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IT1165111B - Composizione e processo per il rivestimento protettivo di componenti elettronici - Google Patents

Composizione e processo per il rivestimento protettivo di componenti elettronici

Info

Publication number
IT1165111B
IT1165111B IT23826/79A IT2382679A IT1165111B IT 1165111 B IT1165111 B IT 1165111B IT 23826/79 A IT23826/79 A IT 23826/79A IT 2382679 A IT2382679 A IT 2382679A IT 1165111 B IT1165111 B IT 1165111B
Authority
IT
Italy
Prior art keywords
composition
electronic components
protective coating
protective
coating
Prior art date
Application number
IT23826/79A
Other languages
English (en)
Other versions
IT7923826A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7923826A0 publication Critical patent/IT7923826A0/it
Application granted granted Critical
Publication of IT1165111B publication Critical patent/IT1165111B/it

Links

Classifications

    • H10P14/683—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10P14/6342—
    • H10W74/01—
    • H10W74/131—
    • H10W74/47—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT23826/79A 1978-06-26 1979-06-25 Composizione e processo per il rivestimento protettivo di componenti elettronici IT1165111B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91935678A 1978-06-26 1978-06-26

Publications (2)

Publication Number Publication Date
IT7923826A0 IT7923826A0 (it) 1979-06-25
IT1165111B true IT1165111B (it) 1987-04-22

Family

ID=25441942

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23826/79A IT1165111B (it) 1978-06-26 1979-06-25 Composizione e processo per il rivestimento protettivo di componenti elettronici

Country Status (5)

Country Link
EP (1) EP0006509B1 (it)
JP (1) JPS6040705B2 (it)
CA (1) CA1108330A (it)
DE (1) DE2962550D1 (it)
IT (1) IT1165111B (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812767U (ja) * 1981-07-20 1983-01-26 カルソニックカンセイ株式会社 リキツドタンク
JPS5812768U (ja) * 1981-07-20 1983-01-26 カルソニックカンセイ株式会社 リキツドタンク
JPS59192869U (ja) * 1983-06-09 1984-12-21 松下電器産業株式会社 電気部品
JPS59192870U (ja) * 1983-06-09 1984-12-21 松下電器産業株式会社 プリント基板装置
US4588912A (en) * 1983-10-24 1986-05-13 Nippondenso Co., Ltd. D.C. brushless motor with an improved yoke
US4612210A (en) * 1985-07-25 1986-09-16 International Business Machines Corporation Process for planarizing a substrate
JPS6369966U (it) * 1986-10-22 1988-05-11
JPS63221629A (ja) * 1987-03-11 1988-09-14 Hitachi Ltd 電子装置
GB8825201D0 (en) * 1988-10-27 1988-11-30 Dow Corning Sa Cavity packages
JPH01199493A (ja) * 1988-12-23 1989-08-10 Matsushita Electric Ind Co Ltd プリント基板への部品取付方法
KR101909803B1 (ko) * 2014-05-24 2018-10-18 가부시키가이샤 가네카 알콕시실란 변성 폴리아미드산 용액, 그것을 사용한 적층체 및 플렉시블 디바이스, 및 폴리이미드 필름 및 적층체의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3515585A (en) * 1968-04-24 1970-06-02 Ibm Gelation coating method for electronic circuit panels
US3931454A (en) * 1972-10-17 1976-01-06 Westinghouse Electric Corporation Printed circuit board and method of preparing it
JPS5543612B2 (it) * 1973-09-26 1980-11-07
DE2526052C2 (de) * 1975-06-11 1983-04-21 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Reinigen polierter Halbleiterscheiben
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
DE2707931A1 (de) * 1977-02-24 1978-08-31 Semikron Gleichrichterbau Verfahren zum aufbringen einer schutzschicht auf halbleiterbauelementen

Also Published As

Publication number Publication date
EP0006509A1 (de) 1980-01-09
DE2962550D1 (en) 1982-06-03
JPS6040705B2 (ja) 1985-09-12
IT7923826A0 (it) 1979-06-25
CA1108330A (en) 1981-09-01
EP0006509B1 (de) 1982-04-21
JPS554991A (en) 1980-01-14

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