Also Published As

Publication number Publication date
EP0200237A3 (en) 1988-09-07
US4812388A (en) 1989-03-14
EP0200237A2 (en) 1986-11-05
NO861090L (no) 1986-11-04
AU5485286A (en) 1986-11-06
CN1006597B (zh) 1990-01-24
IT8520567A0 (it) 1985-05-03
JPS61255029A (ja) 1986-11-12
CN86102448A (zh) 1986-10-29
ZA862336B (en) 1986-11-26
AU585955B2 (en) 1989-06-29

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960612